JP4060185B2 - 縁接触を減じたウェーハ・ハンドリング・システムおよび改造方法およびその使用 - Google Patents

縁接触を減じたウェーハ・ハンドリング・システムおよび改造方法およびその使用 Download PDF

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Publication number
JP4060185B2
JP4060185B2 JP2002547208A JP2002547208A JP4060185B2 JP 4060185 B2 JP4060185 B2 JP 4060185B2 JP 2002547208 A JP2002547208 A JP 2002547208A JP 2002547208 A JP2002547208 A JP 2002547208A JP 4060185 B2 JP4060185 B2 JP 4060185B2
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Japan
Prior art keywords
wafer
chuck
support surface
arm
transfer
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Expired - Lifetime
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JP2002547208A
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English (en)
Japanese (ja)
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JP2004515073A (ja
JP2004515073A5 (enExample
Inventor
クーマー、スティーブン、ディー
コパクツ、スタニスロウ
レイノルズ、グリン
ロンバルディ、マイケル、ジェイムズ
ヴィスコンティ、トッド、マイケル
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of JP2004515073A5 publication Critical patent/JP2004515073A5/ja
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Publication of JP4060185B2 publication Critical patent/JP4060185B2/ja
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2002547208A 2000-11-29 2001-11-20 縁接触を減じたウェーハ・ハンドリング・システムおよび改造方法およびその使用 Expired - Lifetime JP4060185B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/725,823 US6692219B2 (en) 2000-11-29 2000-11-29 Reduced edge contact wafer handling system and method of retrofitting and using same
PCT/US2002/001545 WO2002045137A2 (en) 2000-11-29 2001-11-20 Reduced edge contact wafer handling system and method of retrofitting and using same

Publications (3)

Publication Number Publication Date
JP2004515073A JP2004515073A (ja) 2004-05-20
JP2004515073A5 JP2004515073A5 (enExample) 2005-05-26
JP4060185B2 true JP4060185B2 (ja) 2008-03-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002547208A Expired - Lifetime JP4060185B2 (ja) 2000-11-29 2001-11-20 縁接触を減じたウェーハ・ハンドリング・システムおよび改造方法およびその使用

Country Status (7)

Country Link
US (1) US6692219B2 (enExample)
EP (1) EP1340246A2 (enExample)
JP (1) JP4060185B2 (enExample)
CN (1) CN1481577A (enExample)
AU (1) AU2002236801A1 (enExample)
TW (1) TW511136B (enExample)
WO (1) WO2002045137A2 (enExample)

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US11251066B2 (en) 2018-05-17 2022-02-15 Semes Co., Ltd. Transfer unit and substrate processing apparatus including the same

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Publication number Priority date Publication date Assignee Title
US11251066B2 (en) 2018-05-17 2022-02-15 Semes Co., Ltd. Transfer unit and substrate processing apparatus including the same

Also Published As

Publication number Publication date
US6692219B2 (en) 2004-02-17
EP1340246A2 (en) 2003-09-03
CN1481577A (zh) 2004-03-10
TW511136B (en) 2002-11-21
JP2004515073A (ja) 2004-05-20
US20020064450A1 (en) 2002-05-30
WO2002045137A2 (en) 2002-06-06
AU2002236801A1 (en) 2002-06-11
WO2002045137A3 (en) 2003-03-20

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