CN112437977A - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
CN112437977A
CN112437977A CN201980047542.5A CN201980047542A CN112437977A CN 112437977 A CN112437977 A CN 112437977A CN 201980047542 A CN201980047542 A CN 201980047542A CN 112437977 A CN112437977 A CN 112437977A
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unit
substrate
reversing
processing
groove
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CN201980047542.5A
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CN112437977B (en
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山本慎司
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Abstract

The first and second reversing sections (41a, 41b) are provided with a feed-out groove, a take-in groove, and a reversing mechanism, respectively. The reversing mechanism integrally reverses the feed-out groove and the take-in groove, thereby switching between a feed-out posture in which the feed-out groove is disposed on the lower side and a take-in posture in which the take-in groove is disposed on the lower side. An indexer robot (3) inserts an unprocessed substrate (9) into a delivery slot of the first reversing section or the second reversing section in a delivery posture; the center robot (5) inserts the processed substrate into the receiving groove of the first reversing part or the second reversing part in the receiving posture. Thus, contamination of the processed substrate can be suppressed. In the high operation state, the first reversing section or the second reversing section, which is in the loading position and in which no substrate is inserted into the feed-out groove or the loading groove, is set to the feed-out position, and an unprocessed substrate is inserted into the feed-out groove of the reversing section. Thereby, a plurality of substrates can be efficiently processed.

Description

Substrate processing apparatus and substrate processing method
Technical Field
The present invention relates to a substrate processing apparatus and a substrate processing method.
Background
Conventionally, a substrate processing apparatus for performing various processes on a semiconductor substrate (hereinafter, simply referred to as "substrate") is used in the manufacture of a semiconductor device (semiconductor device). For example, in a substrate processing apparatus disclosed in japanese patent No. 4744426 (document 1), a front surface and a back surface of a substrate are reversed in a reversing unit, and the back surface is cleaned in a back surface cleaning unit. In the substrate processing apparatus, two reversing units are provided between the indexer robot (indexer robot) and the main robot (main robot), and the first reversing unit is used for transfer of a substrate before processing and the second reversing unit is used for transfer of a substrate after processing. This prevents contamination of the substrate after the treatment with the substrate before the treatment when the substrate is transferred.
Further, the substrate processing apparatus disclosed in japanese patent No. 6331698 discloses the following method: in the carry-in substrate container, a plurality of storage positions adjacent to each other are set as storage blocks (blocks), and the storage positions of the substrates corresponding to the same processing task (process job) are set as a common storage block when the processed substrates are carried into the carry-in substrate container. In addition, the following methods are also disclosed: a substrate with low cleanliness is prevented from being accommodated above a substrate with high cleanliness, and substrate contamination caused by falling of dust (dust) is suppressed.
However, in the substrate processing apparatus of document 1, when processing of a plurality of substrates is started, for example, a substrate before processing is inverted by using only one inverting unit, and therefore, it is necessary to transport the plurality of substrates to the cleaning unit for a long time. Two reversing units may be used to transfer a plurality of substrates to the cleaning unit. However, in this case, since the inversion of the substrate before the processing and the inversion of the processed substrate are performed by the same inversion unit, there is a possibility that the dust of the substrate before the processing is attached to the processed substrate by the inversion unit and the processed substrate is contaminated.
Disclosure of Invention
The present invention is applied to a substrate processing apparatus, and aims to efficiently process a plurality of substrates while suppressing contamination of the processed substrates.
The substrate processing apparatus of the present invention includes: a container mounting section on which a container for storing a plurality of substrates is mounted; a processing unit having a plurality of processing units for processing substrates, respectively; a first inverting unit disposed between the container mounting unit and the processing unit and configured to invert the substrate; a second inverting unit disposed between the container mounting unit and the processing unit and configured to invert the substrate; a container side transfer unit configured to transfer a substrate between the storage container and the first and second reversing units; a processing unit side transfer unit configured to transfer substrates between the first and second reversing units and the plurality of processing units; and a controller configured to control the first reversing unit, the second reversing unit, the container-side conveying unit, and the processing-unit-side conveying unit, so that an unprocessed substrate in the storage container is reversed by the first reversing unit or the second reversing unit and conveyed to any one of the processing units, and a processed substrate processed by the processing unit is reversed by the first reversing unit or the second reversing unit and returned to the storage container; each inversion unit includes: a sending slot (sending slot) into which an unprocessed substrate in the storage container is inserted by the container side conveying part; a receiving slot (receiving slot) into which the processed substrate processed by the processing unit is inserted by the processing unit-side transfer unit; and a reversing mechanism configured to switch between a delivery posture in which the delivery tank is disposed at a position corresponding to an unprocessed substrate inserted by the container-side transport unit and a pick-up posture in which the pick-up tank is disposed at a position corresponding to a substrate inserted by the processing-side transport unit and processed by the processing-side transport unit, by integrally reversing the delivery tank and the pick-up tank; the container-side transport unit inserts an unprocessed substrate in the storage container into the carry-out slot of the first reversing unit or the second reversing unit in the carry-out posture in accordance with a command from the control unit, and the processing-unit-side transport unit inserts a processed substrate processed by the processing unit into the take-in slot of the first reversing unit or the second reversing unit in the take-in posture in accordance with a command from the control unit; in a high operation state in which an unprocessed substrate to be transported to any one of the processing units while waiting for completion of processing in the processing unit is present in the storage container, the control unit switches the first reversing unit or the second reversing unit, which is in the loading posture without inserting a substrate into the unloading groove and the loading groove, to the unloading posture, and inserts the unprocessed substrate into the unloading groove of the first reversing unit or the second reversing unit switched to the unloading posture by the container-side transport unit.
According to the present invention, a plurality of substrates can be efficiently processed while contamination of the processed substrates is suppressed.
In a preferred aspect of the present invention, in the high operation state, when no substrate is inserted into the carry-out groove and the take-in groove of one of the first reversing section and the second reversing section, and the one reversing section is in the take-in posture, and when an unprocessed substrate is inserted into the carry-out groove of the other reversing section, the control section switches the one reversing section to the carry-out posture.
In another preferred aspect of the present invention, the feed groove is positioned below the take-in groove in the feed posture of each of the reversing sections, or the take-in groove is positioned above the feed groove in the take-in posture of each of the reversing sections.
In this case, it is preferable that: when the carry-out bath is positioned below the take-in bath in the carry-out posture of each of the reversing sections and each of the reversing sections is in the take-in posture with an unprocessed substrate inserted in the carry-out bath, the unprocessed substrate in the carry-out bath is taken out by the processing-section-side conveying section, and thereafter, a processed substrate is inserted in the take-in bath by the processing-section-side conveying section; alternatively, when the take-in groove is positioned above the carry-out groove in the take-in posture of each of the reversing sections and each of the reversing sections is in the carry-out posture in a state in which a processed substrate is inserted into the take-in groove, the processed substrate in the take-in groove is taken out by the container-side conveying section, and thereafter an unprocessed substrate is inserted into the carry-out groove by the container-side conveying section.
In another preferred embodiment of the present invention, the reversing operation by the reversing mechanism is prohibited in a state where the substrate has entered both the carry-out bath and the take-in bath.
In another preferred embodiment of the present invention, each of the plurality of substrates has a pattern surface on which a pattern (pattern) is formed and a back surface on the opposite side of the pattern surface; in the container, the plurality of substrates are held with the pattern surfaces facing upward; the rear surface of the substrate is processed in the plurality of processing units.
The present invention is also directed to a substrate processing method in a substrate processing apparatus. In the substrate processing method according to the present invention, the substrate processing apparatus includes: a container mounting section on which a container for storing a plurality of substrates is mounted; a processing unit having a plurality of processing units for processing substrates, respectively; a first inverting unit disposed between the container mounting unit and the processing unit and configured to invert the substrate; a second inverting unit disposed between the container mounting unit and the processing unit and configured to invert the substrate; a container side transfer unit configured to transfer a substrate between the storage container and the first and second reversing units; and a processing unit side transfer unit configured to transfer the substrate between the first and second reversing units and the plurality of processing units; each inversion unit includes: a discharge slot into which an unprocessed substrate in the storage container is inserted by the container-side conveying unit; a take-in slot into which a processed substrate processed by the processing unit is inserted by the processing unit-side transport unit; and a reversing mechanism configured to switch between a delivery posture in which the delivery tank is disposed at a position corresponding to an unprocessed substrate inserted by the container-side transport unit and a pick-up posture in which the pick-up tank is disposed at a position corresponding to a substrate inserted by the processing-side transport unit and processed by the processing-side transport unit, by integrally reversing the delivery tank and the pick-up tank; the substrate processing method includes: a step (a) of inserting the unprocessed substrate in the storage container into the carry-out slot of any one of the reversing sections in the carry-out posture by the container-side carrying section; a step (b) of inverting the substrate by switching the inverting section to the taking-in posture; a step (c) of carrying the substrate from the reversing unit to any one of the processing units by the processing unit-side carrying unit; a step (d) of processing the substrate in the processing unit; a step (e) of inserting the processed substrate processed by the processing unit into the take-in groove of any one of the reversing units in the take-in posture by the processing unit-side conveying unit; a step (f) of reversing the substrate by switching the reversing section to the feeding posture; a step (g) of returning the substrate from the reversing section to the storage container by the container-side conveying section; a step (h) of performing the same operations as the steps (a) to (g) on the other unprocessed substrates in the storage container, partially in parallel with the steps (a) to (g); a step (i) of switching the first reversing section or the second reversing section, which is in the loading posture and into which no substrate is inserted, to the unloading groove or the loading groove in a high operation state in which an unprocessed substrate to be transported to the processing section is present in the storage container after completion of processing in any one of the processing sections, to the unloading posture; and (j) inserting the unprocessed substrate into the discharge groove of the first reversing section or the second reversing section, which is switched to the discharge posture in the step (i), by the container-side transport section.
The above and other objects, features, aspects and advantages will become apparent from the following detailed description of the present invention with reference to the accompanying drawings.
Drawings
Fig. 1 is a diagram showing a configuration of a substrate processing apparatus.
Fig. 2 is a diagram showing the first and second reversing sections and the central robot (center robot).
Fig. 3 is a diagram showing the structure of the reversing section.
Fig. 4 is a diagram showing a configuration of the center robot.
Fig. 5 is a block diagram showing a functional configuration of the control unit.
Fig. 6 is a diagram showing a flow of the back surface processing operation.
Fig. 7 is a diagram showing a flow of processing a plurality of substrates.
Fig. 8 is a diagram showing a timing (time chart) in the substrate processing apparatus.
Fig. 9 is a diagram showing the operation of the first reversing unit and the second reversing unit.
Fig. 10 is a diagram showing a timing sequence in the substrate processing apparatus.
Fig. 11 is a diagram showing a timing sequence in the substrate processing apparatus of the comparative example.
Fig. 12 is a diagram showing an operation of the reversing section in the substrate processing apparatus according to the comparative example.
Fig. 13 is a diagram showing another example of the operation of the first reversing section and the second reversing section.
Fig. 14 is a diagram showing another example of the operation of the first reversing unit and the second reversing unit.
Detailed Description
Fig. 1 is a diagram showing a configuration of a substrate processing apparatus 1 according to an embodiment of the present invention. In fig. 1, three directions orthogonal to each other are indicated as an X direction, a Y direction, and a Z direction. Typically, the Z direction is a vertical direction (vertical direction), and the X direction and the Y direction are horizontal directions.
The substrate processing apparatus 1 is a sheet-by-sheet type apparatus that processes disk-shaped substrates 9 one by one in a processing unit 61 described later. The substrate 9 has one main surface (hereinafter referred to as a "pattern surface") as a device (device) formation surface and the other main surface (hereinafter referred to as a "back surface") as a non-device formation surface. The pattern surface is formed with a pattern of the device under manufacture. The back surface is a surface opposite to the pattern surface. In a processing example described later, the processing unit 61 performs processing on the back surface of the substrate 9 held with the back surface facing upward by a processing liquid or the like.
The substrate processing apparatus 1 includes a container mounting portion 2, an indexer robot 3, a first reversing portion 41a, a second reversing portion 41b, a center robot 5, a processing unit 6, and a control unit 7. The control Unit 7 is, for example, a computer (computer) including a CPU (Central Processing Unit) or the like, and is responsible for overall control of the substrate Processing apparatus 1. The function of the control unit 7 will be described later. The container placement unit 2, the indexer robot 3, the first reversing unit 41a, the second reversing unit 41b, and the center robot 5 are arranged in the Y direction in this order. A plurality of processing units 61, which will be described later, in the processing unit 6 are disposed around the central robot 5.
The container mounting unit 2 includes a plurality of container mounting tables 21. The plurality of container stages 21 are arranged in the X direction. A container C for accommodating a plurality of substrates 9 is placed on each container table 21. The storage container C is a carrier (carrier) that stores a plurality of substrates 9 in a multi-stage manner. The container C contains a plurality of substrates 9 with the pattern surface facing upward.
The indexer robot 3 is a container side transport unit (or container side transport device) for transporting the substrates 9 between the storage container C and the first and second reversing units 41a and 41 b. The indexer robot 3 is disposed between the container placement unit 2 and the first reversing unit 41a and the second reversing unit 41 b. The indexer robot 3 includes a moving unit 35. The moving unit 35 is movable in the X direction and rotatable about an axis parallel to the vertical direction (Z direction). The moving unit 35 can be moved up and down in the vertical direction. The indexer robot 3 further includes a hand (hand) set 310. The hand group 310 is connected to the moving unit 35 via an articulated arm (arm) 33. The articulated arm 33 advances and retreats in the horizontal direction while maintaining the hand group 310 in a fixed posture. The hand group 310 has two hands 31. The two hands 31 are arranged in the vertical direction. In addition, two holding portions are provided in each hand 31. The two holding portions are arranged in the vertical direction. Each holding portion is in contact with the outer peripheral edge of the downwardly facing back surface of the substrate 9 to hold the substrate 9. The indexer robot 3 uses a motor or the like as a drive source.
In the following description, when two hands 31 are distinguished, the hand 31 disposed on the upper side and the hand 31 disposed on the lower side are referred to as an "upper hand 31" and a "lower hand 31", respectively. In the case where two holding portions are distinguished from each other in each hand 31, the upper and lower holding portions are referred to as "upper holding portion" and "lower holding portion", respectively. The substrate 9 held by the upper holding portion does not contact the lower holding portion, and the substrate 9 held by the lower holding portion does not contact the upper holding portion. The above-described structure of the indexer robot 3 is merely an example, and may be modified as appropriate. For example, the two hands 31 may be provided with articulated arms 33 individually.
Fig. 2 is a view showing the substrate processing apparatus 1 viewed from the (+ Y) side toward the (-Y) direction, and shows the first inversion unit 41a and the second inversion unit 41b, and the central robot 5. As shown in fig. 1, the first reversing section 41a and the second reversing section 41b are disposed between the indexer robot 3 and the center robot 5 and the processing unit 6. As shown in fig. 2, the first reversing section 41a is disposed above the second reversing section 41 b. The indexer robot 3 described above can access both the first reversing section 41a and the second reversing section 41b (access). The same applies to the central robot 5. The first inversion portion 41a and the second inversion portion 41b have the same structure. The first inversion portion 41a and the second inversion portion 41b are not necessarily arranged in the vertical direction. In the following description, the first inversion unit 41a and the second inversion unit 41b will be simply referred to as "inversion unit 41" unless they are distinguished from each other.
Fig. 3 is a diagram showing the structure of the reversing section 41. The reversing section 41 includes a plurality of grooves 42 and 43, a groove support section 44, and a reversing mechanism 45. Each of the grooves 42 and 43 is a substrate holding portion capable of holding the substrate 9 in a horizontal state. In the grooves 42 and 43, the substrate 9 can be held and released by a motor, an air cylinder, or the like. In the example of fig. 3, four grooves 42, 43 are provided. Two grooves 42 among the four grooves 42, 43 are disposed adjacent to each other in the vertical direction, and the remaining grooves 43 are disposed adjacent to each other in the vertical direction. In the following description, in the state shown in fig. 3, the two grooves 42 disposed on the lower side are referred to as "delivery grooves 42", and the two grooves 43 disposed on the upper side are referred to as "take-in grooves 43". The difference between the feed-out groove 42 and the take-in groove 43 will be described later.
The slot support portion 44 is a frame-shaped member that integrally supports the two delivery slots 42 and the two take-in slots 43. Both sides in the Y direction are opened in the groove support portion 44. The indexer robot 3 can access the feed-out groove 42 and the take-in groove 43 from the opening on the (-Y) side of the groove support 44. The center robot 5 can access the feed-out groove 42 and the take-in groove 43 from the opening on the (+ Y) side of the groove support portion 44. The reversing mechanism 45 has, for example, a motor, and can rotate the groove support portion 44 by 180 degrees about an axis parallel to the X direction. Thereby, the two sending grooves 42 and the two taking grooves 43 are integrally reversed, and the substrate 9 held by the sending grooves 42 or the taking grooves 43 is also reversed.
The reversing unit 41 repeats the reversing operation as instructed by the control unit 7. In other words, the reversing unit 41 switches between the posture shown in fig. 3 in which the feed-out groove 42 is disposed below the feed-in groove 43 (hereinafter referred to as "feed-out posture") and the posture in which the feed-in groove 43 is disposed below the feed-out groove 42 (hereinafter referred to as "feed-in posture"). In the reversing section 41, the reversing operation by the reversing mechanism 45 is prohibited in a state where the substrate 9 enters both the sending-out groove 42 and the taking-in groove 43. The above-described structure of the inversion portion 41 may be appropriately changed.
The central robot 5 shown in fig. 1 is a processing unit-side transfer unit (or a processing unit-side transfer device) for transferring the substrates 9 between the first and second inverting units 41a and 41b and the plurality of processing units 61. The center robot 5 is disposed on the (+ Y) side of the first reversing unit 41a and the second reversing unit 41 b. Fig. 4 is a diagram showing the configuration of the center robot 5. The center robot 5 includes a base (base) portion 56 and an elevation/rotation portion 55. The lifting/lowering rotation portion 55 is rotatable about an axis parallel to the vertical direction with respect to the base portion 56 and is vertically movable.
The center robot 5 further includes two hand groups 510. One hand group 510 is disposed above the other hand group 510. Each hand group 510 is connected to the elevation/subsidence rotating unit 55 via the articulated arm 53. The two articulated arms 53 are independently driven by drive mechanisms, not shown, and move forward and backward in the horizontal direction while maintaining the hand group 510 in a fixed posture. Each hand group 510 has two hands 51. The two hands 51 are arranged in the vertical direction. As described above, the substrate 9 is reversed in the first reversing section 41a and the second reversing section 41b, and the respective hands 51 are brought into contact with the outer peripheral edge of the pattern surface of the substrate 9 facing downward to hold the substrate 9. The center robot 5 uses a motor or the like as a drive source.
In the following description, when two hand groups 510 are distinguished, the hand group 510 disposed on the upper side and the hand group 510 disposed on the lower side are referred to as an "upper hand group 510" and a "lower hand group 510", respectively. When the two hands 51 are distinguished from each other, the hand 51 disposed on the upper side and the hand 51 disposed on the lower side are referred to as an "upper hand 51" and a "lower hand 51", respectively. The substrate 9 held by the upper hand 51 does not contact the lower hand 51, and the substrate 9 held by the lower hand 51 does not contact the upper hand 51. The above-described structure of the center robot 5 is merely an example, and may be modified as appropriate. For example, a multi-joint arm 53 may be provided for each of the four hands 51.
The processing unit 6 shown in fig. 1 has a plurality of processing sections 61. In each processing unit 61, the substrate 9 carried in by the center robot 5 is held in a horizontal state by a chuck (chuck) unit. The clamp part rotates together with the substrate 9 as required. For example, the processing liquid is supplied from a nozzle (nozzle) toward the main surface of the substrate 9 facing upward, and the main surface is processed by the processing liquid. The processing unit 61 may process the substrate 9 with a process gas. In an example of the processing unit 6, as shown in fig. 2, four processing units 61 stacked in the vertical direction are provided as a stacking unit 62, and as shown in fig. 1, four stacking units 62 are arranged around the central robot 5. The above configuration of the processing unit 6 is merely an example, and the number and arrangement of the processing units 61 provided in the processing unit 6 may be changed as appropriate.
Fig. 5 is a block diagram showing a functional configuration of the control unit 7. Fig. 5 also illustrates the indexer robot 3, the center robot 5, the first reversing section 41a, the second reversing section 41b, and the plurality of processing sections 61 in a square shape. The control unit 7 includes a control unit 71, an input/output unit 72, and a storage unit 73. The output/input unit 72 receives an input from an operator and notifies the operator by displaying on a display (display) or the like. The storage unit 73 stores various kinds of information. The control unit 71 includes a scheduling unit 711 and a processing instruction unit 712. The schedule planning unit 711 plans the timings (timing) of operations in the indexer robot 3, the center robot 5, the first inversion unit 41a, the second inversion unit 41b, and the plurality of processing units 61 for the plurality of substrates 9 to be processed based on the input from the operator. The processing command unit 712 outputs command signals to the indexer robot 3, the center robot 5, the first inverter 41a, the second inverter 41b, and the plurality of processing units 61 in accordance with the operation sequence planned by the schedule planning unit 711, and receives completion responses from these components. In the substrate processing apparatus 1, the controller 71 controls the operations of the indexer robot 3, the center robot 5, the first reversing unit 41a, the second reversing unit 41b, and the plurality of processing units 61.
Fig. 6 is a diagram showing a flow of the back surface processing operation. The back surface processing operation is a series of operations for processing the back surface of the substrate 9 by the processing unit 61. Hereinafter, the backside processing operation will be described with reference to one substrate 9 (hereinafter referred to as "target substrate 9"). In the substrate processing apparatus 1, the back surface processing operations for the plurality of substrates 9 are performed in parallel with each other based on the operation timing planned by the schedule planning unit 711, but the back surface processing operations for the plurality of substrates 9 will be described later.
In the back surface processing operation, first, the processing command unit 712 confirms which of the first reversing unit 41a and the second reversing unit 41b is used for reversing the unprocessed target substrate 9. When the first reversing section 41a is used (step S11), the target substrate 9 (unprocessed substrate 9) in the storage container C is taken out by the indexer robot 3 and inserted into the carry-out slot 42 of the first reversing section 41a (step S12 a). At this time, the first reversing section 41a assumes a feeding posture in which the feeding groove 42 is positioned on the lower side. The groove support portion 44 is inverted in the first inversion portion 41 a. Thereby, the first reversing section 41a assumes the loading posture in which the sending-out slot 42 is positioned above and the target substrate 9 is reversed (step S13 a). As described above, the target substrate 9 is stored in the storage container C with the pattern surface facing upward, and the reverse surface of the target substrate 9 is facing upward. The target substrate 9 in the carry-out slot 42 is taken out by the center robot 5 and carried into any of the processing units 61 (step S14 a). Then, the processing unit 61 processes the back surface facing upward with a processing liquid or the like (step S15).
On the other hand, in step S11, when the process command unit 712 confirms that the second reversing unit 41b is used, the indexer robot 3 inserts the target substrates 9 in the containers C into the carry-out grooves 42 of the second reversing unit 41b (step S12 b). At this time, the second reversing section 41b assumes a feeding posture in which the feeding groove 42 is positioned on the lower side. The groove support portion 44 is inverted in the second inversion portion 41 b. Thereby, the second reversing section 41b assumes the loading posture in which the sending-out slot 42 is positioned above and the target substrate 9 is reversed (step S13 b). The target substrate 9 in the carry-out slot 42 is taken out by the center robot 5 and carried into any of the processing units 61 (step S14 b). Then, the processing unit 61 processes the back surface facing upward with a processing liquid or the like (step S15).
When the process in the processing unit 61 is completed, the process instructing unit 712 checks whether the first reversing unit 41a or the second reversing unit 41b is used for reversing the processed target substrate 9. When the first reversing section 41a is used (step S16), the target substrate 9 (processed substrate 9) in the processing section 61 is taken out by the central robot 5 and inserted into the take-in groove 43 of the first reversing section 41a (step S17 a). At this time, the first reversing section 41a assumes an entry posture in which the entry groove 43 is positioned on the lower side. The groove support portion 44 is inverted in the first inversion portion 41 a. Thereby, the first reversing section 41a assumes a feeding posture in which the receiving groove 43 is positioned above and the target substrate 9 is reversed (step S18 a). The pattern formation surface of the target substrate 9 after the inversion is directed upward. The target substrate 9 in the receiving slot 43 is taken out by the indexer robot 3 and returned to the storage container C (step S19 a). The target substrate 9 may be returned to a container C different from the container C stored in the unprocessed state.
On the other hand, in step S16, when the process command unit 712 confirms that the second reversing unit 41b is used, the target substrate 9 in the processing unit 61 is taken out by the central robot 5 and inserted into the take-in groove 43 of the second reversing unit 41b (step S17 b). At this time, the second reversing section 41b assumes the entry posture in which the entry groove 43 is positioned on the lower side. The groove support portion 44 is inverted in the second inversion portion 41 b. Thereby, the second reversing section 41b assumes the sending posture in which the take-in groove 43 is positioned on the upper side and the target substrate 9 is reversed (step S18 b). The target substrate 9 in the receiving slot 43 is taken out by the indexer robot 3 and returned to the storage container C (step S19 b).
In step S11, in principle, the scheduling unit 711 selects one of the first reversing unit 41a and the second reversing unit 41b so that the target substrate 9 in the container C can be transported to the processing unit 61 more quickly. As described above, the indexer robot 3 inserts the substrate 9 into the feed grooves 42 of the first reversing section 41a and the second reversing section 41b in the feed postures. Therefore, for example, the first reversing section 41a is selected in a state where the first reversing section 41a is in the feeding posture and the substrate 9 is not inserted into the feeding groove 42, and the second reversing section 41b is in the loading posture and the substrate 9 is not inserted into the loading groove 43. Thus, the indexer robot 3 can immediately insert the substrate 9 into the feed-out slot 42.
The second reversing section 41b is selected in a state where the first reversing section 41a is in the feeding posture and the substrate 9 is inserted into the feeding groove 42, and the second reversing section 41b is in the loading posture and the substrate 9 is inserted into the loading groove 43. In this case, when the first reversing unit 41a is used, it is necessary to wait for the reversing operation of the first reversing unit 41a, the taking out of the substrate 9 by the center robot 5, and the reversing operation of the first reversing unit 41 a. On the other hand, when the second reversing section 41b is used, the indexer robot 3 can insert the substrate 9 into the feed groove 42 by waiting for the reversing operation of the second reversing section 41 b.
In step S16, in principle, the scheduling planning unit 711 selects one of the first reversing unit 41a and the second reversing unit 41b so that the target substrate 9 in the processing unit 61 can be transferred to the storage container C more quickly. As described above, the center robot 5 inserts the substrate 9 into the receiving grooves 43 of the first inversion unit 41a and the second inversion unit 41b in the receiving posture. Therefore, for example, the second reversing section 41b is selected in a state where the first reversing section 41a is in the feeding posture and the substrate 9 is not inserted into the feeding groove 42, and the second reversing section 41b is in the loading posture and the substrate 9 is not inserted into the loading groove 43. Thereby, the center robot 5 can immediately insert the substrate 9 into the take-in groove 43.
As described above, in the preferred schedule planning unit 711, the first inverting unit 41a and the second inverting unit 41b that can transfer the target substrate 9 faster can be selected based on the postures of the respective inverting units 41a and 41b and the presence or absence of holding of the substrate 9 by the respective inverting units 41a and 41 b.
As shown in fig. 7, in the actual substrate processing apparatus 1, the back surface processing operation is performed on the plurality of substrates 9 to be processed (step S21). At this time, as will be described later, in parallel with the back surface processing operation for one substrate 9, the back surface processing operation is performed for the other unprocessed substrates 9 in the storage container C. In addition, in a high operation state in which the unprocessed substrates 9 are processed in all the processing units 61 and are to be transported to any one of the processing units 61 while waiting for completion of the processing in that processing unit 61 are present, if a predetermined empty inversion condition is satisfied, empty inversion is performed in the first inversion unit 41a or the second inversion unit 41b (step S22). The idle rotation in the present embodiment is an operation of switching the first reversing unit 41a or the second reversing unit 41b, which is not inserted into the substrate 9 in the feeding groove 42 and the taking-in groove 43 and is in the taking-in posture, to the feeding posture, unless otherwise specified. The null reversal condition will be described later. When the back surface processing operation for all the substrates 9 to be processed is completed, the plurality of substrates 9 in the substrate processing apparatus 1 are processed (step S23).
Next, the operation timing of each component in the back surface processing operation of the plurality of substrates 9 (i.e., the operation timing planned by the schedule planning unit 711) will be described in detail. Fig. 8 is a diagram showing a timing sequence in the substrate processing apparatus 1 in the high operation state. In fig. 8 (and fig. 9 to 14 described later), ST denotes the container placement unit 2, IR denotes the indexer robot 3, RVP1 denotes the first reversing unit 41a, RVP2 denotes the second reversing unit 41b, CR denotes the center robot 5, and SPIN1 to SPIN6 denote the first to sixth processing units 61 to 61. Here, for convenience of illustration, only six processing units 61 are shown. The alphabetic letters (alphabet) shown in the squares are used to identify the substrates 9 to be operated in the container placing section 2, the indexer robot 3, the first reversing section 41a, the second reversing section 41b, the center robot 5, and the first to sixth processing sections 61 to 61.
The arrow between ST and IR indicates the transfer of the substrate 9 between the container placement unit 2 and the indexer robot 3, and the arrow between IR and RVP1 or RVP2 indicates the transfer of the substrate 9 between the indexer robot 3 and the first reversing unit 41a or the second reversing unit 41 b. The arrows between the RVP1 or RVP2 and CR indicate the transfer of the substrate 9 between the first reversing unit 41a or the second reversing unit 41b and the center robot 5, and the arrows between CR and the SPIN1 to the SPIN6 indicate the transfer of the substrate 9 between the center robot 5 and the first processing unit 61 to the sixth processing unit 61. "REVERSE" shown below the blocks in RVP1 and RVP2 indicates the REVERSE operation in the first REVERSE unit 41a and the second REVERSE unit 41 b. "processes" shown on the lower side of the blocks in the SPIN1 to SPIN6 indicates the start of processing in the first to sixth processing sections 61 to 61.
Fig. 9 is a diagram showing the operation of the first reversing section 41a and the second reversing section 41b in the high operation state. In fig. 9, the two taking grooves 43 of the respective reversing sections 41a and 41b (RVP1 or RVP2) are denoted by the numbers "1" and "2", and the two sending grooves 42 are denoted by the numbers "3" and "4". The left side of an arrow A1 (one arrow is denoted by A1a) indicating the reverse operation indicates the arrangement of the slots immediately before the reverse operation, and the right side of an arrow A1 indicates the arrangement of the slots immediately after the reverse operation. The same applies to fig. 12 to 14 described later.
Fig. 9 also shows the position (holding portion or hand) at which the substrate 9 is held by the indexer robot 3 and the center robot 5. Up-Up shown on the right side of IR indicates the upper holding portion of the upper hand portion 31, Lw-Up indicates the lower holding portion of the upper hand portion 31, Up-Lw indicates the upper holding portion of the lower hand portion 31, and Lw-Lw indicates the lower holding portion of the lower hand portion 31. In addition, Up-Up shown on the right side of the CR indicates the upper hand 51 of the upper hand group 510, Up-Lw indicates the upper hand 51 of the lower hand group 510, Lw-Up indicates the lower hand 51 of the upper hand group 510, and Lw-Lw indicates the lower hand 51 of the lower hand group 510. As will be described later, in the indexer robot 3, the unprocessed substrate 9 is held by the lower holding portion of the upper hand 31 or the lower hand 31, and the processed substrate 9 is held by the upper holding portion of the upper hand 31 or the lower hand 31. In the central robot 5, the unprocessed substrates 9 are held by the lower hand 51 of the upper hand group 510 or the lower hand group 510, and the processed substrates 9 are held by the upper hand 51 of the upper hand group 510 or the lower hand group 510.
Here, it is assumed that unprocessed substrates 9 which have been carried into all the processing units 61 and are to be conveyed to any one of the processing units 61 while waiting for completion of processing in the processing unit 61 are present in the container C, that is, in the high operation state. When the processing of the substrates 9 in a part of the processing units 61 is nearly completed, the unprocessed substrates 9 of "F" and "G" in the containers C on the container placement unit 2 are taken out by the indexer robot 3. At this time, the unprocessed substrates 9 of "F" and "G" are held by the lower holding portion of the upper hand 31 and the lower holding portion of the lower hand 31, respectively.
The unprocessed substrates 9 of "F" and "G" are inserted into the sending-out grooves 42 of "3" and "4" of the first reversing section 41a, respectively. The feed-out grooves 42 of "3" and "4" are located on the lower side, and the first reversing section 41a is in the feed-out posture. The unprocessed substrates 9 of "F" and "G" are inverted by the inversion operation of the first inversion portion 41 a. The delivery grooves 42 of "3" and "4" are located above, and the first reversing section 41a assumes the intake posture. The unprocessed substrates 9 "G" and "F" in the first reversing section 41a are taken out by the central robot 5. At this time, the unprocessed substrates 9 of "G" and "F" are held by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510, respectively. Thereafter, in the upper hand group 510, the upper hand 51 takes out the processed substrate 9 "a" in the first processing unit 61, and the unprocessed substrate 9 "G" held by the lower hand 51 is transferred to the jig unit in the first processing unit 61 (that is, the unprocessed substrate 9 "G" is carried into the first processing unit 61). In the lower hand group 510, the upper hand 51 takes out the processed substrate 9 "b" in the second processing unit 61, and the unprocessed substrate 9 "F" held by the lower hand 51 is carried into the second processing unit 61. As a result, the processed substrates 9 "a" and "b" are held by the center robot 5. The first processing unit 61 and the second processing unit 61 start processing the unprocessed substrates 9 of "G" and "F".
Here, in the present embodiment, in the high operation state, the substrate 9 is not inserted into the carry-out groove 42 and the take-in groove 43 of one reversing section and the one reversing section is in the take-in posture, and the unprocessed substrate is inserted into the carry-out groove 42 of the other reversing section, which becomes the empty reversing condition of the one reversing section. By taking out the unprocessed substrates 9 of "F" and "G", neither substrate 9 is inserted into the carry-out groove 42 and the take-in groove 43 of the first reversing section 41a, and the first reversing section 41a assumes the take-in posture. As will be described later, in parallel with the above-described reversing operation of the first reversing section 41a ("reversing operation of the unprocessed substrate 9 by F" and "G"), the unprocessed substrate 9 is inserted into the feed-out groove 42 of the second reversing section 41 b. Accordingly, the null inversion condition of the first inversion portion 41a is satisfied, and null inversion of the first inversion portion 41a is performed as indicated by an arrow A1a in fig. 9. Thereby, the first reversing section 41a assumes the feeding posture. The null reversal is indicated in fig. 8 by a block B1 with parallel diagonal lines inside. The operation of the first reversing unit 41a after the null reversing will be described later.
In the indexer robot 3, after the unprocessed substrates 9 of "F" and "G" are transferred to the first reversing section 41a, the unprocessed substrates 9 of "H" and "I" in the storage container C are taken out. At this time, the unprocessed substrates 9 of "H" and "I" are held by the lower holding portion of the upper hand 31 and the lower holding portion of the lower hand 31, respectively. The unprocessed substrates 9 "H" and "I" are inserted into the discharge grooves 42 "3" and "4" of the second reversing section 41b, respectively. The feed-out grooves 42 of "3" and "4" are located on the lower side, and the second reversing section 41b is in the feed-out posture. The unprocessed substrates 9 of "H" and "I" are inverted by the inversion operation of the second inversion unit 41 b. The delivery grooves 42 of "3" and "4" are located above, and the second reversing section 41b assumes the intake position.
The unprocessed substrates 9 "I" and "H" of the second reversing section 41b are held and taken out by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510 of the center robot 5, respectively. At this time, the central robot 5 holds the processed substrates 9 "a" and "b" by the upper hand 51 of the upper hand group 510 and the upper hand 51 of the lower hand group 510. Next, the processed substrates 9 "a" and "b" are inserted into the taking-in grooves 43 "2" and "1" in the second reversing section 41b in the taking-in posture, respectively. In this way, the exchange of two unprocessed substrates 9 and two processed substrates 9 (hereinafter also simply referred to as "substrate exchange") can be performed between the central robot 5 and the second reversing section 41 b.
At this time, in the central robot 5, although the processed substrates 9 "a" and "b" and the unprocessed substrates 9 "I" and "H" are temporarily held simultaneously, all the processed substrates 9 are held by the upper hand 51 and all the unprocessed substrates 9 are held by the lower hand 51. Therefore, the processed substrate 9 is not contaminated by falling of dust from the unprocessed substrate 9. Further, it is also possible to prevent dust of the unprocessed substrate 9 from adhering to the processed substrate 9 through the hand 51. In the second reversing section 41b, although the processed substrate 9 is inserted into the lower taking-in groove 43, the unprocessed substrate 9 can be taken out from the sending-out groove 42 before the processed substrate 9 is inserted. Therefore, the processed substrate 9 in the take-in tank 43 is not contaminated by the falling of the dust from the unprocessed substrate 9 in the carry-out tank 42.
Thereafter, the processed substrates 9 "a" and "b" are reversed by the reversing operation of the second reversing unit 41 b. The receiving grooves 43 of "1" and "2" are located above, and the second reversing section 41b assumes the feed-out posture. In the upper hand group 510 of the central robot 5, the processed substrate 9 of "c" in the third processing unit 61 is taken out and the unprocessed substrate 9 of "I" is carried into the third processing unit 61. In the lower hand group 510, the processed substrate 9 of "d" in the fourth processing unit 61 is taken out and the unprocessed substrate 9 of "H" is carried into the fourth processing unit 61. As a result, the processed substrates 9 "c" and "d" are held by the center robot 5. The third processing unit 61 and the fourth processing unit 61 start processing the unprocessed substrates 9 of "I" and "H".
In the indexer robot 3, the unprocessed substrates 9 of "J" and "K" in the storage container C are taken out in parallel with the substrate exchange between the center robot 5 and the second reversing section 41 b. The unprocessed substrates 9 of "J" and "K" are inserted into the discharge grooves 42 of "3" and "4" of the first reversing section 41a, which has been reversed by the empty state into the discharge posture, respectively. The unprocessed substrates 9 of "J" and "K" are reversed by the reversing operation of the first reversing section 41a, and the first reversing section 41a assumes the loading posture.
The unprocessed substrates 9 "K" and "J" of the first reversing unit 41a are held and taken out by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510 of the center robot 5, respectively. At this time, the central robot 5 holds the processed substrates 9 "c" and "d" by the upper hand 51 of the upper hand group 510 and the upper hand 51 of the lower hand group 510. Next, the processed substrates 9 "c" and "d" are inserted into the taking-in grooves 43 "2" and "1" in the first reversing section 41a in the taking-in posture, respectively. In this way, the exchange of two unprocessed substrates 9 and two processed substrates 9 (that is, substrate exchange) can be performed between the center robot 5 and the first reversing section 41 a. Here, the substrate exchange can be completed by inverting the first inverting section 41a empty and putting two unprocessed substrates 9 into the first inverting section 41a in advance. Further, since the above-described reversing operation of the first reversing unit 41a (the reversing operation of the unprocessed substrate 9 of "J" and "K") is performed while the center robot 5 accesses the third processing unit 61 and the fourth processing unit 61, the substrate can be exchanged with the first reversing unit 41a without an excessive waiting time in the center robot 5. Thereafter, the processed substrates 9 "c" and "d" are inverted by the inversion operation of the first inversion unit 41 a. The subsequent operation of the untreated substrates 9 of "K" and "J" is the same as that of the untreated substrates 9 described above, and therefore, the description thereof is omitted.
On the other hand, in the second reversing section 41b, the processed substrates 9 "a" and "b" in the take-in groove 43 are reversed, and the second reversing section 41b is set to the sending-out posture. The unprocessed substrates 9 "L" and "M" in the storage container C are held by the lower holding portion of the upper hand 31 and the lower holding portion of the lower hand 31 of the indexer robot 3, and are inserted into the discharge grooves 42 "3" and "4" of the second reversing section 41b in the discharge posture. Subsequently, the processed substrates 9 "b" and "a" in the taking-in grooves 43 of "1" and "2" are held by the upper holding portions of the upper hand 31 and the upper holding portions of the lower hand 31 and returned to the storage container C. In this way, the exchange of two unprocessed substrates 9 and two processed substrates 9 (that is, substrate exchange) can be performed between the indexer robot 3 and the second reversing section 41 b.
At this time, in the indexer robot 3, all the processed substrates 9 are held by the upper holding portion, and all the unprocessed substrates 9 are held by the lower holding portion. Therefore, dust of the unprocessed substrate 9 can be prevented from adhering to the processed substrate 9 through the hand 31. In the second reversing section 41b, although the processed substrates 9 "b" and "a" and the unprocessed substrates 9 "L" and "M" are temporarily held simultaneously, the processed substrates 9 are held in the take-in groove 43 located on the upper side and the unprocessed substrates 9 are held in the carry-out groove 42 located on the lower side. Therefore, the processed substrate 9 is not contaminated by the falling of the dust from the unprocessed substrate 9 (the same applies to the first reversing section 41 a). The unprocessed substrate 9 is inserted into the delivery slot 42, and the processed substrate 9 is inserted into the take-in slot 43. Therefore, the adhesion of the dust of the unprocessed substrate 9 to the processed substrate 9 through the groove can be prevented. The subsequent operation of the untreated substrates 9 of "L" and "M" is the same as that of the untreated substrates 9 described above, and therefore, the description thereof is omitted.
In the first reversing section 41a, the processed substrates 9 "c" and "d" in the receiving groove 43 are reversed as described above, and the first reversing section 41a is set to the sending-out posture. In the indexer robot 3, the unprocessed substrates 9 "N" and "O" in the storage container C are inserted into the two feed grooves 42 of the first reversing section 41a, respectively. At this time, the above-described reversing operation of the first reversing section 41a ("reversing operation of the processed substrates 9 of" C "and" d ") is performed in parallel with the above-described operation of the indexer robot 3 to return the processed substrates 9 of" a "and" b "to the storage container C, whereby the unprocessed substrates 9 of" N "and" O "can be loaded into the first reversing section 41a without an excessive waiting time in the indexer robot 3. Thereafter, the processed substrates 9 "C" and "d" in the two taking-in grooves 43 are returned to the storage container C. In this way, the exchange of two unprocessed substrates 9 and two processed substrates 9 (that is, substrate exchange) can be performed between the indexer robot 3 and the first reversing section 41 a. The subsequent operation of the untreated substrates 9 of "N" and "O" is the same as that of the untreated substrates 9 described above, and therefore, the description thereof is omitted.
Fig. 10 is a diagram showing a timing immediately after the start of the back surface processing operation for the plurality of substrates 9. As shown in fig. 10, it is necessary to sequentially carry in unprocessed substrates 9 in the storage container C to the plurality of processing units 61 immediately after the start of the back surface processing operation for the plurality of substrates 9. In this case, after the unprocessed substrate 9 is inverted and the unprocessed substrate 9 is taken out by the inversion units 41a and 41B, the blank inversion is performed as indicated by a block B2 in which a parallel oblique line is formed. Similarly, immediately before the completion of the back surface processing operation on the plurality of substrates 9, the processed substrates 9 need to be sequentially returned from the plurality of processing units 61 into the storage container C. In this case, the processed substrate 9 is inverted in the inversion units 41a and 41b, and the processed substrate 9 is taken out and then subjected to the empty inversion. On the other hand, the dummy inversion shown in block B1 in fig. 8 is performed under the dummy inversion condition in the high operation state, and is different from the above-described dummy inversion performed immediately after the start of the back surface processing operation for the plurality of substrates 9 and immediately before the end of the back surface processing operation for the plurality of substrates 9.
The empty inversion condition in the high operation state may be a condition that can increase the throughput (throughput) in the substrate processing apparatus 1 by performing the empty inversion of the first inversion unit 41a or the second inversion unit 41b, and may be a condition other than the empty inversion condition described with reference to fig. 8 and 9. For example, it is preferable that the empty inversion is performed when the exchange of two unprocessed substrates 9 and two processed substrates 9 (that is, the exchange of substrates) can be performed between the indexer robot 3 and the first and second inversion units 41a and 41b or between the center robot 5 and the first and second inversion units 41a and 41b by performing the empty inversion of the first or second inversion unit 41a or 41 b.
For example, in the high operation state, it is preferable that the empty inversion of at least one of the first inversion unit 41a and the second inversion unit 41b is performed when both the first inversion unit 41a and the second inversion unit 41b do not hold the unprocessed substrates 9 and both the first inversion unit 41a and the second inversion unit 41b are in the loading posture. After the empty inversion, the unprocessed substrate 9 is inserted into the sending-out grooves 42 of the inverting portions 41a and 41b, and the inverting portions 41a and 41b are further inverted, whereby the inverting portions 41a and 41b are brought into the taking-in posture in a state where the unprocessed substrate 9 is held. As described above, when both the inverting units 41a and 41b not holding the unprocessed substrate 9 are in the loading posture, it is considered that the central robot 5 holds the unprocessed substrate 9, accesses the processing unit 61, and carries out the processed substrate 9 from the processing unit 61. Although a certain amount of time is required for the reversing operation in the reversing units 41a and 41b, the first reversing unit 41a or the second reversing unit 41b is set to the pick-up posture in advance in a state where the unprocessed substrate 9 is held while the central robot 5 is accessing the processing unit 61, and thus the processed substrate 9 and the unprocessed substrate 9 can be exchanged without an excessive waiting time.
Next, a substrate processing apparatus of a comparative example in which one of the first reversing section 41a and the second reversing section 41b is omitted and only one reversing section is used will be described. The feeding groove 42 and the taking-in groove 43 are not distinguished in the reversing section in the substrate processing apparatus of the comparative example. The unprocessed substrate 9 is inserted into the lower two grooves by the indexer robot 3, and the processed substrate 9 is inserted into the lower two grooves by the center robot 5.
Fig. 11 is a diagram showing a timing sequence in the substrate processing apparatus of the comparative example, and fig. 12 is a diagram showing an operation of the reversing unit. Fig. 11 and 12 correspond to fig. 8 and 9, respectively. In addition, the RVP in fig. 11 and 12 indicates the above-described one inversion portion. In the substrate processing apparatus of the comparative example, the time for the indexer robot 3 and the center robot 5 to wait for the completion of the operation of the reversing section becomes long, and the overall operation rate decreases. In the reversing section, since the groove into which the unprocessed substrate 9 is inserted is not distinguished from the groove into which the processed substrate 9 is inserted, there is a possibility that dust of the unprocessed substrate 9 may adhere to the processed substrate 9 through the groove.
In contrast, the substrate processing apparatus 1 of fig. 1 is provided with two reversing sections 41a and 41 b. Thus, compared to the substrate processing apparatus of the comparative example, the indexer robot 3 and the center robot 5 can shorten (eliminate) the time for waiting for the completion of the operations of the first inversion unit 41a and the second inversion unit 41b, and can improve the operation rate. In one example, an operation rate substantially equal to that in the case where the substrate 9 is not inverted can be realized. Each of the reversing sections 41a and 41b includes: a discharge slot 42 into which the unprocessed substrate 9 is inserted; and a receiving groove 43 into which the processed substrate 9 is inserted. This can prevent dust from the untreated substrate 9 from adhering to the treated substrate 9 through the grooves and contaminating the treated substrate 9.
In the high operation state, the first reversing section 41a or the second reversing section 41b, which is in the loading position with the substrate 9 not inserted into the feeding groove 42 or the loading groove 43, is set to the feeding position by the idle reversing under a predetermined condition. Then, the unprocessed substrate 9 is inserted into the feed-out groove 42 of the reversing section 41a or 41b set to the feed-out posture by the indexer robot 3. In this way, by performing the inversion (empty inversion) of the first inversion unit 41a or the second inversion unit 41b, into which the substrate 9 is not inserted, in the high operation state, the unprocessed substrate 9 and the processed substrate 9 can be exchanged between the inversion units 41a and 41b and the central robot 5, and a plurality of substrates 9 can be efficiently processed.
Preferably, the method comprises the following steps: in the high operation state, when the substrate 9 is not inserted into the carry-out groove 42 and the take-in groove 43 of one of the first reversing section 41a and the second reversing section 41b and the one reversing section is in the take-in posture, and further the unprocessed substrate 9 is inserted into the carry-out groove 42 of the other reversing section, the one reversing section is set to the carry-out posture by the idle reversing. This allows the unprocessed substrates 9 and the processed substrates 9 to be exchanged between the single reversing unit 41a or 41b and the central robot 5, and thus allows a plurality of substrates 9 to be processed efficiently.
In the substrate processing apparatus 1, the feed-out groove 42 is positioned below the take-in groove 43 in the feed-out postures of the respective reversing sections 41a and 41 b. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 in the reversing sections 41a and 41b in the carrying-out posture, and prevents the processed substrate 9 from being contaminated by the unprocessed substrate 9. When the reversing units 41a and 41b are in the loading position with the unprocessed substrates 9 inserted into the unloading groove 42, the unprocessed substrates 9 in the unloading groove 42 are unloaded by the central robot 5, and then the processed substrates 9 are inserted into the loading groove 43. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 in the reversing sections 41a and 41b in the loading position, and prevents the processed substrate 9 from being contaminated by the unprocessed substrate 9.
In the reversing portions 41a and 41b, the reversing operation of the reversing mechanism 45 is prohibited in a state where the substrate 9 has entered both the sending-out groove 42 and the taking-in groove 43. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 due to the reverse operation.
In each of the reversing sections 41a and 41b, the number of the feed grooves 42 and the take-in grooves 43 may be two or more. Fig. 13 shows a case where the number of the feed grooves 42 and the take-in grooves 43 is one, and fig. 14 shows a case where the number of the feed grooves 42 and the take-in grooves 43 is four. Even in the example of fig. 13 and 14, in the high operation state, when the substrate 9 is not inserted into the carry-out groove 42 and the take-in groove 43 of the first reversing unit 41a (RVP1), the first reversing unit 41a is in the take-in posture, and the unprocessed substrate 9 is inserted into the carry-out groove 42 of the second reversing unit 41b, the null reversing condition of the first reversing unit 41a is satisfied. Thereby, the null inversion of the first inversion portion 41a is performed (refer to the inversion operation of arrow A1 a). As a result, the unprocessed substrates 9 and the processed substrates 9 can be exchanged between the first reversing unit 41a and the central robot 5, and the plurality of substrates 9 can be efficiently processed. The same applies to the case where the null inversion condition of the second inversion portion 41b is satisfied.
Although the back surface processing operation is performed on the plurality of substrates 9 in the above processing example, in the substrate processing apparatus 1, the pattern surface of the substrate 9 may be directed upward in the processing section 61 and may be processed by a processing liquid or the like. In a series of operations for processing the pattern surface of the substrate 9 by the processing section 61 (hereinafter referred to as "pattern surface processing operations"), an unprocessed substrate 9 is inserted into the carry-out slot 42 of the first reversing section 41a or the second reversing section 41b by the indexer robot 3, and the unprocessed substrate 9 is carried out by the center robot 5 without being reversed by the reversing sections 41a, 41 b. The unprocessed substrate 9 is carried into any one of the processing units 61. The processed substrate 9, which is the substrate 9 whose pattern surface has been processed in the processing unit 61, is taken out by the center robot 5 and inserted into the taking-in groove 43 of the first reversing unit 41a or the second reversing unit 41 b. Then, the processed substrate 9 is taken out by the indexer robot 3 without being reversed by the first reversing unit 41a and the second reversing unit 41b and returned to the storage container C.
The substrate processing apparatus 1 may perform both the pattern surface processing operation and the back surface processing operation. In this case, in the high operation state, when the back surface processing operation is performed on the unprocessed substrate 9 to be transported to the processing unit 61, it is preferable that the first reversing unit 41a or the second reversing unit 41b, which is in the taking-in posture and in which the substrate 9 is not inserted into the sending-out groove 42 and the taking-in groove 43, is set to the sending-out posture by the idle reversing. The unprocessed substrate 9 is inserted into the feed groove 42 of the reversing sections 41a and 41b set in the feed posture by the indexer robot 3, and the reversing operation of the reversing sections 41a and 41b is performed. This allows the unprocessed substrates 9 with the back surfaces facing upward to be exchanged between the reversing sections 41a and 41b and the center robot 5 with the processed substrates 9 with the back surfaces or pattern surfaces facing upward, and thus allows a plurality of substrates 9 to be processed efficiently.
Various changes can be made in the substrate processing apparatus 1.
In the substrate processing apparatus 1, the taking-in groove 43 may be positioned above the sending-out groove 42 in the taking-in posture of each of the reversing sections 41a and 41 b. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 in the reversing sections 41a and 41b in the loading position, and thus prevents contamination of the processed substrate 9. In addition, when the reversing sections 41a and 41b are in the delivery posture in a state where the processed substrate 9 is inserted into the take-in groove 43, that is, when the take-in groove 43 is positioned below the delivery groove 42 in the delivery posture, it is preferable that the unprocessed substrate 9 is inserted into the delivery groove 42 after the processed substrate 9 in the take-in groove 43 is taken out by the indexer robot 3. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 in the reversing sections 41a and 41b in the feeding posture, and thus prevents contamination of the processed substrate 9.
In the feeding and taking-in postures of the reversing sections 41a and 41b, the feeding groove 42 and the taking-in groove 43 may be disposed at positions separated in the horizontal direction, for example. In the feed-out posture in the reversing sections 41a and 41b, the feed-out groove 42 may be disposed at an arbitrary position corresponding to the insertion of the unprocessed substrate 9 by the indexer robot 3, and in the take-in posture in the reversing sections 41a and 41b, the take-in groove 43 may be disposed at an arbitrary position corresponding to the insertion of the processed substrate 9 by the center robot 5.
The substrate to be processed by the substrate processing apparatus 1 is not limited to a semiconductor substrate, and may be a glass substrate or another substrate. The substrate processing apparatus 1 may be used for processing a substrate having an outer shape different from a disk shape.
The configurations in the above-described embodiments and the respective modifications may be appropriately combined as long as they are not contradictory to each other.
While the present invention has been depicted and described in detail, the description is illustrative and not restrictive. Thus, it is intended that various changes or modifications can be made without departing from the scope of the invention.
[ description of reference numerals ]
1 substrate processing apparatus
2 Container mounting part
3 graduator manipulator
5 Central manipulator
6 processing unit
9 base plate
41a first reversal part
41b second reversal part
42 discharge chute
43 taking-in groove
45 reversing mechanism
61 processing part
71 control part
C container
S11, S12 a-S14 a, S12 b-S14 b, S15, S16, S17 a-S19 a, S17 b-S19 b, S21-S23

Claims (7)

1. A substrate processing apparatus includes:
a container mounting section on which a container for storing a plurality of substrates is mounted;
a processing unit having a plurality of processing units for processing substrates, respectively;
a first inverting unit disposed between the container mounting unit and the processing unit and configured to invert the substrate;
a second inverting unit disposed between the container mounting unit and the processing unit and configured to invert the substrate;
a container side transfer unit configured to transfer a substrate between the storage container and the first and second reversing units;
a processing unit side transfer unit configured to transfer substrates between the first and second reversing units and the plurality of processing units; and
a controller configured to control the first reversing unit, the second reversing unit, the container-side conveying unit, and the processing-unit-side conveying unit, so that an unprocessed substrate in the storage container is reversed by the first reversing unit or the second reversing unit and conveyed to any one of the processing units, and a processed substrate processed by the processing unit is reversed by the first reversing unit or the second reversing unit and returned to the storage container;
each inversion unit includes:
a discharge slot into which an unprocessed substrate in the storage container is inserted by the container-side conveying unit;
a take-in slot into which a processed substrate processed by the processing unit is inserted by the processing unit-side transport unit; and
a reversing mechanism configured to switch between a delivery posture in which the delivery groove is disposed at a position corresponding to an unprocessed substrate inserted by the container-side transport unit and a pick-up posture in which the pick-up groove is disposed at a position corresponding to a substrate inserted by the processing-side transport unit and processed by the processing-side transport unit, by integrally reversing the delivery groove and the pick-up groove;
the container-side transport unit inserts an unprocessed substrate in the storage container into the carry-out slot of the first reversing unit or the second reversing unit in the carry-out posture in accordance with a command from the control unit, and the processing-unit-side transport unit inserts a processed substrate processed by the processing unit into the take-in slot of the first reversing unit or the second reversing unit in the take-in posture in accordance with a command from the control unit;
in a high operation state in which an unprocessed substrate to be transported to any one of the processing units while waiting for completion of processing in the processing unit is present in the storage container, the control unit switches the first reversing unit or the second reversing unit, which is in the loading posture without inserting a substrate into the unloading groove and the loading groove, to the unloading posture, and inserts the unprocessed substrate into the unloading groove of the first reversing unit or the second reversing unit switched to the unloading posture by the container-side transport unit.
2. The substrate processing apparatus according to claim 1, wherein,
in the high operation state, when the feeding groove and the receiving groove of one of the first reversing unit and the second reversing unit are not inserted with a substrate and the one reversing unit is in the feeding posture, and when an unprocessed substrate is inserted into the feeding groove of the other reversing unit, the control unit switches the one reversing unit to the feeding posture.
3. The substrate processing apparatus according to claim 1 or 2, wherein,
the feed-out groove is positioned below the take-in groove in the feed-out posture of each of the reversing sections, or the take-in groove is positioned above the feed-out groove in the take-in posture of each of the reversing sections.
4. The substrate processing apparatus according to claim 3, wherein,
when the carry-out bath is positioned below the take-in bath in the carry-out posture of each of the reversing sections and each of the reversing sections is in the take-in posture with an unprocessed substrate inserted in the carry-out bath, the unprocessed substrate in the carry-out bath is taken out by the processing-section-side conveying section, and thereafter, a processed substrate is inserted in the take-in bath by the processing-section-side conveying section; or
When the take-in groove is positioned above the carry-out groove in the take-in posture of each reversing section, and each reversing section is in the carry-out posture in a state where a processed substrate is inserted into the take-in groove, the processed substrate in the take-in groove is taken out by the container-side conveying section, and thereafter, an unprocessed substrate is inserted into the carry-out groove by the container-side conveying section.
5. The substrate processing apparatus according to any one of claims 1 to 4,
and prohibiting reverse rotation by the reversing mechanism in a state where the substrate has entered both the carry-out bath and the take-in bath.
6. The substrate processing apparatus according to any one of claims 1 to 5, wherein,
the plurality of substrates are respectively provided with a pattern surface with a pattern and a back surface on the opposite side of the pattern surface;
in the container, the plurality of substrates are held with the pattern surfaces facing upward;
the rear surface of the substrate is processed in the plurality of processing units.
7. A substrate processing method in a substrate processing apparatus, wherein,
the substrate processing apparatus includes:
a container mounting section on which a container for storing a plurality of substrates is mounted;
a processing unit having a plurality of processing units for processing substrates, respectively;
a first inverting unit disposed between the container mounting unit and the processing unit and configured to invert the substrate;
a second inverting unit disposed between the container mounting unit and the processing unit and configured to invert the substrate;
a container side transfer unit configured to transfer a substrate between the storage container and the first and second reversing units; and
a processing unit side transfer unit configured to transfer substrates between the first and second reversing units and the plurality of processing units;
each inversion unit includes:
a discharge slot into which an unprocessed substrate in the storage container is inserted by the container-side conveying unit;
a take-in slot into which a processed substrate processed by the processing unit is inserted by the processing unit-side transport unit; and
a reversing mechanism configured to switch between a delivery posture in which the delivery groove is disposed at a position corresponding to an unprocessed substrate inserted by the container-side transport unit and a pick-up posture in which the pick-up groove is disposed at a position corresponding to a substrate inserted by the processing-side transport unit and processed by the processing-side transport unit, by integrally reversing the delivery groove and the pick-up groove;
the substrate processing method includes:
a step (a) of inserting the unprocessed substrate in the storage container into the carry-out slot of any one of the reversing sections in the carry-out posture by the container-side carrying section;
a step (b) of inverting the substrate by switching the inverting section to the taking-in posture;
a step (c) of carrying the substrate from the reversing unit to any one of the processing units by the processing unit-side carrying unit;
a step (d) of processing the substrate in the processing unit;
a step (e) of inserting the processed substrate processed by the processing unit into the take-in groove of any one of the reversing units in the take-in posture by the processing unit-side conveying unit;
a step (f) of reversing the substrate by switching the reversing section to the feeding posture;
a step (g) of returning the substrate from the reversing section to the storage container by the container-side conveying section;
a step (h) of performing the same operations as the steps (a) to (g) on the other unprocessed substrates in the storage container, partially in parallel with the steps (a) to (g);
a step (i) of switching the first reversing section or the second reversing section, which is in the loading posture and into which no substrate is inserted, to the unloading groove or the loading groove in a high operation state in which an unprocessed substrate to be transported to the processing section is present in the storage container after completion of processing in any one of the processing sections, to the unloading posture; and
a step (j) of inserting the unprocessed substrate into the discharge groove of the first reversing section or the second reversing section, which is switched to the discharge posture in the step (i), by the container-side transport section.
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