CN113169147A - 显示面板以及显示模组 - Google Patents
显示面板以及显示模组 Download PDFInfo
- Publication number
- CN113169147A CN113169147A CN201880097608.7A CN201880097608A CN113169147A CN 113169147 A CN113169147 A CN 113169147A CN 201880097608 A CN201880097608 A CN 201880097608A CN 113169147 A CN113169147 A CN 113169147A
- Authority
- CN
- China
- Prior art keywords
- display panel
- bonding pads
- bonding
- conductive
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Abstract
一种显示面板和显示模组,显示面板上设有用于与绑定对象绑定的绑定区,绑定区上设有多个第一接合垫,绑定区上设有导线,第一接合垫的高度大于导线的高度。通过显示面板的第一接合垫以及绑定对象的第二接合垫的特有结构,能够有效地避免导电介质中的导电粒子直接压在导线上,避免造成显示面板线路短路或漏电。
Description
PCT国内申请,说明书已公开。
Claims (15)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2018/118986 WO2020113385A1 (zh) | 2018-12-03 | 2018-12-03 | 显示面板以及显示模组 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113169147A true CN113169147A (zh) | 2021-07-23 |
Family
ID=70973994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201880097608.7A Pending CN113169147A (zh) | 2018-12-03 | 2018-12-03 | 显示面板以及显示模组 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN113169147A (zh) |
WO (1) | WO2020113385A1 (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1510979A (zh) * | 2002-12-23 | 2004-07-07 | 矽统科技股份有限公司 | 无焊垫设计的高密度电路板及其制造方法 |
JP2005223123A (ja) * | 2004-02-05 | 2005-08-18 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
CN101459151A (zh) * | 2007-12-12 | 2009-06-17 | 群康科技(深圳)有限公司 | 焊接基板、采用该焊接基板的电子封装构造及其封装方法 |
CN107145016A (zh) * | 2017-07-13 | 2017-09-08 | 深圳市华星光电技术有限公司 | 阵列基板、液晶面板及显示设备及阵列基板的制作方法 |
CN108336077A (zh) * | 2017-12-13 | 2018-07-27 | 友达光电股份有限公司 | 像素阵列基板及其制造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100416343C (zh) * | 2004-01-21 | 2008-09-03 | 友达光电股份有限公司 | 增加金属连线可靠度的结构 |
-
2018
- 2018-12-03 WO PCT/CN2018/118986 patent/WO2020113385A1/zh active Application Filing
- 2018-12-03 CN CN201880097608.7A patent/CN113169147A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1510979A (zh) * | 2002-12-23 | 2004-07-07 | 矽统科技股份有限公司 | 无焊垫设计的高密度电路板及其制造方法 |
JP2005223123A (ja) * | 2004-02-05 | 2005-08-18 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
CN101459151A (zh) * | 2007-12-12 | 2009-06-17 | 群康科技(深圳)有限公司 | 焊接基板、采用该焊接基板的电子封装构造及其封装方法 |
CN107145016A (zh) * | 2017-07-13 | 2017-09-08 | 深圳市华星光电技术有限公司 | 阵列基板、液晶面板及显示设备及阵列基板的制作方法 |
CN108336077A (zh) * | 2017-12-13 | 2018-07-27 | 友达光电股份有限公司 | 像素阵列基板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2020113385A1 (zh) | 2020-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7208835B2 (en) | Integrated circuit package and assembly thereof | |
CN109523912B (zh) | 显示面板和显示装置 | |
KR100511121B1 (ko) | 반도체소자의접속구조및방법,그구조를이용한액정표시장치및그것을이용한전자기기 | |
CN106950763A (zh) | 显示模组及终端 | |
WO2012121113A1 (ja) | 電子回路基板、表示装置および配線基板 | |
CN109144320B (zh) | 显示面板和显示装置 | |
CN103269563B (zh) | 覆晶薄膜柔性电路板及显示装置 | |
CN104504998A (zh) | 一种显示面板及显示装置 | |
KR20140131813A (ko) | 분산 배치된 비아 플러그들을 포함하는 칩 온 필름 패키지 | |
JP2753549B2 (ja) | 液晶表示デバイス | |
CN113514989A (zh) | 显示面板和显示装置 | |
CN103972201A (zh) | 封装结构与显示模组 | |
KR100907576B1 (ko) | 전극 간 단락 방지용 반도체 디바이스 및 이를 이용한반도체 패키지 | |
CN110854292B (zh) | 一种显示装置及制作方法 | |
CN112993607A (zh) | 显示装置、显示装置的制造方法及印刷布线基板 | |
TW201241978A (en) | Flip chip device | |
CN109559643A (zh) | 一种显示面板 | |
CN113169147A (zh) | 显示面板以及显示模组 | |
JP2009295857A (ja) | Icチップと外部配線との接続構造およびicチップ | |
CN110783489B (zh) | 一种显示面板及其制备方法、显示装置 | |
JP2004134653A (ja) | 基板接続構造およびその基板接続構造を有する電子部品の製造方法 | |
JPH0529386A (ja) | 被着体の接続端子部の接続構造 | |
JP2008243947A (ja) | フレキシブル回路基板およびそれを用いた回路実装体 | |
KR101008824B1 (ko) | 고분자 입자가 부착된 전극을 구비한 반도체 디바이스 및이를 이용한 반도체 패키지 | |
JP3954152B2 (ja) | パネルの基板とフレキシブル配線板の接続構成及びそれを用いた液晶表示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210723 |