CN1481577A - 减少边缘接触的晶片搬运系统以及改进和使用该系统的方法 - Google Patents

减少边缘接触的晶片搬运系统以及改进和使用该系统的方法 Download PDF

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Publication number
CN1481577A
CN1481577A CNA018199429A CN01819942A CN1481577A CN 1481577 A CN1481577 A CN 1481577A CN A018199429 A CNA018199429 A CN A018199429A CN 01819942 A CN01819942 A CN 01819942A CN 1481577 A CN1481577 A CN 1481577A
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China
Prior art keywords
wafer
chuck
support surface
arm
station
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Pending
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CNA018199429A
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English (en)
Chinese (zh)
Inventor
˹�ٷҡ�D����÷��
斯蒂芬·D·库梅尔
斯坦尼斯瓦夫·科帕茨
��˹��ŵ��
格林·雷诺兹
��ղķ˹��¡�Ͷ���
迈克尔·詹姆斯·隆巴尔迪
ά
托德·迈克尔·维斯孔蒂
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN1481577A publication Critical patent/CN1481577A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNA018199429A 2000-11-29 2001-11-20 减少边缘接触的晶片搬运系统以及改进和使用该系统的方法 Pending CN1481577A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/725,823 2000-11-29
US09/725,823 US6692219B2 (en) 2000-11-29 2000-11-29 Reduced edge contact wafer handling system and method of retrofitting and using same

Publications (1)

Publication Number Publication Date
CN1481577A true CN1481577A (zh) 2004-03-10

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Application Number Title Priority Date Filing Date
CNA018199429A Pending CN1481577A (zh) 2000-11-29 2001-11-20 减少边缘接触的晶片搬运系统以及改进和使用该系统的方法

Country Status (7)

Country Link
US (1) US6692219B2 (enExample)
EP (1) EP1340246A2 (enExample)
JP (1) JP4060185B2 (enExample)
CN (1) CN1481577A (enExample)
AU (1) AU2002236801A1 (enExample)
TW (1) TW511136B (enExample)
WO (1) WO2002045137A2 (enExample)

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CN102765573A (zh) * 2010-09-16 2012-11-07 株式会社大福 搬运装置
CN102916092A (zh) * 2011-08-04 2013-02-06 政美应用股份有限公司 检测及分类晶片的装置及方法
CN102130033B (zh) * 2005-07-08 2014-05-14 交叉自动控制公司 工件支撑结构及其使用设备
CN105097636A (zh) * 2014-05-15 2015-11-25 英飞凌科技股份有限公司 晶片释放
CN105619406A (zh) * 2015-12-31 2016-06-01 北京七星华创电子股份有限公司 多指机械手片叉的校准方法
CN106165056A (zh) * 2014-04-17 2016-11-23 应用材料公司 基板载体
CN111357097A (zh) * 2017-09-28 2020-06-30 鲁道夫科技公司 晶圆级封装组件处理
CN111392395A (zh) * 2020-03-30 2020-07-10 武汉华星光电半导体显示技术有限公司 上料装置
CN112236852A (zh) * 2018-06-19 2021-01-15 科磊股份有限公司 开槽静电吸盘
CN113557599A (zh) * 2019-03-13 2021-10-26 科福罗有限公司 圆形晶片横向定位装置

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JP5877016B2 (ja) * 2011-08-26 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置および基板処理装置
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JP2023516097A (ja) * 2020-03-06 2023-04-17 ラム リサーチ コーポレーション 順応センタリングフィンガを有するリング構造
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Cited By (18)

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Publication number Priority date Publication date Assignee Title
CN102130033B (zh) * 2005-07-08 2014-05-14 交叉自动控制公司 工件支撑结构及其使用设备
CN102765573B (zh) * 2010-09-16 2015-06-17 株式会社大福 搬运装置
CN102765573A (zh) * 2010-09-16 2012-11-07 株式会社大福 搬运装置
CN102916092A (zh) * 2011-08-04 2013-02-06 政美应用股份有限公司 检测及分类晶片的装置及方法
CN102916092B (zh) * 2011-08-04 2015-12-02 政美应用股份有限公司 检测及分类晶片的装置及方法
CN106165056A (zh) * 2014-04-17 2016-11-23 应用材料公司 基板载体
CN106165056B (zh) * 2014-04-17 2018-12-11 应用材料公司 固持件、具有该固持件的载体以及用于固定基板的方法
CN105097636B (zh) * 2014-05-15 2018-05-22 英飞凌科技股份有限公司 晶片释放
CN105097636A (zh) * 2014-05-15 2015-11-25 英飞凌科技股份有限公司 晶片释放
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CN105619406A (zh) * 2015-12-31 2016-06-01 北京七星华创电子股份有限公司 多指机械手片叉的校准方法
CN111357097A (zh) * 2017-09-28 2020-06-30 鲁道夫科技公司 晶圆级封装组件处理
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CN112236852A (zh) * 2018-06-19 2021-01-15 科磊股份有限公司 开槽静电吸盘
CN112236852B (zh) * 2018-06-19 2022-10-14 科磊股份有限公司 半导体晶片处置方法与装置
CN113557599A (zh) * 2019-03-13 2021-10-26 科福罗有限公司 圆形晶片横向定位装置
CN113557599B (zh) * 2019-03-13 2025-05-13 科福罗有限公司 圆形晶片横向定位装置
CN111392395A (zh) * 2020-03-30 2020-07-10 武汉华星光电半导体显示技术有限公司 上料装置

Also Published As

Publication number Publication date
US6692219B2 (en) 2004-02-17
EP1340246A2 (en) 2003-09-03
TW511136B (en) 2002-11-21
JP2004515073A (ja) 2004-05-20
US20020064450A1 (en) 2002-05-30
WO2002045137A2 (en) 2002-06-06
AU2002236801A1 (en) 2002-06-11
JP4060185B2 (ja) 2008-03-12
WO2002045137A3 (en) 2003-03-20

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