CN1689140A - Method and apparatus for supplying substrates to a processing tool - Google Patents
Method and apparatus for supplying substrates to a processing tool Download PDFInfo
- Publication number
- CN1689140A CN1689140A CNA03823887XA CN03823887A CN1689140A CN 1689140 A CN1689140 A CN 1689140A CN A03823887X A CNA03823887X A CN A03823887XA CN 03823887 A CN03823887 A CN 03823887A CN 1689140 A CN1689140 A CN 1689140A
- Authority
- CN
- China
- Prior art keywords
- supporting device
- substrate supporting
- load port
- described substrate
- conveyer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 394
- 238000000034 method Methods 0.000 title claims description 46
- 238000012545 processing Methods 0.000 title abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 47
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 239000012636 effector Substances 0.000 claims description 26
- 230000005540 biological transmission Effects 0.000 claims description 8
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 238000012546 transfer Methods 0.000 abstract description 8
- 238000003860 storage Methods 0.000 description 31
- 230000008569 process Effects 0.000 description 9
- 230000014509 gene expression Effects 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 230000000875 corresponding effect Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 238000003032 molecular docking Methods 0.000 description 3
- 230000009183 running Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Abstract
On one hand, an underlayer loading platform used by a processing tool includes a plurality of loading ports. Each port is manipulatively connected to the processing tool, and is provided with a mechanism used to open an underlayer loader. A loader handling device transfers the underlayer loader from a production exchanging position to a loading port, and does not place the loader on the supporting position of any loader except the loading port. The present invention also provides many other aspects.
Description
The application requires No. 60/407336 U.S. Provisional Application No. of submission on August 31st, 2002, and its full content is herein incorporated for your guidance.
Technical field
The present invention relates generally to substrate processing, particularly relate to the method and apparatus that substrate is provided to handling implement.
Quoting mutually of related application
The application relates to U.S. Patent application following common transfer, co-pending, the full content of each application is herein incorporated for your guidance:
No. 60/407451 U.S. Provisional Patent Application of submitting on August 31st, 2002, be entitled as " System For Transporting WaferCarriers " (lawyer numbers 6900/L);
No. 60/407339 U.S. Provisional Patent Application of submitting on August 31st, 2002, be entitled as " Method and Apparatus for UsingWafer Carrier Movement to Actuate Wafer Carrier Door Opening/Closing " (lawyer numbers 6976/L);
No. 60/407474 U.S. Provisional Patent Application of submitting on August 31st, 2002, be entitled as " Method and Apparatus for UnloadingWafer Carrier from Wafer Carrier Transport Systems " (lawyer numbers 7024/L);
No. 60/407452 U.S. Provisional Patent Application of submitting on August 31st, 2002, be entitled as " End Effector Having Mechanism ForReorienting A Wafer Carrier Between Vertical And HorizontalOrientations " (lawyer numbers 7097/L);
No. 60/407337 U.S. Provisional Patent Application of submitting on August 31st, 2002, be entitled as " Wafer Loading Station with DockingGrippers at Docking Station " (lawyer numbers 7099/L);
No. 60/407340 U.S. Provisional Patent Application of submitting on August 31st, 2002, be entitled as " Wafer Carrier having Door Latchingand Wafer Clamping Mechanism " (lawyer numbers 7156/L);
No. 60/443087 U.S. Provisional Patent Application of submitting on January 27th, 2003, be entitled as " Method and Apparatus forTransporting Wafer Carriers " (lawyer numbers 7163/L);
No. 60/407463 U.S. Patent application of submitting on August 31st, 2002, be entitled as " Wafer Carrier Handler That UnloadsWafer Carriers Directly From a Moving Conveyor " (lawyer numbers 7676/L1);
Submitted on January 27th, 2003, be entitled as " Wafer Carrier Handler That UnloadsWafer Carriers Directly From a Moving Conveyor " (lawyer numbers 7676/L2) No. 60/443004 U.S. Patent application;
Submitted on January 27th, 2003, be entitled as " Overhead Transfer Flange andSupport for Suspending Wafer Carrier " (lawyer numbers 8092/L) No. 60/443153 U.S. Provisional Patent Application;
No. 60/443001 U.S. Provisional Patent Application of submitting on January 27th, 2003, be entitled as " System and Methods For TransferringWafer Carriers Between Processing Tools " (lawyer numbers 8201/L); And
No. 60/443115 U.S. Provisional Patent Application of submitting on January 27th, 2003, be entitled as " Apparatus and Method for Storingand Loading Wafer Carriers " (lawyer numbers 8202/L).
Background technology
Semiconductor device is manufactured on the substrate (for example silicon substrate, sheet glass or analog), and it is commonly called wafer, is used for computer, monitor etc.These devices form via a series of manufacturing steps, for example thin film deposition, oxidation, etching, polishing and heat treatment and photoetching treatment.Though can on a process equipment, finish a plurality of manufacturing steps,, must between different handling implements, transmit substrate usually at least for some manufacturing step.
Substrate is stored in the carrier usually, in order to transport between handling implement and other position.For guaranteeing that handling implement does not dally, instrument should obtain the subcontinuous supply of undressed substrate.Therefore, load and storage facilities be usually located at each handling implement near.These load and storage facilities generally comprises one or more mooring platforms (docking station) (at mooring platform place, the substrate supporting device is opened, each substrate is taken out and be sent to certain handling implement from carrier), also comprise a plurality of storage shelf, a production " loaded " position and automations that are suitable between production " loaded " position, mooring platform and a plurality of storage shelf, transmitting carrier that are used at loading and storage facilities place reception carrier on the mooring platform.Automation can comprise an end effector that is connected in supporting construction.Especially, supporting construction comprises a vertical guide rail and a horizontal guide rail, to guide rail be provided with so that end effector can be between mooring platform, a plurality of storage shelf and production " loaded " position level and vertical moving.
Load and storage facilities can be designed to modular (for example, have a plurality of parts that are installed on the frame, this frame is typically extended in the front of single handling implement) maybe can be designed to non-modularization (for example, have a plurality of independent mounted component, and typically have level of extending previously and/or vertical guide rail) at a plurality of handling implements.
After the production stowage position received carrier, automation can move to certain storage shelf from the production " loaded " position with carrier.Thereafter, carrier can be moved to the mooring platform from storage shelf.After substrate being taken out from carrier, processing gets back to the carrier again, automation can move to certain storage shelf from the mooring platform with carrier.Subsequently, automation can move to the production " loaded " position from storage shelf with carrier.The substrate supporting device moves about between storage shelf, production " loaded " position and mooring platform, and overburden can to make automation, and can prolong substrate in the carrier is in rough in factory time cycle.Therefore, people wish that the transhipment of substrate supporting device is more efficient.
Summary of the invention
In a first aspect of the present invention, provide a kind of first method that substrate is provided to handling implement.First method may further comprise the steps: (1) provides a plurality of load ports, and each load port homogeneous has the mechanism that is suitable for opening the substrate supporting device; (2) provide one to produce switch, when the substrate supporting device transmits at the volley and by substrate supporting device conveyer, exchange these substrate supporting devices in this position and this substrate supporting device conveyer; (3) provide a carrier handler, it has an end effector that is suitable for contacting the substrate supporting device, and this carrier handler is suitable for producing transmission substrate supporting device between switch and a plurality of load port; And (4) producing the switch place, from substrate supporting device conveyer, receiving first substrate supporting device.For in first substrate supporting device each, this method further may further comprise the steps: (1) directly is sent to corresponding load port a plurality of load ports with the substrate supporting device from producing switch; (2) in corresponding load port place mooring (docking) and open the substrate supporting device; (3) take off pool (undocking) and close the substrate supporting device at corresponding load port place; (4) the substrate supporting device directly is sent to the production switch from corresponding load port; And (5) the substrate supporting device is sent back to substrate supporting device conveyer.
In a second aspect of the present invention, provide a kind of second method that transmits the substrate supporting device.Second method may further comprise the steps: (1) is gone up and is transmitted the substrate supporting device being positioned near the substrate loading stage substrate supporting device conveyer (conveyor), and the substrate loading stage comprises the substrate supporting device handler that is suitable for the substrate supporting device is sent to the load port of handling implement; (2) on-stream and when transmitting when the substrate supporting device by substrate supporting device conveyer, use the end effector of the substrate supporting device handler of substrate loading stage to make the substrate supporting device break away from substrate supporting device conveyer; (3) the substrate supporting device directly is sent to load port from substrate supporting device conveyer; (4) in the load port mooring with open the substrate supporting device; (5) take off pool and close the substrate supporting device at load port; And (6) the substrate supporting device is directly sent back to substrate supporting device conveyer.
In a third aspect of the present invention, provide a kind of third party's method that the substrate supporting device is sent to the substrate loading stage.Third party's method is included in to be positioned near the substrate supporting device conveyer of substrate loading stage and transmits the substrate supporting device.The substrate loading stage comprises the substrate supporting device handler that is suitable for the substrate supporting device is sent to first load port of handling implement, and substrate supporting device handler comprises: (1) vertical guide rail; (2) horizontal guide rail that is connected with vertical guide rail; (3) be suitable for support substrates carrier and being suitable for respect to vertical guide rail vertical moving and the end effector that moves horizontally with respect to horizontal guide rail.
Third party's method further comprises: (1) uses the end effector of the substrate supporting device handler of substrate loading stage to make the substrate supporting device break away from substrate supporting device conveyer; (2) the substrate supporting device directly is sent to first load port from substrate supporting device conveyer; (3) in the first load port mooring with open the substrate supporting device; (4) take off pool and close the substrate supporting device at first load port; (5) the substrate supporting device is directly sent back to substrate supporting device conveyer.Many others are provided, as according to the system and equipment of these and other aspect of inventing.Institute's inventive method can by use have the substrate handler that is suitable for contacting and transmits the end effector of single substrate provide similarly single substrate (for example, those not on the substrate supporting device or in substrate) exchange, transmission and placement.
According to the method and apparatus of being invented, the substrate/substrate supporting device that offers handling implement directly is sent to load port from producing switch.Substrate/substrate supporting device " directly " of offering handling implement is sent to load port and refers to handler the transport process and substrate/substrate supporting device is not placed on other Support Position except that load port from producing switch.
The method and apparatus of being invented provides the transportation reasonable and handling implement of substrate and/or substrate supporting device turnover efficiently load port.Therefore, can reduce and transmit and required total time of process substrate, also can reduce substrate semi-products (work-in-process) required cost and capital investment, and can alleviate the burden that the substrate supporting device is handled automation.
According to following detailed description to exemplary embodiment, appended claim and accompanying drawing, more feature and advantage of the present invention will become more obvious.
Description of drawings
Fig. 1 is the vertical view of the traditional arrangement of handling implement and substrate supporting device loading of being correlated with and storage facilities;
Fig. 2 is the tradition loading of Fig. 1 and the front view of storage facilities;
Fig. 3 A and Fig. 3 B are the front views of two exemplary embodiments of the substrate supporting device charging appliance that provides according to the present invention;
Fig. 4 is a schematic vertical view, and the trace (footprint) of the load port row shown in Fig. 3 A and Fig. 3 B has been described;
Fig. 5 is a schematic side elevation, has illustrated that the substrate handler is just near the load port shown in Fig. 3 A or Fig. 3 B;
Fig. 6 is a flow chart, and the substrate supporting device charging appliance invented among application drawing 3A and Fig. 3 B and the method for relevant treatment instrument have been described.
Embodiment
Relational language
In this article, term " mooring " is meant that substrate or substrate supporting device enter into the action of the port (for example port of clean room wall) that is used for exchanging substrate.Similarly, " take off pool " and refer to the action that substrate or substrate supporting device leave the port (for example port of clean room wall) that is used for exchanging substrate.
" production switch " be included in substrate or substrate supporting device from substrate or substrate supporting device conveyer is removed or with substrate or substrate supporting device be placed into the process on substrate or the substrate supporting device conveyer device handle in the space of substrate or substrate supporting device have a few.
" substrate or substrate supporting device conveyer " comprises the device that conveyer, automatic guide delivery vehicle (AVG) or other are sent to substrate or substrate supporting device the handling implement " loaded " position or substrate or substrate supporting device are transported from the handling implement " loaded " position.
" handling implement " comprises one or more process chambers and one or more substrate handler that is used for the loading and unloading process chamber.The substrate handler can maybe cannot be closed in the chamber that itself has for example production hub cavity or transmission cavity.Process chamber can be finished vacuum, normal pressure or other processing of substrate, for example comprises physical vapor deposition (PVD), chemical vapor deposition (CVD), etching, metering (metrology), cleaning, polishing etc.
" load port " comprises a position, and substrate or substrate supporting device are placed on this place, so that substrate is sent to handling implement and/or transports from handling implement.
System description
Fig. 1 is a vertical view, show one be used to store carrier, be positioned near the conventional process instrument 113, traditional modular loads and storage facilities 111.Fig. 2 is the front view of modularized load and storage facilities 111.At first with reference to figure 1, shown front end automation chamber 115 (or producing interface) is between loading and storage facilities 111 and handling implement 113.As shown in Figure 1, loading and storage facilities 111 are positioned near first side of clean room wall 117, and front end automation chamber 115 is positioned near second side of clean room wall 117.Front end automation chamber 115 comprises an automation 119, its can along the guide rail (not shown) move horizontally with substrate from load and storage facilities 111 taking-up, and send it to load lock (loadlock) chamber 121 of handling implement 113.Loading and storage facilities 111 comprise a pair of loading stage 123 (in this example, loading stage can carry out mooring and move, therefore be called as the mooring platform) and a plurality of storage shelf 201 (going out) that is arranged in (for example at a height that is higher than the mooring platform) on the mooring platform 123 in Fig. 2 best image, the substrate supporting device is placed on the mooring platform and sentences and be convenient to take out substrate.Storage shelf 201 is installed on the frames 203.The substrate supporting device is handled automation 205 and also is installed on the frames 203.Automation 205 comprises vertical guide rail 207, and an end effector 209 is installed on this vertical guide rail to move both vertically.Vertical guide rail 207 is mounted to move horizontally along horizontal guide rail 211.Be used for receiving the production " loaded " position 213 of substrate supporting device between mooring platform 123.
Rely on vertical guide rail 207 and horizontal guide rail 211, the substrate supporting device handle the end effector 209 of automation 205 can be between production " loaded " position 213, storage shelf 201 and mooring platform 123 mobile substrate supporting device.Yet, as previously mentioned, the substrate supporting device is from production " loaded " position 213 to storage shelf 201, then to mooring platform 213 and get back to moving around of production " loaded " position 213 (may pass through storage shelf 201) and can cause providing substrate to consume the plenty of time to handling implement 113, thereby increased the amount at goods.
Fig. 3 A is the schematic elevational view of the illustrative substrate loading stage that provides according to the present invention.Reference number 301 is represented the substrate loading stage of being invented usually.Loading stage 301 comprises a plurality of load ports 303.Each load port 303 preferably has mooring mechanism (not shown), for example motor-driven anchor clamps or platform, and these motor-driven anchor clamps or platform are suitable for the support substrates carrier, and are suitable for the substrate supporting device being moved on to the opening that transmits substrate or removing from this opening.In the specific embodiment shown in Fig. 3 A, load port 303 is arranged to respectively to have two group 305,307 of three load ports.Therefore, have six load ports 303 among Fig. 3 A.Also can use the load port of other quantity and/or structure.Group 307 and with it a be separated by spacer segment adjacent with group 305 side.Each load port 303 can comprise the mechanism that is used for opening the substrate supporting device that has been moored to load port 303, and this mechanism is usually by reference number 309 expressions.In one embodiment of the invention, load port 303 is suitable for receiving single substrate supporting device.Term " single substrate supporting device " is meant that its shape and size can only receive the substrate supporting device of a substrate at one time.Usually, load port 303 can receive the substrate supporting device (for example, single substrate supporting device, many substrate supporting device, front openings substrate supporting device, front openings volumetric standard (unified pod) or their combination etc.) of any kind.Fig. 3 A has illustrated that substrate supporting device 311 has been moored to two load ports 303.
In one embodiment, each load port 303 all is suitable for opening substrate supporting device 311 the mooring of substrate supporting device (for example, carrier moves to the port of clean room wall) time.This opens and can finish by for example cam and driven member structure.The load port of this type disclosed in No. 60/407339 U.S. Patent application that submit to, that be entitled as " Method and Apparatusfor Using Wafer Carrier Movement to Actuate Wafer Carrier DoorOpening/Closing " (lawyer numbers 6976/L) on August 31st, 1 that preamble is incorporated into.Perhaps, can use traditional door opener (for example, after mooring, opening traditional door opener of carrier).This type of installs common employed door receiving system and removes to allow to take out substrate from carrier with the carrier door release and with door.
Substrate supporting device conveyer, for example conveyer (schematically illustrating by 313) is designed to and the substrate supporting device is sent to the substrate loading stage 301 invented and the substrate supporting device is removed from institute's invention substrate loading stage 301.Substrate supporting device switch 315 and the substrate loading stage invented 301 are relevant and be positioned near the conveyer 313, and are suitable for receiving the substrate supporting device and be suitable for the substrate supporting device is sent to conveyer 313 from conveyer 313.Therefore, can find that substrate supporting device switch 315 defines produces switch 317, and produce switch and conveyer 313 exchange substrate supporting devices at this.Substrate supporting device switch 315 can be, for example, in the type shown in 31 days Augusts in 2002 that preamble is incorporated into No. 60/407451 U.S. Patent application that submit to, that be entitled as " System ForTransporting Wafer Carriers " (lawyer numbers 6900/L), this patent application discloses a kind of rotation platform, and the rotation of this rotation platform can make the substrate supporting device contact with the production transfer system of top and be connected or separate.
Select as another kind, substrate supporting device switch 315 can be a disclosed type in co-pending No. 09/755394 U.S. Patent application (lawyer numbers 5092), this patent application discloses a kind of lifting piece, and the lifting piece straight line protrudes upward so that the production transfer system contact of substrate supporting device and top and be connected or separate (and this patent application full content is herein incorporated for your guidance).As another selection, substrate supporting device switch 315 can be a disclosed type in 31 days Augusts in 2002 that preamble is incorporated into No. 60/407474 U.S. Patent application that submit to, that be entitled as " Method and Apparatusfor Unloading Wafer Carrier from Wafer Carrier TransportSystems " (lawyer numbers 7024/L), this patent application discloses a kind of turning arm, and the rotation of this turning arm can make the substrate supporting device contact with the production transfer system of top and be connected or separate.In another kind is selected, can save substrate supporting device switch, and the substrate handler can produced switch (for example, being used between loading stage of being invented and substrate-transferring exchanges any position of substrate) exchange substrate supporting device with substrate-transferring 313.This method is described in detail in No. 60/443004 U.S. Patent application (lawyer numbers 7676/L2) that submitted on August 31st, 1, No. 60/407463 U.S. Patent application (lawyer numbers 7676/L) and submission on January 27th, 2003.
Substrate supporting device switch 315 can be designed to, for example, when conveyer (or thereon transmit carrier) is on-stream, the substrate supporting device is removed from conveyer 313, and when conveyer (or along its substrate supporting device conveyer that moves) is on-stream, the substrate supporting device is sent to conveyer 313.Therefore, in fact it can keep the continuous running of conveyer 313 when semiconductor manufacturing facility turns round, therefore improved the transmission of substrate in manufacturing facility, reduce each specific substrate and pass the required time quantum of manufacturing facility, thereby reduced the substrate sum of semi-products form in any preset time.
The loading stage of being invented 301 further comprises carrier handler 319.Carrier handler 319 comprises an end effector 321 that is suitable for contacting substrate supporting device 311.For example, end effector 321 can be suitable for from bottom support substrate supporting device 311, or clamps substrate supporting device 311 etc. from the top.
Fig. 4 is a schematic plan, and the spatial layout feature of the loading stage of being invented 301 has been described.In Fig. 4, reference number 117 is represented the clean room wall.Reference number 401 is represented the trace of the row 305 of load port 303.The trace of the row 307 of reference number 403 expression load ports 303.Be understandable that " trace " of part is the projection of part on the facility bottom surface.Zone between the reference number 405 expression traces 401 and 403.An instrument of the loading stage of being invented " big envelope (envelope) " is interpreted as referring to trace 401 and 403 and adds zone 405 between trace 401 and 403.Reference number 407 expressions are by the instrument big envelope of row 401 and 403 definition.
With reference to figure 3A and Fig. 3 B, can be observed again, produce the height of switch 317 residing height greater than each load port 303.Also can be observed, the row 305 of producing switch 317 and load port 303 have essentially identical trace.Yet, also can consider other layout of institute's invention loading stage 301.For example, produce switch 317 and can be positioned at the height of load port 303 or following.The trace of producing switch 317 also can be consistent with the trace 403 (Fig. 4) of the row 307 of load port 303.Select as another kind, the trace of producing switch 317 can be with any be all inconsistent in the trace 401,403 of the row 305,307 of load port 303.
Fig. 5 is a schematic end view, and the substrate handler relevant with the load port that becomes row 303 of the loading stage 301 (Fig. 3 A and Fig. 3 B) of the conventional process instrument 113 and the dress of inventing has been described.With reference to figure 5, reference number 501 expressions are according to substrate handler provided by the present invention.The substrate handler of being invented 501 can be positioned at lower position (by reference number 503 expression) selectively, and it can move horizontally on this position near in load port 303 row minimum one.The substrate handler of being invented 501 can be positioned at higher position (by reference number 505 expression) selectively, can move horizontally on this position near the highest one in load port 303 row.Be understandable that, the substrate handler of being invented 501 also can be selectively shown in any centre position (in Fig. 5 sign) especially between the position 503 and 505, for example, institute's invention substrate handler 501 can be positioned at a position, and it can move horizontally the port near a centre in the load port 303 that becomes row on this position.
In this article, when the substrate handler extended in the load port zone (for example, in order to transmit substrate), it was " close " load port that the substrate handler is said to be.
Be understandable that, at the substrate handler of being invented 501 the substrate (not shown) has been moored to substrate supporting device 311 (Fig. 3 A or the 3B that certain one-tenth is equipped load port 303 from one, not shown in Figure 5) in remove after, it can offer substrate handling implement 113, or more clearly, offer the load-lock chambers 121 (as shown in Figure 1, it does not illustrate separately) of handling implement 113 in Fig. 5.
Fig. 6 is a flow chart, the operation of the substrate loading stage of design according to the present invention has been described, Fig. 3 A that is for example invented or the substrate loading stage 301 of Fig. 3 B.Controller C can be connected to the substrate loading stage, and can effectively finish the treatment step of one or more Fig. 6.
According to first step 601 among Fig. 6, substrate supporting device 311 is received at production switch 317.For example, in the illustrative substrate loading stage 301 of Fig. 3 A or 3B, carrier switch 315 is removed substrate supporting device 311 from conveyer 313 (for example, by end effector 321).This can take place when for example conveyer 313 is in the running.
Be step 603 after the step 601 among Fig. 6.In step 603, carrier handler 319 is sent to one or more load ports 303 with substrate supporting device 311 from producing switch 317.According to the present invention, substrate supporting device 311 directly is sent to the load port 303 one from producing switch 317.In other words, with substrate supporting device 311 from producing after switch 317 removes, and before one that substrate supporting device 311 is placed in the load port 303, carrier handler 319 can not be placed on substrate supporting device 311 on any carrier Support Position in load port 303 one.
Among Fig. 6, be step 605 after the step 603.In step 605, substrate supporting device 311 in load port 303 locates (substrate supporting device 311 is positioned over herein by carrier handler 319) by mooring with open.As previously mentioned, transforming load port 303 can be suitable for making the mooring of substrate supporting device 311 and open generation simultaneously.
Among Fig. 6, be step 607 after the step 605.In step 607, substrate handler 501 takes out substrate from substrate supporting device 311, and substrate supporting device 311 has been moored in load port 303 places and has been opened by it at this moment.Then, by offering handling implement 113, and substrate processing (step 609) occurs in the handling implement 113 substrate handler 501 with the substrate that taken out.
After the substrate processing in having finished handling implement 113, substrate handler 501 is sent substrate back to substrate supporting device 311 (step 611), this moment substrate supporting device 311 at load port 303 places by mooring and be opened.Then, handled substrate has been inserted into wherein substrate supporting device 311 and is closed and takes off pool (step 613) with load port 303.Taking off of substrate supporting device 303 moored and closed and can take place simultaneously.Among Fig. 6, be step 615 after the step 613.In step 615, carrier handler 319 is sent to substrate supporting device 311 and produces switch 317 from load port 303.According to an aspect of the present invention, substrate supporting device 311 directly can be sent to production switch 317 from load port 303.In other words, with substrate supporting device 311 after load port 303 is removed and placing it in produce switch 317 before, substrate supporting device 311 can be sent to from load port 303 and produce switch 317, and can not place it in any carrier Support Position.
Among Fig. 6, be step 617 after the step 615.In step 617, carrier switch 315 sends back to conveyer 313 with substrate supporting device 311.In one embodiment of the invention, this can finish when conveyer 313 runnings.Need to prove, in transmitting the system of single substrate or in the system that does not need the mooring substrate, can omit mooring and/or open the step of substrate supporting device.Therefore, step 605 and 613 is optional.Be understandable that the method for being invented can be executed in each individual substrate rather than substrate supporting device.For fear of repetition, this paper is not included in the extra accompanying drawing that transmits individual substrate (rather than substrate supporting device) between carrier conveyer and handling implement.
Therefore method and apparatus of the present invention has superiority, because the efficiency of transmission of the turnover load port of substrate supporting device is higher, can reduce substrate total transmission time in semiconductor manufacturing facility.And this can be converted into less semi-products, lower capital cost and less every substrate manufacturing cost.
The description of front only discloses exemplary embodiment of the present invention; To those skilled in the art, it is conspicuous falling into the said method within the scope of the invention and the various modifications of equipment.For example, above comprise that in conjunction with Fig. 3 A or the described carrier handler of 3B one can be made the vertical guide rail that moves horizontally along the wall scroll horizontal guide rail.On the other hand, can consider to use and wherein a vertical guide rail is slidably mounted on two carrier handler types between the parallel, horizontal guide rail.Select as another kind, can use the carrier handler type that therein a horizontal guide rail is slidably mounted on one or more vertical guide rail.Certainly, also can use the carrier handler of other type, comprise the carrier handler that those do not use the linear pattern guide rail.
Except using two three load port row shown in Fig. 3 A and Fig. 3 B, also can consider to use the load port of other structure.For example, whenever equip load port and can have only two load ports, perhaps whenever equipping load port can have four or more load port.The load port that does not also need each load port row to provide number to equate.Select as another kind, can only provide one to equip load port, three row or the load port of multiple row perhaps can be provided.Note also that,, also can use trace to overlap or nonoverlapping other structure though each becomes the load port of row all to be illustrated as occupying identical trace.In certain embodiments, can use single load port, or use the adjacent load port of two or more levels.
Notice that single substrate handler shown in Figure 5 is designed to serve all load ports in the load port row.As possible selection, can provide corresponding substrate handler to serve each load port respectively.Also can consider to use single substrate handler to serve whole load ports of above load port row.Also can further consider to whenever equipping load port corresponding substrate handler is provided respectively.
Except conveyer 313, can use substrate supporting device conveyer that the substrate supporting device is delivered to and produce switch or the substrate supporting device is transported from producing switch.If as substrate supporting device conveyer, when semiconductor manufacturing facility turns round, can conveyer be turned round continuously so conveyer.
Though a production switch relevant with the loading stage of being invented only has been described, can have considered to provide two or more production switches relevant with the substrate loading stage of being invented.For example, first produces switch can be used to introduce the substrate supporting device, and the second production switch can be used to export the substrate supporting device.Also can consider to use more than one substrate supporting device conveyer to serve a substrate loading stage of being invented.
Preferably, the present invention can be used to be connected with on its frame in the substrate loading stage of vertical and horizontal guide rail.In this mode, preferred substrate loading stage is modular, and can be by Fast Installation and calibration.If the substrate loading stage comprises one or more storage shelf, each storage shelf all can be installed on the frame so.By substrate supporting device handler and single or multiple storage shelf are installed on the frame, substrate supporting device handler and storage shelf have preposition each other.This has further simplified Installation And Calibration, is to use another advantage of modularization substrate loading stage.Similarly, other mechanism (being used for for example the substrate supporting device is loaded into the production transfer system of top and/or with the mechanism of substrate supporting device from the unloading of the production transfer system of top) can be installed on the frame easily.Exemplary special mechanism can comprise rotation platform or turning arm etc., described in No. 60/407451 U.S. Patent application of submitting to 31 days Augusts in 2002 of incorporating in front and No. 60/407474 U.S. Patent application of submitting on August 31st, 2002 (lawyer numbers 6900 and 7024).
On the one hand, frame can be installed on the clean room wall or the antetheca of certain chamber (for example, production hub cavity) on predetermined installation site (for example, pre-drilled bolt hole etc.) on.Preferably, wall also has the predetermined installation site that is used for installing mooring anchor clamps or mooring platform.In addition, wall can have the predetermined installation site that is used for installing substrate supporting device opening mechanism.When frame, mooring mechanism and substrate supporting device opening mechanism all were installed in conplane precalculated position, not only the relative position between them was determined in advance, and the Installation And Calibration of substrate loading stage also is simplified.
By the present invention being described in conjunction with single substrate supporting device.Yet, also can consider to apply the present invention to keep a plurality of substrate supporting devices of an above substrate, or apply the present invention to the transmission (not transmitting) of individual substrate by means of carrier.It is evident that the equipment of being invented can exist more different with exemplary embodiment shown here.Yet, anyly all fall within the scope of the present invention according to Fig. 6 method apparatus operating (no matter whether carry out mooring and opening operation, and no matter whether use substrate supporting device (for example, individual substrate system)).
Therefore,, be noted that other embodiment should fall in the spirit and scope of the present invention though the present invention is by disclosed in conjunction with its preferred embodiment, defined as claim of the present invention.
Claims (20)
1. one kind provides the method for substrate to handling implement, and it comprises:
A plurality of load ports are provided, and each load port all has the mechanism that is suitable for opening the substrate supporting device;
Provide one to produce switch, on-stream and when transmitting when the substrate supporting device by substrate supporting device conveyer, exchange described substrate supporting device in this position and described substrate supporting device conveyer;
A carrier handler is provided, and it has an end effector that is suitable for contacting the substrate supporting device, and described carrier handler is suitable for transmitting the substrate supporting device between described production switch and described a plurality of load port;
At described production switch place, receive first substrate supporting device from described substrate supporting device conveyer; And
For in described first substrate supporting device each:
Described substrate supporting device directly is sent to corresponding load port described a plurality of load port from described production switch;
In described corresponding load port place's mooring with open described substrate supporting device;
Take off pool at described corresponding load port place and close described substrate supporting device;
Described substrate supporting device is sent to described production switch from described corresponding load port; And
Send described substrate supporting device back to described substrate supporting device conveyer.
2. method according to claim 1, wherein said substrate supporting device are single substrate supporting device.
3. method according to claim 1, the wherein said step that a plurality of load ports are provided comprises provides two to equip load port.
4. method according to claim 3, wherein said carrier handler are only equipped in the big envelope of load port definition described two and are moved described substrate supporting device.
5. method according to claim 1, opening simultaneously of the mooring of wherein said each substrate supporting device and described respective substrate carrier takes place.
6. method according to claim 1, wherein said production switch and described load port have roughly the same trace.
7. method according to claim 1, wherein said production switch height of living in is higher than the corresponding height of all described load ports.
8. substrate loading stage that is used for handling implement, it comprises:
First load port, it is operatively coupled to described handling implement, and its each have a mechanism that is suitable for opening the substrate supporting device;
Produce switch for one, on-stream and when transmitting when the substrate supporting device by substrate supporting device conveyer, exchange described substrate supporting device in this position and described substrate supporting device conveyer; And
A carrier handler, it has an end effector that is suitable for contacting the substrate supporting device, and described carrier handler is suitable for transmitting the substrate supporting device between described production switch and described first load port;
Wherein said carrier handler has a controller, and it is programmed to carry out following steps:
For each of described first substrate supporting device:
Described substrate supporting device directly is sent to corresponding load port described a plurality of load port from described production switch;
In described corresponding load port place's mooring with open described substrate supporting device;
Take off pool at described corresponding load port place and close described substrate supporting device;
Described substrate supporting device directly is sent to described production switch from described corresponding load port; And
Send described substrate supporting device back to described substrate supporting device conveyer;
9. substrate loading stage according to claim 8, wherein the described substrate supporting device that is transmitted by described carrier handler is single substrate supporting device.
10. substrate loading stage according to claim 8 further comprises:
More than second load port, the adjacent and spacer segments of being separated by in the middle of both in the side of itself and described more than first load port.
11. substrate loading stage according to claim 10, wherein said carrier handler are suitable for vertical moving in the space between described more than first load port and described more than second load port.
12. substrate loading stage according to claim 11, wherein said carrier handler are suitable for only mobile substrate supporting device in the defined big envelope of the trace of described more than first load port and described more than second load port.
13. substrate loading stage according to claim 8, wherein each described load port all is suitable for opening this substrate supporting device in a substrate supporting device and described load port mooring.
14. substrate loading stage according to claim 8, wherein said production switch and described load port have essentially identical trace.
15. substrate loading stage according to claim 8, wherein said substrate supporting device conveyer is a conveyer.
16. substrate loading stage according to claim 8, wherein said production switch height of living in is greater than the corresponding height of all described load ports.
17. one kind provides the equipment of substrate to handling implement, it comprises:
A substrate supporting device handler, it is suitable for a substrate supporting device is sent to one first load port of described handling implement, and described substrate supporting device handler comprises an end effector that is suitable for supporting described substrate supporting device; And
A controller, it is connected to described substrate supporting device handler, and can be operated to control described substrate supporting device handler, so that it is on-stream and during by the transmission of described substrate supporting device conveyer when described substrate supporting device, the described end effector of described substrate supporting device handler makes described substrate supporting device break away from a substrate supporting device conveyer, and described controller can further be operated to carry out the following step:
Described substrate supporting device directly is sent to described first load port from described substrate supporting device conveyer;
In the described first load port place mooring with open described substrate supporting device;
Take off pool at the described first load port place and close described substrate supporting device; And
Directly send described substrate supporting device back to described substrate supporting device conveyer.
18. one kind provides the equipment of substrate to handling implement, it comprises:
A substrate supporting device handler, it is suitable for a substrate supporting device is sent to first load port of described handling implement, and described substrate supporting device handler comprises:
, a vertical guide rail;
, a horizontal guide rail that links to each other with described vertical guide rail; And
An end effector, it is suitable for supporting described substrate supporting device, and is suitable for respect to described vertical guide rail vertical moving, and moves horizontally with respect to described horizontal guide rail; And
A controller, it is connected to described substrate supporting device handler, and can be operated to control described substrate supporting device handler, so that the described end effector of described substrate supporting device handler makes one of described substrate supporting device disengaging be positioned near the substrate supporting device conveyer of described substrate supporting device handler, and described controller further can be operated to carry out the following step:
Described substrate supporting device directly is sent to described first load port from described substrate supporting device conveyer;
In the described first load port place mooring with open described substrate supporting device;
Take off pool at the described first load port place and close described substrate supporting device; And
Directly send described substrate supporting device back to described substrate supporting device conveyer.
19. a method that transmits the substrate supporting device, it comprises:
On a substrate supporting device conveyer, transmit described substrate supporting device, described substrate supporting device conveyer be positioned at a substrate loading stage near, described substrate loading stage comprises a substrate supporting device handler, and it is suitable for described substrate supporting device is sent to a load port of a handling implement;
On-stream and when transmitting when described substrate supporting device by described substrate supporting device conveyer, use an end effector of the described substrate supporting device handler of described substrate loading stage to make described substrate supporting device break away from described substrate supporting device conveyer;
Described substrate supporting device directly is sent to described load port from described substrate supporting device conveyer;
In the place's mooring of described load port with open described substrate supporting device;
Take off pool at described load port place and close described substrate supporting device; And
Directly send described substrate supporting device back to described substrate supporting device conveyer.
20. one kind provides the method for substrate to the substrate loading stage, it comprises:
On a substrate supporting device conveyer, transmit described substrate supporting device, described substrate supporting device conveyer be positioned at described substrate loading stage near, described substrate loading stage comprises:
A substrate supporting device handler, it is suitable for described substrate supporting device is sent to one first load port of a handling implement, and described substrate supporting device handler comprises:
, a vertical guide rail;
, a horizontal guide rail that links to each other with described vertical guide rail; And
An end effector, it is suitable for supporting described substrate supporting device, and is suitable for respect to described vertical guide rail vertical moving, and moves horizontally with respect to described horizontal guide rail;
Use the described end effector of the described substrate supporting device handler of described substrate loading stage to make described substrate supporting device break away from described substrate supporting device conveyer;
Described substrate supporting device directly is sent to described first load port from described substrate supporting device conveyer;
In the described first load port place mooring with open described substrate supporting device;
Take off pool at the described first load port place and close described substrate supporting device; And
Directly send described substrate supporting device back to described substrate supporting device conveyer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40733602P | 2002-08-31 | 2002-08-31 | |
| US60/407,336 | 2002-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1689140A true CN1689140A (en) | 2005-10-26 |
| CN100397558C CN100397558C (en) | 2008-06-25 |
Family
ID=31978461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB03823887XA Expired - Fee Related CN100397558C (en) | 2002-08-31 | 2003-08-28 | Method and apparatus for supplying substrates to a processing tool |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR101058597B1 (en) |
| CN (1) | CN100397558C (en) |
| AU (1) | AU2003265798A1 (en) |
| TW (1) | TWI355708B (en) |
| WO (1) | WO2004021411A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102414782A (en) * | 2009-02-22 | 2012-04-11 | 迈普尔平版印刷Ip有限公司 | Preparation unit for lithogrpahy machine |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5189370B2 (en) * | 2006-02-01 | 2013-04-24 | オリンパス株式会社 | Substrate exchange apparatus, substrate processing apparatus, and substrate inspection apparatus |
| GB2469112A (en) | 2009-04-03 | 2010-10-06 | Mapper Lithography Ip Bv | Wafer support using controlled capillary liquid layer to hold and release wafer |
| TWI486723B (en) | 2011-04-28 | 2015-06-01 | Mapper Lithography Ip Bv | Method of processing a substrate in a lithography system |
| CN104907288A (en) * | 2014-03-13 | 2015-09-16 | 东莞高伟光学电子有限公司 | Cleaning equipment and technique for cleaning electronic components |
| CN106166717B (en) * | 2016-09-23 | 2018-07-13 | 江西洪都航空工业集团有限责任公司 | A kind of auxiliary support apparatus on flexible assemble production line |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2905857B2 (en) * | 1989-08-11 | 1999-06-14 | 東京エレクトロン株式会社 | Vertical processing equipment |
| ATE129360T1 (en) * | 1992-08-04 | 1995-11-15 | Ibm | PRESSURIZED COUPLING SYSTEMS FOR TRANSFERRING A SEMICONDUCTOR WAFER BETWEEN A PORTABLE SEALABLE PRESSURIZED CONTAINER AND A PROCESSING SYSTEM. |
| JPH0817894A (en) * | 1994-06-27 | 1996-01-19 | Dainippon Screen Mfg Co Ltd | Substrate surface treatment device |
| JPH10256346A (en) * | 1997-03-13 | 1998-09-25 | Tokyo Electron Ltd | Cassette transferring mechanism and semiconductor manufacturing apparatus |
| KR100646906B1 (en) * | 1998-09-22 | 2006-11-17 | 동경 엘렉트론 주식회사 | Substrate processing apparatus and substrate processing method |
| US20020090282A1 (en) * | 2001-01-05 | 2002-07-11 | Applied Materials, Inc. | Actuatable loadport system |
-
2003
- 2003-08-28 AU AU2003265798A patent/AU2003265798A1/en not_active Abandoned
- 2003-08-28 KR KR1020057003402A patent/KR101058597B1/en not_active IP Right Cessation
- 2003-08-28 WO PCT/US2003/026918 patent/WO2004021411A2/en not_active Application Discontinuation
- 2003-08-28 CN CNB03823887XA patent/CN100397558C/en not_active Expired - Fee Related
- 2003-08-29 TW TW092124034A patent/TWI355708B/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102414782A (en) * | 2009-02-22 | 2012-04-11 | 迈普尔平版印刷Ip有限公司 | Preparation unit for lithogrpahy machine |
| CN102414782B (en) * | 2009-02-22 | 2014-11-05 | 迈普尔平版印刷Ip有限公司 | Preparation unit for lithogrpahy machine |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003265798A1 (en) | 2004-03-19 |
| TWI355708B (en) | 2012-01-01 |
| KR101058597B1 (en) | 2011-08-22 |
| TW200408041A (en) | 2004-05-16 |
| KR20050057012A (en) | 2005-06-16 |
| WO2004021411A3 (en) | 2004-04-15 |
| CN100397558C (en) | 2008-06-25 |
| WO2004021411A2 (en) | 2004-03-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7857570B2 (en) | Method and apparatus for supplying substrates to a processing tool | |
| WO2007037397A1 (en) | Method and apparatus for transferring and receiving article by overhead hoist transport carrier | |
| KR102388245B1 (en) | Substrate processing apparatus and substrate transporting method | |
| JP7190900B2 (en) | SUBSTRATE PROCESSING APPARATUS, CARRIER CONVEYING METHOD AND CARRIER BUFFER | |
| KR102303630B1 (en) | Indexer apparatus, substrate processing apparatus, method of controlling the indexer apparatus and method for controlling the substrate processing apparatus | |
| CN1689140A (en) | Method and apparatus for supplying substrates to a processing tool | |
| KR101019212B1 (en) | Method and equipment for treating substrate | |
| TWI774021B (en) | Substrate treating system and substrate transporting method | |
| TW202135225A (en) | Apparatus and method for delivering wafers | |
| JP7458718B2 (en) | Substrate processing equipment and substrate transport method | |
| JP2009146975A (en) | Substrate treating device | |
| JPH05728A (en) | Tray changer device and tray supply method | |
| CN112437977A (en) | Substrate processing apparatus and substrate processing method | |
| JP2024030376A (en) | Substrate processing equipment | |
| JPH06342783A (en) | Substrate wet treating apparatus | |
| JP2013165177A (en) | Stocker device | |
| KR102396204B1 (en) | Substrate processing apparatus and substrate transporting method | |
| TWI766355B (en) | Substrate treating system and substrate transporting method | |
| WO2024042815A1 (en) | Substrate processing apparatus | |
| JP3205525B2 (en) | Substrate unloading device, loading device and unloading and loading device | |
| JP3730803B2 (en) | Substrate attitude changing apparatus and method | |
| CN117276149A (en) | Substrate processing apparatus | |
| JP2003257985A (en) | Heat treatment equipment | |
| JPH0393250A (en) | Transfer apparatus | |
| JP2005311169A (en) | Equipment and method for substrate transfer processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080625 Termination date: 20170828 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |