JP2004519544A - 低温高速硬化シリコーン組成物 - Google Patents

低温高速硬化シリコーン組成物 Download PDF

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Publication number
JP2004519544A
JP2004519544A JP2002571766A JP2002571766A JP2004519544A JP 2004519544 A JP2004519544 A JP 2004519544A JP 2002571766 A JP2002571766 A JP 2002571766A JP 2002571766 A JP2002571766 A JP 2002571766A JP 2004519544 A JP2004519544 A JP 2004519544A
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JP
Japan
Prior art keywords
composition
silicone
functional groups
catalyst
rhodium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002571766A
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English (en)
Japanese (ja)
Inventor
フィリップ エル クロップ
レスター ディー ベニングトン
ロバート ピー クロス
バーラム イサリ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Loctite Corp
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Henkel Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Loctite Corp filed Critical Henkel Loctite Corp
Publication of JP2004519544A publication Critical patent/JP2004519544A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2002571766A 2001-01-03 2001-11-19 低温高速硬化シリコーン組成物 Pending JP2004519544A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/753,837 US6573328B2 (en) 2001-01-03 2001-01-03 Low temperature, fast curing silicone compositions
PCT/US2001/043125 WO2002072704A2 (en) 2001-01-03 2001-11-19 Heat curable silicone compositions

Publications (1)

Publication Number Publication Date
JP2004519544A true JP2004519544A (ja) 2004-07-02

Family

ID=25032365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002571766A Pending JP2004519544A (ja) 2001-01-03 2001-11-19 低温高速硬化シリコーン組成物

Country Status (9)

Country Link
US (2) US6573328B2 (ko)
EP (1) EP1348007A2 (ko)
JP (1) JP2004519544A (ko)
KR (1) KR20020095187A (ko)
CN (1) CN1436215A (ko)
AU (1) AU2001297522A1 (ko)
CA (1) CA2402124A1 (ko)
MX (1) MXPA02011176A (ko)
WO (1) WO2002072704A2 (ko)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009263552A (ja) * 2008-04-28 2009-11-12 Shin Etsu Chem Co Ltd 加熱硬化型シリコーン組成物
WO2010010841A1 (ja) 2008-07-22 2010-01-28 電気化学工業株式会社 樹脂組成物
JP2012520375A (ja) * 2009-03-12 2012-09-06 ダウ コーニング コーポレーション 熱界面材料、並びに、その調製及び使用方法
WO2013035736A1 (ja) * 2011-09-08 2013-03-14 積水化学工業株式会社 光半導体装置用硬化性組成物
JP2013541610A (ja) * 2010-09-08 2013-11-14 モーメンティブ・パフォーマンス・マテリアルズ・インク 湿気硬化性オルガノポリシロキサン組成物
JP2017533335A (ja) * 2014-11-07 2017-11-09 ブルースター・シリコーンズ・フランス・エスアエス 新規のシリコーン組成物架橋用触媒
JP2020522382A (ja) * 2017-06-27 2020-07-30 ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー ヒドロシリル化における触媒としての白金化合物及びロジウム化合物の相乗的組み合わせ
JP2021503519A (ja) * 2017-11-16 2021-02-12 ダウ シリコーンズ コーポレーション １剤型硬化性シリコーン組成物

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0017468D0 (en) * 2000-07-18 2000-08-30 Dow Corning Silicone release coating compositions
US6674172B2 (en) * 2001-05-08 2004-01-06 International Business Machines Corporation Flip-chip package with underfill having low density filler
GB0224044D0 (en) * 2002-10-16 2002-11-27 Dow Corning Silicone resins
DE102004049663B3 (de) * 2004-10-11 2006-04-13 Infineon Technologies Ag Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie Verfahren zur Herstellung derselben
US20060134440A1 (en) * 2004-10-27 2006-06-22 Crivello James V Silicone encapsulants for light emitting diodes
DE102004062351A1 (de) * 2004-12-23 2006-07-06 Wacker Chemie Ag Schwerbrennbarer Siliconkautschuk
US20060286389A1 (en) 2005-06-17 2006-12-21 Crawford Emmett D Protein-resistant articles comprising cyclobutanediol
US20100184940A1 (en) * 2005-03-02 2010-07-22 Eastman Chemical Company Polyester Compositions Which Comprise Cyclobutanediol and Certain Thermal Stabilizers, and/or Reaction Products Thereof
EP1861246B1 (en) 2005-03-25 2017-03-29 Encapsys, Llc Adhesively securable stock packaging materials
US7704605B2 (en) * 2006-03-28 2010-04-27 Eastman Chemical Company Thermoplastic articles comprising cyclobutanediol having a decorative material embedded therein
US8586701B2 (en) * 2005-10-28 2013-11-19 Eastman Chemical Company Process for the preparation of copolyesters based on 2,2,4,4-tetramethyl-1,3-cyclobutanediol and 1,4-cyclohexanedimethanol
US8193302B2 (en) 2005-10-28 2012-06-05 Eastman Chemical Company Polyester compositions which comprise cyclobutanediol and certain phosphate thermal stabilizers, and/or reaction products thereof
ATE486904T1 (de) * 2005-10-28 2010-11-15 Eastman Chem Co Cyclobutanediol-haltige polyesterzusammensetzungen mit einer bestimmten kombination aus inhärenter viskosität und gemässigter glasübergangstemperatur sowie daraus hergestellte artikel
US20070106054A1 (en) * 2005-10-28 2007-05-10 Crawford Emmett D Polyester compositions containing cyclobutanediol having a certain combination of inherent viscosity and high glass transition temperature and articles made therefrom
US7767754B2 (en) * 2005-11-08 2010-08-03 Momentive Performance Materials Inc. Silicone composition and process of making same
US9598533B2 (en) 2005-11-22 2017-03-21 Eastman Chemical Company Polyester compositions containing cyclobutanediol having a certain combination of inherent viscosity and moderate glass transition temperature and articles made therefrom
US7737246B2 (en) * 2005-12-15 2010-06-15 Eastman Chemical Company Polyester compositions which comprise cyclobutanediol, cyclohexanedimethanol, and ethylene glycol and manufacturing processes therefor
US9169388B2 (en) 2006-03-28 2015-10-27 Eastman Chemical Company Polyester compositions which comprise cyclobutanediol and certain thermal stabilizers, and/or reaction products thereof
US20080158298A1 (en) * 2006-12-28 2008-07-03 Serbicki Jeffrey P Printhead wirebond encapsulation
CN101790561A (zh) * 2007-07-18 2010-07-28 洛德公司 导热性底层填料配制物
EP2183312A1 (en) * 2007-08-31 2010-05-12 Cabot Corporation Thermal interface materials
US8501287B2 (en) 2007-11-21 2013-08-06 Eastman Chemical Company Plastic baby bottles, other blow molded articles, and processes for their manufacture
KR101895184B1 (ko) 2007-11-21 2018-09-04 이스트만 케미칼 컴파니 플라스틱 젖병, 다른 취입 성형된 제품, 및 이들의 제조 방법
EP2247665A2 (en) * 2008-02-25 2010-11-10 Honeywell International Inc. Processable inorganic and organic polymer formulations, methods of production and uses thereof
WO2009131913A2 (en) * 2008-04-21 2009-10-29 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof
JP5561454B2 (ja) * 2008-05-23 2014-07-30 スリーボンドファインケミカル株式会社 硬化型樹脂組成物
US8198371B2 (en) 2008-06-27 2012-06-12 Eastman Chemical Company Blends of polyesters and ABS copolymers
US20100099828A1 (en) * 2008-10-21 2010-04-22 Eastman Chemical Company Clear Binary Blends of Aliphatic Polyesters and Aliphatic-Aromatic Polyesters
DE102008043316A1 (de) * 2008-10-30 2010-05-06 Wacker Chemie Ag Verfahren zur Herstellung von Siliconformkörpern aus durch Licht vernetzbaren Siliconmischungen
US8895654B2 (en) * 2008-12-18 2014-11-25 Eastman Chemical Company Polyester compositions which comprise spiro-glycol, cyclohexanedimethanol, and terephthalic acid
DE102009027847A1 (de) * 2009-07-20 2011-01-27 Wacker Chemie Ag Härtbare Siliconzusammensetzungen
EP2563865B1 (en) 2010-04-28 2016-06-01 3M Innovative Properties Company Articles including nanosilica-based primers for polymer coatings and methods
JP5745036B2 (ja) 2010-04-28 2015-07-08 スリーエム イノベイティブ プロパティズ カンパニー シリコーン系材料
CN101921489A (zh) * 2010-08-24 2010-12-22 烟台德邦电子材料有限公司 一种高分子导热复合材料及其制备方法
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US8394997B2 (en) 2010-12-09 2013-03-12 Eastman Chemical Company Process for the isomerization of 2,2,4,4-tetraalkylcyclobutane-1,3-diols
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US9080084B2 (en) 2011-07-25 2015-07-14 Henkel IP & Holding GmbH Photolytically induced redox curable compositions
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US20130217830A1 (en) 2012-02-16 2013-08-22 Eastman Chemical Company Clear Semi-Crystalline Articles with Improved Heat Resistance
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WO2015084778A1 (en) 2013-12-05 2015-06-11 Honeywell International Inc. Stannous methansulfonate solution with adjusted ph
KR102282332B1 (ko) 2014-07-07 2021-07-27 허니웰 인터내셔날 인코포레이티드 이온 스캐빈저를 갖는 열 계면 재료
KR20170091669A (ko) 2014-12-05 2017-08-09 허니웰 인터내셔널 인코포레이티드 저열 임피던스를 갖는 고성능 열 계면 재료
FR3029924B1 (fr) * 2014-12-15 2016-12-09 Univ Claude Bernard Lyon Materiaux anisotropes obtenus par hydrosilylation, leur procede de preparation et leur utilisation
TW201638223A (zh) * 2015-03-31 2016-11-01 羅傑斯公司 雙溫度固化型聚矽氧組合物、其製造方法及由其製備之物件
EP3194502A4 (en) 2015-04-13 2018-05-16 Honeywell International Inc. Polysiloxane formulations and coatings for optoelectronic applications
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
WO2017152353A1 (en) 2016-03-08 2017-09-14 Honeywell International Inc. Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50126721A (ko) * 1973-06-23 1975-10-06
JPS5529576A (en) * 1978-08-08 1980-03-01 Gen Electric Silicone and its manufacture and use
JPS57176994A (en) * 1981-03-20 1982-10-30 Minnesota Mining & Mfg Hydroxylation catalyst
JPS61260A (ja) * 1984-06-12 1986-01-06 Toshiba Silicone Co Ltd 硬化性ポリオルガノシロキサン組成物
JPH02148854A (ja) * 1988-11-30 1990-06-07 Toshiba Silicone Co Ltd 電子部品の製造方法
JPH0393876A (ja) * 1989-09-01 1991-04-18 Dow Corning Corp ロジウム含有可剥離性シリコーン塗料及びラミネートの製造方法
JPH05105814A (ja) * 1991-01-24 1993-04-27 Shin Etsu Chem Co Ltd 硬化性シリコーン組成物およびその硬化物
JPH05132623A (ja) * 1991-04-20 1993-05-28 Dow Corning Sa ハイドロシリレーシヨン触媒の製造方法
JPH07149906A (ja) * 1993-09-17 1995-06-13 Th Goldschmidt Ag アクリレート基を用いて変性されたオルガノポリシロキサンおよび該オルガノポリシロキサンからなる硬化可能な結合剤および被覆材料
JPH1067937A (ja) * 1996-07-17 1998-03-10 Wacker Chemie Gmbh 架橋してエラストマーとなる材料、その製法及びそれを含有する成形体
JPH10306214A (ja) * 1997-05-02 1998-11-17 Bayer Ag 付加架橋結合性シリコーンゴム混合物、それらの製造方法、複合成型部品の製造方法およびそれらの使用
JPH1112481A (ja) * 1997-06-20 1999-01-19 Toray Dow Corning Silicone Co Ltd 熱伝導性ポリマー組成物

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US552506A (en) * 1896-01-07 Half to the james a
US3220970A (en) 1960-10-20 1965-11-30 Hoeganaes Dev Co Ltd Acid-cured furfuryl alcohol or furfuryl alcohol/furfural polymer, with plaster of paris
NL128299C (ko) 1962-06-18
US3159601A (en) 1962-07-02 1964-12-01 Gen Electric Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes
US3159662A (en) 1962-07-02 1964-12-01 Gen Electric Addition reaction
US3188299A (en) 1963-02-28 1965-06-08 Gen Electric Preparation of stable mixtures of organosilicon compositions in the presence of a nitrogen-containing ligand
US3188300A (en) 1963-02-28 1965-06-08 Gen Electric Preparation of stable copolymerizable organosilicon compositions containing a platinum catalyst and a phosphorus ligand
NL129346C (ko) 1966-06-23
US3344111A (en) 1966-09-28 1967-09-26 Gen Electric Preparation of stable copolymerizable organosilicon compositions containing a platinum catalyst and an acrylonitrile type compound
US3383356A (en) 1967-03-30 1968-05-14 Gen Electric Halocarbon catalyst inhibitors for reactive organosilicon compositions
US3516946A (en) 1967-09-29 1970-06-23 Gen Electric Platinum catalyst composition for hydrosilation reactions
US3461185A (en) 1968-01-10 1969-08-12 Dow Corning Heat activated curable organosilicon composition
US3453234A (en) 1968-01-31 1969-07-01 Dow Corning Latent catalyst containing platinum and sulfoxide
US3532649A (en) 1968-09-13 1970-10-06 Dow Corning Heat activated curing system for organosilicon compounds
US3814730A (en) 1970-08-06 1974-06-04 Gen Electric Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes
US3723567A (en) 1971-08-25 1973-03-27 Dow Corning Stable organosilicon compositions
GB1448826A (en) 1973-02-07 1976-09-08 Dow Corning Ltd Rhodium complexes containing sulphur and use as catalysts
US3882083A (en) 1973-11-21 1975-05-06 Gen Electric Latent addition curable organopolysiloxane compositions
US3898666A (en) * 1974-01-21 1975-08-05 Warwick Electronics Inc Antenna mounting assembly
US3933880A (en) 1974-12-02 1976-01-20 Dow Corning Corporation Method of preparing a platinum catalyst inhibitor
US3989666A (en) 1974-12-02 1976-11-02 Dow Corning Corporation Crosslinker-platinum catalyst-inhibitor and method of preparation thereof
US3989667A (en) 1974-12-02 1976-11-02 Dow Corning Corporation Olefinic siloxanes as platinum inhibitors
DE2515484C3 (de) 1975-04-09 1979-09-20 Bayer Ag, 5090 Leverkusen Beschichtungsmittel auf Basis PoIyorganosiloxanen und dessen Verwendung
US4061609A (en) 1976-04-09 1977-12-06 General Electric Company Inhibitor for platinum catalyzed silicone rubber compositions
DE2858037C2 (de) 1978-08-08 1984-08-09 Degussa Ag, 6000 Frankfurt Monomere, polymere und traegerfixierte rhodiumkomplexverbindungen, verfahren zu ihrer herstellung und verwendung als katalysatoren
US4256870A (en) 1979-05-17 1981-03-17 General Electric Company Solventless release compositions, methods and articles of manufacture
US4262107A (en) 1979-10-04 1981-04-14 General Electric Company Rhodium catalyzed silicone rubber compositions
US4347346A (en) 1981-04-02 1982-08-31 General Electric Company Silicone release coatings and inhibitors
US4337332A (en) 1981-04-09 1982-06-29 Minnesota Mining And Manufacturing Company Latently curable organosilicone compositions
US4336364A (en) 1981-07-20 1982-06-22 Dow Corning Corporation Method of producing organosilicon composition with in situ produced cure inhibitor
JPS6054991B2 (ja) 1982-04-02 1985-12-03 ト−レ・シリコ−ン株式会社 オルガノポリシロキサン組成物
JPS58219259A (ja) 1982-06-14 1983-12-20 Toray Silicone Co Ltd 熱伝導性シリコ−ンゴム組成物
US4476166A (en) 1983-01-17 1984-10-09 General Electric Company Silicone release coatings and inhibitors
US4533575A (en) 1983-09-23 1985-08-06 Minnesota Mining And Manufacturing Company Latently-curable organosilicone release coating composition
FR2554118B1 (fr) 1983-10-26 1986-01-17 Rhone Poulenc Spec Chim Agent inhibiteur cetonique pour catalyseur d'un metal du groupe du platine et compositions organopolysiloxaniques le contenant
US4600484A (en) 1983-12-06 1986-07-15 Minnesota Mining And Manufacturing Company Hydrosilation process using a (η5 -cyclopentadienyl)tri(σ-aliphatic) platinum complex as the catalyst
US4587137A (en) 1984-09-28 1986-05-06 General Electric Company Novel dual cure silicone compositions
US4562096A (en) 1984-12-24 1985-12-31 Dow Corning Corporation Heat-curable silicone compositions, use thereof and stabilizer therefor
US4609574A (en) 1985-10-03 1986-09-02 Dow Corning Corporation Silicone release coatings containing higher alkenyl functional siloxanes
JPS63251466A (ja) 1987-04-06 1988-10-18 Shin Etsu Chem Co Ltd 熱伝導性液状シリコ−ンゴム組成物
US4774111A (en) 1987-06-29 1988-09-27 Dow Corning Corporation Heat-curable silicone compositions comprising fumarate cure-control additive and use thereof
US5387698A (en) 1992-06-11 1995-02-07 General Electric Company Rhodium containing selective catalysts for the synthesis of epoxysiloxane/epoxysilicone monomers and polymers
US5082735A (en) 1990-05-04 1992-01-21 Dow Corning Corporation Process of curing methylhydrosiloxanes
US5321058A (en) 1990-05-31 1994-06-14 Dow Corning Toray Silicone Co., Ltd. Curable organosiloxane compositions exhibiting reduced mold staining and scorching
US5132885A (en) 1990-11-29 1992-07-21 Kino Flo, Inc. Portable fluorescent lighting system
US5132442A (en) 1990-12-14 1992-07-21 General Electric Company One part heat curable organopolysiloxane compositions
JPH0791468B2 (ja) 1991-04-26 1995-10-04 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP2927081B2 (ja) 1991-10-30 1999-07-28 株式会社デンソー 樹脂封止型半導体装置
JP2656188B2 (ja) 1992-03-24 1997-09-24 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物
US5866666A (en) 1992-05-07 1999-02-02 Wacker-Chemie Gmbh Siloxane copolymers containing vinyloxy groups, their preparation and their use
US5270457A (en) 1992-06-12 1993-12-14 University Of Manitoba Cardiac steriod glycosides
US5270425A (en) 1992-11-23 1993-12-14 Dow Corning Corporation One-part curable organosiloxane compositions
JP2782405B2 (ja) 1992-12-14 1998-07-30 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物
US5371163A (en) * 1993-11-02 1994-12-06 Dow Corning Corporation Organosiloxane compositions yielding tough elastomeric materials
US5413724A (en) 1993-12-30 1995-05-09 Dow Corning Corporation Fiber treatment compositions and methods for the preparation thereof
US5516558A (en) 1994-08-24 1996-05-14 General Electric Company Addition curable paper release composition with improved bathlife
JPH08143778A (ja) 1994-11-18 1996-06-04 Kanegafuchi Chem Ind Co Ltd ヒドロシリル化法及びそれを利用した硬化剤の製造方法
US5650453A (en) 1995-04-28 1997-07-22 General Electric Company UV curable epoxysilicone blend compositions
US5672660A (en) 1995-12-01 1997-09-30 Advanced Elastomer Systems, L.P. Hydrosilylation crosslinking
US5629399A (en) 1996-03-05 1997-05-13 Dow Corning Corporation Fast curing organosiloxane compositions with long working times
US5773561A (en) * 1996-08-02 1998-06-30 International Business Machines Corporation Polymer sealants/adhesives and use thereof in electronic package assembly
US6077611A (en) * 1997-09-30 2000-06-20 General Electric Company Printable paper release compositions

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50126721A (ko) * 1973-06-23 1975-10-06
JPS5529576A (en) * 1978-08-08 1980-03-01 Gen Electric Silicone and its manufacture and use
JPS57176994A (en) * 1981-03-20 1982-10-30 Minnesota Mining & Mfg Hydroxylation catalyst
JPS61260A (ja) * 1984-06-12 1986-01-06 Toshiba Silicone Co Ltd 硬化性ポリオルガノシロキサン組成物
JPH02148854A (ja) * 1988-11-30 1990-06-07 Toshiba Silicone Co Ltd 電子部品の製造方法
JPH0393876A (ja) * 1989-09-01 1991-04-18 Dow Corning Corp ロジウム含有可剥離性シリコーン塗料及びラミネートの製造方法
JPH05105814A (ja) * 1991-01-24 1993-04-27 Shin Etsu Chem Co Ltd 硬化性シリコーン組成物およびその硬化物
JPH05132623A (ja) * 1991-04-20 1993-05-28 Dow Corning Sa ハイドロシリレーシヨン触媒の製造方法
JPH07149906A (ja) * 1993-09-17 1995-06-13 Th Goldschmidt Ag アクリレート基を用いて変性されたオルガノポリシロキサンおよび該オルガノポリシロキサンからなる硬化可能な結合剤および被覆材料
JPH1067937A (ja) * 1996-07-17 1998-03-10 Wacker Chemie Gmbh 架橋してエラストマーとなる材料、その製法及びそれを含有する成形体
JPH10306214A (ja) * 1997-05-02 1998-11-17 Bayer Ag 付加架橋結合性シリコーンゴム混合物、それらの製造方法、複合成型部品の製造方法およびそれらの使用
JPH1112481A (ja) * 1997-06-20 1999-01-19 Toray Dow Corning Silicone Co Ltd 熱伝導性ポリマー組成物

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009263552A (ja) * 2008-04-28 2009-11-12 Shin Etsu Chem Co Ltd 加熱硬化型シリコーン組成物
WO2010010841A1 (ja) 2008-07-22 2010-01-28 電気化学工業株式会社 樹脂組成物
US8278408B2 (en) 2008-07-22 2012-10-02 Denki Kagaku Kogyo Kabushiki Kaisha Resin composition
JP2012520375A (ja) * 2009-03-12 2012-09-06 ダウ コーニング コーポレーション 熱界面材料、並びに、その調製及び使用方法
JP2013541610A (ja) * 2010-09-08 2013-11-14 モーメンティブ・パフォーマンス・マテリアルズ・インク 湿気硬化性オルガノポリシロキサン組成物
WO2013035736A1 (ja) * 2011-09-08 2013-03-14 積水化学工業株式会社 光半導体装置用硬化性組成物
JP2017533335A (ja) * 2014-11-07 2017-11-09 ブルースター・シリコーンズ・フランス・エスアエス 新規のシリコーン組成物架橋用触媒
JP2018500406A (ja) * 2014-11-07 2018-01-11 エルケム・シリコーンズ・フランス・エスアエスＥＬＫＥＭ ＳＩＬＩＣＯＮＥＳ Ｆｒａｎｃｅ ＳＡＳ 新規のシリコーン組成物架橋用触媒
JP2020522382A (ja) * 2017-06-27 2020-07-30 ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー ヒドロシリル化における触媒としての白金化合物及びロジウム化合物の相乗的組み合わせ
US11180613B2 (en) 2017-06-27 2021-11-23 Heraeus Deutschland GmbH & Co. KG Synergistic combinations of platinum compounds and rhodium compounds as catalysts in hydrosilylations
JP2021503519A (ja) * 2017-11-16 2021-02-12 ダウ シリコーンズ コーポレーション １剤型硬化性シリコーン組成物
JP7359761B2 (ja) 2017-11-16 2023-10-11 ダウ シリコーンズ コーポレーション １剤型硬化性シリコーン組成物

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