JP2004515073A5 - - Google Patents

Download PDF

Info

Publication number
JP2004515073A5
JP2004515073A5 JP2002547208A JP2002547208A JP2004515073A5 JP 2004515073 A5 JP2004515073 A5 JP 2004515073A5 JP 2002547208 A JP2002547208 A JP 2002547208A JP 2002547208 A JP2002547208 A JP 2002547208A JP 2004515073 A5 JP2004515073 A5 JP 2004515073A5
Authority
JP
Japan
Prior art keywords
wafer
chuck
support surface
arm
loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002547208A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004515073A (ja
JP4060185B2 (ja
Filing date
Publication date
Priority claimed from US09/725,823 external-priority patent/US6692219B2/en
Application filed filed Critical
Publication of JP2004515073A publication Critical patent/JP2004515073A/ja
Publication of JP2004515073A5 publication Critical patent/JP2004515073A5/ja
Application granted granted Critical
Publication of JP4060185B2 publication Critical patent/JP4060185B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2002547208A 2000-11-29 2001-11-20 縁接触を減じたウェーハ・ハンドリング・システムおよび改造方法およびその使用 Expired - Lifetime JP4060185B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/725,823 US6692219B2 (en) 2000-11-29 2000-11-29 Reduced edge contact wafer handling system and method of retrofitting and using same
PCT/US2002/001545 WO2002045137A2 (en) 2000-11-29 2001-11-20 Reduced edge contact wafer handling system and method of retrofitting and using same

Publications (3)

Publication Number Publication Date
JP2004515073A JP2004515073A (ja) 2004-05-20
JP2004515073A5 true JP2004515073A5 (enExample) 2005-05-26
JP4060185B2 JP4060185B2 (ja) 2008-03-12

Family

ID=24916099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002547208A Expired - Lifetime JP4060185B2 (ja) 2000-11-29 2001-11-20 縁接触を減じたウェーハ・ハンドリング・システムおよび改造方法およびその使用

Country Status (7)

Country Link
US (1) US6692219B2 (enExample)
EP (1) EP1340246A2 (enExample)
JP (1) JP4060185B2 (enExample)
CN (1) CN1481577A (enExample)
AU (1) AU2002236801A1 (enExample)
TW (1) TW511136B (enExample)
WO (1) WO2002045137A2 (enExample)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6986636B2 (en) * 2000-06-09 2006-01-17 Brooks Automation, Inc. Device for positioning disk-shaped objects
US6824343B2 (en) * 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
DE10217028C1 (de) * 2002-04-11 2003-11-20 Nanophotonics Ag Meßmodul für Waferfertigungsanlagen
EP1534616A4 (en) * 2002-06-14 2010-04-28 Fortrend Engineering Corp UNIVERSAL MASK TRANSFER SYSTEM
US6769861B2 (en) * 2002-10-08 2004-08-03 Brooks Automation Inc. Apparatus for alignment and orientation of a wafer for processing
SG115602A1 (en) * 2003-01-09 2005-10-28 Disco Corp Conveying device for a plate-like workpiece
JP3981885B2 (ja) * 2003-05-20 2007-09-26 株式会社ダイフク 搬送装置
US7654596B2 (en) * 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
TW200532043A (en) * 2004-02-10 2005-10-01 Ulvac Inc Thin film forming apparatus
US6833717B1 (en) * 2004-02-12 2004-12-21 Applied Materials, Inc. Electron beam test system with integrated substrate transfer module
US7319335B2 (en) 2004-02-12 2008-01-15 Applied Materials, Inc. Configurable prober for TFT LCD array testing
US7355418B2 (en) 2004-02-12 2008-04-08 Applied Materials, Inc. Configurable prober for TFT LCD array test
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US8167522B2 (en) * 2005-03-30 2012-05-01 Brooks Automation, Inc. Substrate transport apparatus with active edge gripper
US7374391B2 (en) * 2005-12-22 2008-05-20 Applied Materials, Inc. Substrate gripper for a substrate handling robot
US7535238B2 (en) 2005-04-29 2009-05-19 Applied Materials, Inc. In-line electron beam test system
EP2197027A3 (en) * 2005-05-18 2017-04-26 Murata Manufacturing Co., Ltd. Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage
EP1902465A2 (en) * 2005-07-08 2008-03-26 Asyst Technologies, Inc. Workpiece support structures and apparatus for accessing same
KR100631928B1 (ko) * 2005-12-02 2006-10-04 삼성전자주식회사 웨이퍼 세정장치에서의 웨이퍼 가이드
TWI323788B (en) 2006-03-14 2010-04-21 Applied Materials Inc Method to reduce cross talk in a multi column e-beam test system
US20070231108A1 (en) * 2006-04-04 2007-10-04 Applied Materials, Inc. Method and apparatus for transferring wafers
US7602199B2 (en) 2006-05-31 2009-10-13 Applied Materials, Inc. Mini-prober for TFT-LCD testing
KR100809594B1 (ko) * 2006-09-12 2008-03-04 세메스 주식회사 척킹부재 및 이를 포함하는 스핀헤드
JP5175743B2 (ja) * 2006-12-14 2013-04-03 アイエス・テクノロジー・ジャパン株式会社 円板保持装置および欠陥異物検出装置
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
WO2008133149A1 (ja) * 2007-04-23 2008-11-06 Ulvac, Inc. 支持部材およびキャリアと支持方法
JP5206528B2 (ja) * 2009-03-19 2013-06-12 トヨタ自動車株式会社 ワーク搬送用機器およびワーク搬送方法
US8698099B2 (en) * 2009-09-30 2014-04-15 Kyocera Corporation Attraction member, and attraction device and charged particle beam apparatus using the same
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
JP5574177B2 (ja) * 2010-09-16 2014-08-20 株式会社ダイフク 搬送装置
TWI579939B (zh) * 2011-08-04 2017-04-21 政美應用股份有限公司 檢測及分類晶圓的裝置及方法
JP5877016B2 (ja) * 2011-08-26 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置および基板処理装置
US8556566B1 (en) * 2011-09-30 2013-10-15 WD Media, LLC Disk stacking method and apparatus
US9136155B2 (en) * 2011-11-17 2015-09-15 Lam Research Ag Method and device for processing wafer shaped articles
DE102012100825A1 (de) 2011-12-01 2013-06-06 solar-semi GmbH Vorrichtung zum Bearbeiten eines Substrats und Verfahren hierzu
US9431282B2 (en) * 2011-12-27 2016-08-30 Rudolph Technologies, Inc. Wafer inversion mechanism
US20140064888A1 (en) * 2012-09-06 2014-03-06 Texas Instruments Incorporated Appartaus for handling an electronic device and related methodology
CN102903661A (zh) * 2012-10-25 2013-01-30 上海宏力半导体制造有限公司 晶圆末端执行器
JP6186124B2 (ja) * 2012-12-14 2017-08-23 東京応化工業株式会社 搬送アーム、搬送装置および搬送方法
KR102245762B1 (ko) * 2014-04-17 2021-04-27 어플라이드 머티어리얼스, 인코포레이티드 홀더, 홀더를 갖는 캐리어, 및 기판을 고정시키기 위한 방법
US9410249B2 (en) 2014-05-15 2016-08-09 Infineon Technologies Ag Wafer releasing
WO2016043750A1 (en) * 2014-09-18 2016-03-24 Halliburton Energy Services, Inc. Electrically conductive pattern printer for downhole tools
CN105619406B (zh) * 2015-12-31 2017-10-17 北京七星华创电子股份有限公司 多指机械手片叉的校准方法
USD803283S1 (en) 2016-05-16 2017-11-21 Veeco Instruments Inc. Wafer handling assembly
TWI766105B (zh) * 2017-09-28 2022-06-01 美商魯道夫科技股份有限公司 晶圓級封裝組裝體處置
KR102242812B1 (ko) 2018-05-17 2021-04-22 세메스 주식회사 반송 유닛 및 이를 갖는 기판 처리 장치
US11121019B2 (en) * 2018-06-19 2021-09-14 Kla Corporation Slotted electrostatic chuck
TWI890340B (zh) * 2019-03-13 2025-07-11 以色列商核心流有限公司 圓形晶圓側向定位裝置
JP2023516097A (ja) * 2020-03-06 2023-04-17 ラム リサーチ コーポレーション 順応センタリングフィンガを有するリング構造
CN111392395A (zh) * 2020-03-30 2020-07-10 武汉华星光电半导体显示技术有限公司 上料装置
JP7005690B2 (ja) * 2020-06-17 2022-02-10 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、およびプログラム
CN112858343B (zh) * 2021-02-02 2021-11-16 西安中科微星光电科技有限公司 一种多功能硅基液晶芯片在线检测系统及方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4915564A (en) 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US5749469A (en) * 1992-05-15 1998-05-12 Fluoroware, Inc. Wafer carrier
US5516732A (en) 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
JP3143770B2 (ja) * 1994-10-07 2001-03-07 東京エレクトロン株式会社 基板搬送装置
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
US5647626A (en) * 1995-12-04 1997-07-15 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer pickup system
US5746460A (en) * 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
TW321192U (en) * 1995-12-23 1997-11-21 Samsung Electronics Co Ltd A arm of robot for transporting semiconductor wafer
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system
US5820329A (en) 1997-04-10 1998-10-13 Tokyo Electron Limited Vacuum processing apparatus with low particle generating wafer clamp
DE69813014T2 (de) 1997-11-03 2004-02-12 Asm America Inc., Phoenix Verbesserte kleinmassige waferhaleeinrichtung
US6116848A (en) * 1997-11-26 2000-09-12 Brooks Automation, Inc. Apparatus and method for high-speed transfer and centering of wafer substrates
KR100625485B1 (ko) * 1998-02-18 2006-09-20 어플라이드 머티어리얼스, 인코포레이티드 처리 시스템 내 웨이퍼 핸들러를 위한 엔드 이펙터
JP2003527737A (ja) 1998-07-11 2003-09-16 セミトゥール・インコーポレイテッド マイクロ電子ワークピース取扱い用ロボット
WO2000014772A1 (de) 1998-09-02 2000-03-16 Tec-Sem Ag Vorrichtung und verfahren zum handhaben von einzelnen wafern
US6298280B1 (en) * 1998-09-28 2001-10-02 Asyst Technologies, Inc. Method for in-cassette wafer center determination
US6143147A (en) 1998-10-30 2000-11-07 Tokyo Electron Limited Wafer holding assembly and wafer processing apparatus having said assembly
JP2000260859A (ja) 1999-03-09 2000-09-22 Nikon Corp 基板収納装置
US6357996B2 (en) * 1999-05-14 2002-03-19 Newport Corporation Edge gripping specimen prealigner

Similar Documents

Publication Publication Date Title
JP2004515073A5 (enExample)
JP4060185B2 (ja) 縁接触を減じたウェーハ・ハンドリング・システムおよび改造方法およびその使用
TWI527149B (zh) 慣性晶圓定心末端作用器及輸送裝置
US6109677A (en) Apparatus for handling and transporting plate like substrates
US11842917B2 (en) Process kit ring adaptor
TWI636858B (zh) Substrate transfer robot and substrate processing system
US8651539B1 (en) Integrated gripper for workpiece transfer
JP2011061237A (ja) ケミカルメカニカルポリッシャ用のウェーハ搬送ステーション
JPH0220041A (ja) 半導体ウエハの係合方法および装置
JP2022160683A5 (enExample)
CN114435873B (zh) 运载机器人及包括其的塔式升降机
JP2002517088A (ja) 半導体ウエハハンドリング用バッチ式エンドエフェクタ
KR101409752B1 (ko) 기판 이송 로봇을 이용한 멀티 챔버 기판 처리 장치
JP2016072428A (ja) ウエーハの保持方法
CN108470708B (zh) 一种晶圆载具、晶圆清洗系统及方法
JPH11116046A (ja) ウェハ搬送ロボットにおけるロボットハンド
JP7002347B2 (ja) ワークの搬送装置、及び、ワークの搬送方法
CN112466798B (zh) 一种半导体机台
KR100583942B1 (ko) 양면 가공용 웨이퍼의 고정 장치
KR101414136B1 (ko) 기판 반송 장치
TW200524804A (en) Apparatus for transporting for polishing wafers
CN115692276B (zh) 一种晶圆传送装置、气相沉积系统及使用方法
KR20120061598A (ko) 기판 이송 장치
CN101378026B (zh) 晶圆传送片
JP3200927U (ja) 基板搬送装置