JP6688361B2 - Substrate transfer method - Google Patents

Description

  The present invention relates to a substrate transfer method.

  There are various substrate processing apparatuses that process a substrate. For example, in the substrate processing apparatus of Patent Document 1, an indexer block that accumulates unprocessed substrates and processed substrates is connected to a processing block that performs processing such as cleaning on the substrate via a substrate reversing unit and a substrate placement unit. It has been configured. A transfer robot dedicated to each block is arranged in each of the indexer block and the processing block.

  Patent Document 1 discloses an indexer block transfer robot (main robot) including two arms that are independently driven to move forward and backward. In addition, a substrate holding hand is provided at each tip of the two arms, and the substrate holding hand is configured to hold two substrates, so that a total of four substrates are transferred. It is possible.

JP, 2010-45214, A

  However, this document does not disclose what processing unit the main robot should access at what timing in processing a series of substrates. Therefore, in processing a series of substrates, the transfer schedule of each substrate cannot be appropriately set according to the situation.

  The present invention has been made in view of the above problems, and in processing a series of substrates, it is possible to improve the throughput of the substrate processing apparatus by appropriately setting the transfer schedule of each substrate according to the situation. The purpose is to provide technology that can.

In order to solve the above problems, a substrate transfer method according to a first aspect is directed to a relay unit, a center robot capable of unloading a substrate from the relay unit or loading a substrate into the relay unit, and the center robot. Is a substrate transfer method in a substrate processing apparatus having a plurality of processing units capable of loading and unloading substrates, the method including steps (a) to (e). In the step (a), the number of substrates that can be simultaneously held by the relay unit is specified. In the step (b), the number of substrates that can be simultaneously transferred by the center robot is determined. In the step (c), the number of processing units capable of performing parallel processing among the plurality of processing units based on the information of the flow recipe that determines the transfer content of each substrate inside the substrate processing apparatus. To decide. In the step (d), the number of substrates specified in the step (a), the number of substrates determined in the step (b), and the number of processing units determined in the step (c), On the basis of the above, the substrate transfer cycle of the center robot and the cycle of the substrate processing start timing in the number of processing units determined in the step (c) proceed in synchronization with each other. Schedule data that integrates the operation schedule and the substrate processing schedule in each of the processing units is created. In the step (e), the substrate transfer operation between the relay unit and the plurality of processing units and the center robot, and the substrate processing operation through the entire substrate processing apparatus are performed according to the schedule data. The substrate transfer cycle includes a first operation in which the central robot transfers a smaller number of substrates to the plurality of processing units than the number of substrates determined in the step (b). In the substrate transfer cycle, the first operation is repeatedly executed.

  According to the substrate transfer method of the first aspect, it is possible to create a time-efficient schedule when creating a schedule for transferring a plurality of substrates. That is, in processing a series of substrates, the throughput of the substrate processing apparatus can be improved by appropriately setting the transfer schedule of each substrate according to the situation.

  A substrate transfer method according to a second aspect is the substrate transfer method according to the first aspect, wherein the relay section includes a relay unit including a plurality of substrate mounting sections, a reversing unit, and a reversing and delivering unit.

  A substrate transfer method according to a third aspect is the substrate transfer method according to the first or second aspect, wherein a number of substrates less than the number of substrates determined in the step (b) is transferred to the relay section. When placed, the center robot takes out the substrate from the relay section.

Substrate transfer method according to the fourth aspect is a substrate transfer method according to the first or second aspect, the substrate transfer cycle, said number of sheets of substrates of the substrate determined in the step (b) The center robot further includes an operation of transporting the center robot toward the plurality of processing units.

A substrate transfer method according to a fifth aspect is the substrate transfer method according to the fourth aspect, wherein in the substrate transfer cycle, the central robot simultaneously transfers a plurality of substrates in the step (b). When it is determined that the processing is possible, the center robot repeatedly conveys one substrate toward the plurality of processing units .

A substrate transfer method according to a sixth aspect is a relay unit, a center robot capable of unloading a substrate from the relay unit or loading a substrate into the relay unit, and loading and unloading a substrate by the center robot. A substrate transfer method in a substrate processing apparatus having a plurality of processing units capable of performing the steps (a) to (e). In the step (a), the number of substrates that can be simultaneously held by the relay unit is specified. In the step (b), the number of substrates that can be simultaneously transferred by the center robot is determined. In the step (c), the number of processing units capable of performing parallel processing among the plurality of processing units based on the information of the flow recipe that determines the transfer content of each substrate inside the substrate processing apparatus. To decide. In the step (d), the number of substrates specified in the step (a), the number of substrates determined in the step (b), and the number of processing units determined in the step (c), On the basis of the above, the substrate transfer cycle of the center robot and the cycle of the substrate processing start timing in the number of processing units determined in the step (c) proceed in synchronization with each other. Schedule data that integrates the operation schedule and the substrate processing schedule in each of the processing units is created. In the step (e), the substrate transfer operation between the relay unit and the plurality of processing units and the center robot, and the substrate processing operation through the entire substrate processing apparatus are performed according to the schedule data. When the substrate transfer cycle by the central robot and the cycle of the timing of starting the substrate processing in the number of processing units determined in the step (c) proceed in synchronization, one cycle by the central robot is performed. Since the time required for the substrate transfer cycle is longer than the processing time in one processing unit of the plurality of processing units, a waiting time is generated on the side of the one processing unit, and a transfer rate-controlled state, and the center Both the process-controlled state in which the time required for one substrate transfer cycle by the robot is shorter than the processing time in the one processing unit and a waiting time occurs on the side of the central robot may occur. Does not happen.

A substrate transfer method according to a seventh aspect is an indexer robot, a relay unit for transferring a substrate by the indexer robot, and a center capable of unloading a substrate from the relay unit or loading a substrate into the relay unit. A substrate transfer method in a substrate processing apparatus having a robot and a plurality of processing units capable of loading and unloading substrates by the center robot, the method including steps (a) to (f). In the step (a), the number of substrates that the indexer robot can simultaneously carry is specified. In the step (b), the number of substrates that the relay section can hold simultaneously is specified. In the step (c), the number of substrates that can be simultaneously transferred by the center robot is determined. In the step (d), the number of processing units capable of performing parallel processing among the plurality of processing units based on the information of the flow recipe that determines the transfer content of each substrate inside the substrate processing apparatus. To decide. In the step (e), the number of substrates specified in the step (a), the number of substrates specified in the step (b), the number of substrates determined in the step (c), Based on the number of processing units determined in step (d), the substrate transfer cycle by the central robot and the cycle of the timing of starting the substrate processing in the number of processing units determined in step (d) are Schedule data that integrates the operation schedules of the indexer robot and the center robot and the substrate processing schedule in each of the processing units is created so as to proceed in synchronization. In the step (f), according to the schedule data, the substrate transfer operation between the relay section and the indexer robot, the substrate transfer operation between the relay section and the plurality of processing units and the center robot, and the substrate processing. Perform substrate processing operations throughout the apparatus. When the substrate transfer cycle by the center robot and the cycle of the timing of starting the substrate processing in the number of processing units determined in the step (d) proceed in synchronization with each other, one cycle is performed by the center robot. Since the time required for the substrate transfer cycle is longer than the processing time in one processing unit of the plurality of processing units, a waiting time is generated on the side of the one processing unit, and a transfer rate-controlled state, and the center Both the process-controlled state in which the time required for one substrate transfer cycle by the robot is shorter than the processing time in the one processing unit and a waiting time occurs on the side of the central robot may occur. Does not happen.

  According to the substrate transfer method of the seventh aspect, it is possible to create a time-efficient schedule when creating a schedule for transferring a plurality of substrates. That is, in processing a series of substrates, the throughput of the substrate processing apparatus can be improved by appropriately setting the transfer schedule of each substrate according to the situation.

  A substrate transfer method according to an eighth aspect is the substrate transfer method according to the seventh aspect, wherein the relay section includes a relay unit including a plurality of substrate mounting sections, a reversing unit, and a reversing and passing unit.

  A substrate transfer method according to a ninth aspect is the substrate transfer method according to the seventh or eighth aspect, wherein the indexer robot has a smaller number of substrates than the number of substrates determined in the step (c). Are mounted on the relay section, and the center robot is configured to transfer the substrate from the relay section when the number of the boards is smaller than the number of the boards determined in the step (c). Take out.

A substrate transfer method according to a tenth aspect is the substrate transfer method according to the seventh or eighth aspect, wherein the substrate transfer cycle is performed with a number of substrates smaller than the number of substrates determined in the step (c). In the substrate transfer cycle , the first operation is repeatedly executed, including a first operation in which the center robot transfers the substrate toward the plurality of processing units.

A substrate transfer method according to an eleventh aspect is an indexer robot, a relay unit for transferring a substrate by the indexer robot, and a center capable of unloading a substrate from the relay unit or loading a substrate into the relay unit. A substrate transfer method in a substrate processing apparatus having a robot and a plurality of processing units capable of loading and unloading substrates by the center robot, the method including steps (a) to (f). In the step (a), the number of substrates that the indexer robot can simultaneously carry is specified. In the step (b), the number of substrates that the relay section can hold simultaneously is specified. In the step (c), the number of substrates that can be simultaneously transferred by the center robot is determined. In the step (d), the number of processing units capable of performing parallel processing among the plurality of processing units based on the information of the flow recipe that determines the transfer content of each substrate inside the substrate processing apparatus. To decide. In the step (e), the number of substrates specified in the step (a), the number of substrates specified in the step (b), the number of substrates determined in the step (c), Based on the number of processing units determined in step (d), the substrate transfer cycle by the central robot and the cycle of the timing of starting the substrate processing in the number of processing units determined in step (d) are Schedule data that integrates the operation schedules of the indexer robot and the center robot and the substrate processing schedule in each of the processing units is created so as to proceed in synchronization. In the step (f), according to the schedule data, the substrate transfer operation between the relay section and the indexer robot, the substrate transfer operation between the relay section and the plurality of processing units and the center robot, and the substrate processing. Perform substrate processing operations throughout the apparatus. The substrate transfer cycle includes a second operation in which the substrate of the number smaller than the number of substrates that are specific in the step (a) is placed on the relay portion by the indexer robot. In the substrate transfer cycle, the second operation is repeatedly executed.

It is a schematic diagram which shows the whole structure of the substrate processing apparatus 1 which concerns on 1st Embodiment. It is a side view of the processing division 3 which concerns on 1st Embodiment. It is a side view of the processing division 3 which concerns on 1st Embodiment. It is a schematic diagram which shows the structure of the indexer robot IR which concerns on 1st Embodiment. It is a schematic diagram which shows the structure of the cleaning processing unit which concerns on 1st Embodiment. It is a schematic diagram which shows the structure of the inversion processing unit RT which concerns on 1st Embodiment. It is a schematic diagram which shows the structure of the center robot CR which concerns on 1st Embodiment. It is a side view of relay unit 50a concerning a 1st embodiment. It is a top view of the relay unit 50a which concerns on 1st Embodiment. It is a system block diagram of the substrate processing apparatus 1 which concerns on 1st Embodiment. It is a block diagram which shows the structure with which the control part 60 which concerns on 1st Embodiment is equipped. It is a conceptual diagram explaining the substrate delivery operation in the central robot CR and the cleaning processing unit according to the first embodiment. It is a conceptual diagram explaining the substrate delivery operation in the central robot CR and the cleaning processing unit according to the first embodiment. It is a conceptual diagram explaining the board | substrate delivery operation in the central robot CR and relay unit 50a which concern on 1st Embodiment. 9 is a table showing an example of a substrate transfer pattern that can be implemented by the present substrate processing apparatus 1. 6 is a flowchart for explaining a schedule data creating method according to the first embodiment. It is a schematic diagram explaining the flow of a board | substrate when a board | substrate is conveyed by the pattern of "back 3 parallel" in 1st Embodiment. It is a schematic diagram explaining the flow of a board | substrate when a board | substrate is conveyed by the pattern of "back 3 parallel-front 6 parallel" in 1st Embodiment. It is a time chart which shows the example of a schedule created by the planning logic concerning a 1st embodiment. It is a time chart which shows the example of a schedule created by the planning logic concerning a 1st embodiment.

  Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

{First embodiment}
<1. Schematic configuration of the substrate processing apparatus 1>
FIG. 1 is a plan view showing a layout of a substrate processing apparatus 1 according to the first embodiment of the present invention. In addition, FIG. 2 is a side view of the substrate processing apparatus 1 viewed in the direction of arrow a from the AA cross section in FIG. Further, FIG. 3 is a side view of the substrate processing apparatus 1 seen from the AA cross section in FIG. 1 in the direction of arrow b. In the drawings attached to this specification, the X and Y directions are two-dimensional coordinate axes that define a horizontal plane, and the Z direction is a vertical direction that is perpendicular to the XY plane.

  The substrate processing apparatus 1 is a single-wafer type substrate cleaning apparatus that processes substrates W such as semiconductor wafers one by one. As shown in FIG. 1, the substrate processing apparatus 1 includes an indexer section 2 and a processing section 3 connected to the indexer section 2, and a relay is provided at a boundary portion between the indexer section 2 and the processing section 3. The part 50 is arranged. The relay unit 50 includes a relay unit 50a for transferring the substrate W between the indexer robot IR and the center robot CR, a reversing unit (RT1) for reversing the substrate W between the center robot CR, and the substrate W. The reverse transfer unit (RT2) is provided for transferring the substrate W between the indexer robot IR and the center robot CR while reversing. As shown in FIG. 2, the relay section 50 has a laminated structure in which the reversing unit RT1 is arranged above the relay unit 50a, and the reversal delivery unit RT2 is arranged below the relay unit 50a.

  Further, the substrate processing apparatus 1 is provided with a control unit 60 for controlling the operation of each device in the substrate processing apparatus 1. The processing section 3 is a section for performing substrate processing such as scrub cleaning processing described later, and the substrate processing apparatus 1 as a whole is a single-wafer type substrate cleaning apparatus. The control unit 60 is connected to a host computer placed outside the substrate processing apparatus 1 via a LAN. From the host computer to the control unit 60, a process recipe PR that determines the substrate processing content of the front surface cleaning processing unit SS or the back surface cleaning processing unit SSR of each substrate W is transmitted. In addition, the host computer transmits to the control unit 60 a flow recipe FR that determines the transport content of each substrate W inside the substrate processing apparatus 1. The control unit 60 refers to the received flow recipe FR to create a transfer schedule of each substrate W inside the substrate processing apparatus 1. In the recording medium processing apparatus 1 according to the first embodiment, the control unit 60 stores in advance a computer program for creating a schedule for processing or carrying each substrate in the form of digital data. Then, the computer of the control unit 60 executes the computer program, so that the schedule creating device is realized as one function of the control unit 60. Details of these will be described later.

<1.1 Indexer section>
The indexer section 2 transfers the substrate W (unprocessed substrate W) received from the outside of the substrate processing apparatus 1 to the processing section 3 and transfers the substrate W (processed substrate W) received from the processing section 3 to the substrate processing apparatus 1. It is a compartment for carrying out. The indexer section 2 includes a carrier holding unit 4 capable of holding a carrier C capable of accommodating a plurality of substrates W, an indexer robot IR that is a substrate transfer unit (also referred to as a substrate transfer unit), and an indexer robot IR that is horizontal. And an indexer robot moving mechanism 5 (hereinafter, referred to as “IR moving mechanism 5”).

  The carrier C can hold, for example, a plurality of substrates W horizontally with a certain space vertically, and a plurality of the substrates W with the surface (the main surface forming the electronic device of the two main surfaces) facing upward. Holds the substrate W. The plurality of carriers C are held by the carrier holding portion 4 in a state of being arranged along a predetermined arrangement direction (Y direction in the first embodiment). The IR moving mechanism 5 can horizontally move the indexer robot IR along the Y direction.

  The carrier C accommodating the unprocessed substrate W is carried into each carrier holding unit 4 from the outside of the apparatus by OHT (Overhead Hoist Transfer), AGV (Automated Guided Vehicle) or the like and placed. Further, the processed substrate W, which has been subjected to the substrate processing such as the scrub cleaning processing in the processing section 3, is transferred from the central robot CR to the indexer robot IR via the relay section 50 and placed on the carrier holding section 4. Stored again in carrier C. The carrier C storing the processed substrate W is carried out of the apparatus by OHT or the like. That is, the carrier holding unit 4 functions as a substrate stacking unit that stacks the unprocessed substrate W and the processed substrate W.

  The configuration of the IR moving mechanism 5 in this embodiment will be described. The indexer robot IR has a movable base fixed thereto. The movable base is screwed into a ball screw extending in the Y direction in parallel with the arrangement of the carriers C and is slidably provided on the guide rail. ing. Therefore, when the ball screw is rotated by the rotation motor, the entire indexer robot IR fixed to the movable base horizontally moves along the Y-axis direction (all are not shown). As described above, since the indexer robot IR can move freely along the Y direction, the loading / unloading of the substrate to each carrier C or the relay unit 50 (hereinafter, loading / unloading of the substrate is referred to as “access”). It may be called.) It is possible to move to a possible position.

  FIG. 4 is a schematic side view of the indexer robot IR. Among the reference symbols given to the respective elements in FIG. 4, reference symbols shown in parentheses indicate that the center robot CR uses a robot mechanism having substantially the same degree of freedom as the indexer robot IR as the center robot CR. The reference symbol for the element. Therefore, in the description of the structure of the indexer robot IR, reference numerals outside the parentheses are referred to.

  The indexer robot IR has a base portion 18. One ends of the arms 6a and 7a are attached to the base portion 18, and the hands 6b, 6c and the hands 7b, 7c are vertically staggered at the other ends of the arms so as not to interfere with each other. They are arranged (in FIG. 1, the hands 6b and 6c and the hands 7b and 7c are vertically overlapped with each other). Therefore, the hands 6b and 6c are held by the base portion 18 via the arm 6a.

  The hands 7b and 7c are held by the base portion 18 via the arm 7a. The tips of the hands 6b, 6c, 7b, 7c each have a pair of finger portions. That is, the tips of the respective hands 6b, 6c, 7b, 7c are formed in a forked shape in a top view, and hold one substrate W horizontally by supporting the lower surface of the substrate W from below. be able to. Further, in the present embodiment, the hands 7b and 7c are used only when the unprocessed substrate before the cleaning process is carried, and the hands 6b and 6c are used only when the processed substrate after the cleaning process is carried. The outer size of the pair of finger portions of each hand is smaller than the distance between the pair of support members 54 arranged to face the relay portion 50 (FIG. 9). Therefore, in the substrate loading and unloading operations described later, the hands 6b, 6c, 7b, 7c can load and unload the substrate W into the relay unit 50 without interfering with the supporting member 54.

  The outer dimensions of the pair of fingers of each hand 6b, 6c, 7b, 7c are smaller than the diameter of the substrate W. Therefore, the substrate W can be stably held. Therefore, although this indexer robot IR has four hands 6b, 6c, 7b, 7c, it is possible to simultaneously transfer unprocessed substrates up to two substrates, and also to simultaneously transfer processed substrates. It is a robot mechanism that can handle up to two substrates. Both the arm 6a and the arm 7a are articulated bending / extending arms. The indexer robot IR can extend and retract the arms 6a and 7a individually by the advancing / retreating drive mechanism 8. Therefore, the hands 6b and 6c and 7b and 7c corresponding to the arms 6a and 7a can be horizontally moved separately.

  Further, the base portion 18 has a built-in swivel mechanism 9 for rotating the base portion 18 around a vertical axis, and a lift drive mechanism 10 for raising and lowering the base portion 18 in the vertical direction. With the above configuration, the indexer robot IR can be freely moved along the Y direction by the IR moving mechanism 5. Further, the indexer robot IR can adjust the angle of each hand in the horizontal plane and the height of each hand in the vertical direction by the turning mechanism 9 and the lifting drive mechanism 10. Therefore, the indexer robot IR can make the hands 6b, 6c and the hands 7b, 7c face the carrier C and the relay section 50. The indexer robot IR extends the arm 6a or the arm 7a in a state where the hands 6b and 6c and the hands 7b and 7c face the carrier C, so that the hands 6b and 6c and the hands 7b and 7b corresponding to the arms 6a and 7a. 7c can access the carrier C and the relay unit 50.

<1.2 processing section>
The processing section 3 is a section in which the unprocessed substrate W transported from the indexer section 2 is subjected to cleaning processing, and the processed substrate W subjected to the cleaning processing is transported to the indexer section 2 again.

  The processing section 3 includes a front surface cleaning processing unit 11 that performs cleaning processing on the front surface of the substrate one by one, a back surface cleaning processing unit 12 that performs cleaning processing on the back surface of the substrate one by one, and a substrate transport unit (both substrate transport unit). A center robot CR, which is a so-called), and a center robot moving mechanism 17 (hereinafter, referred to as “CR moving mechanism 17”) for horizontally moving the center robot CR. The configuration of each device in the processing section 3 will be described below.

  As shown in FIGS. 1 to 3, the cleaning processing section 11 includes two sets of surface cleaning processing units SS1 to SS4 and SS5 to SS8 each of which is vertically stacked and has a four-stage configuration. The cleaning processing units 11 and 12 are configured to include two sets of back surface cleaning processing units SSR1 to SSR4 and SSR5 to SSR8, each of which is stacked in the vertical direction to form a four-stage structure. As shown in FIG. 1, the front surface cleaning processing unit 11 and the back surface cleaning processing unit 12 are arranged side by side in the Y direction with a predetermined distance therebetween. The center robot CR is arranged between the front surface cleaning processing section 11 and the back surface cleaning processing section 12.

  FIG. 5 is a diagram showing a state of scrub cleaning processing on the surface of the substrate W in each of the cleaning processing units SS1 to SS8 of the surface cleaning processing section 11. The cleaning processing units SS1 to SS8 include a spin chuck 111 that holds a substrate W whose surface faces upward and rotates the substrate W around an axis along the vertical direction, and a surface of the substrate W held on the spin chuck 111. A cleaning brush 112 for performing scrub cleaning in contact with or in close proximity to the nozzle W, a nozzle 113 for ejecting a cleaning liquid (for example, pure water) onto the surface of the substrate W, a spin rotation support 114 for rotating the spin chuck 111, and on the spin chuck 111. A cup (not shown) that surrounds the substrate W held by, and a unit case 115 that stores these members are provided. The unit case 115 is formed with a gate 117 in which a slit 116 that can be slid and opened for loading and unloading the substrate W is arranged.

  The back surface cleaning processing unit 12 performs a scrub cleaning processing on the back surface of the substrate W. Like the front surface cleaning processing units SS1 to SS8, the back surface cleaning processing units SSR1 to SSR8 also include a spin chuck, a cleaning brush, a nozzle, a spin motor, a cup, and a unit case for storing these members. Further, the unit case is formed with a gate provided with an openable / closable slit for loading and unloading the substrate W (both not shown).

  The spin chuck 111 of the front surface cleaning processing units SS1 to SS8 may be of a vacuum adsorption type in order to hold the substrate W from the back surface side, but the spin chucks of the back surface cleaning processing units SSR1 to SSR8 are the substrate W. In order to hold the substrate from the surface side, the edge of the substrate is preferably mechanically gripped.

  When the surface of the substrate W is cleaned by the cleaning brush 112, the cleaning brush 112 is moved to the upper side of the substrate W held by the spin chuck 111 with the surface facing upward by a brush moving mechanism (not shown). Then, while rotating the substrate W by the spin chuck 111, a processing liquid (for example, pure water (deionized water)) is supplied from the nozzle 113 to the upper surface of the substrate W, and the cleaning brush 112 is brought into contact with the upper surface of the substrate W. Further, with the cleaning brush 112 in contact with the upper surface of the substrate W, the cleaning brush 112 is moved along the upper surface of the substrate W. This allows the cleaning brush 112 to scan the upper surface of the substrate W to scrub and clean the entire surface of the substrate W. In this way, the surface of the substrate W is processed. The same applies to the backside cleaning of the substrate.

  In this embodiment, the cleaning processing units SS1 to SS8 and SSR1 to SSR8 in the cleaning processing units 11 and 12 are described as an apparatus for scrub cleaning the substrate W. However, the substrate processing performed by the cleaning processing units SS1 to SS8 and SSR1 to SSR8 in the cleaning processing units 11 and 12 is not limited to the scrub cleaning. For example, a cleaning processing unit that performs single-wafer cleaning of the substrate W with a fluid such as a processing liquid (cleaning liquid, rinse liquid, or the like) or gas discharged from a nozzle or the like facing the front surface or the back surface of the substrate without brush cleaning. May be.

  FIG. 6 is a schematic side view of the reversing unit RT1 and the reversing delivery unit RT2.

  The reversing unit RT1 and the reversing delivery unit RT2 are different in that the former is accessible only by the center robot CR, whereas the latter is accessible not only by the center robot CR but also by the indexer robot IR. , The same FIG. 6 will be described. The reversing unit RT1 is a processing unit that performs a reversing process on the substrate W carried in by the center robot CR, and when the substrate W is reversed by the reversing unit RT1, the center robot CR carries out the substrate from the reversing unit RT1. The reverse delivery unit RT2 is accessible from both the indexer robot IR and the center robot CR.

  When the substrate W is carried into the reverse delivery unit RT2 by the indexer robot IR, the reverse delivery unit RT2 reverses the substrate W. After that, the central robot CR carries out the substrate from the reverse delivery unit RT2. Further, when the substrate W is carried into the reverse delivery unit RT2 by the central robot CR, the reverse delivery unit RT2 reverses the substrate W.

  After that, the indexer robot IR carries out the substrate from the reverse delivery unit RT2.

  In the substrate processing apparatus 1 according to the first embodiment, in each of the cleaning processing units SS1 to SS8 and SSR1 to SSR8 of the front surface cleaning processing unit 11 and the back surface cleaning processing unit 12, the upper surface of the substrate (irrespective of the front and back of the substrate, The upper side in the vertical direction at the time point is the upper surface, and the lower side in the vertical direction is the lower surface). Therefore, when performing the cleaning process on both sides of the substrate, it is necessary to perform the reversing process of the substrate W separately from the cleaning process, and the reversing unit RT1 and the reversing transfer unit RT2 are used at that time.

  As shown in FIG. 6, the reversing unit RT1 has a fixed plate 33 arranged horizontally and four movable plates 34 arranged horizontally with the fixed plate 33 sandwiched vertically. The fixed plate 33 and the four movable plates 34 each have a rectangular shape and are arranged so as to overlap each other in a plan view. The fixed plate 33 is fixed to the support plate 35 in a horizontal state, and each movable plate 34 is attached to the support plate 35 in a horizontal state via a guide 36 extending in the vertical direction. Each movable plate 34 is movable in the vertical direction with respect to the support plate 35. Each movable plate 34 is moved in the vertical direction by an actuator (not shown) such as an air cylinder. A rotary actuator 37 is attached to the support plate 35. The fixed plate 33 and the four movable plates 34 are rotated together with the support plate 35 by a rotary actuator 37 about a horizontal rotation axis. The rotation actuator 37 can turn the support plate 35 180 degrees around a horizontal rotation axis to turn the fixed plate 33 and the four movable plates 34 upside down.

  Further, in the fixed plate 33 and the four movable plates 34, a plurality of support pins 38 are attached to the surfaces facing each other (for example, the lower surface of the upper movable plate 34 and the upper surface of the fixed plate 33). . The plurality of support pins 38 are arranged on each surface at appropriate intervals on the circumference corresponding to the outer peripheral shape of the substrate W. The height (the length from the base end to the tip) of each support pin 38 is constant, and the thickness of the hands 6b, 6c, the hands 7b, 7c, and the hands 13b to 16b (the length in the vertical direction). Has been made larger than.

  The fixing plate 33 can horizontally support one substrate W above the fixing plate 33 via the plurality of supporting pins 38. Further, each of the four movable plates 34 can horizontally support one substrate W above the four movable plates 34 via the plurality of support pins 38 when positioned on the lower side. The vertical distance between the substrate support position by the fixed plate 33 and the substrate support position by the movable plate 34 is set to the vertical direction of the two substrates W held by the respective hands 6b and 6c and the hands 7b and 7c of the indexer robot IR. And the distance in the vertical direction between the two substrates W held by the hands 13b to 16b of the center robot CR are set to be equal to each other.

  Since the reversing unit RT1 is configured as described above, the center robot CR can access (carry in / out) the substrate W held by each of the hands 13b to 16b. Further, since the reversing / delivering unit RT2 is configured as described above, the indexer robot IR and the center robot CR (hereinafter, the indexer robot IR and the center robot CR may be collectively referred to as “robot IR and CR”). ) Can access (load / unload) the substrate W held by each of the hands 6b and 6c, the hands 7b and 7c, and the hands 13b to 16b to the reversal transfer unit RT2.

  The detailed transfer operation of the substrate W will be described later.

  The indexer robot IR or the center robot CR places the first substrate W in the gap between the fixed plate 33 and the movable plate 34 immediately above it, and the second substrate W in the gap between the movable plate 34 and the movable plate 34 further above. The substrate W is inserted. By moving these two movable plates 34 toward the fixed plate 33 in this state, these two substrates W can be held by the reversing unit RT1 or the reversing and delivering unit RT2.

  Similarly, the first substrate W is held in the gap between the fixed plate 33 and the movable plate 34 immediately below it, and the second substrate W is held in the gap between the movable plate 34 and the movable plate 34 below it. be able to.

  Then, while the substrate W is held in the reversing unit RT1, the rotation actuator 37 rotates the support plate 35 around the horizontal rotation axis, so that the two held substrates W can be turned upside down. it can.

  As described above, the reversing unit RT1 and the reversing / transferring unit RT2 can hold a plurality of (two in the first embodiment) substrates W horizontally and turn the held substrates W upside down. The structure of the CR moving mechanism 17 in this embodiment is the same as the structure of the IR moving mechanism 5 described above. That is, the CR moving mechanism 17 is composed of a movable base (not shown), a ball screw or guide rail that is long in the X direction, and a rotation motor that rotates the ball screw. When the ball screw rotates, the entire movable robot and the central robot CR fixedly move horizontally between the front surface cleaning processing section 11 and the back surface cleaning processing section 12 in the processing section 3 in the X direction.

  In this way, the center robot CR can move freely along the X direction, so that it can move to a position where it can access (carry in / out) each of the cleaning processing units SS1 to SS8 and SSR1 to SSR8. In addition, similarly, it is possible to move to a position where the relay unit 50 can be accessed (loaded and unloaded). The center robot CR has a configuration substantially similar to that of the indexer robot IR shown in FIG. 4, that is, a robot mechanism (hereinafter, referred to as an "arm") in which two relatively fixed two-stage hands are vertically movable to independently move forward and backward. A “2A4H mechanism” can be used to mean “two pairs of four hands”, or another configuration can be used. Since the respective constituent elements in the case of using the robot of the 2A4H mechanism as the indexer robot IR are the same as those described for the indexer robot IR in FIG. 4, duplicate description will be omitted here.

  FIG. 7A is an illustration of the central robot CR in the case where each of the four hands 13b to 16b is configured to be independently advanceable and retractable by the four arms 13a to 16a (hereinafter referred to as "4A4H mechanism"). FIG. Further, FIG. 7B is a schematic top view showing how the central robot CR accesses the cleaning processing unit SS (SSR) in the substrate loading and unloading operations described later. As shown in FIG. 7A, this center robot CR having a 4A4H mechanism has a base 28. One end of each arm 13a to 16a is attached to the base portion 28, and each hand 13b to 16b is attached to the other end of each arm 13a to 16a. Therefore, the hands 13b to 16b are held by the base portion 28 via the arms 13a to 16a, respectively. Further, the hands 13b to 16b are arranged with their heights vertically shifted (separated from each other by the same distance h1 in the vertical direction) so as not to interfere with the adjacent hands 13b to 16b. Further, the tips of the hands 13b to 16b each have a pair of finger portions. That is, the tips of the respective hands 13b to 16b are formed in a forked shape in a top view, and each of the hands 13b to 16b horizontally supports one substrate W by supporting the lower surface of the substrate W from below. Can be held. In the present embodiment, the hands 15b and 16b are used only when the unprocessed substrate before the cleaning process is carried, and the hands 13b and 14b are used only when the processed substrate after the cleaning process is carried.

  The outer dimensions of the pair of finger portions of the hands 13b to 16b are smaller than the distance between the pair of opposing support pins 55 in the relay portion 50. Therefore, it is possible to prevent the hands 13b to 16b from interfering with the support member 54 of the relay section 50 in the substrate loading and unloading operations described later. Further, a member passing area is formed between the pair of finger portions of the hands 13b to 16b. The area is larger than the spin chuck 111 of the substrate cleaning unit SS (SSR). Therefore, the hands 13b to 16b are prevented from interfering with the spin chuck 111 in the substrate loading and unloading operations described later (see FIG. 7B). The thickness of each hand 13b is smaller than the distance between the upper surface of the spin chuck 111 and the upper surface of the rotation support portion 114. The arms 13a to 16a are all articulated bending / extending arms. The center robot CR can individually extend and retract each arm 13a to 16a by the advancing / retreating drive mechanism 29, and separately move the hands 13b to 16b corresponding to the arm horizontally.

  Further, the base unit 28 has a built-in swivel mechanism 31 for rotating the base unit 28 about a vertical axis and a lift drive mechanism 32 for vertically moving the base unit 28.

  After moving the central robot CR by the CR moving mechanism 17 to a position where the cleaning processing units SS1 to SS8 and SSR1 to SSR8 can be accessed, the rotating mechanism 31 rotates the base 28 to move the hands 13b to 16b. These arbitrary hands 13b to 16b are moved to desired cleaning processing units SS1 to SS8 and SSR1 to SSR8 by rotating them around a predetermined vertical axis and moving the base section 28 up and down by the lifting drive mechanism 32 in the vertical direction. They can face each other. Then, by extending the arms 13a to 16a with the hands 13b to 16b facing the cleaning processing unit, the hands 13b to 16b corresponding to the arm can be made to access the cleaning processing unit. Similarly, the center robot CR can access any of the hands 13b to 16b to the relay section 50.

  Whether the 2A4H mechanism or the 4A4H mechanism is used as the center robot CR, the maximum number of unprocessed substrates that can be collectively transferred (simultaneous transfer) from the relay section 50 to the processing units SS1 to SS8 and SSR1 to SSR8 is two. There is a maximum of two processed substrates that can be collectively transported from the processing units SS1 to SS8 and SSR1 to SSR8 to the relay section 50.

  Therefore, since the maximum number of substrates that can be collectively transported is the same, the center robot CR configured as the 4A4H mechanism will be described below for convenience of description. However, the case where the 2A4H mechanism is used as the center robot CR will be described. Also, by analogy with the arm motion of the indexer robot IR, the individual arm motions of the center robot CR can be understood. In the above description, the mode in which the hands 13b to 16b of the central robot CR can be accessed to the processing units SS and SSR and the relay section 50 by using the CR moving mechanism 17 together has been described. However, the hands 13b to 16b of the center robot CR are transferred to the processing units SS, SSR, and the relay section 50 only by the turning mechanism 31, the lifting drive mechanism 32, and the advancing / retreating drive mechanism 29 of the center robot CR without using the CR moving mechanism 17. Of course, it is possible to make it accessible.

<1.3 Relay unit 50a>
A relay unit 50 a for transferring the substrate W between the indexer robot IR and the center robot CR is arranged at the boundary between the indexer section 2 and the processing section 3. The relay unit 50a is a housing including the substrate rests PASS1 to PASS4, and when the substrate W is transferred between the indexer robot IR and the center robot CR, the substrates are placed in the substrate rests PASS1 to PASS4. W is temporarily placed.

  FIG. 8 is a side view of the relay unit 50a in the first embodiment. FIG. 9 is a top view of the AA cross section in FIG. 8 as seen from the direction of the arrow. An opening 51 for loading and unloading the substrate W is provided on one side wall of the casing of the relay unit 50a facing the indexer robot IR. A similar opening 52 is also provided on the other side wall located on the side of the central robot CR facing the one side wall.

  Substrate platforms PASS1 to PASS4 for holding the substrate W in a substantially horizontal state are provided at portions of the housing that face the openings 51 and 52. Therefore, the indexer robot IR and the center robot CR can access the substrate rests PASS1 to PASS4 through the openings 51 and 52, respectively. In the present embodiment, the upper substrate rests PASS1 and PASS2 are used when the processed substrate W is transported from the processing section 3 to the indexer section 2, and the lower substrate rests PASS3 and PSS4 are , Is used when the unprocessed substrate W is transported from the indexer section 2 to the processing section 3.

  As shown in FIGS. 8 and 9, the substrate rests PASS1 to PASS4 are provided as a set of a pair of support members 54 fixed to the side walls inside the housing and two end portions on the upper surface of the support member 54. 4 support pins 55 in total. The support member 54 is fixed to a pair of side walls different from the side walls in which the openings 51 and 52 are formed. The upper end of the support pin 55 is formed in a conical shape. Therefore, the substrate W is detachably held by the pair of support pins 55 by engaging the peripheral portion at four positions.

  Here, the support pins 55 between PASS1 and PASS2, between PASS2 and PASS3, and between PASS3 and PASS4 are provided at the same distance h2 in the vertical direction (see FIG. 8). This distance h2 is equal to the vertical interval h1 between the hands 13b to 16b of the central robot CR described above. Therefore, while the center robot CR faces the relay unit 50a, the hands 15b and 16b of the center robot CR are simultaneously extended by the advancing / retreating drive mechanism 29, so that the substrate rest portions PASS3 and PASS4 to 2 of the relay unit 50a can be extended. The unprocessed substrates W can be received at the same time. Similarly, the hands 13b and 14b of the center robot CR are simultaneously extended by the advancing / retreating drive mechanism 29, so that the two processed substrates W held by these hands 13b and 14b are placed on the substrate of the relay unit 50a. It can be delivered to the parts PASS1 and PASS2 at the same time.

<1.4 Control unit 60>
FIG. 10 is a block diagram for explaining the electrical configuration of the substrate processing apparatus 1. Further, FIG. 11 is a block diagram for explaining the internal configuration of the control unit 60.

  As shown in FIG. 11, the control unit 60 is composed of, for example, a general computer in which a CPU 61, a ROM 62, a RAM 63, a storage device 64, and the like are interconnected via a bus line 65. The ROM 62 stores basic programs and the like, and the RAM 63 serves as a work area when the CPU 61 performs a predetermined process. The storage device 64 is composed of a flash memory or a non-volatile storage device such as a hard disk device. The storage device 64 stores a processing program P0 and a schedule creation program P1. A table format in which schedule data (hereinafter, referred to as “SD”) of each substrate W to be processed is arranged in chronological order by the CPU 61 performing arithmetic processing described later according to the procedure described in the schedule creation program P1. It is created by. The created schedule data SD is stored in the storage device 64. Further, according to the procedure described in the processing program P0, the CPU 61 performs the arithmetic processing to realize various functions of the substrate processing apparatus 1, and the target substrate W is subjected to the predetermined cleaning processing according to the schedule data SD.

  Further, in the control unit 60, the input unit 66, the display unit 67, and the communication unit 68 are also connected to the bus line 65. The input unit 66 includes various switches, a touch panel, and the like, and receives various input setting instructions such as a processing recipe from the operator. The display unit 67 includes a liquid crystal display device, a lamp, and the like, and displays various information under the control of the CPU 61.

  The communication unit 68 has a data communication function via a LAN or the like.

  To the control unit 60, the indexer robot IR, the center robot CR, the IR moving mechanism 5, the CR moving mechanism 17, the front surface cleaning processing unit 11, the back surface cleaning processing unit 12, the reversing unit RT1, and the reversing and delivering unit RT2 are connected as control targets. Has been done. A detailed description of the schedule creation program P1 will be given after the description of the operation of the substrate processing apparatus 1.

<2. Operation of Substrate Processing Apparatus 1>
So far, the configuration of each device in the substrate processing apparatus 1 and the operation (cleaning process, reversing process, etc.) in each device have been described.

  Hereinafter, the transfer operation of the substrate W between the respective devices (the substrate platform PASS, the reversing unit RT1, the reversing transfer unit RT2, the cleaning processing unit SS (SSR), etc.) inside the substrate processing apparatus 1 and the indexer robot IR or the center robot CR. , And the substrate processing operation throughout the substrate processing apparatus 1 will be described. These operations are performed according to the schedule data SD created by the schedule creating program P1. First, each operation will be described below, and the principle of generation of the schedule data SD and the overall timing control based on the operation will be described in detail later. To do.

<2.1 Transfer of Substrate W>
As described above, the indexer robot IR and the center robot CR are provided with a moving mechanism, a turning mechanism, a lifting drive mechanism, and a forward / backward drive mechanism, and each hand of the robot accesses each element inside the substrate processing apparatus 1. It is possible to

  The substrate transfer operation at this time will be described by taking a case where the center robot CR accesses the surface cleaning processing unit SS and a case where the center robot CR accesses the relay section 50 as an example. 12 and 13 are schematic diagrams showing an example of the substrate transfer operation between the central robot CR and the surface cleaning processing unit SS. Further, FIG. 14 is a schematic diagram showing the substrate transfer operation between the center robot CR and the PASS (relay unit 50). For easy understanding, the substrate W and the substrate rests PASS1 to PASS4 are shown. The substrate transfer operation is simply represented by only the support member 54 and the hands 13b to 16b.

[Access between central robot CR and processing unit]
As shown in FIG. 12A, the processed substrate W1 is placed on the spin chuck 111 of the processing unit SS. Further, the slit 116 of the processing unit SS slides to open the gate 117.

  When the central robot CR carries out the processed substrate W1 from the surface cleaning processing unit SS, the control unit 60 first controls the turning mechanism 31 to make the hand 13b face the surface cleaning processing unit SS. At the same time, the control unit 60 controls the elevation drive mechanism 32 so that the upper surface of the hand 13b is below the upper surface of the spin chuck 111 and the lower surface of the hand 13b is above the upper surface of the rotation support unit 114. The position (see FIG. 12 (a)).

  Next, the controller 60 controls the advancing / retreating drive mechanism 29 to extend the arm 13a. As a result, the hand 13b horizontally moves into the inside of the surface cleaning processing unit SS, the member passing area at the tip of the hand 13b passes through the spin chuck 111, and as shown in FIG. It is arranged below the substrate W1 held by 111. Since each of the hands 13b to 16b of the present embodiment can be individually expanded and contracted, only the hand (here, the hand 13b) necessary for loading and unloading the substrate is allowed to enter the unit case 115 of the surface cleaning processing unit SS. You can This can minimize the amount of particles that may be brought into the unit case 115 by the hands 13b to 16b. Further, the space between the spin chuck 111 and the rotation support portion 114 can be narrowed to a vertical width such that only one hand 13b to 16b can enter.

  After that, the control unit 60 controls the elevation drive mechanism 32 to raise the hand 13b. As a result, as shown in FIG. 12C, the substrate W1 placed on the spin chuck 111 is transferred to the upper side of the hand 13b. Then, the controller 60 controls the advancing / retreating drive mechanism 29 to contract the arm 13a. As a result, the hand 13b is retracted from the surface cleaning processing unit SS as shown in FIG. Further, in the series of operations described above, the case where one substrate W is carried out from any of the surface cleaning processing units SS using the hand 13b has been described, but also when using the other substrate holding hands 14b to 16b. The same carry-out operation can be performed by changing the height of the hand by the elevating and lowering drive mechanism 32 so that the same condition as the above-described one-sheet carry-out can be obtained.

  Next, the substrate loading operation will be described. The control unit 60 controls the elevation drive mechanism 32 to raise the arm 15a to a height where the unprocessed substrate W2 held on the upper surface of the hand 15b is above the spin chuck 111 (FIG. 13A).

  Next, the controller 60 controls the advancing / retreating drive mechanism 29 to extend the arm 15a. As a result, the hand 15b horizontally moves into the surface cleaning processing unit SS, and the substrate W2 held on the upper side of the hand 15b is arranged above the spin chuck 111, as shown in FIG. 13B. It

  After that, the control unit 60 controls the up-and-down drive mechanism 32 to lower the hand 15b. Thus, as shown in FIG. 13C, the substrate W2 held by the hand 15b is transferred to the spin chuck 111. Then, the control unit 60 controls the forward / backward drive mechanism 29 to contract the arm 15a. As a result, as shown in FIG. 13D, the hand 15b retracts from the surface cleaning processing unit SS. Further, in the series of operations described above, the case where one substrate W is loaded into the front surface cleaning processing unit SS by using the hand 15b has been described, but this one-sheet loading operation is performed with one substrate W in the back surface cleaning unit SSR. The same applies when carrying in.

  When the hand 15b is lowered, as shown in FIGS. 13B and 13C, the hand 15b has a timing at which the hand 15b overlaps with the spin chuck 111 in a side view (viewed from the horizontal direction). However, as described above, since the hand 15b is formed into a bifurcated fork shape, at this time, the spin chuck 111 does not enter the inside of the substrate holding hand 15b and does not interfere with the hand 15b. Similarly, in the substrate transfer operation between the support pins in the substrate platform PASS or the reversing unit RT1 and the respective hands, there is a timing at which the support pins and the respective hands overlap each other in a side view (when viewed from the horizontal direction), but interference occurs. Is designed to be free.

[Access to the relay unit 50 of the central robot CR]
FIG. 14 is a schematic diagram for explaining an example of an operation when two substrates W are simultaneously loaded into the substrate platforms PASS1 and PASS2 by the central robot CR.

  When two substrates W are simultaneously loaded into the substrate rests PASS1 and PASS2 by the central robot CR, for example, the two substrates W are placed on the hands 13b and 14b one by one. The sheets are simultaneously loaded into the storage sections PASS1 and PASS2 (two-sheet loading operation). Specifically, the control unit 60 controls the turning mechanism 9 and the elevating / lowering drive mechanism 10 to make the hands 13b and 14b face the substrate platforms PASS1 and PASS2. At this time, as shown in FIG. 14A, the hands 13b and 14b have a height such that the two substrates W held by the hands 13b and 14b are above the substrate platforms PASS1 and PASS2, respectively. It is going up or down.

  As described above, the vertical distance between the upper and lower substrate supporting positions in the substrate rests PASS1 to PASS4 is equal to the vertical distance between the two substrates W held by the hands 13b and 14b of the central robot CR. It is set to be equal. Therefore, if the substrate W held by the hand 13b is arranged so as to be above the substrate platform PASS1 by the elevating and lowering drive mechanism 10, the other hands 14b are also respectively arranged above the substrate platform PASS2. You can

  Next, the control unit 60 controls the forward / backward drive mechanism 8 to extend the arms 13a and 14a at the same time. As a result, the hands 13b and 14b enter the inside of the substrate rests PASS1 and PASS2, and as shown in FIG. 14B, the two substrates W respectively held by the hands 13b and 14b are placed on the substrates. It is arranged above the placing parts PASS1 and PASS2.

  After that, the control unit 60 controls the elevation drive mechanism 10 to lower the hands 13b and 14b until the two substrates W are supported by the PASS1 and PASS2. As a result, as shown in FIG. 14C, the substrates W are simultaneously placed on the support pins 55 (not shown) of the PASS1 and PASS2, and the two substrates W are placed on the substrate rests PASS1 and PASS2 from the central robot CR. Passed at the same time. Then, the control unit 60 controls the forward / backward drive mechanism 29 to contract the arms 13a and 14a at the same time. As a result, the hands 13b and 14b are retracted from the substrate platforms PASS3 and PASS4 (two-sheet loading operation). Although not described with reference to the drawings, when the central robot CR simultaneously carries out two unprocessed substrates W from the substrate platform PASS3, PASS4, the series of operations described above is reversed. That is, the hands 15b and 16b are extended below the substrate rests PASS3 and PASS4. Next, the hands 15b and 16bc are raised, and then the arms 15a and 16a are simultaneously contracted to simultaneously carry out the two substrates W from the substrate platforms PASS1 and PASS2 using the hands 15b and 16b. It is possible (two-sheet unloading operation).

  Up to this point, the two-substrate loading and unloading operations of the substrate W in the central robot CR and the PASS have been described, but this series of operations is the same for the transfer of substrates between the central robot CR and other units. . Specifically, the substrate transfer between the center robot CR and the reversing unit RT1, the substrate transfer between the indexer robot IR or the center robot CR and the reversing transfer unit RT2, the substrate transfer between the indexer robot IR and the substrate platform PASS. , And in the transfer of the substrate between the indexer robot IR and the carrier C, the above-described two-sheet loading operation and two-sheet unloading operation can be performed.

  In each hand of each robot (CR or IR) in the present embodiment, it is properly used whether the held substrate W is an unprocessed substrate before the cleaning process or a cleaned processed substrate. There is. Therefore, it is possible to carry in and carry out the processed substrate W with the hands 7b and 7c, which are the hands for unprocessed substrates, and the hands 15b and 16b, as a principle of the carry-in operation and carry-out operation described above. It is not implemented in this embodiment. The same applies to the hands 6b and 6c and the hands 13b and 14b, which are hands for processed substrates.

  In addition, when the center robot CR holds a plurality of substrates W, the substrates W may be sequentially carried into the plurality of cleaning processing units SS (or SSR) one by one. Similarly, the center robot CR may carry out the substrates W one by one from the plurality of cleaning processing units SS (SSR). In these cases, if attention is paid only to the relationship between the individual processing unit SS (SSR) and the central robot CR, the one-sheet loading operation or the one-sheet loading operation is performed, but the plurality of cleaning processing units SS (SSR) In the relationship between the cleaning processing unit 11 (or 12) as a whole and the central robot CR, it can be considered that a two-sheet loading operation or a two-sheet loading operation is performed. Therefore, in this specification, the case where the central robot CR holding a plurality of substrates W sequentially carries in the plurality of cleaning processing units SS (SSR) or the plurality of substrates W is sequentially carried out from the plurality of cleaning processing units SS (SSR). Also in the case of moving to another segment, as in the case where the central robot CR accesses the relay unit 50 and carries out the two-sheet loading (or unloading) operation, the two-sheet loading (or unloading) operation is performed. The same description will be made.

<2.2 Substrate processing pattern>
Here, a pattern of substrate processing that can be performed in the present substrate processing apparatus 1 will be described.

  In this substrate processing apparatus 1, various substrate processing patterns such as “front surface cleaning only”, “back surface cleaning only”, “double-sided cleaning (back surface → front surface)”, “double-sided cleaning (front surface → back surface)”, etc. are applied to the substrate W. Can be selectively applied.

  In the “only surface cleaning” pattern, after the substrate W is unloaded from the carrier C, the surface of the substrate W is cleaned without inverting the front and back of the substrate W. After the cleaning process, the substrate W is returned to the carrier C without being turned upside down. In the “back surface cleaning only” pattern, after the substrate W is unloaded from the carrier C, the front surface and the back surface of the substrate W are inverted, and then the back surface of the substrate W is cleaned. After the cleaning process, the substrate W is turned upside down and returned to the carrier C. In the “double-sided cleaning (back surface → front surface)” pattern, after the substrate W is unloaded from the carrier C, the front surface and the back surface of the substrate W are inverted, and then the rear surface of the substrate W is cleaned. After that, the front and back of the substrate W are turned over so that the surface of the substrate W faces upward, and the surface of the substrate W is cleaned. After that, the substrate W is returned to the carrier C without inverting the front and back of the substrate W. In the “double-sided cleaning (front surface → back surface)” pattern, after the substrate W is unloaded from the carrier C, the front surface of the substrate W is cleaned without inversion. Then, the front and back of the substrate W are turned over so that the back surface of the substrate W faces upward, and the back surface of the substrate W is cleaned. After that, the substrate W is turned upside down and returned to the carrier C.

  A series of processes performed on the substrate W by the substrate processing apparatus 1 can be divided into a plurality of segments S1 to S13 as shown in FIG.

  The segments S1 and S13 correspond to the stage where the substrate W is stored in the carrier C. The segments S2 and S12 correspond to the stage where the substrate W is transported in the indexer section 2 by the indexer robot IR. The segments S3, S7, and S11 correspond to the stage where the substrate W is stored in the relay section 50. The segments S5 and S9 correspond to the stage of processing the substrate W in the processing section 3. The segments S4, S6, S8, and S10 correspond to the stage where the substrate W is transported in the processing section 3 by the central robot CR.

  As shown in FIG. 15, the transfer destination of the substrate W in each segment may differ depending on the transfer pattern of the substrate W. For example, in the segment S3, the substrate W is transferred to the substrate platform PASS of the relay processing unit 50a in the case of the pattern of “only front surface cleaning” and “double-sided cleaning (front surface → back surface)”. In the case of “only backside cleaning” and “double-sided cleaning (backside → frontside)”, the substrate W is transported to the reverse delivery unit RT2. In the segment S5, the substrate W is transported to any of the front surface cleaning processing units SS1 to SS8 in the case of the pattern of “only front surface cleaning” or “double-sided cleaning (front surface → back surface)”. In the case of the pattern of “only backside cleaning” and “double-sided cleaning (backside → frontside)”, the substrate W is transported to one of the backside cleaning processing units SSR1 to SSR8. In the segment S7, if the pattern is “double-sided cleaning (back surface → front surface)” or “double-sided cleaning (front surface → back surface)”, the substrate W is transported to the reversal processing unit RT1. In the segment S9, if the pattern is “double-sided cleaning (back surface → front surface)”, the substrate W is transported to any of the front surface cleaning processing units SS1 to SS8. On the other hand, in the case of the “double-sided cleaning (front surface → back surface)” pattern, the substrate W is transported to one of the back surface cleaning processing units SSR1 to SSR8. In the segment S11, in the case of the pattern of “only front surface cleaning” and “double-sided cleaning (back surface → front surface)”, the substrate W is transferred to one of the substrate platform PASS of the relay processing unit 50a. In the case of the “back surface cleaning only” and “double-sided cleaning (front surface → back surface)” pattern, the substrate W is transported to the reversal transfer unit RT2.

  Further, in FIG. 15, how to handle the substrate W in the shaded segments (S1, S3, S5, S7, S9, S11, S13) is specified in the flow recipe FR.

  Specifically, it is as follows.

  With respect to the segments S1 and S13, the flow recipe FR defines the slot position of the carrier C that stores the substrate W. Regarding the segments S3 and S11, the flow recipe FR defines which of the relay unit 50a in the relay unit 50, the reversing unit RT1, and the reversal transfer unit RT2 to transfer the substrate W to be processed. Regarding the segments S5, S7 and S9, the flow recipe FR defines which of the front surface cleaning processing units SS1 to SS8 and the back surface cleaning processing units SSR1 to SSR8 the substrate W to be processed is transported.

<3. Schedule creation program P1>
The schedule creation program P1 will be described below.

  As shown in FIG. 11, the schedule creation program P1 is a program stored in the storage device 64 in the control unit 60. The schedule creation program P1 is a program that is executed by the CPU 61 that performs various arithmetic processes to create schedule data SD of each board to be processed. The schedule data SD created in this way is stored in the storage device 64. It Further, various functions of the substrate processing apparatus 1 are realized by the CPU 61 performing arithmetic processing in accordance with the procedure described in the processing program P0, and the target substrate W is subjected to predetermined cleaning processing according to the schedule data SD.

<3.1 Planning logic in schedule creation>
FIG. 16 is a flowchart showing the flow of creating the schedule data SD by the schedule creating program P1 in the first embodiment of the present invention. First, the flow recipe FR is given to the schedule creation program P1 for a plurality of (for example, one lot) substrates W (step ST1). The schedule creation program P1 uses the flow recipe FR to determine the number of processing units that can perform parallel processing (also referred to as parallel processing) in the first cleaning processing segment S5 and the second cleaning processing segment S9 (the number of parallel processing units). (Also called) (step ST2).

  As described above, the flow recipe FR defines which of the front surface cleaning processing units SS1 to SS8 and the back surface cleaning processing units SSR1 to SSR8 is to be used in the segments S5 and S9. Therefore, the schedule creation program P1 determines the number of processing units (the number of parallel processing units) capable of performing parallel processing in the segment S5 for performing the first cleaning processing and the segment S9 for performing the second cleaning processing based on this information. can do. For example, if the flow recipe FR specifies only the surface cleaning processing unit SS1 as the surface cleaning processing unit to be used in the segment S5, the number of parallel processing units in the segment S5 is “1”. On the other hand, if the flow recipe FR defines all the surface cleaning processing units SS1 to SS8 in the segment S5, the number of parallel processing units in the segment S5 is “8”. Similarly, if the flow recipe FR defines only a specific back surface cleaning processing unit SSR1 for the segment S5, the number of parallel processing units in the segment S5 is “1”. If the flow recipe FR defines all the back surface cleaning processing units SSR1 to SSR8 for the segment S5, the number of parallel processing units in the segment S5 is “8”. From the same idea, the number of processing units that can perform parallel processing (the number of parallel processing units) in the segment S9 in which the second cleaning processing is performed is determined based on the flow recipe FR.

  In the following description, the number of processing units capable of performing parallel processing in the first cleaning process is referred to as M (M1 when performing double-side cleaning). Further, the number of processing units capable of performing parallel processing in the second cleaning processing is referred to as M2.

  The schedule creation program P1 determines the flow of substrate transportation based on the above (step ST3). In the following, the type and number of processing units to be processed in parallel in the segment S5, and the type and number of processing units to be processed in parallel in the segment S9 will be written together as in "back 3 parallel-table 4 parallel". Here, the flow of substrate transfer is expressed. Further, when only the cleaning process is performed in the segment S5 and the cleaning process is not performed in the segment S9, the flow of the substrate transfer is expressed by the type and the number of the processing units processed in parallel in the segment S5, such as “back 8 parallel”. To do.

  When the cleaning processing unit is operated in "back 3 parallel" in the above-mentioned "back surface cleaning only" pattern, the substrate W is transported as shown in FIG. A plurality of substrates W are sequentially transported from the carrier C to the reverse delivery unit RT2 by the indexer robot IR (segment S2). The substrate W transferred to the reverse delivery unit RT2 by the indexer robot IR is sequentially transferred to the three back surface cleaning processing units SSR1 to SSR3 by the center robot CR (segment S4). The back surface cleaning processing units SSR1 to SSR3 clean the three substrates W in parallel (segment S5). The substrate W, which has undergone the cleaning processing in the back surface cleaning processing units SSR1 to SSR3, is sequentially transported by the central robot CR toward the reverse delivery unit RT2 (segment S6). The substrate W transferred to the reverse transfer unit RT2 is sequentially transferred from the reverse transfer unit RT2 to the carrier C by the indexer robot IR (segment S12).

  Further, in the above-described “double-sided cleaning (back surface → front surface)” pattern, when the processing units are operated in “back side 3 parallel-table 6 parallel”, the substrate W is transported as shown in FIG. 18. The description from the segment S2 to the segment S5 is omitted because it is the same as "only backside cleaning".

  The substrate W that has undergone the cleaning processing in the back surface cleaning processing units SS1 to SSR is sequentially transported by the central robot CR toward the reversing unit RT1 (segment S6). The substrate W transported to the reversing unit RT1 is subjected to the reversing process, and then sequentially transported to the six surface cleaning processing units SS1 to SS6 by the central robot CR (segment S8). The surface cleaning processing units SS1 to SS6 clean the six substrates W in parallel (segment S9). The substrates W that have been cleaned by the surface cleaning processing units SS1 to SS6 are sequentially transported by the central robot CR toward the substrate platform PASS of the relay unit 50a (segment S10). The substrate W placed on the substrate platform PASS is sequentially transported toward the carrier C by the indexer robot IR (segment S12).

  In this way, in the segments S2, S4, S6 and S12 in the "back 3 parallel", it is necessary to sequentially transport the three substrates W. Further, it is necessary to sequentially transport three substrates W in the segments S2, S4, and S6 and six substrates W in the segments S8, S10, and S12 in "back 3 parallel-front 6 parallel". However, the indexer robot IR and the center robot CR can simultaneously transfer only two unprocessed substrates W. Similarly, the reversing unit RT1, the reversing transfer unit RT2, and the substrate platform PASS can simultaneously hold only two unprocessed substrates W. Therefore, how to move the indexer robot IR and the center robot CR in these segments is important.

  Returning to the description of FIG. When the flow of substrate transport is determined as described above (step ST3), the number of substrates W that can be simultaneously transported by the central robot CR is determined (step ST4). As described above, since the number of substrates W that can be simultaneously transferred by the central robot CR is "2", "2" is usually designated in step ST4. However, it is considered that some hands 13 of the center robot CR cannot be used due to a failure of the center robot CR. Therefore, in step ST4, "1" or "2" may be specified as the number of substrates W that can be simultaneously transported. As a generalization, if the center robot CR has a specification capable of simultaneously carrying X or less (X is 1 or more) substrates W, a natural number of X or less may be specified in step ST4. Further, in the present embodiment, among the four hands 13b to 16b of the central robot CR, the hands 13b and 14b are used for unprocessed substrates and the hands 15b and 16b are used for processed substrates, so that the central robot is used. The number of unprocessed substrates W or processed substrates W to which CRs can be simultaneously transferred is “1” or “2”, but if the hands 13b to 16b are not used in this way, the central robot CR can be simultaneously transferred. The number of unprocessed substrates W or processed substrates W is “1”, “2”, “3”, or “4”. From the same idea, the number of substrates W that can be simultaneously transported by the indexer robot IR is specified (step ST5).

  Next, the number of substrates W that can be simultaneously held by the reversing unit RT1, the reversing transfer unit RT2, and the substrate platform PASS is specified (step ST6). As described above, the number of substrates W that can be simultaneously held by the reversing unit RT1, the reversing / transferring unit RT2, and the substrate platform PASS is “2”, so that “2” is normally designated in step ST6. However, it is conceivable that only one substrate W can be held due to a failure of the reversing unit RT1, the reversing delivery RT2, or the substrate platform PASS. Therefore, in step ST6, “1” or “2” may be specified as the number of substrates W that can be simultaneously held. As a generalization, if the reversing unit RT1, the reversing / delivering unit RT2, and the substrate platform PASS are capable of simultaneously carrying Y or less (Y is 1 or more) substrates W, a natural number of Y or less in step ST6. May be identified.

  Next, the schedule creation program P1 creates an operation schedule of the indexer robot IR in the segments S2 and S12 and an operation schedule of the center robot CR in the segments S4, S6, S8 and S10 (step ST7). The schedule creation program P1 creates an operation schedule of the indexer robot IR in the segments S2 and S12 and an operation schedule of the center robot CR in the segments S4, S6, S8 and S10 according to steps ST7a to ST7e which are substeps of step ST7.

  In step ST7a, the number M of parallel processing units at the transfer destination of the indexer robot IR or the center robot CR (M1 and M2 when performing double-sided cleaning) is the number N of substrates W that can be simultaneously transferred by the robot IR or CR. A decision is made as to whether it is divisible. In other words, in step ST7a, it is determined whether or not N sheets is a divisor of M, which is the number of parallel processing units (M1 and M2 when double-sided cleaning is performed). When it is determined “Yes” in step ST7a, the indexer robot IR or the center robot CR simultaneously transfers N substrates W to the processing unit SS or SSR (step ST7b). On the other hand, if "No" is determined in step ST7a, the process proceeds to step ST7c, and it is determined whether the pattern of substrate transfer to be executed is "front surface cleaning only" or "back surface cleaning only". Then, if "Yes" is determined in step ST7c, the operation schedule of the indexer robot IR or the center robot CR is determined according to the following planning logic 1 (step ST7d). On the other hand, if it is determined "No" in step ST7c, the operation schedule of the central robot CR is determined according to the following planning logic 2 (step ST7e).

[Planning Logic 1] When the central robot CR conveys the substrate W between the two segments, the operation schedule of the central robot CR is created so that the cycle including the following steps SS11 and SS12 is repeated.

  SS11: The center robot CR executes the simultaneous transfer of N substrates W by the number of quotients obtained by dividing M by N.

  SS12: The center robot CR simultaneously carries the surplus number of substrates W obtained by dividing M by N in the ““ number of quotients obtained by dividing M by N ”+1” times.

  However, M is the number of parallel processing units at the substrate transfer destination of the central robot CR or the number of substrates that can simultaneously hold the substrates W (also referred to as the simultaneous substrate holding number). N is the number of substrates W that can be simultaneously transported by the central robot CR.

[Planning Logic 2] When the central robot CR sequentially transfers one substrate W to a plurality of processing units as in the case of “back 3 parallel-front 6 parallel”, the following sub-steps SS21 and SS22 are performed. The operation schedule of the central robot CR is created so that the cycle consisting of and is repeated.

  SS21: The center robot CR executes the simultaneous transfer of N substrates W by the number of quotients (M3) obtained by dividing the greatest common divisor of M1 and M2 by N.

  SS22: In the “M3 + 1” th substrate transport, the center robot CR simultaneously transports the number of substrates W equal to “a remainder obtained by dividing the greatest common divisor of M1 and M2 by N”.

  Here, M1 is the number of processing units performing parallel processing in the first cleaning processing, M2 is the number of processing units performing parallel processing in the second cleaning processing, and N is the number of substrates W that can be simultaneously transferred by the central robot CR. Is.

  As described above, the schedule creation program P1 determines the operation schedule of the center robot CR in the segments S4, S6, S8, and S10. After that, the operation schedule of the indexer robot IR is created in accordance with the operation schedule of the center robot CR. Finally, the schedule creation program P1 integrates the substrate transfer schedule by each robot, the substrate processing schedule in each cleaning processing unit SS and SSR, the substrate reversal schedule in the reversing unit RT1 and the reversing transfer unit RT2, and the like. Schedule data SD is generated (step ST8).

<3.2 Application Example of Planning Logic 1>
Below, an example of the transportation schedule created based on the planning logic 1 will be described.

  When the planning logic 1 is applied to the movement of the center robot CR in the segment S4 in the “back 3 parallel” pattern (see FIG. 17), the center robot CR repeatedly executes the cycle including the following substeps SS11 and SS12. become.

(Sub-step SS11) The central robot CR transfers the two (that is, N) substrates W at the same time from the reverse transfer unit RT2 to the two back surface cleaning processing units SSR once (that is, 3 in 2). Execute only the number of divided quotients.

(Sub-step SS12) In the second time (ie, the number of quotients obtained by dividing 3 by 2 and adding 1), the central robot CR uses one substrate (that is, the remainder number obtained by dividing 3 by 2). Transport W.

  Thereby, for example, a schedule as shown in FIG. 19 is created. FIG. 19 is a timing chart of the center robot CR and the back surface cleaning units SSR1 to SSR3 in the segments S4 and S5 in the “back 3 parallel” pattern. In reality, the center robot CR also carries out the processed substrate W from the back surface cleaning units SSR1 to SSR3, but in FIG. For the purpose of intensive description, it is assumed that the unloading work of the processed substrate W from the back surface cleaning units SSR1 to SSR3 is not performed.

  By time t0, the two unprocessed substrates W1 and W2 are placed on the reverse delivery unit RT2 by the indexer robot IR. These substrates W1 and W2 are reversed by the reverse transfer unit RT2 by time t1. The central robot CR simultaneously carries out the two unprocessed substrates W1 and W2 from the reverse transfer unit RT2 at time t1. The central robot CR moves to a position facing the back surface transport processing unit SSR1 while holding the two unprocessed substrates W1 and W2 during a period from time t1 to time t2. The central robot CR carries the unprocessed substrate W1 into the back surface cleaning processing unit SSR1 at time t2. Then, the back surface cleaning processing unit SSR1 starts the back surface cleaning processing on the unprocessed substrate W1. Next, the central robot CR moves to a position facing the back surface cleaning processing unit SSR2. Then, the unprocessed substrate W2 is carried into the back surface cleaning processing unit SSR2 at a timing slightly delayed from the time t2. The back surface cleaning processing unit SSR2 starts the back surface cleaning processing on the unprocessed substrate W2.

  Note that, for simplicity, FIG. 19 illustrates that the central robot CR simultaneously carries in two unprocessed substrates W1 and W2 to the back surface cleaning processing units SSR1 and SSR2 at the same time t2 (hereinafter the same).

  After that, the central robot CR moves to a position facing the reverse delivery unit RT2 in a period until time t3. By time t3, the third unprocessed substrate W3 is placed on the reversing and delivering unit RT2 by the indexer robot IR, and reversing at the reversing and delivering unit RT2 is completed. The central robot CR takes out the third unprocessed substrate W3 from the reverse delivery unit RT2 at time t3.

  After that, the central robot CR moves to a position facing the back surface cleaning processing unit SSR3 while holding one substrate W3 during a period from time t3 to time t4. Next, the central robot CR carries in one unprocessed substrate W3 into the back surface cleaning processing unit SSR3 at time t4. The back surface cleaning processing unit SSR3 starts the back surface cleaning processing on the unprocessed substrate W3.

  After that, the central robot CR moves to a position facing the reverse delivery unit RT2 during the period from time t4 to time t5. By time t5, two unprocessed substrates W4 and W5 have been placed on the reversing and delivering unit RT2 by the indexer robot IR, and reversing at the reversing and delivering unit RT2 has been completed.

  The central robot CR takes out the unprocessed substrates W4 and W5 from the reverse delivery unit RT2 at time t5. Subsequently, the center robot CR moves to a position facing the back surface cleaning processing unit SSR1 during a period from time t5 to time t6. The center robot CR carries the unprocessed substrate W4 into the back surface cleaning processing unit SSR1. The back surface cleaning processing unit SSR1 starts the back surface cleaning processing on the unprocessed substrate W4. The central robot CR moves to a position facing the back surface cleaning processing unit SSR2, and carries it into the back surface cleaning processing unit SSR2 at a time slightly delayed from time t6. The back surface cleaning processing unit SSR2 starts the back surface cleaning processing on the unprocessed substrate W5.

  After that, the central robot CR moves to a position facing the reverse delivery unit RT2 in a period until time t7. By the time t7, the sixth unprocessed substrate W6 has been placed by the indexer robot IR, and the reversal of the substrate W6 by the reversal transfer unit RT2 has been completed. The central robot CR takes out the sixth unprocessed substrate W6 from the reverse delivery unit RT2 at time t7.

  After that, the central robot CR moves to a position facing the back surface cleaning processing unit SSR3 while holding one substrate W6 during a period from time t7 to time t8. Next, the central robot CR carries in one unprocessed substrate W6 into the back surface cleaning processing unit SSR3 at time t8. The back surface cleaning processing unit SSR3 starts the back surface cleaning processing on the unprocessed substrate W6.

  As described above, the center robot CR performs unprocessed from the reverse delivery unit RT2 to the three back surface cleaning processing units SR1 to SR3 in the rhythm of carrying two sheets → one sheet → two sheets → one sheet. The substrate W is being transported. One cycle of substrate transfer is from time t1 to time t4 (from time t5 to time 8).

  In the example of FIG. 19, since the time required for carrying one cycle of the substrate is longer than the processing time in one substrate processing unit, a waiting time occurs on the substrate processing unit side. Such a state is called "conveyance-controlled". On the other hand, when the time required for carrying one cycle of the substrate is shorter than the processing time in one substrate processing unit, a waiting time occurs on the side of the central robot CR. Such a state is called "process rate limiting". When an operation schedule for sequentially transporting a plurality of substrates W toward the processing unit SS or SSR using the plurality of hands 13b, 14b (or 15b, 16b) from the central robot CR is created, the transfer time and the substrate processing in the processing unit are performed. Depending on the magnitude relationship with time, either a transport rate-controlled state, a process rate-controlled state, or a state in which the central robot CR and the processing unit are completely synchronized occurs.

  However, when the operation schedule of the robot IR or CR is created in accordance with the planning logic 1, only one of "transport limiting rate" and "process limiting rate" occurs, and "transport limiting rate" and "process limiting rate" are confused and occur. Absent.

  Further, as shown in FIG. 19, a period during which the central robot CR executes one substrate transfer cycle (for example, a period from time t1 to time t4, a period from time t5 to time t8, or a period from time t9 to time t12). During the period) or a period that is an integral multiple of the period, the substrate W is transferred to all the parallel processing units SSR1 to SSR3. As a result, it becomes possible to start the substrate processing in all the parallel processing units SSR1 to SSR3 within a period of one transfer cycle (or an integral multiple of the period) by the central robot CR.

  As a result, the cycle of substrate transfer by the central robot CR and the cycle of substrate processing start timing in the parallel processing unit proceed in synchronization. Since the substrate transfer cycle and the substrate processing start cycle proceed in synchronization, the substrate transfer and the substrate processing proceed at a constant rhythm, and stable substrate processing becomes possible. Therefore, it becomes possible to smoothly connect a segment that executes such an operation schedule and an operation schedule of a segment before or after the segment.

<3.3 Application example of planning logic 2>
Below, an example of the transportation schedule created based on the planning logic 2 will be described. When the planning logic 2 is applied to the movement of the center robot CR in the segments S4, S6, and S8 in the "back 3 parallel-front 6 parallel" pattern described above with reference to FIG. 18, the center robot CR performs the following sub-step SS21. And SS22 will be repeatedly executed.

(Sub-step SS21)
The central robot CR transfers the two (ie, N) substrates W at the same time from the reverse transfer unit RT2 to the two back surface cleaning processing units SSR once (ie, (the greatest common divisor of M1 and M2 is (Quotient divided by N) times).

(Sub-step SS22)
The center robot CR transfers one substrate (that is, (the greatest common divisor of M1 and M2) / N in the second (that is, ((the greatest common divisor of M1 and M2 divided by N) +1) th) substrate transport. (The remainder) sheets W are transported.

  As a result, a schedule as shown in FIG. 20 is created. FIG. 20 shows the reverse transfer unit RT2, the center robot CR, the back surface cleaning processing unit SSR, and the front surface cleaning processing unit SS at the respective timings when a plurality of substrates W are sequentially transferred in the "back 3 parallel-front 6 parallel" pattern. It is a schematic diagram which shows the holding state of the board | substrate W of FIG. Note that FIG. 20 also illustrates the process of unloading the substrate W from the back surface cleaning processing unit SSR by the center robot CR.

  By time t0, the indexer robot IR places the two unprocessed substrates W1 and W2 on the reverse delivery unit RT2. Then, by the time t1, the substrates W1 and W2 are reversed by the reverse transfer unit RT2. At time t1, the two substrates W1 and W2 are simultaneously transferred from the reverse transfer unit RT2 to the central robot CR. From time t1 to t2, the center robot CR holding the substrates W1 and W2 moves to a position facing the back surface cleaning processing unit SSR1. At time t2, the substrate W1 is transferred from the central robot CR to the back surface cleaning processing unit SSR1. Then, the back surface cleaning processing unit SSR1 starts the back surface cleaning processing of the substrate W1. Further, the center robot CR moves to a position facing the back surface cleaning processing unit SSR2. Then, the substrate W2 is transferred from the central robot CR to the back surface cleaning processing unit SSR2. Then, the back surface cleaning processing unit SSR2 starts the back surface cleaning processing of the substrate W2. The timing of the transfer from the central robot CR to the back surface cleaning processing unit SSR is slightly later for the substrate W2 than for the substrate W1. However, in FIG. 20, for simplification, the substrate W1 and the substrate W2 are illustrated as being transferred from the central robot CR to the back surface cleaning processing unit SSR at the same time t2.

  From time t2 to time t3, the central robot CR moves to a position facing the reverse delivery unit RT2. By the time t3, the third substrate W3 is placed on the reverse delivery unit RT2 by the indexer robot IR, and then inverted by the reverse delivery unit RT2. At time t3, the third substrate W3 is transferred from the reverse transfer unit RT2 to the central robot CR. From time t3 to t4, the central robot CR holding the substrate W3 moves to a position facing the back surface cleaning processing unit SSR3. At time t4, the substrate W3 is transferred from the central robot CR to the back surface cleaning processing unit SSR3. Then, the back surface cleaning processing unit SSR3 starts the cleaning processing of the back surface of the substrate W3.

  From time t4 to time t5, the center robot CR moves to a position facing the back surface cleaning processing unit SSR1. At time t5, the substrate W1 is transferred from the back surface cleaning processing unit SSR1 to the central robot CR. Next, after the center robot CR moves to a position facing the back surface cleaning processing unit SSR2, the substrate W2 is transferred from the back surface cleaning processing unit SSR2 to the center robot CR. From time t5 to time t6, the central robot CR holding the substrates W1 and W2 moves to a position facing the reversing unit RT1. At time t6, the substrates W1 and W2 are simultaneously transferred from the central robot CR to the reversing unit RT1. From time t6 to t7, the reversing unit RT1 reverses the substrates W1 and W2 at the same time. At time t7, the substrates W1 and W2 are simultaneously transferred from the reversing unit RT1 to the central robot CR. From time t7 to time t8, the central robot CR holding the substrates W1 and W2 moves to a position facing the surface cleaning processing unit SS1. At time t8, the substrate W1 is transferred from the central robot CR to the surface cleaning processing unit SS1. Then, the surface cleaning processing unit SS1 starts the cleaning processing of the surface of the substrate W1. Further, the central robot CR moves to a position facing the surface cleaning processing unit SS2. Then, the substrate W2 is transferred from the central robot CR to the surface cleaning processing unit SS2. After that, the front surface cleaning processing unit SS2 starts the cleaning processing of the back surface of the substrate W2.

  From time t8 to time t9, the central robot CR moves to a position facing the back surface cleaning processing unit SSR3. At time t9, the substrate W3 is transferred from the back surface cleaning processing unit SSR3 to the central robot CR. From time t9 to time t10, the central robot CR holding the substrate W3 moves to a position facing the reversing unit RT1. At time t10, the substrate W3 is transferred from the central robot CR to the reversing unit RT1. The reversing unit RT1 reverses the substrate W3 from time t10 to time t11. At time t11, the substrate W3 is transferred from the reversing unit RT1 to the central robot CR. From time t11 to t12, the central robot CR holding the substrate W3 moves to a position facing the surface cleaning processing unit SS3. At time t12, the substrate W3 is transferred from the central robot CR to the surface cleaning processing unit SS3. Then, the surface cleaning processing unit SS3 starts the surface cleaning processing of the substrate W3.

  From time t12 to t13, the central robot CR moves to a position facing the reverse delivery unit RT2. By time t13, the fourth and fifth substrates W4 and W5 are placed on the reverse delivery unit RT2 by the indexer robot IR and inverted by the reverse delivery unit RT2. At time t13, the substrates W4 and W5 are simultaneously transferred from the reverse transfer unit RT2 to the central robot CR. From time t13 to time t14, the central robot CR holding the substrates W4 and W5 moves to a position facing the back surface cleaning processing unit SSR1. At time t14, the substrate W4 is transferred from the central robot CR to the back surface cleaning processing unit SSR1. Then, the back surface cleaning processing unit SSR1 starts the back surface cleaning processing of the substrate W4. Further, the center robot CR moves to a position facing the back surface cleaning processing unit SSR2. Then, the substrate W5 is transferred from the central robot CR to the back surface cleaning processing unit SSR2. After that, the back surface cleaning processing unit SSR2 starts the back surface cleaning processing of the substrate W5. The substrate W5 is slightly later than the substrate W4 when it is transferred from the central robot CR to the back surface cleaning processing unit SSR. However, in FIG. 20, for simplification, the substrate W4 and the substrate W5 are illustrated as being transferred from the central robot CR to the back surface cleaning processing unit SSR at the same time t14.

  From time t14 to time t15, the central robot CR moves to a position facing the reverse delivery unit RT2. By time t15, the sixth substrate W6 is placed on the reversing and delivering unit RT2 by the indexer robot IR, and is reversed by the reversing and delivering unit RT2. At time t15, the sixth substrate W6 is transferred from the reverse transfer unit RT2 to the central robot CR. From time t15 to t16, the central robot CR holding the substrate W6 moves to a position facing the back surface cleaning processing unit SSR3. At time t16, the substrate W6 is transferred from the central robot CR to the back surface cleaning processing unit SSR3. Then, the back surface cleaning processing unit SSR3 starts the back surface cleaning processing of the substrate W6.

  From time t16 to time t17, the central robot CR moves to a position facing the back surface cleaning processing unit SSR1. At time t17, the substrate W4 is transferred from the back surface cleaning processing unit SSR1 to the central robot CR. Next, after the center robot CR moves to a position facing the back surface cleaning processing unit SSR2, the substrate W5 is transferred from the back surface cleaning processing unit SSR2 to the center robot CR. From time t17 to time t18, the center robot CR holding the substrates W4 and W5 moves to a position facing the reversing unit RT1. At time t18, the substrates W4 and W5 are simultaneously transferred from the central robot CR to the reversing unit RT1. From time t18 to time t19, the reversing unit RT1 reverses the substrates W4 and W5 at the same time. At time t19, the substrates W4 and W5 are simultaneously transferred from the reversing unit RT1 to the central robot CR. From time t19 to time t20, the central robot CR holding the substrates W4 and W5 moves to a position facing the surface cleaning processing unit SS4. At time t20, the substrate W4 is transferred from the central robot CR to the surface cleaning processing unit SS4. Then, the surface cleaning processing unit SS4 starts the cleaning processing of the surface of the substrate W4. Further, the central robot CR moves to a position facing the surface cleaning processing unit SS5. Then, the substrate W5 is transferred from the central robot CR to the surface cleaning processing unit SS5. Then, the surface cleaning processing unit SS5 starts the cleaning processing of the surface of the substrate W5.

  From time t20 to time t21, the central robot CR moves to a position facing the back surface cleaning processing unit SSR3. At time t21, the substrate W6 is transferred from the back surface cleaning processing unit SSR3 to the central robot CR. From time t21 to time t22, the central robot CR holding the substrate W6 moves to a position facing the reversing unit RT1. At time t22, the substrate W6 is transferred from the central robot CR to the reversing unit RT1. The reversing unit RT1 reverses the substrate W6 from time t22 to time t23. At time t23, the substrate W6 is transferred from the reversing unit RT1 to the central robot CR. From time t23 to time t24, the central robot CR holding the substrate W6 moves to a position facing the surface cleaning processing unit SS6. At time t24, the substrate W6 is transferred from the central robot CR to the surface cleaning processing unit SS6. Then, the surface cleaning processing unit SS6 starts the cleaning processing of the surface of the substrate W6.

  In this way, the center robot CR moves from the reverse delivery unit RT2 (segment S2) to the back surface cleaning unit 12 (segment S5) in which the three back surface cleaning processing units SSR perform the parallel processing. The substrate W is transported at a rhythm of 2 sheets → 1 sheet.

  Similarly, the center robot CR conveys the substrate W from the back surface cleaning processing section 12 toward the reversing unit RT1 (segment S7) at a rhythm of 2 sheets → 1 sheet → 2 sheets → 1 sheet. The center robot CR moves from the reversing unit RT1 toward the front surface cleaning unit 11 (segment S9) where the six front surface cleaning processing units SS perform parallel processing at a rhythm of 2 sheets → 1 sheet → 2 sheets → 1 sheet ... The substrate W is being transported.

<3.4 Generalization of the present invention>
Here, the contents of the present invention will be generalized. An object of the present invention is to provide one or more segments (carrier C, reversal unit RT1, reversal delivery unit RT2) that simultaneously hold a plurality of (M) substrates W. A plurality of surface cleaning processing units SS capable of parallel processing. A plurality of sheets (N sheets, N is a divisor of M) toward or from the front surface cleaning processing section 11 and the back surface cleaning processing section 12 having a plurality of back surface cleaning processing units SSR capable of parallel processing. The substrate W is rhythmically transported by the substrate transport unit (indexer robot IR or center robot CR) capable of simultaneously transporting the (not) substrate.

  First, attention is paid to the substrate transfer processing performed by the substrate transfer unit toward or from one segment. When M is divisible by N, the simultaneous transfer of N substrates W is repeated. When M is not divisible by N, variables i1, i2, ... iN that satisfy the following expression 1 are set. Then, the operation schedule of the substrate transfer unit is set with reference to the equation 1 in which the variables i1, i2, ...

M = N * i1 + (N-1) * i2 + (N-2) * i3 + ... + 1 * iN ... Formula 1
However, i1, i2, i3, ... iN are all arbitrary integers of 0 or more and (M / N) or less.

  In other words, the substrate transfer cycle including the following first step, second step, third step, ... Nth step is repeatedly executed.

  [First Step] The substrate transfer step of simultaneously transferring the N substrates W from or to one segment by the substrate transfer unit is executed only i1 times.

  [Second Step] The substrate transfer step of simultaneously transferring (N-1) substrates W from or to one segment by the substrate transfer unit is executed i2 times.

  [Third Process] The substrate transfer step of simultaneously transferring (N−2) substrates W from one segment or toward the one segment by the substrate transfer unit is performed i3 times.

  [Nth Step] The substrate transfer step of simultaneously transferring one substrate W from or to one segment by the substrate transfer unit is executed iN times.

  It should be noted that in the substrate transfer cycle, the first step to the Nth step are not limited to the mode performed in this order, and for example, the first step to the Nth step may be performed in any order. Further, the first process to the Nth process are not limited to be sequentially performed in an arbitrary order in a time sequence. For example, at least a part of two or more processes of the first process to the Nth process is performed in parallel. May be done.

  In other words, N pieces (N is not a divisor of M) from or toward one segment capable of simultaneously holding M pieces (M is an integer of 2 or more) of substrates W. The next substrate transfer cycle is repeatedly executed by the substrate transfer unit capable of transferring (integral number of 2 or more) substrates W at the same time. However, here, each of the N variables ik (k is an integer of 1 to N) is an arbitrary integer of 0 or more and (M / N) or less, and the following expression 2 is satisfied. Then, in the substrate transfer cycle, N transfer steps are performed ik times of the substrate transfer step of simultaneously transferring (N−k + 1) substrates W by the substrate transfer unit from or toward one segment. Is carried out for the transfer process in which the number of substrate transfer steps is defined by each variable which is a natural number among the variables ik.

  Then, if i1 is a natural number, in the substrate transfer cycle, a substrate transfer step of simultaneously transferring N substrates from or to one segment by the substrate transfer unit is performed i1 times. Is included. This improves the throughput of the substrate processing apparatus.

  Here, a case where three sheets are simultaneously conveyed (M = 10, N = 3) in “10 sheets parallel to the back” will be specifically described.

  In this case, the following can be exemplified as the combinations of the variables i1, i2, i3, ... iN that satisfy the expressions 1 and 2.

10 = 3 × 3 + 2 × 0 + 1 × 1
(In this case, i1 = 3, i2 = 0, iN = 1) ... [1]
10 = 3 × 2 + 2 × 2 + 1 × 0
(In this case, i1 = 2, i2 = 2, iN = 0) ... [2]
10 = 3 × 2 + 2 × 1 + 1 × 2
(In this case, i1 = 2, i2 = 1, iN = 2) ... [3]
10 = 3 × 2 + 2 × 0 + 1 × 4
(In this case, i1 = 2, i2 = 0, iN = 4) ... [4]
10 = 3 × 1 + 2 × 3 + 1 × 1
(In this case, i1 = 1, i2 = 3, iN = 1) ... [5]
[1] corresponds to the planning logic 1 described above, and is an operation schedule in which the substrate W is transported by repeating a cycle in which three substrates are simultaneously transported three times and then one substrate is transported once. [2] is an operation schedule for carrying the substrate W by repeating a cycle of carrying out simultaneous carrying of two sheets twice after carrying out simultaneous carrying of three sheets twice. [3] is an operation schedule in which the substrate W is transferred by repeating a cycle in which the simultaneous transfer of three sheets is repeated twice and the simultaneous transfer of two sheets is performed once and the single sheet is transferred twice. [4] is an operation schedule in which the substrate W is transferred by repeating a cycle of performing one transfer four times after repeating three simultaneous transfer. [5] is an operation schedule in which the substrate W is transported by repeating a cycle in which three substrates are simultaneously transported once, two substrates are simultaneously transported three times, and one substrate is once transported. In any of [1] to [5], while the substrate transfer unit completes one substrate transfer cycle, M substrates W to or from the segment are transferred by the substrate transfer unit. Is carried out.

  Next, the substrate transfer unit is arranged between the plurality of segments (the first segment R1 capable of simultaneously holding M1 substrates and the second segment R2 capable of simultaneously holding M2 substrates W). A substrate transfer process in the case of sequentially transferring the substrates W will be considered. First, when both M1 and M2 are not divisible by N, M3, which is the greatest common divisor of M1 and M2, is obtained. Then, variables i1, i2, ... iN that satisfy the following Expression 3 are set. Then, the operation schedule of the substrate transfer unit is set with reference to the equation 3 in which the variables i1, i2, ...

M3 = N * i1 + (N-1) * i2 + (N-2) * i3 + ... + 1 * iN ... Formula 3
(However, i1 to iN are all integers of 0 or more and (M / N) or less)
Here, the first segment, the second segment, the substrate W are sequentially transported to the first segment and the second segment, and a plurality of substrates (N sheets, where N is a divisor of at least one of M1 and M2). Substrate transporting part capable of holding the substrate W (not).

  In other words, the substrate transfer cycle including the following first step, second step, third step, ... Nth step is repeatedly executed.

  [First Step] Substrate transport is performed i1 times, in which the N substrates W are simultaneously transported to the first segment, then the N substrates W are unloaded from the first segment, and then simultaneously transported to the second segment.

  [Second step] (N-1) substrates are simultaneously transferred to the first segment, then the (N-1) substrates W are unloaded from the first segment, and then simultaneously transferred to the second segment. Substrate transportation is performed i2 times.

  [Third step] (N-2) substrates are simultaneously transferred to the first segment, then the (N-2) substrates W are unloaded from the first segment, and then simultaneously transferred to the second segment. Substrate transportation is carried out i3 times.

  [Nth Step] One substrate is transported to the first segment, then the one substrate is unloaded from the first segment, and then the substrate is transported to the second segment only iN times.

  It should be noted that in the substrate transfer cycle, the first step to the Nth step are not limited to the mode performed in this order, and for example, the first step to the Nth step may be performed in any order. Further, the first process to the Nth process are not limited to be sequentially performed in an arbitrary order in a time sequence. For example, at least a part of two or more processes of the first process to the Nth process is performed in parallel. May be done.

  In other words, the first segment capable of simultaneously holding M1 sheets (M1 is an integer of 2 or more) and the first segment capable of simultaneously holding M2 sheets (M2 is an integer of 2 or more). It is possible to transfer two segments and substrates sequentially to the first segment and the second segment, and hold N sheets (N is an integer of 2 or more that is not a divisor of at least one of M1 and M2). The next substrate transfer cycle is repeatedly executed by the different substrate transfer unit. However, here, the greatest common divisor of M1 and M2 is M3, and N variables ik (k is an integer of 1 to N) are arbitrary integers of 0 or more and (M3 / N) or less. And the following expression 4 is satisfied. Then, in the substrate transport cycle, (N−k + 1) substrates are simultaneously transported toward the first segment, then the (N−k + 1) substrates are unloaded from the first segment, and then the (N -K + 1) In the transfer process of performing ik substrate transfer steps of simultaneously transferring the substrates toward the second segment, the number of substrate transfer steps is defined by each variable that is a natural number among the N variables ik. It is performed about a conveyance process.

  If i1 is a natural number, in the substrate transfer cycle, the substrate transfer unit simultaneously transfers N substrates toward the first segment, and the operation of unloading the N substrates from the first segment. , And a carrying step of carrying out the board carrying step of carrying out the operation of carrying simultaneously the N substrates toward the second segment at the same time i1 times. This improves the throughput of the substrate processing apparatus.

  Here, a specific description will be given of a case where two sheets are simultaneously conveyed in “back three sheets parallel−front six sheets parallel” (M1 sheet = 3 sheets, M2 sheet = 6 sheets, N sheet = 2 sheets). To do.

  The greatest common denominator of M1 and M2 is M3, which is “3”. Therefore, the combination of i1 and i2 satisfying the expressions 3 and 4 is i1 = 1 and i2 = 1, and the following expressions are obtained.

  3 = 2 × 1 + 1 × 1 [6].

  [6] corresponds to the planning logic 2 described above. A plurality of substrates W are sequentially transferred to the first segment R1 by repeating a cycle in which two sheets are simultaneously conveyed once and then one sheet is conveyed once. The substrate that has been transported and then unloaded from the first segment R1 is transported to the second segment R2. In this case, rhythm conveyance is realized.

  In the first embodiment, the delivery of the substrate W between the central robot CR, the relay unit 50, the front surface cleaning processing unit 11, and the back surface cleaning processing unit 12 has been mainly described. However, the present invention is also applicable to the case where the indexer robot IR transfers the carrier C or the relay unit 50 and the substrate W. Further, in the first embodiment, the schedule creation program P1 creates the operation schedules of the indexer robot IR and the center robot CR and the schedule data SD, but these are created by the control circuit having the same function as the schedule creation program P1. May be.

  In the first embodiment, the scrub cleaning processing apparatus is used as an example of the substrate processing apparatus 1 to describe the configuration for creating a schedule. However, the substrate processing apparatus 1 according to the present invention is not limited to the scrub cleaning processing apparatus, and brush cleaning may be performed. It can be used for various substrate processing apparatuses such as a single-wafer substrate cleaning apparatus, a cooling processing apparatus, and a drying processing apparatus which are not accompanied by this.

1 substrate processing apparatus 2 indexer section 3 processing section (processing section)
4 carrier holding section 6b, 6c, 7b, 7c, 13b, 14b, 15b, 16b hand 11 front surface cleaning processing section 12 back surface cleaning processing section 60 control section (schedule creation device)
CR center robot (transportation means)
P0 processing program P1 schedule creation program PASS substrate platform RT1 reversing unit RT2 reversing delivery unit SS (SS1 to SS8) front surface cleaning processing unit SSR (SSR1 to SSR8) back surface cleaning processing unit

Claims (11)

A relay unit, a center robot capable of unloading a substrate from the relay unit or loading a substrate into the relay unit, and a plurality of processing units capable of loading and unloading the substrate by the center robot. A substrate transfer method in a substrate processing apparatus, comprising:
(a) a step of specifying the number of substrates that the relay section can simultaneously hold,
(b) determining the number of substrates that the center robot can transfer simultaneously,
(c) Determining the number of processing units that can perform parallel processing among the plurality of processing units based on information of a flow recipe that determines the transport content of each substrate inside the substrate processing apparatus When,
(d) Based on the number of substrates specified in the step (a), the number of substrates determined in the step (b), and the number of processing units determined in the step (c), An operation schedule of the center robot so that the substrate transfer cycle by the center robot and the cycle of the timing of starting the substrate processing in the number of processing units determined in the step (c) proceed in synchronization with each other; Creating a schedule data integrating the substrate processing schedule in each of the processing units;
(e) according to said schedule data, have a, and performing a substrate processing operation throughout delivery operation, and the substrate processing apparatus of the substrate and the center robot and the relay unit and the plurality of processing units,
The substrate transfer cycle includes a first operation in which the center robot transfers a smaller number of substrates to the plurality of processing units than the number of substrates determined in the step (b).
A substrate transfer method , wherein the first operation is repeatedly executed in the substrate transfer cycle .   The substrate transfer method according to claim 1, wherein the relay unit includes a relay unit including a plurality of substrate mounting units, a reversal unit, and a reversal transfer unit.   The center robot takes out the substrates from the relay unit when a number of substrates less than the number of substrates determined in the step (b) are placed on the relay unit. 2. The substrate transfer method described in 2. The substrate transfer cycle, further comprising the operation of a number of sheets of substrates of the substrate determined in the step (b) is the center robot conveys the plurality of processing units, according to claim 1 or claim 2 Substrate transfer method. In the substrate transfer cycle, when it is determined in the step (b) that the center robot can transfer a plurality of substrates at the same time , one substrate is directed by the center robot to the plurality of processing units. The substrate transfer method according to claim 4, including an operation of repeatedly transferring the substrate. A relay unit, a center robot capable of unloading a substrate from the relay unit or loading a substrate into the relay unit, and a plurality of processing units capable of loading and unloading the substrate by the center robot. A substrate transfer method in a substrate processing apparatus, comprising:
(a) a step of specifying the number of substrates that the relay section can simultaneously hold,
(b) determining the number of substrates that the center robot can transfer simultaneously,
(c) Determining the number of processing units that can perform parallel processing among the plurality of processing units based on information of a flow recipe that determines the transport content of each substrate inside the substrate processing apparatus When,
(d) Based on the number of substrates specified in the step (a), the number of substrates determined in the step (b), and the number of processing units determined in the step (c), An operation schedule of the center robot so that the substrate transfer cycle by the center robot and the cycle of the timing of starting the substrate processing in the number of processing units determined in the step (c) proceed in synchronization with each other; Creating a schedule data integrating the substrate processing schedule in each of the processing units;
(e) a step of performing a substrate transfer operation between the relay unit and the plurality of processing units and the center robot according to the schedule data, and a substrate processing operation through the entire substrate processing apparatus,
When the substrate transfer cycle by the central robot and the cycle of the timing of starting the substrate processing in the number of processing units determined in the step (c) proceed in synchronization, one cycle by the central robot is performed. Since the time required for the substrate transfer cycle is longer than the processing time in one processing unit of the plurality of processing units, a waiting time is generated on the side of the one processing unit, and a transfer rate-controlled state, and the center Both the process-controlled state in which the time required for one substrate transfer cycle by the robot is shorter than the processing time in the one processing unit and a waiting time occurs on the side of the central robot may occur. It occurs not, board transfer method. The indexer robot, a relay unit for transferring the substrate by the indexer robot, a center robot capable of unloading the substrate from the relay unit or loading the substrate into the relay unit, and the center robot loading and unloading the substrate. A substrate transfer method in a substrate processing apparatus having a plurality of processing units capable of being carried out,
(a) a step of specifying the number of substrates that the indexer robot can simultaneously carry,
(b) a step of specifying the number of substrates that can be simultaneously held by the relay section,
(c) determining the number of substrates that the center robot can transfer at the same time;
(d) Determining the number of processing units that can perform parallel processing among the plurality of processing units based on information of a flow recipe that determines the transport content of each substrate inside the substrate processing apparatus When,
(e) the number of substrates identified in step (a), the number of substrates identified in step (b), the number of substrates determined in step (c), and the step (d) On the basis of the number of processing units determined in step 1, the substrate transfer cycle by the center robot and the cycle of the timing of starting the substrate processing in the number of processing units determined in step (d) proceed in synchronization. As described above, a step of creating schedule data in which the operation schedules of the indexer robot and the center robot and the substrate processing schedule in each of the processing units are integrated,
(f) According to the schedule data, the substrate transfer operation between the relay section and the indexer robot, the substrate transfer operation between the relay section and the plurality of processing units and the center robot, and the entire substrate processing apparatus. possess and performing a substrate processing operation, and
When the substrate transfer cycle by the center robot and the cycle of the timing of starting the substrate processing in the number of processing units determined in the step (d) proceed in synchronization with each other, one cycle is performed by the center robot. Since the time required for the substrate transfer cycle is longer than the processing time in one processing unit of the plurality of processing units, a waiting time is generated on the side of the one processing unit, and a transfer rate-controlled state, and the center Both the process-controlled state in which the time required for one substrate transfer cycle by the robot is shorter than the processing time in the one processing unit and a waiting time occurs on the side of the central robot may occur. A substrate transfer method that does not occur .   The substrate transfer method according to claim 7, wherein the relay unit includes a relay unit including a plurality of substrate mounting units, a reversal unit, and a reversal transfer unit. The indexer robot places a smaller number of substrates on the relay unit than the number of substrates determined in the step (c).
8. The center robot takes out the substrates from the relay unit when a number of substrates less than the number of substrates determined in the step (c) are placed on the relay unit. 8. The substrate transfer method according to item 8. The substrate transfer cycle includes a first operation in which the center robot transfers a smaller number of substrates than the number of substrates determined in the step (c) toward the plurality of processing units,
The substrate transfer method according to claim 7 , wherein the first operation is repeatedly executed in the substrate transfer cycle. The indexer robot, a relay unit for transferring the substrate by the indexer robot, a center robot capable of unloading the substrate from the relay unit or loading the substrate into the relay unit, and the center robot loading and unloading the substrate. A substrate transfer method in a substrate processing apparatus having a plurality of processing units capable of being carried out,
(a) a step of specifying the number of substrates that the indexer robot can simultaneously carry,
(b) a step of specifying the number of substrates that can be simultaneously held by the relay section,
(c) determining the number of substrates that the center robot can transfer at the same time;
(d) Determining the number of processing units that can perform parallel processing among the plurality of processing units based on information of a flow recipe that determines the transport content of each substrate inside the substrate processing apparatus When,
(e) the number of substrates identified in step (a), the number of substrates identified in step (b), the number of substrates determined in step (c), and the step (d) On the basis of the number of processing units determined in step 1, the substrate transfer cycle by the center robot and the cycle of the timing of starting the substrate processing in the number of processing units determined in step (d) proceed in synchronization. As described above, a step of creating schedule data in which the operation schedules of the indexer robot and the center robot and the substrate processing schedule in each of the processing units are integrated,
(f) According to the schedule data, the substrate transfer operation between the relay section and the indexer robot, the substrate transfer operation between the relay section and the plurality of processing units and the center robot, and the entire substrate processing apparatus. And a step of performing the substrate processing operation of
The substrate transfer cycle, seen including a second operation in which the substrate of the number smaller than the number of substrates that are specific in the step (a) is placed on the relay portion by the indexer robot,
A substrate transfer method , wherein the second operation is repeatedly executed in the substrate transfer cycle .

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