TWI355708B - Method and apparatus for supplying substrates to a - Google Patents
Method and apparatus for supplying substrates to a Download PDFInfo
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- TWI355708B TWI355708B TW092124034A TW92124034A TWI355708B TW I355708 B TWI355708 B TW I355708B TW 092124034 A TW092124034 A TW 092124034A TW 92124034 A TW92124034 A TW 92124034A TW I355708 B TWI355708 B TW I355708B
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- substrate
- substrate carrier
- carrier
- loading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Workpieces (AREA)
Description
1355708 六、發明說明: 【發明所屬之技術領域】 本申請案主張美國臨時專利申請案第60/407,336號, 申請曰2002年8月31曰之優先權。本文併呈於此以供參 考。 本發明係相關於基材之處理,並尤指相關於供應基材 至處理工具之設備和方法。 【先前技術】 本申請案係相關於下列共同讓予、共同申請之美國專 利申請案,本文併呈於此以供參考。 美國臨時專利申請案第60/407,45 1號,申請日2002年 8 月 31 日,案件名稱"System For Transporting Wafer Carriers"; 美國臨時專利申請案第60/407,339號,申請曰2002年 8 月 31 日,案件名稱"Method and Apparatus for Using Wafer Carrier Movement to Actuate Wafer Carrier Door Ope'ning/Closing” ; 美國臨時專利申請案第60/407,474號,申請曰2002年 8 月 31 日,案件名稱"Method and Apparatus for Unloading Wafer Carriers from Wafer Carrier Transport System"; 美國臨時專利申請案第60M07,452號,申請日2002年 8 月 3 1 日,案件名稱"End Effector Having Mechanism For Reorienting A Wafer Carrier Between Vertical And Horizontal Orientations"; 美國臨時專利申請案第60/407,337號,申請曰2002年 1355708 8 月 3 1 曰’案件名稱"Wafer Loading Station with Docking Grippers at Docking Stations"; 美國臨時專利申請案第60/407,340號,申請日2002年 8 月 31 曰’案件名稱"Wafer Carrier having Door Latching and Wafer Clamping Mechanisms"; 美國臨時專利申請案第60/443,087號,申請曰2003年 1 月 27 日’案件名稱"Methods and Apparatus for Transporting Wafer Carriers"; 美國臨時專利申請案第60/407,463號,申請曰2002年 8 月 31 曰’案件名稱"wafer Carrier Handler That Unloads Wafer Carriers Directly From a Moving Conveyor" ! 美國臨時專利申請案第60/443,004號,申請曰2003年 1 月 27 曰’案件名稱"Wafer Carrier Handler That Unloads Wafer Carriers Directly From a Moving Conveyor" » 美國臨時專利申請案第60/443,153號,申請曰2003年 1 月 27 曰’案件名稱 ”〇verhead Transfer Flange and Support for Suspending Wafer Carrier"; 美國臨時專利申請案第60/443,001號,申請日2003年 1 月 27 日’案件名稱"Systems ancj Methods for Tra.nsferring Wafer Carriers Between Processing Tools";及 美國臨時專利申請案第60/443,115號,申請曰2003年1 月 27 曰’案件名稱"Apparatus an(j Method for Storing and Loading Wafer Carriers"。 半導體元件通常製造於基材上,諸如,矽基材、玻璃 平板或其他相似者、通常稱之為晶圓者,以供電腦、螢幕 和其他相似者之用。這些元件係由一系列製造步驟所製 成’諸如薄膜沈積、氧化、蝕刻、研磨、和熱處理及微影 丄力5708 第彳之丨彳。4號專利案㈣年ι月修i 製程。雖然可以在單一處理設備中執行多個丄 — 般而言,為了 $ /丨、廿,, 處理工具產步驟’基材仍需在不同的多個 在處理工具和其他位置中傳送’基材通常儲存在 。為了保證處理工具免於空轉,尚未處 應要能夠幾近於遠嫜坫板不恿理的基材 n〜 連應至該工具。因此,裝載和儲存 各!處理工具附近。此類裝載和儲存設備通 別義材係=個停靠站台’其中基材承載件係開啟並且個 ^材係從該承载件取出而傳送至-個處理卫具,亦包含 二位於停靠站台之上的儲存架、-個在裝載和儲存設備 I 的工廢裝載位置、和一個用以在工廢裝載站 二器和夕個儲存架間傳送承載件的機器手臂。該 機器手臂可以包含一個連接 型的& 支構料端㈣器。典 支撐、.、°構包含經設定的一個垂直導引和一個水平 穿載:端受動器可以在停靠站台、多個儲存架和工廠 裝載站σ令水平和垂直移動。 件,it:?二備可以是模組化設計的(例如,具有元 ^ 再典型者安裝在單—虛 1 者非模組化設料⑽如,呈有了 ^狀框架),或 型者具有在多個處理工且前有方m 裝,而典 引)。 八⑴方延伸之水平和/或垂直導 當工廢展載位置接收—個系番从^ μ 該承载件自工廠裝载位置移至館’以機器手臂將 後、經處理、而後傳回至該:*载件之 臂自停靠站台移至儲存架之:载二該:载件藉由機器手 手臂自儲存架移至工廉裝載站么而^該承載件藉由機器 動基材承載件,工廠裝載二:停需在儲存架間移 直和停罪站台可能施加相當大 135.5708 第丨>4d外號專利案丨〇〇年g月修正 «%月U曰修(¾正替換頁 的負荷在機器手臂,而且可能使在工廠中出現的基材承載 件中之基材沒有被處理的時間拉長。因此,亟需流 承载件的操控。 ~— L 土 【發明内容】 本發明之第一個態樣,提出供應基材至處理工具的方 2。該第-個方法包括下列步驟⑴提供多個裝載埠;、其每 —個皆具有用以(adaptedt0)開啟基材承載件的機構& 換位置,其中當基材承載件正在移動並藉由基材 承2 備料時,與基材承載件料設備交換基材 aJI丧(3)提供一個承載件搬運機,其具有-個用以接觸 ^承載件的終端受動器,該㈣件搬運機係用以在 2位置和多個裝載埠之間傳送基材承載件;和(4)在工廢 ΐ件位m承載件運送設備接收第-組多個基材承 ::對第-組多個基材承載件中的每—個而言, 自工廠交換位置直接傳送基材承载件至 啟基個;⑺在個別的裝載埠,停靠並開 件:(4)直=在個別的裝載埠’移開並關閉基材承载 置:和mi的裝料傳送基材承载件至工廠交換位 ,:丄5):專回該基材承載件至基材承载件運送設傷。、 二方法二ί第:出用以傳送基材承載件之第 載站台包含傳送基材承載件,又該基材裝 至處理工“ΓΐΓ運機’用以傳送基材承载件 载件搬運機的動(:)使用;個基材裝載站台的基材承 藉由基材承該基材承载件正在移動並 材承載件輪送帶傳料,使基材承载件自 1355708 件輸找帶阶丨丨時$月1 8 ¾¾正替換貪i 傳=ϊ:載件自基而 戰垾,(4)在裝載琿停靠並開啟基材承进# 傳 站4Γ=三態樣,提供傳送基材承載件至基材裝載 材承载件輸送帶上傳送基材承載件 基 第-運輸基材承载件到處理工具的 袭載車’該基材承載件搬運機包括(i)_個垂 引,(2 ) —個與該垂直導引連接的水平導引 Γΐ:受動器,用以支援基材承載件以相對於垂直導引: 直移動和以相對於水平導引水平移動。垂直導引垂 件搬步包括⑴使用基材裝载站台的基材承載 帶脫ί ==動器’使基材承載件從基材承载件輸送 第-α纟載件自基材承载件輸送帶直接傳送至 (4)在第一裝截(i)在第—裝载埠,停靠和開啟基材承载件; 材承载件輸送帶傳件;和(5)直接向基 別的基材,本發明用以接觸和運輸一個 此 方法同樣可以提供個別基材(例如,那 ;。基材承載件之中或之上的基材)之交換、運輸和放 姑本發明之方法和設備,供應給處理卫具之基材/基 機將接由卫廠裝載位置傳送至裝載埠。無需搬運 件置於除了裝載蜂之外的工廠交換位 =,基材/基材承载件「直接」由工廒裝載位置傳送至裝載 1355708 本發明之方法和設備提供基材或*基材承載件之戒 暢而高度有效進出處理工具裝載埠的傳送。因而,運輸和 處理基材所需之總時間可以減少,在基材工作過程中所需 要的費用和資本的投資亦可以減少,而基材承載件搬運機 的機器手臂的負擔可以降低。 本發明的其他特徵和態樣將清楚呈現於下文中所詳述 之不例性實施例、本文之後的申請專利範圍和附圖。 【實施方式】 相關專有名詞 在本文中,專有名詞「停靠」意指基材或基材承載件 向-璋α移動’如潔淨室牆上料口,藉以交換基材。同 樣地’「移開」意指基材或基材承載件離開埠口的移動,如 潔淨室牆上的埠口,藉以交換基材。 鄉:乂俠徂置」包括空間中藉由一裝置搬運一基相 或基材承斜之所有的點’錢從基材承載件運送設^移 開基材或基材承載件或放置基材或基材承載件於基材承栽 件運送設備的期間。 「基材或基材承載件運送設備」包括一個輸送帶、自 動導引車輛(AGV)或任何其他將基材或基材承載件傳送至 處理工具裝載位置(或反向傳送)之裝置。 一「處理工具」包含一或多個處理室和一或多個用以 裝載和卸載該處理室之基材搬運機,該基材搬運機可以或 不為本身之處理室所涵蓋,如工廠界面處理室或傳送室。 處理室可以在基材上執行真空、常壓或其他的製程,包括 例如,物理氣相沉積(PVD)、化學氣相沉積(Cvd)、蝕刻、 測量、清潔、研磨等等。 ^55708 一 裝載埠j包括 供傳送基材至處理1355708 VI. Description of the Invention: [Technical Field of the Invention] This application claims priority to U.S. Provisional Patent Application Serial No. 60/407,336, the entire disclosure of which is incorporated herein. This article is hereby incorporated by reference. The present invention relates to the processing of substrates, and more particularly to apparatus and methods for supplying substrates to processing tools. [Prior Art] This application is related to the following U.S. Patent Application, the entire disclosure of which is hereby incorporated by reference. U.S. Provisional Patent Application No. 60/407,45, filed on August 31, 2002, Case Name "System For Transporting Wafer Carriers"; US Provisional Patent Application No. 60/407,339, Application 曰2002-8 On the 31st of the month, the case name "Method and Apparatus for Using Wafer Carrier Movement to Actuate Wafer Carrier Door Ope'ning/Closing"; US Provisional Patent Application No. 60/407,474, application 8 August 31, 2002, the name of the case "Method and Apparatus for Unloading Wafer Carriers from Wafer Carrier Transport System"; US Provisional Patent Application No. 60M07, 452, Application Date August 31, 2002, Case Name "End Effector Having Mechanism For Reorienting A Wafer Carrier Between Vertical and Horizontal Orientations"; US Provisional Patent Application No. 60/407,337, Application 曰 2002 1355708 August 3 1 曰 'Case Name" Wafer Loading Station with Docking Grippers at Docking Stations"; US Provisional Patent Application No. 60/407,340, application date August 2002 3 1 曰 'Case Name' "Wafer Carrier having Door Latching and Wafer Clamping Mechanisms"; US Provisional Patent Application No. 60/443,087, filed on January 27, 2003, 'Case Names"Methods and Apparatus for Transporting Wafer Carriers" US Provisional Patent Application No. 60/407, 463, filed on August 31, 2002 曰 'Case Name Handler That Handler That Unloads Wafer Carriers Directly From a Moving Conveyor" ! US Provisional Patent Application No. 60/443,004, Application 1 January 27, 2003 曰 'Case Name </ br> Wafer Carrier Handler That Unloads Wafer Carriers Directly From a Moving Conveyor" » US Provisional Patent Application No. 60/443, 153, Application 1 January 27, 2003 曰 'Case Name' 〇verhead Transfer Flange and Support for Suspending Wafer Carrier"; US Provisional Patent Application No. 60/443,001, January 27, 2003, 'Case Names"Systems ancj Methods for Tra.nsferring Wafer Carriers Between Processing Tools" And the US temporary Lee application No. 60 / 443,115, filed Jan. 27, 2003, saying saying 'case name " Apparatus an (j Method for Storing and Loading Wafer Carriers ". Semiconductor components are typically fabricated on substrates such as germanium substrates, glass plates or the like, commonly referred to as wafers, for use by computers, screens, and the like. These components are fabricated by a series of fabrication steps such as thin film deposition, oxidation, etching, grinding, and heat treatment, and lithography 5708. No. 4 patent case (four) year yue repair process. Although multiple 丄 can be performed in a single processing device—in general, for $/丨, 廿, processing tool production steps, the substrate still needs to be transferred in different processing tools and other locations. Stored in. In order to ensure that the processing tool is free from idling, it is not necessary to be able to be close to the substrate that is not ruthless. So load and store each! Near the processing tool. Such loading and storage equipment is generally referred to as a docking station=where the substrate carrier is opened and the material is taken out from the carrier and transferred to a processing fixture, and the second is located on the docking station. The storage rack, a waste loading position at the loading and storage device I, and a robotic arm for transporting the carrier between the work waste station and the storage rack. The robot arm can contain a connected & The support, ., and structure consist of a set vertical guide and a horizontal load: the end effector can be moved horizontally and vertically at the docking station, multiple storage racks, and the factory loading station. Piece, it:? The second preparation can be modularized (for example, with a meta ^ and then a typical installation in a single - virtual 1 non-modular material (10), such as a ^ frame), or type It has a number of processors and is installed in front of the m, while the code is cited. Eight (1) side extension horizontal and / or vertical guidance work waste exhibition position receiving - a system from the ^ μ The carrier moved from the factory loading position to the museum 'after the robot arm, processed, and then returned to The arm of the * carrier is moved from the docking station to the storage rack: the second carrier: the carrier is moved from the storage rack to the working load station by the robot arm and the carrier is driven by the machine substrate carrier , Factory loading 2: Stopping the need to move between the storage racks and the severing platform may impose a considerable amount of 135.5708 Dimensions > 4d nickname patent case g g g month correction «% month U 曰 repair (3⁄4 positive replacement page The load is on the robot arm, and the substrate in the substrate carrier that appears in the factory may not be lengthened for processing. Therefore, the handling of the flow carrier is not required. ~—L soil [Invention] The present invention In the first aspect, a method of supplying a substrate to a processing tool is proposed. The first method comprises the following steps (1) providing a plurality of loading cassettes; each of which has an adapted substrate to open the substrate carrier. Mechanism & change position where the substrate carrier is moving and When the material is prepared, the base material is exchanged with the substrate carrier equipment. (3) A carrier carrier is provided, which has a terminal actuator for contacting the carrier, and the (four) carrier is used. Transmitting the substrate carrier between the 2 position and the plurality of loading cassettes; and (4) receiving the first plurality of substrate substrates in the working waste position m carrier conveying device:: pairing the plurality of bases For each of the material carriers, the substrate carrier is directly transferred from the factory exchange location to the base; (7) in individual loading ports, docked and opened: (4) straight = in individual loading Opening and closing the substrate carrying: and the charging transfer substrate carrier of the mi to the factory exchange position, 丄 5): specifically returning the substrate carrier to the substrate carrier for shipping damage. The second method is as follows: the first station for transporting the substrate carrier comprises a transfer substrate carrier, and the substrate is loaded to the handler "scraper" for transporting the substrate carrier carrier carrier The use of the substrate (:); the substrate of the substrate loading platform is driven by the substrate, the substrate carrier is moving, and the material carrier is transported, so that the substrate carrier is searched from the 1355708 piece.丨丨时$1 1 3 3⁄43⁄4 is replacing greedy i pass = ϊ: the carrier is trembled from the base, (4) docked at the loading 并 and the substrate is driven in. The carrier-to-substrate-loading material carrier conveyance belt conveys the substrate carrier-based-transport substrate carrier to the processing tool. The substrate carrier transporter includes (i) a vertical guide, ( 2) a horizontal guide 连接 connected to the vertical guide: an actuator for supporting the substrate carrier to guide relative to the vertical: straight movement and horizontal movement relative to the horizontal guide. Vertical guide pendant The step of moving includes (1) using the substrate loading platform of the substrate loading station to remove the substrate carrier from the substrate The carrier transporting the -α纟 carrier is directly transferred from the substrate carrier conveyor belt to (4) at the first loading (i) at the first loading port, stopping and opening the substrate carrier; the material carrier conveying belt And (5) directly to the base substrate, the present invention for contacting and transporting one such method can also provide individual substrates (eg,; substrate in or on the substrate carrier) The method and equipment of the present invention are exchanged, transported, and the substrate/base machine supplied to the processing fixture is transferred from the factory loading position to the loading magazine. No need to transport the parts to a factory exchange other than the loading bee. Bit =, the substrate/substrate carrier is "directly" transferred from the work loading position to the load 1355708. The method and apparatus of the present invention provides for the transfer of the substrate or the substrate carrier without the smooth and highly efficient access of the processing tool. . Thus, the total time required to transport and handle the substrate can be reduced, the cost and capital investment required to operate the substrate can be reduced, and the burden on the robotic arm of the substrate carrier handler can be reduced. Other features and aspects of the invention will be apparent from the exemplary embodiments described hereinafter, the scope of the claims and the accompanying drawings. [Embodiment] Related Terms In this context, the proper term "docking" means that the substrate or substrate carrier moves toward -璋α, such as a clean room wall opening, thereby exchanging the substrate. Similarly, "removal" means the movement of the substrate or substrate carrier away from the mouthpiece, such as the mouth of a clean room wall, thereby exchanging the substrate. Township: 乂 徂 」 ” ” ” ” ” ” ” ” ” ” “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ “ Or the substrate carrier during the substrate carrier transport device. A "substrate or substrate carrier transport device" includes a conveyor belt, an automated guided vehicle (AGV), or any other device that transports a substrate or substrate carrier to a processing tool loading location (or reverse transport). A "processing tool" includes one or more processing chambers and one or more substrate handlers for loading and unloading the processing chambers, which may or may not be covered by a processing chamber of its own, such as a factory interface Processing room or transfer room. The processing chamber can perform vacuum, atmospheric or other processes on the substrate including, for example, physical vapor deposition (PVD), chemical vapor deposition (Cvd), etching, measuring, cleaning, grinding, and the like. ^55708 A load 埠j includes for conveying substrates to processing
時5月曰修UU正#板貪 一個基材或基材置的位~~一 工具(或反方向)之用。In May, the UU is a tool (or the opposite direction).
第1圖係一俯視平面圖,顯示在鄰接習知處理工具113 之,,儲存基材之習知模組化的裝載和存儲設備U11、第2 ϋ一前端視圖,顯示模組化的裝載和存儲設備⑴。以參 圖開始’前端機器手臂處理室115(或工廠界面)顯示 位在裝載和存儲設備U1與處理工具113之間。如第1圖 二示之位於鄰接潔淨室牆117的第一面之裝載和存儲設備 ,而前端機器手臂處理室則位於潔淨室牆117所鄰接之 第二個面。前端機器手臂處理室115包含機器手臂119,其 :以沿著一軌道水平移動(未見於圖示),以從裝載和存儲 =備111提取基材和傳送它們至處理工具113的負載鎖定 ^ U1。裝載和儲存設備m包含一對裝載站台123,為了 提取基材,基材承載件被置於其中(本例中裝載站台之裝備 係供停靠動作之用’所以可稱作停靠站台),而多個儲‘架 201 (第2圖為最佳圖示)被置於停靠站台丨23之上(例如,在 一較高位置卜在支撐框架203上安裝了儲存架201。在支 撐框架203上亦同樣地安裝了基材承載件搬運機器手臂 2〇5 «機器手臂205包括一個垂直導引2〇7,為了垂直移動, 終端受動器209安裝在其中。該垂直導引2〇7被安裝以沿 著水平導引211水平運動。一個用以接收基材承載件之工 廠裝載位置2 1 3係位於停靠站台123之間。 藉助於垂直導引207和水平導引211,基材承載件搬運 機器手臂205的終端受動器209能在工廠裝載位置2丨3、 儲存架201和停靠站台123之中,移動基材承載件。然而, 如同·先前所指出的,反覆移動基材承載件,從工廠裝載位 9 1355708 ★ # &到到儲存架2(H,然後到停靠站台―― 廠裝載位置213(可能藉由儲存架201)可能導致在二:到 且113供仏^月匕導致在向處理工 2理中7 消耗大量的時間,從而增加了「工作 處理中」(work_in_pr〇cess)的量。 作 ⑽iiA圖係—個正視概圖’圖示依據本發明所提供之示 列性土材裝載站台。標示號碼301通 八 2載站台’裝载站台301包括多個裝 : 較佳的都具有停靠機構(未見於圖示),: 承載件移^平台,用以支援基材承载件和用以使基材 一個基材所欲傳送之開口。如第3A圖所 '、之特殊實%例中,在每一者具有三 3。5、3 07中安裝裝載埠3〇3。因此,在第兩堆: 出現六個裝載埠3〇3。亦/於 埠。堆疊3〇7到被置於堆疊3。5:他—數邊:^ ^ ^ 〜您亚開。每一個裝 用以門啟Π:包括一個機構,通常以標示號碼309表示, == 4 3〇3之基材承载件。在本發明之- 載淳303係用以接收單一基材承載件。專 載件二二ί二承載件」係表示形狀和大…基材承 括美材承3基材。—般而言,裝载埠303可以包 何類型(例如,單-基材承载件、多個基 承;:L前開式標 基材承载件311—在裝載谭3°3中的兩個之 本發明之一個實施例中’每一個 =:ΐΓ311和停靠基材承載件(例如,=朝 句位在泳淨室牆上的埴梦 器可以達成此類的開啟二排-個凸輪和跟隨 請案第_,339號,申ί =申^案’美國專利申 观甲印曰2002年8月31曰,申請案 丄3557081 is a top plan view showing a conventional modular loading and storage device U11, a second front end view of a storage substrate, adjacent to the conventional processing tool 113, showing modular loading and storage devices (1) . The front end robotic processing chamber 115 (or factory interface) display is located between the loading and storage device U1 and the processing tool 113. As shown in Fig. 1, the loading and storage device is located adjacent to the first side of the clean room wall 117, and the front end arm processing chamber is located on the second side adjacent to the clean room wall 117. The front end robotic arm processing chamber 115 includes a robotic arm 119 that moves horizontally along a track (not shown) to extract substrates from the loading and storage unit 111 and transfer them to the load lock of the processing tool 113. . The loading and storage device m comprises a pair of loading stations 123, in order to extract the substrate, the substrate carrier is placed therein (in this case, the equipment for loading the platform is for docking operations, so it can be called a docking station), and more A storage rack 201 (Fig. 2 is a preferred illustration) is placed on the docking station table 23 (for example, a storage rack 201 is mounted on the support frame 203 at a higher position. Also on the support frame 203 Similarly, the substrate carrier handling robot arm 2〇5 is mounted «The robot arm 205 includes a vertical guide 2〇7 in which the terminal actuator 209 is mounted for vertical movement. The vertical guide 2〇7 is mounted along The horizontal guide 211 is horizontally moved. A factory loading position 2 1 3 for receiving the substrate carrier is located between the docking stations 123. By means of the vertical guide 207 and the horizontal guide 211, the substrate carrier carries the robot arm The terminal actuator 209 of 205 is capable of moving the substrate carrier in the factory loading position 2, 3, the storage rack 201 and the docking station 123. However, as previously indicated, the substrate carrier is repeatedly moved, loaded from the factory Bit 9 1355708 ★ # & to the storage rack 2 (H, then to the docking station - the factory loading position 213 (possibly by the storage rack 201) may result in two: to and 113 supply 仏 ^ 匕 匕 led to the processing 2 The reason 7 consumes a large amount of time, thereby increasing the amount of "work_in_pr_cess". (10) iiA diagram - a front view 'illustration' shows an illustrative soil loading station provided in accordance with the present invention. Marking number 301 through eight 2 station platform 'Loading station 301 includes a plurality of loading: preferably all have a docking mechanism (not shown), the carrier is moved to support the substrate carrier and to enable An opening to be transported by one substrate of the substrate. As in the special example of Fig. 3A, each of them has three 3. 5, 3 07 mounted load 埠 3 〇 3. Therefore, in the second Heap: There are six loadings 埠3〇3. Also / Yu 埠. Stacking 3〇7 to be placed on the stack 3. 5: He-number side: ^ ^ ^ ~ You are open. Each one is used to open the door : includes a mechanism, usually indicated by the reference number 309, == 4 3〇3 substrate carrier. In the present invention - Receiving a single substrate carrier. The special carrier member is a shape and a large substrate. The substrate is covered with a US material 3 substrate. In general, the loading cassette 303 can be of any type (for example, Single-substrate carrier, a plurality of bases;: L front open-type substrate carrier 311 - in one embodiment of the invention in which two of Tan 3° 3 are loaded, 'each one =: ΐΓ 311 and a docking base Material carrier (for example, = a nightmare on the wall of the swimming room can achieve this kind of opening two rows - a cam and follow the request No. _, No. 339, Shen ί = Shen ^ case 'US patent Shen Guan Jia Yin, August 31, 2002, application 丄 355708
名稱「使用晶圓承载件的移動 十蝴正趣I 方法和1,描:的移動以使晶圓承載件開之——, :法::備」,揭不了一個此類型的裝载 擇,亦可以使用習知的閉門開啟裝置(例如’在停二 啟承載件)。此類裝置通常使用—個 =罪=開 栽件閘門和將基材自承載件移走,使能提取基材。 -個基材承載件運送設備,例如,—個 圖示於313)經設定以值择Α从名油 带(不心圖 站△ 3〇1 载件至本發明的基材裝載 口 301,和從本發明的基材裝載站台π〗 件。關於本發明之裝裁站Α 移開基材承載 -個基材承载件交換Ϊ; L /用鄰接:輸送帶313的是 的其w并: 其用以接收來自輸送帶313 可;:輸送帶313傳送基材承載件。因此, 317而^分彳父換裝置315定義了 —個工廠交換位置 交換裝Π"與輸送帶313在其中交換。基枯承載件 、、 可月匕具有先前的申請案之型態,例如,先前 ,美國專利中請案第6_7,451號,申請日讀年= 露-曰徊姑申紅請案名稱「用以傳送晶圓承載件之系統」,其揭 承:株的平台’其轉動用以接觸和連接/解除連接晶圓 载件至或從上方之工廠運輸系統。 尚有另一種選擇,基材承裁件交換裝置3 =:::請案之型態,例如,美國專利申請案Ϊ ’394旒,其揭露的一個升高元件’其線性升高以接 統(太解除連接基材承载件至或自上方的工廠輸送系 =本文▲參照其全部内容併呈於此)。尚有另一選擇,基材 父換裝置315可能具有先前的共同申請案之型態, 列如’美國專利申請案第6〇/4〇7 474號,申請日2〇〇2年8 日’申請案名稱「用以自晶㈣載件運輸系統卸載晶 載件的方法和設備」,其揭露一個旋轉臂,其旋轉以接 和連接/解除連接基材承載件至或自上方的工廠運輸系The name "Using the wafer carrier's mobile ten-family I method and 1, the description of the movement to make the wafer carrier open -, :::", can not reveal a type of loading, It is also possible to use conventional closed door opening devices (eg 'on-off carrier'). Such devices typically use a single = sin = plant gate and remove the substrate from the carrier to enable extraction of the substrate. a substrate carrier transport device, for example, shown in 313, is set to select a value from the oil band (the unscrupulous station Δ 3〇1 carrier to the substrate loading port 301 of the present invention, and Loading the platform π from the substrate of the present invention. Regarding the assembly station of the present invention, the substrate carrier is removed, and the substrate carrier is exchanged; L / with the abutment: the conveyor belt 313 is its w and: For receiving from the conveyor belt 313; the conveyor belt 313 conveys the substrate carrier. Therefore, the 317 and the parent-changing device 315 define a factory exchange position exchange device " exchange with the conveyor belt 313. The dry carrier, may have the type of the previous application, for example, in the previous US Patent Application No. 6_7, 451, the application date of the year = the name of the dew-Augu Shenhong application A system for transporting wafer carriers, which reveals that the platform of the plant 'turns to contact and connect/unlink wafer carriers to or from the factory transport system above. There is another option, substrate acceptance Piece exchange device 3 =::: the type of the request, for example, the US patent application Ϊ '394旒One of the elevated elements disclosed therein is linearly raised to meet (too unlink the substrate carrier to or from the factory transport system above = ▲ cf. its entirety and present here). There is another option, The substrate parent changing device 315 may have the type of the previous co-application, as described in 'US Patent Application No. 6/4〇7 474, the filing date is 2, 2, 8 'application name' Self-crystal (four) method and apparatus for unloading a crystal carrier from a carrier transport system, which discloses a rotating arm that rotates to connect and connect/unlink the substrate carrier to or from the factory transport system above
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統。尚有進一步的選握叮 日修㈣正替美頁I 並且承裁件搬運機可以在工戰件父換裝置, 發明裝载站台和承载件、 ^如,承載件在本 承載件輸送裝置313交換1父換的任何位置)與 . 同申請案,美國專利申 載牛°此類方法詳述於共 年8月日Λλ与案第_7,463號,申請日編 f日和60/443,_,宇請日2003年!月27s 當輸送帶(或者在1上運輪的系㈣、—I1月27曰。 ^ ^ , 建輸的承載件)在移動時,可以設 疋基材承载件交換裝置,、, XL ^ 例如從输运帶313移走基 載件,和在輸送帶(或者沿著其上 送器)移動時,對輸送帶313傳逆基材承載件傳 it. a* . a 得达基材承载件。因此,當半 導體生產s又備運作時,輪 施的,從送 料持續地移動是可實 產执借沾氣 土在生產設備中的運輸,以減少穿過生 ί:;^每一個特定基材所需之時間,並且據以在任何給 疋的時間中’減少在工作過程中的基材總量。 本發明之裝载站台3〇1進一步包括承載件搬運機 ,載件搬運機319包括用以同基材承載件311接觸的 終端文動器321。例如’終端受動器321可用以從底部支 樓土材承載件311 ’或者從頂部抓住基材承載件311,等等。 μ鈿爻動器321係用以沿著一個垂直導引323以垂直 移動。垂直導引323依次用以沿著一個水平導引325以水 平移動。因此,終端受動器321可以在工廠交換位置317 和所有裝載埠303中移動。吾人也將了解終端受動器321 亦可以在裝載埠303的堆疊305、307間之空間327中垂直 移動。另一個選擇,垂直和水平的導引可以如第3Β圖所示 般重新配置,以使終端受動器32丨可用以沿著水平導引325 水平移動’以及使水平導引325沿著垂直導引323垂直移 動。儘管未見於第3A或3B圖,本發明之裝載站台可以包 括—個或多個儲存架,以儲存基材和/或基材承載件。 12 1355708 \〇dr 第4圖是說明本發明裝載站台3〇1佈^□ 面俯視示意圖。在第4圖,標示號碼117表示一面潔淨室 牆。標示號碼401表示裝載埠303的堆4 305的軌跡。標 示,碼403表示裝載淳3〇3的堆疊3〇7的軌跡。應了“ 目執跡」(f0〇tprint)是在設備地板上之項目的投影。標示 號碼4G5表示軌跡4G1#彻之間的區域。應了解本發明 裝載站口的工具「虛線範圍」係意指在軌跡401和403再 加上執跡4G1# 403之間的區域405。標示號碼407表示 用堆疊401和403所定義的工具虛線範圍。 、 可操作承載件搬運冑319 α使其僅僅 3一的軌跡401、403所定義的虛線範圍之 材承載件⑴。依據本發明之第6圖之流程圖,一個=· 器c控制承載件搬運機319的操作。 二 再次參照第3Α或3Β圖’將了解工廠交換位置317 在高於裝載埠303的個別高度’也將了解裝载璋朗 的堆疊305和工廠交換位置317具有實質相同的執跡。然 而,亦思及本發明之裝載站台301之其他配置。例如,: ^父換位f 317可能位«載槔303的高度或之下。 ’工薇父換位置317的軌跡亦可以與裝載埠3〇 。7之軌跡4。3相符合(第4圖)。尚有另一選擇,工 7的軌跡可能不與裝載埠303的堆疊305、3〇7轨 跡4〇1、4〇3之任一個相符合。 〇7之執 圖疋個示思性側面視圖,圖示一個基材搬運機, 其相關於習知處理工呈.機 4 3〇3Γ^ ,λ ^ 八113和本發明裝载站台3〇1的裝载 3 3B ^)°參照第5圖,標示號瑪501表示 依據本發明所提供的基材搬運機。 谢 训置於-個較低的位置(如標示號瑪5()3所^)= ^本發明之基材搬運機501能夠水平移動以存取裝栽 J3 1355708 埠303最低的堆疊之一。也能夠把本發明Us 置於一個較高的位置(如圖和標示號碼505所示),在該 本發明之基材搬運機501能夠水平移動以存取在°載埠 303當中最高處的堆疊。吾人將了解’也可以把本發明基 材搬運機5〇1置於標示位置5〇3和5〇5之間的任何位置 特別標示於圖示)’例如,在一個本發明基材搬運機5〇ι能 夠水平移動以存取裝載埠303的t間堆疊之位置。 在本文中,當基材搬運機延伸進入至裝載埠區 則說基材搬運機「存取」一個褒載淳(例如,用以運輸一個 基材)。 =人將了解’在本發明基材搬運機5〇1從停靠在多個 裝載槔3〇3中的—個之基材承載件3ιι移走—個基材(未見 於圖不)之後(第3A或3B圖,未見於第5圖),本發明基材 可以向處理工* 113,或者,特別是,丄 第的負載鎖定室121(如第1圖所示,未單獨顯示於 第5圖)供給基材。 第6圖係一個流程圖,其說明依據本發 =台之操作’例如第3Α_圖中,本發明之基材: =站口 3〇1。可以使控制器c與基材裝載站台連接,並且 操作執行以完成第6圖過程中的一或多個步驟。 根據第6圖的第一步驟6〇1’在工廠交換位置η?接收 a 載件3U。在第3A或3B圖之示例性基材裝載站 :^中’❹,承載件交換裝置315從輸送帶313移走 =承載件311(例如,藉由終端受動器321)。它是可以發 生的’例如,當輸送帶313移動時。 在第6圖的第601步驟之後的是第603步驟。在第6〇3 承載件搬運機319從工廠交換位置川運輸基材 11到裝載埠3 03中的一個。依據本發明,從工廠 1355708 夺拖a 月q日修(更}i替g頁 位置317直接運輸基材承載件311至裝ViT〇3中的 ^ Z °亦即’在從工廠交換位置317移走基材承載件川 ^ 和在放置基材承載件3丨1至裝載埠303中的一個之 ^ ’承載件搬運機319除了裝載谭303中的一個以外 何承載件支撐位置皆不放置基材承载件311。 在第6圖的第603步驟之後的是第6〇5步驟。在 :帮’基材承栽件3U停靠並開啟在裝載淳3。3中 藉由承載件搬運機319放置於其中。如上所示,裝載埠3〇3 可能用以使基材承載件3丨丨的停靠和開啟同時發生。 在第6圖的第6〇5步驟之後的是第6〇7步驟。在第⑼7 步驟,基材搬運機501從在已經停靠在裝載埠3〇3中的一 # 個並由其所開啟之基材承載件311提取—個基材。而後, 由基材搬運機501供應所提取的基材給處理工具⑴,並 在處理工具U3之内處理之(第6〇9步驟卜 .在完成處理工具113中的基材的處理程序之後,基材 搬運機501傳回基材至在裝载璋3〇3(第6ιι步驟)令的一個 停靠並開啟的基材承載件311。然後’經處理過的基材所 插入的基材承載件3Π關閉並離開裝載埠3〇3(第613步 驟)。基材承载件303的離開和關閉可以同時發生。在第6 圖的第6!3步驟之後較第615步驟。在第615步驟中,籲 承^件搬運機319從裝載埠303運輸基材承載件311到工 廠父換位置3 1 7。根據本發明的一個態樣,可以從裝載埠 303直接運輸基材承載件311到工廠交換位置31八亦即, 在從裝载蟑303移走之後’和在送到工廠交換位置3 17之 前,基材承載件311可以從裝載崞303運輸到工廠交換位 置317,而無需置於任何承載件支撐位置上。 在第6圖的第615步驟之後的是第617步驟。在第 步驟中’承載件交換裝置315傳回基材承載件311到輸送 15 1355708 帶313。在本發明的一個實施例中’當輸送L帶-了 時仍可以達成。應注意的是,停靠和/或開啟基材承載件的 步驟可以在運輸個別的基材或者不需要停靠基材的系統中 被省略。因此,第605和613步驟是選擇性的。吾人將了 解可以用個別基材而非基材承載件來完成本發明之方法。 在承載件輸送裝置和處理工具間的運輸’附加的數字係指 示個別基材而非基材承载件,以避免重複。 ’ 本發明的方法和設備之優點在於,因為使在裝載蟀間 往返的基材承載件的運輸流暢,才可以減少基材經過 體生產設備的總時間^它繼而可以解釋為減少卫作過程、 降低的資本費用、和降低單一基材的製造費用。 前文中所揭露者僅是本發明之示例性實施例;對 =述揭露的方法和設備的修正^落人本發明之範圍内,對 熟知本項技藝者將是顯而易見。 _ ^ ^ J 例如’上文所述之相關 於第圖之承載件搬運機包括 相= 平導引水平移動的垂直導引… J 者水 件搬運機類型,其中,在雨徊亚〜, 汜用個承載 Μ夕…田: 平行水平導弓I之間安裝有可 滑動之-或,個垂直導引。尚有另 :: 可滑動之水平導引,,括 有 其他類型的承载件搬運I -銭線J·生導引之 除了第 3 A 或 3 ϋ 阁 όΑ - 疊之外,本發明亦思及使二=三個裝載崞的那兩個堆 能在裝載埠的每—堆最,^構之裝載埠。例如,可 裝載璋的每-堆疊有:個;:;: =淳,或者,可能在 -堆疊提供相同的裝載埠數 J載埠。亦無需在每 提供一個堆疊的裝載堆.^尚有另一個選擇,可以只 的裝載埠。要強調的尚 個或者更多堆疊 雖然所不每個堆疊的裝裁埠具 1355708 有相同的軌跡, 的其他種類配置 上水平鄰接的裝 卜叫3修办麵g 亦可以使用部份重疊軌跡g者一 。、亦有使用單―裝载崞,或者使用二個以 载淳的實施例。 單-美材搬運機 ' 個供”璺"所有裝載埠使用的 早-基材搬運機。尚有可能的選擇,個別的基材搬運機可 以提供給母-個裝載蜂。亦思及可以供應單—基材搬 給比多於-個堆4的裝載蝉的所有裝載埠使用。進 及’可以供應個別的基材搬運機給每_堆疊的裝載埠使用二 可以使用輸送帶313之外的基材承載件運送設備來 基材承載件運至/運離工廠交換位置。如果使用—個輸 作為基材承載件運送設備,當半導體,生產設備 以選擇持續運動。 雖然相關於本發明的基材裝載站台僅顯示了一個工廠 交換位置,但亦思及提供與本發明相關的基材裝載站么二 個或以上的工廠交換位置。例如,對於進入的基材承 可使用H交換位置’並且可以對於外送的基材承載 件使用第二個工廠交換位置。本文亦思及可以供應多於一 個基材承載件運送設備給本發明的基材裝載站台使用。 本發明之較佳實施例,把本發明使用於基材裝載站 口,其具有與垂直導引和水平導引相連之框架。在該方法 中,較佳的基材裝載站台是模組化的,並可以迅速安萝和 校準。在該情況下,基材裝載站台含有一或多個儲存 每一個儲存架可以安裝在框架上。藉由在框架上安裝基材 承載件搬運機和儲存架,基材承載件搬運機和儲存架^有 彼此相關的預設位置。它更有利於安裝和校準,並具有使 用模組化基材裝載站台的另一個優點。同樣地,用以裝載 和/或從一個上方工廠運輸系統卸載基材承載件的其他機 構’例如’饋送機構’亦可擇優安裝在框架上。示例性饋 17 , (#3月1曰修(貢)i替餐頁iSystem. There is still a further selection of 叮 修 修 四 四 四 四 四 四 四 四 四 四 四 四 四 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且Exchange 1 parent to change any position) and the same application, the United States patent application of cattle ° such methods are detailed in the year of August Λ λ and the case No. _7, 463, the application date is f day and 60/443, _ , Yu, please 2003! 27s when the conveyor belt (or the line on the 1st wheel (4), -I1 month 27曰. ^ ^, the load-bearing part of the construction) can be set to the substrate carrier exchange device when moving, XL ^ The base carrier is removed from the conveyor belt 313, and when the conveyor belt (or along its feeder) is moved, the conveyor belt 313 is transferred to the substrate carrier to transmit it. a*. a to the substrate carrier . Therefore, when the semiconductor production s is ready for operation, the rotation of the wheel, the continuous movement from the feeding is the production of the smuggling soil in the production equipment to reduce the passage of the raw materials; The time required, and in order to reduce the total amount of substrate during the work at any given time. The loading station 3〇1 of the present invention further includes a carrier handler 319 including a terminal actuator 321 for contacting the substrate carrier 311. For example, the end effector 321 can be used to grasp the substrate carrier 311 from the bottom deck soil carrier 311' or from the top, and the like. The μ actuator 321 is used to move vertically along a vertical guide 323. The vertical guides 323 are sequentially used to move horizontally along a horizontal guide 325. Therefore, the terminal actuator 321 can move in the factory exchange position 317 and all the loading magazines 303. It will also be appreciated that the end effector 321 can also move vertically in the space 327 between the stacks 305, 307 of the load cassette 303. Alternatively, the vertical and horizontal guides can be reconfigured as shown in Figure 3 to allow the end effector 32 to be used to move horizontally along the horizontal guide 325 and to guide the horizontal guide 325 along the vertical guide. 323 moves vertically. Although not shown in Figure 3A or 3B, the loading station of the present invention may include one or more storage shelves to store the substrate and/or substrate carrier. 12 1355708 \〇dr Fig. 4 is a schematic plan view showing the 3〇1 cloth surface of the loading platform of the present invention. In Fig. 4, the reference numeral 117 indicates a clean room wall. The reference number 401 indicates the trajectory of the stack 4 305 on which the cassette 303 is loaded. Indicated, code 403 represents the trajectory of the stack 3〇7 carrying 淳3〇3. The "following" (f0〇tprint) is a projection of the item on the floor of the equipment. The number 4G5 indicates the area between the tracks 4G1#. It should be understood that the tool "dashed line range" of the loading station port of the present invention means that the area 405 between the tracks 401 and 403 plus the track 4G1# 403 is added. The reference number 407 represents the dotted line range of the tool defined by stacks 401 and 403. The operable carrier carries 胄 319 α such that it is only a linear range of material carriers (1) defined by the trajectories 401, 403 of the one. In accordance with the flow chart of Fig. 6 of the present invention, a controller c controls the operation of the carrier handler 319. 2 Referring again to Figure 3 or Figure 3, it will be understood that the factory exchange location 317 at an individual height above the load magazine 303 will also be understood to have substantially the same manifestations for the stack 305 and the factory exchange location 317. However, other configurations of the loading station 301 of the present invention are also contemplated. For example, the ^ parent transposition f 317 may be located at or below the height of 303. The trajectory of the worker Wei's change position 317 can also be loaded with 埠3〇. The trajectory of 7 is 4. 3 matches (Fig. 4). Alternatively, the trajectory of the work 7 may not coincide with any of the stack 305, 3 〇 7 tracks 4 〇 1, 4 〇 3 of the load 埠 303.示7's figure, a side view of the substrate, showing a substrate handler, which is related to the conventional processor. Loading 3 3B ^) ° Referring to Figure 5, the symbol 501 represents a substrate handler provided in accordance with the present invention. The Xie Xun is placed at a lower position (e.g., the mark number 5 () 3 ^) = ^ The substrate handler 501 of the present invention can be moved horizontally to access one of the lowest stacks of the loaded J3 1355708 埠 303. It is also possible to place the Us of the present invention in a higher position (as shown in the figure and reference numeral 505), in which the substrate handler 501 of the present invention can be horizontally moved to access the stack at the highest point of the load 303. . It will be understood that 'any position where the substrate handler 5〇1 of the present invention is placed between the marked positions 5〇3 and 5〇5 is specifically indicated in the drawing) 'for example, in a substrate handler 5 of the present invention. The 〇ι can be moved horizontally to access the position of the stack of t between the loads 303. In this context, the substrate handler "accesses" a substrate (e.g., to transport a substrate) as it extends into the loading area. = Person will understand that 'after the substrate carrier 5〇1 of the present invention is removed from the substrate carrier 3 ιι which is docked in the plurality of loading cassettes 3〇3 (after not shown in the figure) 3A or 3B, not shown in Fig. 5), the substrate of the present invention may be directed to the processor * 113, or, in particular, the load lock chamber 121 of the first stage (as shown in Fig. 1, not separately shown in Fig. 5) ) supply substrate. Figure 6 is a flow chart illustrating the substrate of the present invention in accordance with the operation of the present invention, e.g., Figure 3: = station port 3〇1. Controller c can be coupled to the substrate loading station and operation is performed to complete one or more steps in the process of Figure 6. The carrier member 3U is received at the factory exchange position η? according to the first step 6〇1' of Fig. 6. In the exemplary substrate loading station of Figure 3A or 3B, the carrier exchange device 315 removes the carrier 311 from the conveyor belt 313 (e.g., by the end effector 321). It can occur 'for example, when the conveyor belt 313 moves. Following the 601st step of Fig. 6, is the 603th step. At the 6th 3th carrier handler 319, one of the transport substrates 11 to the load magazine 03 is exchanged from the factory. According to the present invention, from the factory 1355708, the monthly transportation of the substrate carrier 311 to the mounting of the substrate carrier 311 to the ViT3 is also carried out from the factory exchange position 317. The substrate carrier member and the carrier carrier 319 in which one of the substrate carrier 3丨1 and the loading cassette 303 is placed are not placed on the substrate except for one of the loading tans 303. The carrier member 311. After the step 603 of Fig. 6, is the step of step 6〇5. In the case: the substrate carrier 3U is docked and opened in the loading cassette 3. 3 by the carrier handler 319. Wherein, as shown above, the loading 埠3〇3 may be used to cause the docking and opening of the substrate carrier 3丨丨 to occur simultaneously. After the sixth step 5 of Fig. 6 is the sixth step 7 step. (9) Step 7, the substrate handler 501 extracts a substrate from a substrate carrier 311 that has been parked in the loading cassette 3 and is opened by the substrate carrier 311. Then, the substrate carrier 501 supplies the substrate. The extracted substrate is given to the processing tool (1) and processed within the processing tool U3 (Step 6-9). After the processing procedure of the substrate in 113, the substrate handler 501 returns the substrate to a substrate carrier 311 that is docked and opened at the loading 〇3〇3 (step 6). The substrate carrier 3 into which the substrate has been inserted is closed and exits the loading cassette 3 (step 613). The separation and closing of the substrate carrier 303 can occur simultaneously. After step 6! 3 of FIG. Step 615. In step 615, the carrier handler 319 transports the substrate carrier 311 from the loading cassette 303 to the factory parent changing position 3 17 . According to one aspect of the invention, the loading cassette 303 can be loaded. The substrate carrier 311 can be transported directly from the load magazine 303 to the factory by directly transporting the substrate carrier 311 to the factory exchange location 31, ie after removal from the load magazine 303 and before being sent to the factory exchange location 3 17 The position 317 is exchanged without being placed in any of the carrier support positions. Following the 615th step of Figure 6 is step 617. In the first step, the carrier exchange device 315 returns the substrate carrier 311 to the delivery 15 1355708 strip 313. In one embodiment of the invention ' The delivery of the L-belt can still be achieved. It should be noted that the step of docking and/or opening the substrate carrier can be omitted in systems that transport individual substrates or do not need to dock substrates. Therefore, Section 605 and Step 613 is optional. It will be appreciated that the method of the present invention can be accomplished with individual substrates rather than substrate carriers. Transport between the carrier transport device and the processing tool 'additional numbers indicate individual substrates rather than Substrate carrier to avoid duplication. 'The method and apparatus of the present invention have the advantage that the total time of the substrate passing through the body production equipment can be reduced because of the smooth transport of the substrate carrier between the loading crucibles. This can be explained by reducing the manufacturing process, reducing capital costs, and reducing the cost of manufacturing a single substrate. The invention disclosed herein is intended to be illustrative of the embodiments of the invention, and the scope of the present invention will be apparent to those skilled in the art. _ ^ ^ J For example, the carrier transporter described above in relation to the figure includes a vertical guide for phase-to-horizontal horizontal movement... J-type water transporter type, in which Yuyao~, 汜Use a load Μ ...... Field: Between the parallel horizontal guide bows I are slidable - or, a vertical guide. There are still other:: slidable horizontal guides, including other types of carrier handling I - 銭 line J · raw guides in addition to the 3rd A or 3 όΑ όΑ όΑ - stack, the present invention also considers The two stacks that make the two = three load rafts can be loaded at the top of each stack. For example, each stack that can be loaded with : has: one;:;: =淳, or, possibly, the same number of load J in the stack. There is also no need to provide a stack of stacked stacks each. There is still another option to load only 埠. There are still more or more stacks to be emphasized. Although not every stacked stacking cooker 1355708 has the same trajectory, other types of configurations can be used for horizontally adjacent loadings. One. There are also examples of using a single "loading cassette" or using two loading cassettes. Single-US material handling machine 'supplied' 璺" All the early-substrate handling machines used for loading 。. There are still possible options, individual substrate handling machines can be supplied to the mother-loading bee. Supply order—Substrate transfer is used for all load magazines than load stacks of more than one stack 4. Advance can be supplied to individual substrate handlers for each stack of stacks 2 can be used outside conveyor belt 313 The substrate carrier transport device transports the substrate carrier to/from the factory exchange location. If a transfer is used as the substrate carrier transport device, when the semiconductor, the production device is continuously selected to move. Although related to the present invention The substrate loading station only shows one factory exchange location, but also considers two or more factory exchange locations for the substrate loading station associated with the present invention. For example, the H exchange location can be used for incoming substrates. And a second factory exchange location can be used for the outbound substrate carrier. It is also contemplated herein that more than one substrate carrier transport device can be supplied for use with the substrate loading station of the present invention. In a preferred embodiment of the invention, the invention is used in a substrate loading station port having a frame that is coupled to a vertical guide and a horizontal guide. In this method, the preferred substrate loading station is modular. And can be quickly infused and calibrated. In this case, the substrate loading station contains one or more storage. Each storage rack can be mounted on the frame. By mounting the substrate carrier handler and storage rack on the frame, The substrate carrier handler and the storage rack have preset positions associated with each other. It is more advantageous for installation and calibration and has another advantage of using a modular substrate loading station. Similarly, for loading and / or Other mechanisms for unloading the substrate carrier from an upper factory transport system, such as the 'feeding mechanism', can also be optimally mounted on the frame. Exemplary Feed 17, (#3月1曰修(贡)i餐餐页i
送機構可以包紅結妥 ' __ I .* 轉動平台或者轉動臂,等等,詳見於先前 之專利申_安、, 0ΛΛ〇 ^ °月’、’美國專利申請案第60/407,451號,申請曰 2002 年 8 月 Q , 曰’和第60/407,474號,申請曰2002年8 月31日。 ^發明之一個態樣’可以在潔淨室牆上預定的安裝位 一=:框架(例如,預先鑽好的螺栓洞,等等),或在處理 ^則的牆上(例如’工薇界面腔室)。本發明較佳的實施例 ^該牆具有預定的安裝位置,供停靠夹鉗或者停靠平台 t裝之用。此外’該牆具有預定的安裝位置,供基材承載 件開啟機構安裝之用。當每一個框架、停靠機構' 和基材 承載件開啟機構都安裂在相同表面上的預定位置時,每一 φ 個相對位置都是預定的,並有助於基材裝載站台之安裝以 及校準。 本文已揭示了相關於單一基材承載件之發明。然而, 亦思及應用本發明在容納多於一個基材之相關基材承载 件,或者應用本發明在相關的個別基材的運輸(未藉由承載 件運輸)。吾人將明白,本發明之設備可以遠遠不同於本丈 所示和所述的示例性實施例。任何根據第6圖之方法所操 作之設備(不論是否完成停靠並開啟,並不論是否使用基材 承載件(例如,個別的基材承載件系統))皆可以讀入於本發_ 明的範固之内。 因此,當藉由一個較佳之相關實施例揭露了本發明, 應了解本發明亦包含可以讀入於本發明精神和範圍之内, 例如,下文尹之申請專利範圍,的其他實施例。 【圖式簡單說明】 第1圖係一平面俯視圖,圖示處理工具和相關的基材 18 /U8 ㈣年胡°(日修替▲丨 • ^-------] 9 圖之習知裝載和儲存設 承載件裝栽和儲存設備之習知配置 第2圖係一正視圖,圖示第1 備; 第3Α和3Β 承載件裝戴設備 第4圖係— 埠之堆疊軌跡; 圖係正視圖,圖示依據本發明提供之基材 之兩個示例性實施例; 平面概圖,圖示第3八或38圖所示之裝載 圖所示之基材搬運機存取裝載埠 第5圖係第3Α或3Β 之側視圖;及 第6圖係一流程圖 明基材承載件裝載設備 ’說明操作第3Α或3Β圖所示本發 和相關處理工具之方法。The delivery mechanism can be bundled with red __ I.* rotating platform or rotating arm, etc., as described in the prior patent application _ An,, 0ΛΛ〇^ °月', 'US Patent Application No. 60/407, 451, Application 8 August 2002 Q, 曰' and No. 60/407, 474, application on August 31, 2002. ^ One aspect of the invention 'can be placed on the clean room wall with a mounting position =: frame (for example, pre-drilled bolt holes, etc.), or on the wall of the processing ^ (eg 'Wu Wei interface cavity room). Preferred Embodiments of the Invention ^ The wall has a predetermined mounting position for docking the clamp or docking platform t. In addition, the wall has a predetermined mounting position for mounting the substrate carrier opening mechanism. When each frame, docking mechanism' and substrate carrier opening mechanism are cracked at predetermined positions on the same surface, each φ relative position is predetermined and contributes to the mounting and calibration of the substrate loading station. . The invention relating to a single substrate carrier has been disclosed herein. However, it is also contemplated to use the present invention to accommodate associated substrate carriers of more than one substrate, or to transport the associated individual substrates (not transported by the carrier) using the present invention. It will be apparent to those skilled in the art that the apparatus of the present invention can be far different from the exemplary embodiments shown and described herein. Any equipment operated in accordance with the method of Figure 6 (whether or not docked and opened, and whether or not a substrate carrier (eg, individual substrate carrier system) is used) can be read in Within the solid. Therefore, the present invention is disclosed by a preferred embodiment, and it is understood that the invention also includes other embodiments that can be read within the spirit and scope of the invention, for example, the scope of the patent application. [Simple description of the diagram] Figure 1 is a plan view of the plane, showing the processing tool and related substrate 18 / U8 (four) year Hu ° (day repair ▲ 丨 • ^-------] 9 diagram habits Known configuration of loading and storage of carrier loading and storage equipment Fig. 2 is a front view showing the first preparation; 3rd and 3rd carrier mounting equipment Fig. 4 - stacking track of 埠; A front view showing two exemplary embodiments of a substrate provided in accordance with the present invention; a plan view showing the substrate carrier access load shown in the loading diagram shown in FIG. 3 or 38 5 is a side view of the third or third side; and Fig. 6 is a flow chart showing the substrate carrier loading device' illustrating the method of operating the present invention and related processing tools as shown in Fig. 3 or Fig. 3.
【主要元件符號說明】 111 裝載和儲存設備 113 處理工具 115 工廠介面 117 潔淨室牆 119 機手臂 121 負載鎖定室 123 傳送爐 201 儲存架 203 支撐框架 205 機器手臂 207 垂直導引 209 終端受動器 211 水平導引 213 工廠裝載位置 301 裝載站台 303 裝載埠 305 堆疊 307 堆疊 309 開啟器 311 基材承載件 313 輸送帶 315 基材承載件交換裝置[Main component symbol description] 111 Loading and storage equipment 113 Processing tool 115 Factory interface 117 Clean room wall 119 Arm 121 Load lock chamber 123 Transfer furnace 201 Storage rack 203 Support frame 205 Robot arm 207 Vertical guide 209 Terminal actuator 211 Horizontal Guide 213 Factory loading position 301 Loading station 303 Loading 305 305 Stacking 307 Stacking 309 Opener 311 Substrate carrier 313 Conveyor belt 315 Substrate carrier exchange
1355708 317 工廠交換位置 3 19 321 终端受動器 323 401 軌跡 403 405 執跡間的區域 407 501 505 基材搬運機 一較高的位置 503 承載件搬運機 垂直導引 轨跡 工具虛線範圍 一較低的位置1355708 317 Factory exchange position 3 19 321 Terminal actuator 323 401 Trajectory 403 405 Inter-existing area 407 501 505 Substrate handler a higher position 503 Carrier transporter Vertical guidance trajectory tool Dash line range lower position
2020
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40733602P | 2002-08-31 | 2002-08-31 |
Publications (2)
Publication Number | Publication Date |
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TW200408041A TW200408041A (en) | 2004-05-16 |
TWI355708B true TWI355708B (en) | 2012-01-01 |
Family
ID=31978461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW092124034A TWI355708B (en) | 2002-08-31 | 2003-08-29 | Method and apparatus for supplying substrates to a |
Country Status (5)
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KR (1) | KR101058597B1 (en) |
CN (1) | CN100397558C (en) |
AU (1) | AU2003265798A1 (en) |
TW (1) | TWI355708B (en) |
WO (1) | WO2004021411A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007088927A1 (en) * | 2006-02-01 | 2007-08-09 | Olympus Corporation | Substrate exchanging apparatus, substrate processing apparatus, and substrate inspection apparatus |
US8436324B2 (en) | 2009-02-22 | 2013-05-07 | Mapper Lithography Ip B.V. | Preparation unit for lithography machine |
GB2469112A (en) | 2009-04-03 | 2010-10-06 | Mapper Lithography Ip Bv | Wafer support using controlled capillary liquid layer to hold and release wafer |
US9176397B2 (en) | 2011-04-28 | 2015-11-03 | Mapper Lithography Ip B.V. | Apparatus for transferring a substrate in a lithography system |
CN104907288A (en) * | 2014-03-13 | 2015-09-16 | 东莞高伟光学电子有限公司 | Cleaning equipment and technique for cleaning electronic components |
CN106166717B (en) * | 2016-09-23 | 2018-07-13 | 江西洪都航空工业集团有限责任公司 | A kind of auxiliary support apparatus on flexible assemble production line |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2905857B2 (en) * | 1989-08-11 | 1999-06-14 | 東京エレクトロン株式会社 | Vertical processing equipment |
ATE129360T1 (en) * | 1992-08-04 | 1995-11-15 | Ibm | PRESSURIZED COUPLING SYSTEMS FOR TRANSFERRING A SEMICONDUCTOR WAFER BETWEEN A PORTABLE SEALABLE PRESSURIZED CONTAINER AND A PROCESSING SYSTEM. |
JPH0817894A (en) * | 1994-06-27 | 1996-01-19 | Dainippon Screen Mfg Co Ltd | Substrate surface treatment device |
JPH10256346A (en) * | 1997-03-13 | 1998-09-25 | Tokyo Electron Ltd | Cassette transferring mechanism and semiconductor manufacturing apparatus |
KR100646906B1 (en) * | 1998-09-22 | 2006-11-17 | 동경 엘렉트론 주식회사 | Substrate processing apparatus and substrate processing method |
US20020090282A1 (en) * | 2001-01-05 | 2002-07-11 | Applied Materials, Inc. | Actuatable loadport system |
-
2003
- 2003-08-28 AU AU2003265798A patent/AU2003265798A1/en not_active Abandoned
- 2003-08-28 WO PCT/US2003/026918 patent/WO2004021411A2/en not_active Application Discontinuation
- 2003-08-28 CN CNB03823887XA patent/CN100397558C/en not_active Expired - Fee Related
- 2003-08-28 KR KR1020057003402A patent/KR101058597B1/en not_active IP Right Cessation
- 2003-08-29 TW TW092124034A patent/TWI355708B/en not_active IP Right Cessation
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CN1689140A (en) | 2005-10-26 |
KR20050057012A (en) | 2005-06-16 |
KR101058597B1 (en) | 2011-08-22 |
CN100397558C (en) | 2008-06-25 |
WO2004021411A2 (en) | 2004-03-11 |
AU2003265798A1 (en) | 2004-03-19 |
WO2004021411A3 (en) | 2004-04-15 |
TW200408041A (en) | 2004-05-16 |
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