KR100512992B1 - 플라즈마 디스플레이 패널의 접속 구조 및 방법 - Google Patents

플라즈마 디스플레이 패널의 접속 구조 및 방법 Download PDF

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Publication number
KR100512992B1
KR100512992B1 KR10-2003-0046330A KR20030046330A KR100512992B1 KR 100512992 B1 KR100512992 B1 KR 100512992B1 KR 20030046330 A KR20030046330 A KR 20030046330A KR 100512992 B1 KR100512992 B1 KR 100512992B1
Authority
KR
South Korea
Prior art keywords
substrate
panel
electrode
connection
plasma display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2003-0046330A
Other languages
English (en)
Korean (ko)
Other versions
KR20050006496A (ko
Inventor
최용기
김순학
박승태
Original Assignee
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지전자 주식회사 filed Critical 엘지전자 주식회사
Priority to KR10-2003-0046330A priority Critical patent/KR100512992B1/ko
Priority to US10/885,695 priority patent/US7211951B2/en
Priority to EP04254128A priority patent/EP1496537B1/en
Priority to CNB2004100900054A priority patent/CN100350542C/zh
Priority to JP2004203508A priority patent/JP2005031684A/ja
Publication of KR20050006496A publication Critical patent/KR20050006496A/ko
Application granted granted Critical
Publication of KR100512992B1 publication Critical patent/KR100512992B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/46—Connecting or feeding means, e.g. leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/22—Electrodes, e.g. special shape, material or configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Gas-Filled Discharge Tubes (AREA)
KR10-2003-0046330A 2003-07-09 2003-07-09 플라즈마 디스플레이 패널의 접속 구조 및 방법 Expired - Fee Related KR100512992B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR10-2003-0046330A KR100512992B1 (ko) 2003-07-09 2003-07-09 플라즈마 디스플레이 패널의 접속 구조 및 방법
US10/885,695 US7211951B2 (en) 2003-07-09 2004-07-08 Connection structure and method of plasma display panel
EP04254128A EP1496537B1 (en) 2003-07-09 2004-07-09 Connection structure and method of plasma display panel
CNB2004100900054A CN100350542C (zh) 2003-07-09 2004-07-09 等离子体显示面板的连接结构和连接方法
JP2004203508A JP2005031684A (ja) 2003-07-09 2004-07-09 プラズマディスプレイパネルの接続構造及び接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2003-0046330A KR100512992B1 (ko) 2003-07-09 2003-07-09 플라즈마 디스플레이 패널의 접속 구조 및 방법

Publications (2)

Publication Number Publication Date
KR20050006496A KR20050006496A (ko) 2005-01-17
KR100512992B1 true KR100512992B1 (ko) 2005-09-05

Family

ID=33448367

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-0046330A Expired - Fee Related KR100512992B1 (ko) 2003-07-09 2003-07-09 플라즈마 디스플레이 패널의 접속 구조 및 방법

Country Status (5)

Country Link
US (1) US7211951B2 (enExample)
EP (1) EP1496537B1 (enExample)
JP (1) JP2005031684A (enExample)
KR (1) KR100512992B1 (enExample)
CN (1) CN100350542C (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020256533A1 (ko) * 2019-06-19 2020-12-24 삼성디스플레이 주식회사 표시 장치, 칩온 필름의 제조 장치, 및 칩온 필름의 제조 방법

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100718963B1 (ko) * 2005-02-17 2007-05-16 엘지전자 주식회사 플라즈마 디스플레이 패널의 씨오에프/티씨피 패키지
KR100715877B1 (ko) * 2005-09-14 2007-05-08 (주)아이디에스 요철형상의 커버레이 필름이 적층된 아웃터리드를 구비한연성회로기판
JP5128773B2 (ja) * 2006-01-23 2013-01-23 日本電気株式会社 液晶表示装置の製造方法
KR100777732B1 (ko) * 2006-03-02 2007-11-19 삼성에스디아이 주식회사 플라즈마 디스플레이 패널
KR20090057719A (ko) * 2007-12-03 2009-06-08 엘지전자 주식회사 플라즈마 디스플레이 장치
TW201123377A (en) * 2009-12-16 2011-07-01 Raydium Semiconductor Corp Electronic chip and substrate with void
US10172241B2 (en) * 2013-09-13 2019-01-01 Korea Advanced Institute Of Science And Technology Method for packaging flexible device using holding wafer, and flexible device manufactured by the same
CN104754866B (zh) * 2013-12-27 2019-01-04 昆山国显光电有限公司 柔性印刷电路板及其制造方法和平板显示器
EP3035117A1 (fr) * 2014-12-16 2016-06-22 Gemalto Sa Procédé de fabrication d'un dispositif d'affichage
KR102662413B1 (ko) * 2017-12-29 2024-04-30 엘지디스플레이 주식회사 표시 패널용 전극 접속 구조

Family Cites Families (16)

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JPS5085297A (enExample) * 1973-11-29 1975-07-09
JP2827650B2 (ja) * 1992-01-14 1998-11-25 松下電器産業株式会社 熱圧着方法および圧着用部材
US5785535A (en) * 1996-01-17 1998-07-28 International Business Machines Corporation Computer system with surface mount socket
JP2896458B2 (ja) * 1996-09-02 1999-05-31 株式会社日立製作所 フラットパネル表示装置
US6086441A (en) * 1997-04-30 2000-07-11 Matsushita Electric Industrial Co., Ltd. Method for connecting electrodes of plasma display panel
JP3492195B2 (ja) * 1997-04-30 2004-02-03 松下電器産業株式会社 プラズマディスプレイパネルの電極接合方法
JP2006276881A (ja) * 1997-04-30 2006-10-12 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの製造方法
JPH1140064A (ja) * 1997-07-25 1999-02-12 Hitachi Ltd ガス放電型表示パネルおよびそれを用いた表示装置
JP3561137B2 (ja) * 1998-01-19 2004-09-02 株式会社エンプラス 表示パネル検査用ソケット
JP3705914B2 (ja) * 1998-01-27 2005-10-12 三菱電機株式会社 面放電型プラズマディスプレイパネル及びその製造方法
JPH11273577A (ja) * 1998-03-20 1999-10-08 Dainippon Printing Co Ltd プラズマディスプレイパネルの電極端子部
JP3462135B2 (ja) * 1999-01-14 2003-11-05 シャープ株式会社 二次元画像検出器およびアクティブマトリクス基板並びに表示装置
JP3259771B2 (ja) * 1999-01-25 2002-02-25 日本電気株式会社 プラズマディスプレイパネル
JP2001305570A (ja) * 2000-04-24 2001-10-31 Nec Corp 表示パネルモジュール及びその製造方法
JP4107787B2 (ja) 2000-06-09 2008-06-25 パイオニア株式会社 プラズマディスプレイパネル及びその製造方法
JP2002108231A (ja) * 2000-09-27 2002-04-10 Fujitsu Ltd 接続部材とマトリックス型表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020256533A1 (ko) * 2019-06-19 2020-12-24 삼성디스플레이 주식회사 표시 장치, 칩온 필름의 제조 장치, 및 칩온 필름의 제조 방법
US12389766B2 (en) 2019-06-19 2025-08-12 Samsung Display Co., Ltd. Display device, manufacturing apparatus of chip on film, and manufacturing method of chip on film

Also Published As

Publication number Publication date
CN100350542C (zh) 2007-11-21
US7211951B2 (en) 2007-05-01
EP1496537B1 (en) 2013-01-09
EP1496537A2 (en) 2005-01-12
JP2005031684A (ja) 2005-02-03
CN1599005A (zh) 2005-03-23
US20050006650A1 (en) 2005-01-13
EP1496537A3 (en) 2007-07-25
KR20050006496A (ko) 2005-01-17

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