JP6187894B2 - 回路装置の製造方法、半導体部品の実装構造および回路装置 - Google Patents
回路装置の製造方法、半導体部品の実装構造および回路装置 Download PDFInfo
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- JP6187894B2 JP6187894B2 JP2012202083A JP2012202083A JP6187894B2 JP 6187894 B2 JP6187894 B2 JP 6187894B2 JP 2012202083 A JP2012202083 A JP 2012202083A JP 2012202083 A JP2012202083 A JP 2012202083A JP 6187894 B2 JP6187894 B2 JP 6187894B2
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Wire Bonding (AREA)
Description
(エポキシ樹脂)
ビスフェノールF型エポキシ樹脂、新日鐵化学株式会社「YDF8170」
(硬化剤)
酸無水物、DIC株式会社「B650」
(硬化促進剤)
マイクロカプセル型潜在性硬化促進剤、旭化成ケミカル株式会社「HX3722」
(無機充填剤)
無機充填剤1:株式会社龍森「SO−32R」
無機充填剤2:日本アエロジル「#300」
(有機酸)
アジピン酸(東京化成)
アビエチン酸(東京化成)
セバシン酸(東京化成)
グルタル酸(東京化成)
アンダーフィルおよびサイドフィルの樹脂組成物の製造は次の方法で調製した。まず表1に示す無機充填剤以外の各配合成分を、表1に示す割合で配合し、ミキサーで均一に混合した後、この混合物に無機充填剤を加え、再度、攪拌、混合、分散を行ってアンダーフィルおよびサイドフィルの樹脂組成物を得た。
先塗布サイドフィル:図1に示す工程により行った。
後入れアンダーフィル:図2に示す工程により行った。
後入れサイドフィル:図2に示す工程において、アンダーフィル12のディスペンスに替えてサイドフィルのディスペンスを行った。
先塗布アンダーフィル:図2に示す工程において、半導体部品3の載置前に予め基板上にアンダーフィル12のディスペンスを行った。
リフロー条件:130℃〜185℃(70s)、220℃〜250℃(1min)
アンダーフィルのアフターキュア条件:120℃、60min
上記の条件にて作成した回路装置について、ディスペンス塗りしろ、実装補強後のパッケージ下のボイド発生、接合後の実装接合率についての測定および評価を行った。
[ディスペンス塗りしろ]
実装補強した状態の半導体部品の側周部(エッジ部)からはみ出した、アンダーフィルおよびサイドフィルの距離を測定した。
[実装後のパッケージ下のボイド発生]
実装補強した状態の半導体部品および回路基板を切断し、アンダーフィルおよびサイドフィルのボイドのあり、なしについて目視にて評価した。
[実装接合率]
実装補強した状態の半導体装置の接続性について電気抵抗値を測定し、結果から実装接合率を測定した。
[ヒートサイクル試験]
半導体パッケージとして、0.75mm厚、14mm角の半導体パッケージを用い、回路基板としてFR−4の回路基板を用いた。
○:不良率0〜39%
△:不良率40%〜69%
×:不良率70%〜100%
[リペア性]
FR−4基板上にアンダーフィルまたはサイドフィルの樹脂組成物を120℃、1hにて塗布硬化させた。
○:アンダーフィルまたはサイドフィルがきれいに取り除かれる。基板上にアンダーフィルまたはサイドフィルが残らないモード
×:アンダーフィルまたはサイドフィルが残る。基板上のレジストがはがれるモード
上記の測定および評価の結果を表1に示す。
2 ランド
3 半導体部品
3a 側周部
4 導電接続部材
5a はんだペースト
5b フラックス
6a サイドフィル用熱硬化性樹脂組成物
6b サイドフィル
7 接合構造体
Claims (8)
- はんだが供給された複数の導電接続部材を備えた半導体部品を用意する工程と、
複数のランドを有する回路基板の前記半導体部品が搭載される部分における、前記半導体部品の側周部に沿った範囲に、活性剤として有機酸を含有するサイドフィル用熱硬化性樹脂組成物を、前記回路基板における、前記半導体部品の側周部に沿った最外側に配置された前記導電接続部材に接続される前記ランドの表面を少なくとも含む範囲に先塗布する工程と、
前記導電接続部材と前記ランドとを位置合わせして前記回路基板に前記半導体部品を搭載し、および、先塗布された前記サイドフィル用熱硬化性樹脂組成物を、前記半導体部品の側周部に沿った裏面と前記回路基板の表面との間に介在させ、かつ、少なくとも前記半導体部品の側周部に沿った最外側に配置された前記導電接続部材と前記ランドとの接合構造体に接触させる工程と、
リフロー処理を行うことによって、前記導電接続部材と前記ランドとのはんだによる接続と前記サイドフィル用熱硬化性樹脂組成物の硬化によるサイドフィルの形成とを同時に行う工程とを含み、
前記有機酸の含有量が、前記サイドフィル用熱硬化性樹脂組成物の全量に対して0.5質量%以上5質量%以下の範囲内であり、
前記サイドフィル用熱硬化性樹脂組成物とその硬化物の色が、前記回路基板の色および前記半導体部品の封止材料の色とは、視認により区別される異なる色であり、
前記サイドフィルが、前記半導体部品の側周部から外側に露出せずに前記半導体部品の側周部に沿った裏面と前記回路基板の表面との間を封止することを特徴とする回路装置の製造方法。 - 前記サイドフィル用熱硬化性樹脂組成物が、エポキシ樹脂、硬化剤、硬化促進剤、無機充填剤、および前記有機酸を含有するエポキシ樹脂組成物であることを特徴とする請求項1に記載の回路装置の製造方法。
- 前記有機酸が、アジピン酸、アビエチン酸、およびセバシン酸から選ばれる少なくとも一種であることを特徴とする請求項1または2に記載の回路装置の製造方法。
- 前記はんだが供給された複数の導電接続部材は、表面にはんだペーストを有するか、または、はんだボール表面にフラックスを有することを特徴とする請求項1から3のいずれか一項に記載の回路装置の製造方法。
- 半導体部品の導電接続部材と回路基板のランドとがはんだにより接続され、サイドフィルが、活性剤として有機酸をサイドフィル用熱硬化性樹脂組成物の全量に対して0.5質量%以上5質量%以下の範囲内で含有されたサイドフィル用熱硬化性樹脂組成物の硬化物であり、かつ、少なくとも前記半導体部品の側周部に沿った最外側に配置された前記導電接続部材と前記ランドとの接合構造体に接触し、かつ、前記半導体部品の側周部から外側に露出せずに前記半導体部品の側周部に沿った裏面と前記回路基板の表面との間を接着補強しており、前記サイドフィル用熱硬化性樹脂組成物の硬化物の色が、前記回路基板の色および前記半導体部品の封止材料の色とは、視認により区別される異なる色であることを特徴とする半導体部品の実装構造。
- 前記サイドフィル用熱硬化性樹脂組成物が、エポキシ樹脂、硬化剤、硬化促進剤、無機充填剤、および前記有機酸を含有するエポキシ樹脂組成物であることを特徴とする請求項5に記載の半導体部品の実装構造。
- 前記有機酸が、アジピン酸、アビエチン酸、およびセバシン酸から選ばれる少なくとも一種であることを特徴とする請求項5または6に記載の半導体部品の実装構造。
- 請求項5から7のいずれか一項に記載の半導体部品の実装構造を備えることを特徴とする回路装置。
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