JP2005031684A - プラズマディスプレイパネルの接続構造及び接続方法 - Google Patents

プラズマディスプレイパネルの接続構造及び接続方法 Download PDF

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Publication number
JP2005031684A
JP2005031684A JP2004203508A JP2004203508A JP2005031684A JP 2005031684 A JP2005031684 A JP 2005031684A JP 2004203508 A JP2004203508 A JP 2004203508A JP 2004203508 A JP2004203508 A JP 2004203508A JP 2005031684 A JP2005031684 A JP 2005031684A
Authority
JP
Japan
Prior art keywords
electrode
panel
connection
substrate
plasma display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004203508A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005031684A5 (enExample
Inventor
Yong Gi Choi
チョイ，ヨン・ギ
Soon Hak Kim
キム，スーン・ハク
Seung Tea Park
パク，セウン・テ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
Original Assignee
LG Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Electronics Inc filed Critical LG Electronics Inc
Publication of JP2005031684A publication Critical patent/JP2005031684A/ja
Publication of JP2005031684A5 publication Critical patent/JP2005031684A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/46—Connecting or feeding means, e.g. leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/22—Electrodes, e.g. special shape, material or configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Gas-Filled Discharge Tubes (AREA)
JP2004203508A 2003-07-09 2004-07-09 プラズマディスプレイパネルの接続構造及び接続方法 Pending JP2005031684A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2003-0046330A KR100512992B1 (ko) 2003-07-09 2003-07-09 플라즈마 디스플레이 패널의 접속 구조 및 방법

Publications (2)

Publication Number Publication Date
JP2005031684A true JP2005031684A (ja) 2005-02-03
JP2005031684A5 JP2005031684A5 (enExample) 2007-08-23

Family

ID=33448367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004203508A Pending JP2005031684A (ja) 2003-07-09 2004-07-09 プラズマディスプレイパネルの接続構造及び接続方法

Country Status (5)

Country Link
US (1) US7211951B2 (enExample)
EP (1) EP1496537B1 (enExample)
JP (1) JP2005031684A (enExample)
KR (1) KR100512992B1 (enExample)
CN (1) CN100350542C (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006227622A (ja) * 2005-02-17 2006-08-31 Lg Electronics Inc コネクターを含むプラズマディスプレイ装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100715877B1 (ko) * 2005-09-14 2007-05-08 (주)아이디에스 요철형상의 커버레이 필름이 적층된 아웃터리드를 구비한연성회로기판
JP5128773B2 (ja) * 2006-01-23 2013-01-23 日本電気株式会社 液晶表示装置の製造方法
KR100777732B1 (ko) * 2006-03-02 2007-11-19 삼성에스디아이 주식회사 플라즈마 디스플레이 패널
KR20090057719A (ko) * 2007-12-03 2009-06-08 엘지전자 주식회사 플라즈마 디스플레이 장치
TW201123377A (en) * 2009-12-16 2011-07-01 Raydium Semiconductor Corp Electronic chip and substrate with void
US10172241B2 (en) * 2013-09-13 2019-01-01 Korea Advanced Institute Of Science And Technology Method for packaging flexible device using holding wafer, and flexible device manufactured by the same
CN104754866B (zh) * 2013-12-27 2019-01-04 昆山国显光电有限公司 柔性印刷电路板及其制造方法和平板显示器
EP3035117A1 (fr) * 2014-12-16 2016-06-22 Gemalto Sa Procédé de fabrication d'un dispositif d'affichage
KR102662413B1 (ko) * 2017-12-29 2024-04-30 엘지디스플레이 주식회사 표시 패널용 전극 접속 구조
KR20200145877A (ko) * 2019-06-19 2020-12-31 삼성디스플레이 주식회사 표시 장치, 칩온 필름의 제조 장치, 및 칩온 필름의 제조 방법

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5085297A (enExample) * 1973-11-29 1975-07-09
JPH05190612A (ja) * 1992-01-14 1993-07-30 Matsushita Electric Ind Co Ltd 熱圧着方法および圧着用部材
JPH09223762A (ja) * 1996-01-17 1997-08-26 Internatl Business Mach Corp <Ibm> 表面実装コンポーネントを交換するコンピュータ・システムおよびソケット
JPH1116502A (ja) * 1997-04-30 1999-01-22 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの電極接合方法
JPH1140064A (ja) * 1997-07-25 1999-02-12 Hitachi Ltd ガス放電型表示パネルおよびそれを用いた表示装置
JPH11202792A (ja) * 1998-01-19 1999-07-30 Enplas Corp 表示パネル検査用ソケット
JPH11273577A (ja) * 1998-03-20 1999-10-08 Dainippon Printing Co Ltd プラズマディスプレイパネルの電極端子部
JP2000269475A (ja) * 1999-01-14 2000-09-29 Sharp Corp 二次元画像検出器およびアクティブマトリクス基板並びに表示装置
JP2002108231A (ja) * 2000-09-27 2002-04-10 Fujitsu Ltd 接続部材とマトリックス型表示装置
JP2006276881A (ja) * 1997-04-30 2006-10-12 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2896458B2 (ja) * 1996-09-02 1999-05-31 株式会社日立製作所 フラットパネル表示装置
US6086441A (en) * 1997-04-30 2000-07-11 Matsushita Electric Industrial Co., Ltd. Method for connecting electrodes of plasma display panel
JP3705914B2 (ja) * 1998-01-27 2005-10-12 三菱電機株式会社 面放電型プラズマディスプレイパネル及びその製造方法
JP3259771B2 (ja) * 1999-01-25 2002-02-25 日本電気株式会社 プラズマディスプレイパネル
JP2001305570A (ja) * 2000-04-24 2001-10-31 Nec Corp 表示パネルモジュール及びその製造方法
JP4107787B2 (ja) 2000-06-09 2008-06-25 パイオニア株式会社 プラズマディスプレイパネル及びその製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5085297A (enExample) * 1973-11-29 1975-07-09
JPH05190612A (ja) * 1992-01-14 1993-07-30 Matsushita Electric Ind Co Ltd 熱圧着方法および圧着用部材
JPH09223762A (ja) * 1996-01-17 1997-08-26 Internatl Business Mach Corp <Ibm> 表面実装コンポーネントを交換するコンピュータ・システムおよびソケット
JPH1116502A (ja) * 1997-04-30 1999-01-22 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの電極接合方法
JP2006276881A (ja) * 1997-04-30 2006-10-12 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの製造方法
JPH1140064A (ja) * 1997-07-25 1999-02-12 Hitachi Ltd ガス放電型表示パネルおよびそれを用いた表示装置
JPH11202792A (ja) * 1998-01-19 1999-07-30 Enplas Corp 表示パネル検査用ソケット
JPH11273577A (ja) * 1998-03-20 1999-10-08 Dainippon Printing Co Ltd プラズマディスプレイパネルの電極端子部
JP2000269475A (ja) * 1999-01-14 2000-09-29 Sharp Corp 二次元画像検出器およびアクティブマトリクス基板並びに表示装置
JP2002108231A (ja) * 2000-09-27 2002-04-10 Fujitsu Ltd 接続部材とマトリックス型表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006227622A (ja) * 2005-02-17 2006-08-31 Lg Electronics Inc コネクターを含むプラズマディスプレイ装置
US8011989B2 (en) 2005-02-17 2011-09-06 Lg Electronics Inc. Method of making a plasma display panel with a novel connection structure

Also Published As

Publication number Publication date
CN100350542C (zh) 2007-11-21
US7211951B2 (en) 2007-05-01
EP1496537B1 (en) 2013-01-09
EP1496537A2 (en) 2005-01-12
KR100512992B1 (ko) 2005-09-05
CN1599005A (zh) 2005-03-23
US20050006650A1 (en) 2005-01-13
EP1496537A3 (en) 2007-07-25
KR20050006496A (ko) 2005-01-17

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