CN1926643A - 绝缘导电颗粒以及包含这种颗粒的各向异性导电薄膜 - Google Patents
绝缘导电颗粒以及包含这种颗粒的各向异性导电薄膜 Download PDFInfo
- Publication number
- CN1926643A CN1926643A CNA2004800319670A CN200480031967A CN1926643A CN 1926643 A CN1926643 A CN 1926643A CN A2004800319670 A CNA2004800319670 A CN A2004800319670A CN 200480031967 A CN200480031967 A CN 200480031967A CN 1926643 A CN1926643 A CN 1926643A
- Authority
- CN
- China
- Prior art keywords
- conductive particle
- layer
- methyl
- insulated conductive
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0233—Deformable particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Insulated Conductors (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
实例 | ||||||
1 | 2 | 3 | 4 | 5 | 6 | |
每平方毫米(mm2)绝缘导电颗粒的数量 | 20,000 | 30,000 | 30,000 | 40,000 | 40,000 | 50,000 |
绝缘导电颗粒的大小(μm) | 5.0 | 5.0 | 4.5 | 4.5 | 4.0 | 4.0 |
最外层绝缘层的厚度(最外层的厚度/包括Ni层和Au层的基体树脂的粒径) | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
IC凸点的面积(μm2) | 3,000 | 3,000 | 3,000 | 3,000 | 3,000 | 3,000 |
电连接可靠性 | △ | ◎ | ◎ | ◎ | ◎ | ◎ |
连接电阻值的增加◎:不大于0.1Ω,△:大于0.1Ω不大于0.3Ω,×:大于0.3Ω |
绝缘可靠性 | ◎ | ◎ | × | ◎ | ◎ | ◎ |
◎:大于1010Ω,×:不大于1010Ω |
对比实例 | ||||||
1 | 2 | 3 | ||||
每平方毫米(mm2)绝缘导电颗粒的数量 | 30,000 | 40,000 | 50,000 | |||
绝缘树脂层 | - | 丙烯酸树脂 | PVA树脂 | |||
最外绝缘层的厚度(最外层的厚度/导电颗粒的大小) | - | 0.05 | 0.05 | |||
用于评价电连接可靠性的IC凸点的面积(μm2) | 3,000 | 3,000 | 3,000 | |||
电连接的可靠性 | △ | △ | × | |||
连接电阻值的增加◎:不大于0.1Ω,△:大于0.1Ω不大于0.3Ω,×:大于0.3Ω | ||||||
绝缘可靠性 | × | × | ◎ | |||
◎:大于1010Ω,×:不大于1010Ω |
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20030078316 | 2003-11-06 | ||
KR1020030078316 | 2003-11-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1926643A true CN1926643A (zh) | 2007-03-07 |
CN100533603C CN100533603C (zh) | 2009-08-26 |
Family
ID=34567673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800319670A Active CN100533603C (zh) | 2003-11-06 | 2004-11-05 | 绝缘导电颗粒以及包含这种颗粒的各向异性导电薄膜 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060263581A1 (zh) |
JP (1) | JP4863490B2 (zh) |
KR (1) | KR100621463B1 (zh) |
CN (1) | CN100533603C (zh) |
WO (1) | WO2005045851A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103730192A (zh) * | 2012-10-16 | 2014-04-16 | 鸿富锦精密工业(深圳)有限公司 | 各向异性导电膜及其制备方法 |
CN106775048A (zh) * | 2015-11-20 | 2017-05-31 | 三星显示有限公司 | 触摸感测单元 |
CN111051894A (zh) * | 2017-08-31 | 2020-04-21 | 株式会社Isc | 测试插座以及导电颗粒 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100667374B1 (ko) | 2004-12-16 | 2007-01-10 | 제일모직주식회사 | 이방전도성 접속부재용 고분자 수지 미립자, 전도성 미립자 및 이를 포함한 이방 전도성 접속재료 |
KR100650284B1 (ko) * | 2005-02-22 | 2006-11-27 | 제일모직주식회사 | 도전성능이 우수한 고분자 수지 미립자, 전도성 미립자 및이를 포함한 이방 전도성 접속재료 |
KR100720895B1 (ko) | 2005-07-05 | 2007-05-22 | 제일모직주식회사 | 농도 구배를 갖는 이종(異種) 복합 금속층이 형성된 전도성미립자, 그 제조방법 및 이를 이용한 이방 전도성 접착제조성물 |
JP2007041389A (ja) | 2005-08-04 | 2007-02-15 | Nec Lcd Technologies Ltd | 表示装置及びその製造方法 |
KR100765363B1 (ko) * | 2005-10-31 | 2007-10-09 | 전자부품연구원 | 도전성 입자의 제조 방법 |
US20100065311A1 (en) * | 2006-07-03 | 2010-03-18 | Hitachi Chemical Company, Ltd. | Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member |
US20100110652A1 (en) * | 2006-09-26 | 2010-05-06 | Hitachi Chemical Company, Ltd. | Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles |
WO2008047600A1 (fr) * | 2006-10-17 | 2008-04-24 | Hitachi Chemical Company, Ltd. | particule revêtue et son procédé de fabrication, composition adhésive conductrice anisotrope utilisant la particule revêtue et film adhésif conducteur anisotrope |
KR100819524B1 (ko) * | 2007-01-25 | 2008-04-07 | 제일모직주식회사 | 절연 전도성 미립자 및 이를 이용한 이방 전도성 필름 |
JP5425636B2 (ja) | 2007-10-22 | 2014-02-26 | 日本化学工業株式会社 | 被覆導電性粉体およびそれを用いた導電性接着剤 |
WO2009054410A1 (ja) * | 2007-10-24 | 2009-04-30 | Hitachi Chemical Company, Ltd. | 導電粒子、回路接続材料及び接続構造体 |
JP5141456B2 (ja) * | 2007-10-24 | 2013-02-13 | 日立化成工業株式会社 | 回路接続材料及び接続構造体 |
JP2012003917A (ja) * | 2010-06-16 | 2012-01-05 | Sekisui Chem Co Ltd | 導電性粒子、異方性導電材料及び接続構造体 |
US8427775B2 (en) * | 2010-06-30 | 2013-04-23 | HGST Netherlands B.V. | Particle-capturing device including a component configured to provide an additional function within an enclosure exclusive of capturing particles |
US9475963B2 (en) | 2011-09-15 | 2016-10-25 | Trillion Science, Inc. | Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes |
WO2015163907A1 (en) | 2014-04-25 | 2015-10-29 | Hewlett-Packard Development Company, L.P. | Aligned particle layer |
US10649302B2 (en) | 2014-04-25 | 2020-05-12 | Hewlett-Packard Development Company, L.P. | Aligned particle coating |
KR20160046977A (ko) * | 2014-10-20 | 2016-05-02 | 삼성디스플레이 주식회사 | 이방성 도전입자 |
KR20160046621A (ko) * | 2014-10-21 | 2016-04-29 | 삼성전자주식회사 | 반도체 칩 패키지 테스트용 테스트 소켓 및 이의 제조 방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3786213A (en) * | 1971-02-22 | 1974-01-15 | Asea Ab | Electric switching device comprising insulating parts comprising an acrylate resin binder |
JPH0623349B2 (ja) * | 1986-01-30 | 1994-03-30 | 富士高分子工業株式会社 | 異方導電性接着剤 |
JPH0734325B2 (ja) * | 1989-07-17 | 1995-04-12 | 信越ポリマー株式会社 | 異方導電性接着剤用導電性粒子および異方導電性接着剤 |
JP2895872B2 (ja) * | 1989-09-26 | 1999-05-24 | 触媒化成工業株式会社 | 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板 |
JP2748705B2 (ja) * | 1991-02-14 | 1998-05-13 | 日立化成工業株式会社 | 回路の接続部材 |
JPH04269766A (ja) * | 1991-02-25 | 1992-09-25 | Mitsubishi Kasei Corp | 静電荷像現像用トナー |
JPH07105716A (ja) * | 1993-10-05 | 1995-04-21 | Soken Kagaku Kk | 被覆粒子および異方導電性接着剤 |
JPH07118617A (ja) * | 1993-10-22 | 1995-05-09 | Three Bond Co Ltd | ファインピッチ用異方導電性接着剤 |
JP3150054B2 (ja) * | 1994-10-13 | 2001-03-26 | 住友ベークライト株式会社 | 異方導電フィルム |
US5763388A (en) * | 1996-12-18 | 1998-06-09 | Dsm Copolymer, Inc. | Process for producing improved silica-reinforced masterbatch of polymers prepared in latex form |
US20010046021A1 (en) * | 1997-08-28 | 2001-11-29 | Takeshi Kozuka | A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device |
AUPP004497A0 (en) * | 1997-10-28 | 1997-11-20 | University Of Melbourne, The | Stabilized particles |
JP2003308728A (ja) * | 1998-07-16 | 2003-10-31 | Sony Chem Corp | 異方性導電接着剤用導電性粒子 |
JP2000090727A (ja) * | 1998-07-16 | 2000-03-31 | Sony Chem Corp | 異方性導電接着剤用導電性粒子 |
JP3816254B2 (ja) | 1999-01-25 | 2006-08-30 | 京セラケミカル株式会社 | 異方性導電接着剤 |
DE10102739A1 (de) * | 2001-01-23 | 2002-07-25 | Bayer Ag | Verfahren zur Herstellung von Sol-Gel-Kondensaten auf Basis polyfunktioneller Organosilane sowie deren Verwendung |
JP4108340B2 (ja) * | 2002-01-23 | 2008-06-25 | 宇部日東化成株式会社 | 導電性シリカ系粒子 |
-
2004
- 2004-11-02 KR KR1020040088203A patent/KR100621463B1/ko active IP Right Grant
- 2004-11-05 CN CNB2004800319670A patent/CN100533603C/zh active Active
- 2004-11-05 WO PCT/KR2004/002847 patent/WO2005045851A1/en active Application Filing
- 2004-11-05 JP JP2006537895A patent/JP4863490B2/ja active Active
-
2006
- 2006-05-05 US US11/429,390 patent/US20060263581A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103730192A (zh) * | 2012-10-16 | 2014-04-16 | 鸿富锦精密工业(深圳)有限公司 | 各向异性导电膜及其制备方法 |
CN106775048A (zh) * | 2015-11-20 | 2017-05-31 | 三星显示有限公司 | 触摸感测单元 |
CN111051894A (zh) * | 2017-08-31 | 2020-04-21 | 株式会社Isc | 测试插座以及导电颗粒 |
Also Published As
Publication number | Publication date |
---|---|
JP4863490B2 (ja) | 2012-01-25 |
KR100621463B1 (ko) | 2006-09-13 |
KR20050043639A (ko) | 2005-05-11 |
JP2007510268A (ja) | 2007-04-19 |
US20060263581A1 (en) | 2006-11-23 |
WO2005045851A1 (en) | 2005-05-19 |
CN100533603C (zh) | 2009-08-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1926643A (zh) | 绝缘导电颗粒以及包含这种颗粒的各向异性导电薄膜 | |
CN100514501C (zh) | 绝缘导电颗粒以及包含该颗粒的各向异性导电胶膜 | |
KR100932045B1 (ko) | 경화성 수지 조성물, 접착성 에폭시 수지 페이스트, 접착성에폭시 수지 시트, 도전 접속 페이스트, 도전 접속 시트및 전자 부품 접합체 | |
KR101246516B1 (ko) | 절연 피복 도전 입자 | |
KR101150116B1 (ko) | 회로 접속용 접착 필름, 회로 부재의 접속 구조 및 회로 부재의 접속 방법 | |
CN1218439C (zh) | 连接结构体、液晶装置、电子装置和各向异性导电性粘接剂及其制造方法 | |
CN1675754A (zh) | 微电极连接方法及基于其的连接结构 | |
CN1575096A (zh) | 电子电路装置及其制造方法 | |
CN1264943C (zh) | 连接材料 | |
US20170004901A1 (en) | Fixed-array anisotropic conductive film using conductive particles with block copolymer coating | |
CN1898764A (zh) | 电路连接构造及连接方法 | |
JP5099987B2 (ja) | 回路接続方法および接続構造体 | |
CN1252206C (zh) | 粘接剂和粘接膜 | |
TW202031117A (zh) | 電磁波遮蔽片以及電子零件搭載基板 | |
CN1356368A (zh) | 连接材料 | |
CN1429742A (zh) | 电子元件运送用覆盖带及其制造方法与电子元件运送体 | |
CN1461181A (zh) | 配线基板和使用它的电子装置 | |
CN1913752A (zh) | 混合多层电路基板的制造方法 | |
KR101922293B1 (ko) | 패턴화된 피접속부재를 포함하는 디스플레이 장치 및 이의 제조 방법 | |
KR20090073366A (ko) | 이방성 도전접속용 절연 도전성 입자 및 이를 이용한이방성 도전접속재료 | |
JP2006233201A (ja) | 異方性導電接着フィルム | |
KR100575262B1 (ko) | 절연 전도성 미립자 및 이를 함유하는 이방전도성 필름 | |
KR20100007035A (ko) | 이방성 도전 필름의 제조방법 및 이에 의해 제조된 이방성도전 필름 | |
JP2003068139A (ja) | 導電ペースト | |
KR20240019751A (ko) | 피복 입자, 피복 입자의 제조 방법, 수지 조성물 및 접속 구조체 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191206 Address after: Seoul, South Kerean Patentee after: Guo Duhuaxue(zhu) Address before: Han Guojingjidao Patentee before: Samsung SDI Co.,Ltd. Effective date of registration: 20191206 Address after: Han Guojingjidao Patentee after: Samsung SDI Co.,Ltd. Address before: Han Guoqingshangbeidao Patentee before: CHEIL INDUSTRIES Inc. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220913 Address after: Gyeonggi Do, South Korea Patentee after: Guo Dujianduansucai Address before: Seoul, South Kerean Patentee before: Guo Duhuaxue(zhu) |