CN100350542C - 等离子体显示面板的连接结构和连接方法 - Google Patents

等离子体显示面板的连接结构和连接方法 Download PDF

Info

Publication number
CN100350542C
CN100350542C CNB2004100900054A CN200410090005A CN100350542C CN 100350542 C CN100350542 C CN 100350542C CN B2004100900054 A CNB2004100900054 A CN B2004100900054A CN 200410090005 A CN200410090005 A CN 200410090005A CN 100350542 C CN100350542 C CN 100350542C
Authority
CN
China
Prior art keywords
electrode
substrate
panel
syndeton
connection electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100900054A
Other languages
English (en)
Chinese (zh)
Other versions
CN1599005A (zh
Inventor
崔容箕
金淳学
朴承泰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
Original Assignee
LG Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Electronics Inc filed Critical LG Electronics Inc
Publication of CN1599005A publication Critical patent/CN1599005A/zh
Application granted granted Critical
Publication of CN100350542C publication Critical patent/CN100350542C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/46—Connecting or feeding means, e.g. leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/22—Electrodes, e.g. special shape, material or configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Gas-Filled Discharge Tubes (AREA)
CNB2004100900054A 2003-07-09 2004-07-09 等离子体显示面板的连接结构和连接方法 Expired - Fee Related CN100350542C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR46330/2003 2003-07-09
KR46330/03 2003-07-09
KR10-2003-0046330A KR100512992B1 (ko) 2003-07-09 2003-07-09 플라즈마 디스플레이 패널의 접속 구조 및 방법

Publications (2)

Publication Number Publication Date
CN1599005A CN1599005A (zh) 2005-03-23
CN100350542C true CN100350542C (zh) 2007-11-21

Family

ID=33448367

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100900054A Expired - Fee Related CN100350542C (zh) 2003-07-09 2004-07-09 等离子体显示面板的连接结构和连接方法

Country Status (5)

Country Link
US (1) US7211951B2 (enExample)
EP (1) EP1496537B1 (enExample)
JP (1) JP2005031684A (enExample)
KR (1) KR100512992B1 (enExample)
CN (1) CN100350542C (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104754866A (zh) * 2013-12-27 2015-07-01 昆山国显光电有限公司 柔性印刷电路板及其制造方法和平板显示器

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100718963B1 (ko) * 2005-02-17 2007-05-16 엘지전자 주식회사 플라즈마 디스플레이 패널의 씨오에프/티씨피 패키지
KR100715877B1 (ko) * 2005-09-14 2007-05-08 (주)아이디에스 요철형상의 커버레이 필름이 적층된 아웃터리드를 구비한연성회로기판
JP5128773B2 (ja) * 2006-01-23 2013-01-23 日本電気株式会社 液晶表示装置の製造方法
KR100777732B1 (ko) * 2006-03-02 2007-11-19 삼성에스디아이 주식회사 플라즈마 디스플레이 패널
KR20090057719A (ko) * 2007-12-03 2009-06-08 엘지전자 주식회사 플라즈마 디스플레이 장치
TW201123377A (en) * 2009-12-16 2011-07-01 Raydium Semiconductor Corp Electronic chip and substrate with void
US10172241B2 (en) * 2013-09-13 2019-01-01 Korea Advanced Institute Of Science And Technology Method for packaging flexible device using holding wafer, and flexible device manufactured by the same
EP3035117A1 (fr) * 2014-12-16 2016-06-22 Gemalto Sa Procédé de fabrication d'un dispositif d'affichage
KR102662413B1 (ko) * 2017-12-29 2024-04-30 엘지디스플레이 주식회사 표시 패널용 전극 접속 구조
KR20200145877A (ko) 2019-06-19 2020-12-31 삼성디스플레이 주식회사 표시 장치, 칩온 필름의 제조 장치, 및 칩온 필름의 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09179505A (ja) * 1996-09-02 1997-07-11 Hitachi Ltd フラットパネル表示装置
JP2000215818A (ja) * 1999-01-25 2000-08-04 Nec Corp プラズマディスプレイパネル
JP2001351535A (ja) * 2000-06-09 2001-12-21 Nec Corp プラズマディスプレイパネル及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5085297A (enExample) * 1973-11-29 1975-07-09
JP2827650B2 (ja) * 1992-01-14 1998-11-25 松下電器産業株式会社 熱圧着方法および圧着用部材
US5785535A (en) * 1996-01-17 1998-07-28 International Business Machines Corporation Computer system with surface mount socket
JP2006276881A (ja) * 1997-04-30 2006-10-12 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの製造方法
US6086441A (en) * 1997-04-30 2000-07-11 Matsushita Electric Industrial Co., Ltd. Method for connecting electrodes of plasma display panel
JP3492195B2 (ja) * 1997-04-30 2004-02-03 松下電器産業株式会社 プラズマディスプレイパネルの電極接合方法
JPH1140064A (ja) * 1997-07-25 1999-02-12 Hitachi Ltd ガス放電型表示パネルおよびそれを用いた表示装置
JP3561137B2 (ja) * 1998-01-19 2004-09-02 株式会社エンプラス 表示パネル検査用ソケット
JP3705914B2 (ja) * 1998-01-27 2005-10-12 三菱電機株式会社 面放電型プラズマディスプレイパネル及びその製造方法
JPH11273577A (ja) * 1998-03-20 1999-10-08 Dainippon Printing Co Ltd プラズマディスプレイパネルの電極端子部
JP3462135B2 (ja) * 1999-01-14 2003-11-05 シャープ株式会社 二次元画像検出器およびアクティブマトリクス基板並びに表示装置
JP2001305570A (ja) * 2000-04-24 2001-10-31 Nec Corp 表示パネルモジュール及びその製造方法
JP2002108231A (ja) * 2000-09-27 2002-04-10 Fujitsu Ltd 接続部材とマトリックス型表示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09179505A (ja) * 1996-09-02 1997-07-11 Hitachi Ltd フラットパネル表示装置
JP2000215818A (ja) * 1999-01-25 2000-08-04 Nec Corp プラズマディスプレイパネル
JP2001351535A (ja) * 2000-06-09 2001-12-21 Nec Corp プラズマディスプレイパネル及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104754866A (zh) * 2013-12-27 2015-07-01 昆山国显光电有限公司 柔性印刷电路板及其制造方法和平板显示器
CN104754866B (zh) * 2013-12-27 2019-01-04 昆山国显光电有限公司 柔性印刷电路板及其制造方法和平板显示器

Also Published As

Publication number Publication date
JP2005031684A (ja) 2005-02-03
KR100512992B1 (ko) 2005-09-05
EP1496537B1 (en) 2013-01-09
EP1496537A3 (en) 2007-07-25
US20050006650A1 (en) 2005-01-13
KR20050006496A (ko) 2005-01-17
US7211951B2 (en) 2007-05-01
CN1599005A (zh) 2005-03-23
EP1496537A2 (en) 2005-01-12

Similar Documents

Publication Publication Date Title
CN100350542C (zh) 等离子体显示面板的连接结构和连接方法
CN1196957C (zh) 液晶显示装置
CN1292290C (zh) 与膜型触摸板结合的液晶显示装置的制造方法
CN1048359C (zh) 具有端子排的弹性接线板及其与电路板的连接结构
CN1158566C (zh) 显示装置及具有该显示装置的电子机器
CN1387633A (zh) 液晶显示装置
CN1256476A (zh) 矩阵型显示装置及其制造方法和热压键合头
CN1913117A (zh) 增进电子线路布局效益的方法、电子连接器及电子面板
CN1680846A (zh) 平面显示面板及其组装方法
CN1629917A (zh) 驱动芯片及具有该驱动芯片的显示装置
CN1624733A (zh) 互连器和等离子体显示装置以及其制造方法
CN1926643A (zh) 绝缘导电颗粒以及包含这种颗粒的各向异性导电薄膜
CN1721931A (zh) 柔性膜的结合方法和由此结合的显示器
CN1505455A (zh) 导电配线的连接构造
KR101000455B1 (ko) 구동 칩 및 이를 갖는 표시장치
CN1976557A (zh) 电路基板装置及基板间的连接方法
CN1811864A (zh) 平板显示器及其制造方法
CN1855631A (zh) 连接器及连接于该连接器的印刷衬底
CN101059740A (zh) 触摸面板及其制造方法
CN1179609C (zh) 压接连接衬底、液晶装置及电子设备
CN1694590A (zh) 双屏显示器装置及其制造方法
CN1260600C (zh) 连接器以及带这种连接器的背光组件灯装置和液晶显示器
CN1801252A (zh) 等离子体显示装置
CN1599006A (zh) 等离子体显示面板的连接部件以及驱动装置
CN1761382A (zh) 等离子体显示装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20071121

Termination date: 20140709

EXPY Termination of patent right or utility model