TW511136B - Reduced edge contact wafer handling system and method of retrofitting and using same - Google Patents

Reduced edge contact wafer handling system and method of retrofitting and using same Download PDF

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Publication number
TW511136B
TW511136B TW090128565A TW90128565A TW511136B TW 511136 B TW511136 B TW 511136B TW 090128565 A TW090128565 A TW 090128565A TW 90128565 A TW90128565 A TW 90128565A TW 511136 B TW511136 B TW 511136B
Authority
TW
Taiwan
Prior art keywords
wafer
chuck
arm
semiconductor
support surface
Prior art date
Application number
TW090128565A
Other languages
English (en)
Chinese (zh)
Inventor
Stephen D Commer
Stanislaw Kopacz
Glyn Reynolds
Michael James Lombardi
Todd Michael Visconti
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW511136B publication Critical patent/TW511136B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW090128565A 2000-11-29 2001-11-16 Reduced edge contact wafer handling system and method of retrofitting and using same TW511136B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/725,823 US6692219B2 (en) 2000-11-29 2000-11-29 Reduced edge contact wafer handling system and method of retrofitting and using same

Publications (1)

Publication Number Publication Date
TW511136B true TW511136B (en) 2002-11-21

Family

ID=24916099

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090128565A TW511136B (en) 2000-11-29 2001-11-16 Reduced edge contact wafer handling system and method of retrofitting and using same

Country Status (7)

Country Link
US (1) US6692219B2 (enExample)
EP (1) EP1340246A2 (enExample)
JP (1) JP4060185B2 (enExample)
CN (1) CN1481577A (enExample)
AU (1) AU2002236801A1 (enExample)
TW (1) TW511136B (enExample)
WO (1) WO2002045137A2 (enExample)

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US8256774B2 (en) 2006-09-12 2012-09-04 Semes Co., Ltd. Chucking member and spin head and method for chucking substrate using the chucking member
TWI621195B (zh) * 2011-11-17 2018-04-11 蘭姆研究股份公司 用以處理晶圓狀物體之裝置及方法

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JP3981885B2 (ja) * 2003-05-20 2007-09-26 株式会社ダイフク 搬送装置
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US7355418B2 (en) 2004-02-12 2008-04-08 Applied Materials, Inc. Configurable prober for TFT LCD array test
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
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US7602199B2 (en) 2006-05-31 2009-10-13 Applied Materials, Inc. Mini-prober for TFT-LCD testing
JP5175743B2 (ja) * 2006-12-14 2013-04-03 アイエス・テクノロジー・ジャパン株式会社 円板保持装置および欠陥異物検出装置
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JP5206528B2 (ja) * 2009-03-19 2013-06-12 トヨタ自動車株式会社 ワーク搬送用機器およびワーク搬送方法
US8698099B2 (en) * 2009-09-30 2014-04-15 Kyocera Corporation Attraction member, and attraction device and charged particle beam apparatus using the same
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
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JP5574177B2 (ja) * 2010-09-16 2014-08-20 株式会社ダイフク 搬送装置
TWI579939B (zh) * 2011-08-04 2017-04-21 政美應用股份有限公司 檢測及分類晶圓的裝置及方法
JP5877016B2 (ja) * 2011-08-26 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置および基板処理装置
US8556566B1 (en) * 2011-09-30 2013-10-15 WD Media, LLC Disk stacking method and apparatus
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TWI766105B (zh) * 2017-09-28 2022-06-01 美商魯道夫科技股份有限公司 晶圓級封裝組裝體處置
KR102242812B1 (ko) 2018-05-17 2021-04-22 세메스 주식회사 반송 유닛 및 이를 갖는 기판 처리 장치
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8256774B2 (en) 2006-09-12 2012-09-04 Semes Co., Ltd. Chucking member and spin head and method for chucking substrate using the chucking member
TWI621195B (zh) * 2011-11-17 2018-04-11 蘭姆研究股份公司 用以處理晶圓狀物體之裝置及方法

Also Published As

Publication number Publication date
US6692219B2 (en) 2004-02-17
EP1340246A2 (en) 2003-09-03
CN1481577A (zh) 2004-03-10
JP2004515073A (ja) 2004-05-20
US20020064450A1 (en) 2002-05-30
WO2002045137A2 (en) 2002-06-06
AU2002236801A1 (en) 2002-06-11
JP4060185B2 (ja) 2008-03-12
WO2002045137A3 (en) 2003-03-20

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