WO2020054182A1 - Substrate processing device and substrate processing method - Google Patents

Substrate processing device and substrate processing method Download PDF

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Publication number
WO2020054182A1
WO2020054182A1 PCT/JP2019/025957 JP2019025957W WO2020054182A1 WO 2020054182 A1 WO2020054182 A1 WO 2020054182A1 JP 2019025957 W JP2019025957 W JP 2019025957W WO 2020054182 A1 WO2020054182 A1 WO 2020054182A1
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Prior art keywords
substrate
unit
slot
reversing
processing
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PCT/JP2019/025957
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French (fr)
Japanese (ja)
Inventor
慎司 山本
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Priority to CN201980047542.5A priority Critical patent/CN112437977B/en
Priority to KR1020217006649A priority patent/KR102449001B1/en
Publication of WO2020054182A1 publication Critical patent/WO2020054182A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Definitions

  • the present invention relates to a substrate processing apparatus and a substrate processing method.
  • a substrate processing apparatus that performs various processes on a semiconductor substrate (hereinafter, simply referred to as “substrate”) has been used.
  • substrate a substrate processing apparatus that performs various processes on a semiconductor substrate
  • the substrate processing apparatus disclosed in Japanese Patent No. 4744426 Document 1
  • the front surface and the back surface of the substrate are reversed in the reversing unit, and the back surface is cleaned in the back surface cleaning unit.
  • two reversing units are provided between the indexer robot and the main robot, the first reversing unit is used when transferring a substrate before processing, and the second reversing unit is used. It is used at the time of delivery of a substrate after processing. This prevents the processed substrate from being contaminated by the unprocessed substrate when the substrate is delivered.
  • a plurality of storage blocks are provided in a carry-in substrate container with a plurality of storage positions adjacent to each other as a storage block, and the processed substrate is placed in the carry-in substrate container.
  • a method is disclosed in which, when a substrate is carried in, a substrate storage position corresponding to the same process job is used as a common storage block. Also disclosed is a method of preventing a substrate having a low degree of cleanness from being accommodated above a substrate having a high degree of cleanliness, thereby suppressing substrate contamination due to dust falling.
  • the substrate before processing is reversed using only one reversing unit.
  • the cleaning unit it is conceivable to use two reversing units.
  • dust of the substrate before processing is processed through the reversing unit. And may contaminate the processed substrate.
  • the present invention is directed to a substrate processing apparatus, and an object of the present invention is to efficiently process a plurality of substrates while suppressing contamination of a processed substrate.
  • a substrate processing apparatus includes: a container mounting unit on which a storage container that stores a plurality of substrates is mounted; a processing unit including a plurality of processing units each performing a process on a substrate; A first reversing unit disposed between the mounting unit and the processing unit and reversing the substrate, a second reversing unit disposed between the container mounting unit and the processing unit and reversing the substrate, A container-side transfer unit that transfers a substrate between a storage container and the first and second reversing units; and a processing unit side that transfers a substrate between the first and second reversal units and the plurality of processing units.
  • the unprocessed substrate in the storage container is moved to the first or second substrate.
  • a control unit that reverses the substrate processed by the unit in the first or second reversing unit and returns the substrate to the inside of the storage container.
  • a sending slot in which a substrate is inserted, an intake slot in which a substrate processed by the processing unit is inserted by the processing unit side transport unit, and the sending slot and the intake slot are integrally inverted.
  • the control unit controls the transmission slot and the The board is not inserted into the take-in slot, and the first or second inverting portion in the take-up posture is the sending posture, and the first or second inverting portion in the sending posture is The unprocessed substrate is inserted into the delivery slot by the container-side transfer unit.
  • the substrate in the high operation state, is not inserted into the sending slot and the intake slot of one of the first and second reversing sections, and
  • the control unit sends the one reversing unit to the sending slot. Posture.
  • the sending slot in the sending posture of each of the reversing parts, is located below the intake slot, or in the taking posture of each of the inverting parts, the taking slot Is located above the delivery slot.
  • the sending slot in the sending posture of each of the inverting portions, the sending slot is located below the take-in slot, and each of the inverting portions is in a state where an unprocessed substrate is inserted into the sending slot.
  • the taking-in posture after the unprocessed substrate in the sending slot is taken out by the processing unit-side transport unit, a processed substrate is inserted into the taking-in slot, or
  • the capturing slot is located above the sending slot, and each of the reversing parts is in the state where the processed substrate is inserted in the capturing slot and the sending posture.
  • it is preferable that an unprocessed substrate is inserted into the delivery slot after the processed substrate in the intake slot is taken out by the container-side transport unit.
  • the reversing operation by the reversing mechanism is prohibited in a state where the substrate is in both the sending slot and the taking-in slot.
  • each of the plurality of substrates has a pattern surface on which a pattern is formed, and a back surface opposite to the pattern surface. Each is held with the pattern surface facing upward, and processing is performed on the back surface of the substrate in the plurality of processing units.
  • the present invention is also directed to a substrate processing method in a substrate processing apparatus.
  • the substrate processing apparatus includes a container mounting portion on which a storage container for storing a plurality of substrates is mounted, and a plurality of processing units each performing a process on the substrate.
  • each of the reversing sections includes a delivery slot into which an unprocessed substrate in the storage container is inserted by the container-side transport section, and the processing section by the processor-side transport section.
  • the substrate processing method comprises the steps of: Inserting an unprocessed substrate in a storage container into the delivery slot of any of the reversing portions in the delivery position; b) reversing the substrate with the reversing portion in the taking position; A step of transporting the substrate from the reversing section to any of the processing sections by a processing section side transport section; a step of performing processing on the substrate in the processing section; Inserting the processed substrate into the take-in slot of one of the reversing units in the taking-up posture by the processing unit-side transfer unit; and f) reversing the substrate with the reversing unit as the sending-out posture.
  • the substrate In the high operation state in which the substrate is present in the storage container, the substrate is not inserted in the sending slot and the intake slot, and the first or second reversing unit in the intake posture is A step of setting a sending posture; i) inserting the unprocessed substrate into the delivery slot of the first or second reversing unit in the delivery posture in the delivery posture by the container-side transport unit.
  • FIG. 2 is a diagram illustrating a configuration of a substrate processing apparatus.
  • FIG. 4 is a diagram illustrating first and second reversing units and a center robot. It is a figure showing composition of an inversion part.
  • FIG. 3 is a diagram illustrating a configuration of a center robot.
  • FIG. 3 is a block diagram illustrating a functional configuration of a control unit. It is a figure showing the flow of back side processing operation. It is a figure showing the flow which processes a plurality of substrates. It is a figure showing a time chart in a substrate processing device.
  • FIG. 7 is a diagram illustrating operations of first and second inversion units. It is a figure showing a time chart in a substrate processing device.
  • FIG. 9 is a diagram illustrating a time chart in the substrate processing apparatus of the comparative example.
  • FIG. 9 is a diagram illustrating an operation of a reversing unit in the substrate processing apparatus of the comparative example. It is a figure showing operation of other examples of the 1st and 2nd inversion parts. It is a figure showing operation of other examples of the 1st and 2nd inversion parts.
  • FIG. 1 is a diagram showing a configuration of a substrate processing apparatus 1 according to one embodiment of the present invention.
  • three directions orthogonal to each other are shown as an X direction, a Y direction, and a Z direction.
  • the Z direction is a vertical direction (vertical direction)
  • the X direction and the Y direction are horizontal directions.
  • the substrate processing apparatus 1 is a single-wafer processing apparatus that processes the disk-shaped substrates 9 one by one in a processing unit 61 described below.
  • the substrate 9 has one main surface (hereinafter, referred to as a “pattern surface”) that is a device formation surface and another main surface (hereinafter, “back surface”) that is a device non-formation surface.
  • the pattern of the device being manufactured is formed on the pattern surface.
  • the back surface is a surface opposite to the pattern surface.
  • the processing unit 61 performs a processing using a processing liquid or the like on the rear surface of the substrate 9 held with the rear surface facing upward.
  • the substrate processing apparatus 1 includes the container mounting section 2, the indexer robot 3, the first and second reversing sections 41a and 41b, the center robot 5, the processing unit 6, and the control unit 7.
  • the control unit 7 is, for example, a computer including a CPU and the like, and performs overall control of the substrate processing apparatus 1. The function of the control unit 7 will be described later.
  • the container placement unit 2, the indexer robot 3, the first and second reversing units 41a and 41b, and the center robot 5 are arranged in this order in the Y direction.
  • a plurality of processing units 61 described later in the processing unit 6 are arranged around the center robot 5.
  • the container mounting part 2 has a plurality of container mounting tables 21.
  • the plurality of container mounting tables 21 are arranged in the X direction.
  • a storage container C for storing a plurality of substrates 9 is mounted on each container mounting table 21.
  • the storage container C is a carrier that stores the plurality of substrates 9 in multiple stages. In the storage container C, the plurality of substrates 9 are stored with the pattern surface facing upward.
  • the indexer robot 3 is a container-side transfer unit (or a container-side transfer device) that transfers the substrate 9 between the storage container C and the first and second reversing units 41a and 41b.
  • the indexer robot 3 is disposed between the container placement unit 2 and the first and second reversing units 41a and 41b.
  • the indexer robot 3 includes a moving unit 35.
  • the moving unit 35 is movable in the X direction, and is rotatable about an axis parallel to the vertical direction (Z direction).
  • the moving unit 35 can move up and down.
  • the indexer robot 3 further includes one hand group 310.
  • the hand group 310 is connected to the moving unit 35 via the articulated arm 33.
  • the articulated arm 33 moves the hand group 310 horizontally while maintaining the hand group 310 in a constant posture.
  • the hand group 310 has two hands 31.
  • the two hands 31 are provided side by side in the vertical direction.
  • Each hand 31 is provided with two holding units.
  • the two holding units are provided side by side in the up-down direction.
  • Each holding portion contacts the outer peripheral edge of the back surface of the substrate 9 facing downward, and holds the substrate 9.
  • a motor or the like is used as a drive source.
  • the hand 31 arranged on the upper side and the hand 31 arranged on the lower side are referred to as an “upper hand 31” and a “lower hand 31”, respectively.
  • the upper and lower holding units are referred to as “upper holding unit” and “lower holding unit”, respectively.
  • the substrate 9 held by the upper holder does not contact the lower holder, and the substrate 9 held by the lower holder does not contact the upper holder.
  • the above structure of the indexer robot 3 is merely an example, and may be appropriately changed.
  • the articulated arms 33 may be individually provided for the two hands 31.
  • FIG. 2 is a view showing the substrate processing apparatus 1 viewed from the (+ Y) side in the ( ⁇ Y) direction, and shows the first and second reversing units 41 a and 41 b and the center robot 5.
  • the first and second reversing units 41a and 41b are arranged between the indexer robot 3, the center robot 5, and the processing unit 6.
  • the first reversing unit 41a is disposed above the second reversing unit 41b.
  • the above-described indexer robot 3 can access both the first and second reversing units 41a and 41b.
  • the first and second reversing sections 41a and 41b have the same structure as each other.
  • first and second reversing sections 41a and 41b do not necessarily have to be lined up and down.
  • first and second reversing units 41a and 41b are simply referred to as “reversing unit 41”.
  • FIG. 3 is a diagram showing the configuration of the reversing unit 41.
  • the reversing section 41 includes a plurality of slots 42 and 43, a slot support section 44, and a reversing mechanism 45.
  • Each of the slots 42 and 43 is a substrate holding unit that can hold the substrate 9 in a horizontal state. In each of the slots 42 and 43, the substrate 9 can be held and released using a motor, an air cylinder, or the like.
  • four slots 42 and 43 are provided. Of the four slots 42, 43, two slots 42 are arranged vertically adjacent to each other, and the remaining slots 43 are arranged vertically adjacent to each other.
  • sending slots 42 the two slots 42 arranged on the lower side
  • the two slots 43 arranged on the upper side are referred to as “intake slots 43”. The difference between the sending slot 42 and the receiving slot 43 will be described later.
  • the slot support 44 is a frame-like member that integrally supports the two sending slots 42 and the two taking slots 43. In the slot support portion 44, both sides in the Y direction are open.
  • the indexer robot 3 can access the sending slot 42 and the taking slot 43 from the opening on the ( ⁇ Y) side of the slot supporting section 44.
  • the center robot 5 can access the sending slot 42 and the receiving slot 43 from the opening on the (+ Y) side of the slot support 44.
  • the reversing mechanism 45 has, for example, a motor, and rotates the slot support 44 by 180 degrees about an axis parallel to the X direction. Thereby, the two sending slots 42 and the two taking slots 43 are integrally inverted, and the substrate 9 held in the sending slot 42 or the taking slot 43 is also inverted.
  • the reversing operation is repeated according to a command from the control unit 7.
  • sending posture the posture shown in FIG. 3 in which the sending slot 42 is arranged below the receiving slot 43
  • acquisition posture the posture shown in which the sending slot 42 is arranged below the sending slot 42.
  • acquisition posture the posture shown in which the sending slot 42 is arranged below the receiving slot 43
  • acquisition posture the posture shown in which the sending slot 42 is arranged below the sending slot 42.
  • acquisition posture the posture to be arranged
  • the reversing operation by the reversing mechanism 45 is prohibited when the substrate 9 is in both the sending slot 42 and the taking slot 43.
  • the above structure of the reversing unit 41 may be changed as appropriate.
  • the center robot 5 shown in FIG. 1 is a processing unit-side transfer unit (or a processing unit-side transfer device) that transfers the substrate 9 between the first and second reversing units 41a and 41b and the plurality of processing units 61. .
  • the center robot 5 is disposed on the (+ Y) side of the first and second reversing units 41a and 41b.
  • FIG. 4 is a diagram illustrating a configuration of the center robot 5.
  • the center robot 5 includes a base unit 56 and a vertically rotating unit 55.
  • the elevating / lowering rotating unit 55 is rotatable about an axis parallel to the up-down direction with respect to the base unit 56, and is able to move up and down in the up-down direction.
  • the center robot 5 further includes two hand groups 510.
  • One hand group 510 is arranged above the other hand group 510.
  • Each hand group 510 is connected to the lifting / lowering rotating unit 55 via the articulated arm 53.
  • the two articulated arms 53 are driven independently of each other by a drive mechanism (not shown), and move the hand group 510 in the horizontal direction while maintaining a constant posture.
  • Each hand group 510 has two hands 51.
  • the two hands 51 are provided side by side in the vertical direction.
  • the substrate 9 is inverted, and each hand 51 contacts the outer peripheral edge of the pattern surface facing the lower side of the substrate 9 to hold the substrate 9 in place. Hold.
  • a motor or the like is used as a drive source.
  • the upper hand group 510 and the lower hand group 510 are referred to as an “upper hand group 510” and a “lower hand group 510,” respectively.
  • the hand 51 disposed on the upper side and the hand 51 disposed on the lower side are referred to as an “upper hand 51” and a “lower hand 51”, respectively.
  • the substrate 9 held by the upper hand 51 does not contact the lower hand 51, and the substrate 9 held by the lower hand 51 does not contact the upper hand 51.
  • the above structure of the center robot 5 is merely an example, and may be appropriately changed.
  • articulated arms 53 may be individually provided for four hands 51.
  • the processing unit 6 shown in FIG. 1 has a plurality of processing units 61.
  • each processing unit 61 the substrate 9 carried in by the center robot 5 is held in a horizontal state by the chuck unit.
  • the chuck rotates together with the substrate 9 as needed.
  • a processing liquid is supplied from a nozzle toward a main surface facing upward of the substrate 9, and the main surface is processed with the processing liquid.
  • the processing with the processing gas may be performed on the substrate 9.
  • four processing units 61 stacked vertically are provided as a stacking unit 62, and as shown in FIG.
  • the stacking unit 62 is arranged.
  • the above configuration of the processing unit 6 is merely an example, and the number and arrangement of the processing units 61 provided in the processing unit 6 may be appropriately changed.
  • FIG. 5 is a block diagram showing a functional configuration of the control unit 7.
  • the control unit 7 includes a control unit 71, an input / output unit 72, and a storage unit 73.
  • the input / output unit 72 receives an input from the operator and notifies the operator of the input / output by displaying it on a display or the like.
  • the storage unit 73 stores various information.
  • the control unit 71 includes a scheduling unit 711 and a processing command unit 712.
  • the scheduling unit 711 performs the indexer robot 3, the center robot 5, the first reversing unit 41a, the second reversing unit 41b, and the plurality of processing units 61 on the plurality of substrates 9 to be processed based on the input from the operator. Plan the timing of the operation in.
  • the processing command unit 712 outputs a command signal to the indexer robot 3, the center robot 5, the first reversing unit 41a, the second reversing unit 41b, and the plurality of processing units 61 according to the operation timing planned by the scheduling unit 711. At the same time, a completion response and the like from these are received.
  • the operations of the indexer robot 3, the center robot 5, the first reversing unit 41 a, the second reversing unit 41 b, and the plurality of processing units 61 are controlled by the control unit 71.
  • FIG. 6 is a diagram showing a flow of the back surface processing operation.
  • the back surface processing operation is a series of operations for performing processing by the processing unit 61 on the back surface of the substrate 9.
  • the back surface processing operation will be described by focusing on one substrate 9 (hereinafter, referred to as “target substrate 9”).
  • target substrate 9 the back surface processing operations on the plurality of substrates 9 are performed in parallel with each other based on the operation timing planned by the scheduling unit 711.
  • the back surface processing operations on the plurality of substrates 9 will be described later.
  • the processing command unit 712 confirms which of the first and second reversing units 41a and 41b is to be used for reversing the unprocessed target substrate 9.
  • the first reversing unit 41a is used (Step S11)
  • the target substrate 9 (unprocessed substrate 9) in the storage container C is taken out by the indexer robot 3 and inserted into the sending slot 42 of the first reversing unit 41a. Is performed (step S12a).
  • the first reversing part 41a is in the sending posture in which the sending slot 42 is located on the lower side.
  • the slot supporting section 44 is reversed.
  • the first reversing unit 41a assumes the taking posture in which the sending slot 42 is located on the upper side, and the substrate 9 of interest is reversed (step S13a).
  • the target substrate 9 is stored with the pattern surface facing upward, and the rear surface of the inverted target substrate 9 faces upward.
  • the center robot 5 takes out the board 9 of interest in the sending slot 42 and carries it into one of the processing units 61 (step S14a). Then, the processing unit 61 performs a process using a processing liquid or the like on the rear surface facing upward (step S15).
  • the indexer robot 3 moves the target substrate 9 in the storage container C to the sending slot 42 of the second inverting unit 41b. (Step S12b).
  • the second reversing part 41b is in the sending posture in which the sending slot 42 is located on the lower side.
  • the slot supporting section 44 is reversed.
  • the second reversing unit 41b is brought into the taking posture in which the sending slot 42 is located on the upper side, and the target substrate 9 is reversed (step S13b).
  • the board 9 of interest in the sending slot 42 is taken out by the center robot 5 and carried into one of the processing units 61 (step S14b). Then, the processing unit 61 performs a process using a processing liquid or the like on the rear surface facing upward (step S15).
  • the processing command section 712 confirms which of the first and second reversing sections 41a and 41b is to be used for reversing the processed target substrate 9.
  • the first reversing unit 41a is used (step S16)
  • the target substrate 9 (the processed substrate 9) in the processing unit 61 is taken out by the center robot 5, and is taken into the taking-in slot 43 of the first reversing unit 41a. It is inserted (step S17a).
  • the first reversing portion 41a is in the taking posture in which the taking slot 43 is located on the lower side.
  • the slot supporting section 44 is reversed.
  • the first reversing unit 41a assumes the sending posture in which the intake slot 43 is positioned on the upper side, and the substrate 9 of interest is reversed (step S18a).
  • the pattern formation surface faces upward.
  • the target substrate 9 in the take-in slot 43 is taken out by the indexer robot 3 and returned into the storage container C (step S19a). Note that the target substrate 9 may be returned to a storage container C different from the storage container C that has been stored at the time of unprocessing.
  • step S16 when the processing command unit 712 confirms that the second inversion unit 41b is to be used, the center robot 5 takes out the target substrate 9 in the processing unit 61 and takes out the second inversion unit 41b. It is inserted into the insertion slot 43 (step S17b). At this time, the second reversing part 41b is in the taking posture in which the taking slot 43 is located on the lower side. In the second reversing section 41b, the slot supporting section 44 is reversed. Thereby, the second reversing unit 41b assumes the sending posture in which the intake slot 43 is located on the upper side, and the substrate 9 of interest is reversed (step S18b). The target substrate 9 in the take-in slot 43 is taken out by the indexer robot 3 and returned into the storage container C (step S19b).
  • one of the first and second reversing units 41a and 41b is selected in principle such that the target substrate 9 in the storage container C can be transported earlier by the processing unit 61. .
  • the indexer robot 3 inserts the substrate 9 into the sending slot 42 of the sending posture reversing units 41a and 41b. Therefore, for example, the first reversing part 41a is in the sending posture, the board 9 is not inserted into the sending slot 42, the second reversing part 41b is in the taking posture, and the board is placed in the taking slot 43. In a state where 9 is not inserted, the first reversing unit 41a is selected. This allows the indexer robot 3 to insert the substrate 9 into the sending slot 42 immediately.
  • the first reversing part 41a is in the sending posture, the substrate 9 is inserted in the sending slot 42, the second reversing part 41b is in the taking posture, and the substrate 9 is inserted in the taking slot 43.
  • the second inverting unit 41b is selected.
  • the indexer robot 3 can insert the substrate 9 into the sending slot 42 if only the reversing operation of the second reversing unit 41b is waited.
  • the scheduling unit 711 selects one of the first and second reversing units 41a and 41b so that, in principle, the target substrate 9 in the processing unit 61 can be transported to the storage container C earlier. .
  • the center robot 5 inserts the substrate 9 into the intake slot 43 of the reversing portion 41a, 41b of the intake posture. Therefore, for example, the first reversing part 41a is in the sending posture, the board 9 is not inserted into the sending slot 42, the second reversing part 41b is in the taking posture, and the board is placed in the taking slot 43. In a state where 9 is not inserted, the second inverting unit 41b is selected. Thus, the center robot 5 can immediately insert the substrate 9 into the take-in slot 43.
  • the units 41a and 41b are selected.
  • the back surface processing operation is performed on the plurality of substrates 9 to be processed (Step S21).
  • the back surface processing operation is performed on another unprocessed substrate 9 in the storage container C while partially paralleling the back surface processing operation on one substrate 9.
  • the substrates 9 are processed in all the processing units 61, and the unprocessed substrates 9 to be transported to the processing units 61 after the completion of the processing in any one of the processing units 61 are stored in the storage container C.
  • the idle inversion of the first or second inversion unit 41a, 41b is performed when a predetermined idle inversion condition is satisfied (step S22).
  • Step S23 the processing of the plurality of substrates 9 in the substrate processing apparatus 1 is completed (Step S23).
  • FIG. 8 is a diagram showing a time chart in the substrate processing apparatus 1 in a high operation state.
  • ST is the container placing section 2
  • IR is the indexer robot 3
  • RVP1 is the first reversing section 41a
  • RVP2 is the second reversing section 41b
  • CR is the center robot 5.
  • SPIN1 to SPIN6 indicate first to sixth processing units 61.
  • only six processing units 61 are shown for convenience of illustration.
  • the alphabets shown in the blocks indicate the substrates 9 to be operated in the container mounting unit 2, the indexer robot 3, the first reversing unit 41a, the second reversing unit 41b, the center robot 5, and the first to sixth processing units 61. It is for identification.
  • the arrow between ST and IR indicates the transfer of the substrate 9 between the container mounting unit 2 and the indexer robot 3, and the arrow between IR and RVP1 or RVP2 indicates the transfer between the indexer robot 3 and the first or the second.
  • 9 shows the transfer of the substrate 9 between the two reversing units 41a and 41b.
  • the arrow between RVP1 or RVP2 and CR indicates the transfer of the substrate 9 between the first or second reversing unit 41a, 41b and the center robot 5, and the arrow between CR and SPIN1 to SPIN6 indicates the center.
  • the transfer of the substrate 9 between the robot 5 and the first to sixth processing units 61 is shown.
  • RVP1 and RVP2 indicate the inversion operation in the first and second inversion units 41a and 41b.
  • PROCESS shown below the block in SPIN1 to SPIN6 indicates the start of processing in the first to sixth processing units 61.
  • FIG. 9 is a diagram showing the operation of the first and second reversing units 41a and 41b in the high operation state.
  • the numbers “1” and “2” are assigned to the two intake slots 43 of each of the reversing units 41 a and 41 b (RVP1 or RVP2), and “3” and “2” are assigned to the two sending slots 42.
  • the number “4” is assigned.
  • the sequence of slots immediately before the inversion operation is indicated by a number on the left side of an arrow A1 indicating one of the inversion operations (one arrow is denoted by the symbol A1a), and the arrangement of slots immediately after the inversion operation is on the right side of the arrow A1.
  • FIG. 9 also shows the position (holding unit or hand) where the substrate 9 is held in the indexer robot 3 and the center robot 5.
  • Up-Up shown on the right side of the IR indicates the upper holder of the upper hand 31
  • Lw-Up indicates the lower holder of the upper hand 31
  • Up-Lw indicates the upper holder of the lower hand 31
  • Lw-Lw Indicates a lower holding portion of the lower hand 31.
  • Up-Up shown on the right side of the CR indicates the upper hand 51 of the upper hand group 510
  • Up-Lw indicates the upper hand 51 of the lower hand group 510
  • Lw-Up indicates the lower hand 51 of the upper hand group 510.
  • Lw-Lw indicates the lower hand 51 of the lower hand group 510.
  • the unprocessed substrate 9 is held by the lower holding portion of the upper hand 31 or the lower hand 31, and the processed substrate 9 is held by the upper holding portion of the upper hand 31 or the lower hand 31. Is held.
  • the unprocessed substrate 9 is held by the upper hand group 510 or the lower hand group 510 by the lower hand 51, and the processed substrate 9 is processed by the upper hand group 510 or the lower hand group 510. It is held at 51.
  • the substrate 9 is carried into all the processing units 61, and the unprocessed substrate 9 to be transported to the processing unit 61 after the completion of the processing in any one of the processing units 61 is stored in the storage container C. , That is, a high operation state.
  • the unprocessed substrates 9 of “F” and “G” in the storage container C on the container mounting unit 2 are taken out by the indexer robot 3.
  • the unprocessed substrates 9 of “F” and “G” are respectively held by the lower holding unit of the upper hand 31 and the lower holding unit of the lower hand 31.
  • the unprocessed substrates 9 of “F” and “G” are inserted into the sending slots 42 of “3” and “4” of the first reversing unit 41a, respectively.
  • the “3” and “4” sending slots 42 are located on the lower side, and the first reversing unit 41a is in the sending posture.
  • the “F” and “G” unprocessed substrates 9 are reversed by the reversing operation of the first reversing unit 41a.
  • the “3” and “4” sending slots 42 are located on the upper side, and the first reversing part 41a is in the taking posture.
  • the “G” and “F” unprocessed substrates 9 in the first reversing unit 41 a are taken out by the center robot 5.
  • the unprocessed substrates 9 of “G” and “F” are held by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510, respectively. Thereafter, in the upper hand group 510, the processed substrate 9 of “a” in the first processing unit 61 is taken out by the upper hand 51, and the unprocessed substrate 9 of “G” held by the lower hand 51 is removed by the first hand.
  • the unprocessed substrate 9 of “G” is transferred into the first processing unit 61 (ie, transferred to the chuck unit in the processing unit 61).
  • the processed substrate 9 of “b” in the second processing unit 61 is taken out by the upper hand 51, and the unprocessed substrate 9 of “F” held by the lower hand 51 is removed by the second hand. It is carried into the processing section 61.
  • the center robot 5 is in a state of holding the processed substrates 9 of “a” and “b”.
  • processing is started on the unprocessed substrates 9 of "G” and "F".
  • the board 9 in the high operation state, the board 9 is not inserted into the sending slot 42 and the taking slot 43 of one of the reversing parts, and the one reversing part is in the taking posture.
  • the insertion of an unprocessed substrate into the sending slot 42 of the other inverting unit is a condition of the empty inverting of the one inverting unit.
  • the unprocessed transmission slot 42 of the second reversing unit 41b is used.
  • the substrate 9 is inserted. Therefore, the empty reversal condition of the first reversing unit 41a is satisfied, and the empty reversal of the first reversing unit 41a is performed as indicated by an arrow A1a in FIG.
  • the first reversing unit 41a assumes the sending posture.
  • empty reversal is indicated by a block B1 with a parallel oblique line inside. The operation of the first reversing unit 41a after the empty reversal will be described later.
  • the “H” and “I” unprocessed substrates 9 in the storage container C are taken out.
  • the unprocessed substrates 9 of “H” and “I” are respectively held by the lower holding unit of the upper hand 31 and the lower holding unit of the lower hand 31.
  • the “H” and “I” unprocessed substrates 9 are inserted into the “3” and “4” transmission slots 42 of the second reversing unit 41b, respectively.
  • the “3” and “4” sending slots 42 are located on the lower side, and the second reversing unit 41b is in the sending posture.
  • the “H” and “I” unprocessed substrates 9 are inverted by the inversion operation of the second inversion unit 41b.
  • the “3” and “4” sending slots 42 are located on the upper side, and the second reversing part 41b is in the taking posture.
  • the unprocessed substrates 9 of “I” and “H” of the second reversing unit 41b are held and taken out by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510 of the center robot 5, respectively.
  • the center robot 5 holds the processed substrates 9 of “a” and “b” by the upper hand 51 of the upper hand group 510 and the upper hand 51 of the lower hand group 510.
  • the processed substrates 9 of “a” and “b” are inserted into the “2” and “1” capture slots 43 in the second reversing portion 41b in the capture posture, respectively.
  • the exchange between the two unprocessed substrates 9 and the two processed substrates 9 (hereinafter, simply referred to as “substrate exchange”) is performed between the center robot 5 and the second reversing unit 41b. .
  • the processed substrates 9 of “a” and “b” and the unprocessed substrates 9 of “I” and “H” are temporarily held simultaneously. 9 are also held by the upper hand 51, and any unprocessed substrates 9 are held by the lower hand 51. Therefore, the processed substrate 9 is not contaminated by dust falling from the unprocessed substrate 9. Further, dust of the unprocessed substrate 9 is prevented from adhering to the processed substrate 9 via the hand 51. Further, in the second reversing section 41b, the processed substrate 9 is inserted into the lower intake slot 43, but the unprocessed substrate 9 is taken out from the sending slot 42 before the processed substrate 9 is inserted. Therefore, the processed substrate 9 in the intake slot 43 is not contaminated by the fall of dust from the unprocessed substrate 9 in the sending slot 42.
  • the processed substrates 9 of “a” and “b” are inverted by the inversion operation of the second inversion unit 41b.
  • the “1” and “2” intake slots 43 are located on the upper side, and the second reversing unit 41b is in the sending posture.
  • the processed substrate 9 of “c” in the third processing unit 61 is taken out, and the unprocessed substrate 9 of “I” is carried into the third processing unit 61.
  • the “d” processed substrate 9 in the fourth processing unit 61 is taken out, and the “H” unprocessed substrate 9 is carried into the fourth processing unit 61.
  • the center robot 5 is in a state of holding the processed substrates 9 of “c” and “d”.
  • processing is started on the unprocessed substrates 9 of "I” and "H”.
  • unprocessed substrates 9 of "J” and “K” in the storage container C are taken out in parallel with the substrate exchange between the center robot 5 and the second reversing section 41b.
  • the unprocessed substrates 9 of “J” and “K” are respectively inserted into the “3” and “4” transmission slots 42 of the first reversing unit 41a that has been in the transmission posture due to the empty reversal.
  • the unprocessed substrates 9 of “J” and “K” are reversed, and the first reversing unit 41a is in the taking posture.
  • the unprocessed substrates 9 of “K” and “J” of the first reversing unit 41a are held and taken out by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510 of the center robot 5, respectively.
  • the center robot 5 holds the processed substrates 9 of “c” and “d” by the upper hand 51 of the upper hand group 510 and the upper hand 51 of the lower hand group 510.
  • the processed substrates 9 of “c” and “d” are inserted into the “2” and “1” capture slots 43 in the first reversing portion 41a in the capture posture, respectively.
  • the exchange between the two unprocessed substrates 9 and the two processed substrates 9 is performed between the center robot 5 and the first reversing unit 41a.
  • the substrate exchange here can be performed by emptying the first reversing unit 41a and putting two unprocessed substrates 9 into the first reversing unit 41a.
  • the center robot 5 is accessing the third and fourth processing units 61, the above-described reversing operation of the first reversing unit 41a (reversing operation of the unprocessed substrates 9 of “J” and “K”) is performed. Therefore, the center robot 5 can exchange the board with the first reversing unit 41a without an excessive waiting time.
  • the second reversing unit 41b the reversal of the processed substrates 9 of “a” and “b” in the intake slot 43 has been completed, and the second reversing unit 41b is in the sending posture.
  • the “L” and “M” unprocessed substrates 9 in the storage container C are respectively held by the lower holding part of the upper hand 31 and the lower holding part of the lower hand 31 of the indexer robot 3, and the second attitude of the sending posture is maintained. They are inserted into the “3” and “4” transmission slots 42 of the reversing unit 41b, respectively.
  • the processed substrates 9 of “b” and “a” in the intake slots 43 of “1” and “2” are held by the upper holding unit of the upper hand 31 and the upper holding unit of the lower hand 31. Is returned to the storage container C. In this way, the exchange between the two unprocessed substrates 9 and the two processed substrates 9 (that is, substrate exchange) is performed between the indexer robot 3 and the second reversing unit 41b.
  • the processed substrates 9 of “b” and “a” and the unprocessed substrates 9 of “L” and “M” are temporarily held at the same time, but are located on the upper side.
  • the processed substrate 9 is held in the intake slot 43, and the unprocessed substrate 9 is held in the lower sending slot 42. Therefore, the processed substrate 9 is not contaminated by the drop of dust from the unprocessed substrate 9 (similarly in the first reversing section 41a).
  • the unprocessed substrate 9 is inserted into the sending slot 42, and the processed substrate 9 is inserted into the intake slot 43. Therefore, the dust of the unprocessed substrate 9 is prevented from adhering to the processed substrate 9 via the slot. Subsequent operations on the unprocessed substrates 9 of “L” and “M” are the same as those of the unprocessed substrate 9 described above, and a description thereof will be omitted.
  • the processed substrates 9 of “c” and “d” in the intake slot 43 are reversed, and the first reversing unit 41a is in the sending posture. I have.
  • the indexer robot 3 the “N” and “O” unprocessed substrates 9 in the storage container C are inserted into the two sending slots 42 of the first reversing part 41a, respectively.
  • the indexer robot 3 performs the above inversion operation (“c” and “d”) of the first inversion unit 41a.
  • the indexer robot 3 can input the unprocessed substrates 9 of “N” and “O” into the first reversing unit 41a without an excessive waiting time. It is possible. Thereafter, the processed substrates 9 of “c” and “d” in the two intake slots 43 are returned to the storage container C. In this way, the exchange between the two unprocessed substrates 9 and the two processed substrates 9 (that is, substrate exchange) is performed between the indexer robot 3 and the first reversing unit 41a. Subsequent operations on the unprocessed substrates 9 of “N” and “O” are the same as those of the unprocessed substrate 9 described above, and a description thereof will be omitted.
  • FIG. 10 is a diagram showing a time chart immediately after the start of the back surface processing operation on a plurality of substrates 9.
  • the unprocessed substrates 9 in the storage container C need to be sequentially loaded into the plurality of processing units 61.
  • the empty inversion is performed as shown in a block B2 with parallel oblique lines inside.
  • the processed substrates 9 need to be sequentially returned from the plurality of processing units 61 to the storage container C immediately before the end of the back surface processing operation on the plurality of substrates 9. Also in this case, after the processed substrate 9 is inverted in each of the reversing sections 41a and 41b, and the processed substrate 9 is taken out, the empty inversion is performed. On the other hand, the empty reversal indicated by block B1 in FIG. 8 is performed according to the empty reversal condition in the high operation state, and is performed immediately after the start of the back surface processing operation on a plurality of substrates 9 and immediately before the end. And different.
  • the idle reversal condition in the high operation state may be any condition that improves the throughput in the substrate processing apparatus 1 by performing the idle reversal of the first or second reversing unit 41a, 41b, and refer to FIG. 8 and FIG. Other than the empty inversion condition described above.
  • the idle reversal condition in the high operation state may be any condition that improves the throughput in the substrate processing apparatus 1 by performing the idle reversal of the first or second reversing unit 41a, 41b, and refer to FIG. 8 and FIG. Other than the empty inversion condition described above.
  • the empty inversion is performed.
  • both the first and second reversing units 41a and 41b do not hold the unprocessed substrate 9 and the two reversing units 41a and 41b are in the taking-up posture in the high operation state. It is preferable that one of the reversing portions 41a and 41b be idle-reversed. After the empty reversal, the unprocessed substrate 9 is inserted into the sending slot 42 of the reversing unit 41a, 41b, and the reversing unit 41a, 41b is further subjected to the reversing operation. With the substrate 9 held, the posture is taken.
  • the center robot 5 holds the unprocessed substrate 9 and accesses the processing unit 61, It is considered that the processed substrate 9 is unloaded from the processing unit 61.
  • the reversing operation in the reversing units 41a and 41b requires some time, but the first or second reversing units 41a and 41b hold the unprocessed substrate 9 while the center robot 5 accesses the processing unit 61.
  • By setting the loading posture in this state it is possible to exchange the processed substrate 9 and the unprocessed substrate 9 without an excessive waiting time.
  • the sending slot 42 and the taking slot 43 are not distinguished.
  • the unprocessed substrate 9 is inserted into the lower two slots by the indexer robot 3, and the processed substrate 9 is inserted into the lower two slots by the center robot 5.
  • FIG. 11 is a diagram showing a time chart in the substrate processing apparatus of the comparative example
  • FIG. 12 is a diagram showing the operation of the reversing unit. 11 and 12 correspond to FIGS. 8 and 9, respectively.
  • RVP in FIGS. 11 and 12 indicates the one inversion unit.
  • the time required for the indexer robot 3 and the center robot 5 to complete the operation of the reversing unit becomes longer, and the operating rate as a whole decreases.
  • the slot into which the unprocessed substrate 9 is inserted is not distinguished from the slot into which the processed substrate 9 is inserted, so that dust of the unprocessed substrate 9 adheres to the processed substrate 9 via the slot. there is a possibility.
  • each of the reversing sections 41a and 41b includes a sending slot 42 into which the unprocessed substrate 9 is inserted and a take-in slot 43 into which the processed substrate 9 is inserted. Thereby, it is possible to prevent the dust of the unprocessed substrate 9 from adhering to the processed substrate 9 via the slot and contaminating the processed substrate 9.
  • the first or second reversing portions 41a and 41b in which the substrate 9 is not inserted into the sending slot 42 and the taking slot 43 and the taking posture is empty under predetermined conditions.
  • the sending posture is set by the inversion.
  • the unprocessed substrate 9 is inserted by the indexer robot 3 into the sending slot 42 of the reversing unit 41a, 41b in the sending posture.
  • the first or second reversing unit 41a, 41b in which the substrate 9 is not inserted is reversed (empty reversal), so that the position between the reversing units 41a, 41b and the center robot 5 is changed.
  • the unprocessed substrate 9 and the processed substrate 9 can be exchanged, and a plurality of substrates 9 can be efficiently processed.
  • the substrate 9 is not inserted into the sending slot 42 and the take-in slot 43 of one of the first and second reversing sections 41a and 41b, and the other of the first and second reversing sections 41a and 41b.
  • the one inverting unit is set to the sending posture by idle inversion.
  • the unprocessed substrate 9 and the processed substrate 9 are exchanged between the one of the reversing units 41a and 41b and the center robot 5, and the plurality of substrates 9 can be efficiently processed.
  • the sending slot 42 is located below the take-in slot 43 in the sending posture of each of the reversing sections 41 a and 41 b. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 in the reversing sections 41 a and 41 b in the sending posture, and prevents the processed substrate 9 from being contaminated by the unprocessed substrate 9. Can be suppressed.
  • the unprocessed substrate 9 in the sending slot 42 is taken out by the center robot 5. Thereafter, the processed substrate 9 is inserted into the intake slot 43.
  • each of the reversing units 41a and 41b the reversing operation by the reversing mechanism 45 is prohibited when the substrate 9 is in both the sending slot 42 and the receiving slot 43. Thereby, it is possible to prevent the processed substrate 9 from being disposed below the unprocessed substrate 9 due to the inversion operation.
  • the number of the sending slot 42 and the number of the receiving slot 43 may be other than two.
  • FIG. 13 shows a case where the number of each of the sending slot 42 and the taking slot 43 is 1
  • FIG. 14 shows a case where the number of each of the sending slot 42 and the taking slot 43 is 4. Also in the examples of FIGS.
  • the board 9 in the high operation state, the board 9 is not inserted into the sending slot 42 and the receiving slot 43 of the first reversing unit 41a (RVP1), and the first reversing unit 41a is not
  • the empty reversing condition of the first reversing section 41a is satisfied.
  • the first inverting section 41a is idle-inverted (see the inverting operation of the arrow A1a).
  • the unprocessed substrate 9 and the processed substrate 9 are exchanged between the first reversing unit 41a and the center robot 5, and the plurality of substrates 9 can be efficiently processed.
  • the empty reversal condition of the second reversing unit 41b is satisfied.
  • the back surface processing operation is performed on the plurality of substrates 9.
  • the processing unit 61 faces the pattern surface of the substrate 9 upward, and the processing liquid or the like May be performed.
  • the indexer robot 3 sends the first or second inverting units 41a and 41b.
  • the unprocessed substrate 9 is inserted into the slot 42, and the center robot 5 takes out the unprocessed substrate 9 without performing the reversing operation in the reversing units 41a and 41b.
  • the unprocessed substrate 9 is carried into one of the processing units 61.
  • the substrate 9 on which the pattern surface has been processed in the processing unit 61 is taken out by the center robot 5, and inserted into the take-in slot 43 of the first or second reversing unit 41a, 41b. You. Then, the processed substrate 9 is taken out by the indexer robot 3 and returned to the storage container C without performing the reversing operation in the reversing units 41a and 41b.
  • the pattern surface processing operation and the back surface processing operation may be performed in a mixed manner.
  • the substrate 9 is inserted into the sending slot 42 and the receiving slot 43.
  • the first or second reversing unit 41a, 41b which is not performed and is in the taking-in posture, is set to the sending posture by idle reversal.
  • the unprocessed substrate 9 is inserted by the indexer robot 3 into the sending slot 42 of the reversing unit 41a, 41b in the sending posture, and the reversing operation of the reversing unit 41a, 41b is performed.
  • the take-in slot 43 may be located above the sending slot 42 in the take-up posture of each of the reversing sections 41 a and 41 b. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 in the reversing portions 41a and 41b in the take-in attitude, thereby suppressing contamination of the processed substrate 9. .
  • the taking slot 43 is located below the sending slot 42 in the sending posture.
  • the unprocessed substrate 9 is inserted into the sending slot 42 after the processed substrate 9 in the intake slot 43 is taken out by the indexer robot 3. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 in the reversing portions 41a and 41b in the sending posture, thereby suppressing contamination of the processed substrate 9.
  • the sending slot 42 and the taking slot 43 may be arranged at positions horizontally separated from each other.
  • the sending slot 42 is arranged at an arbitrary position corresponding to the insertion of the unprocessed substrate 9 by the indexer robot 3
  • the center robot 5 is used in the taking posture in the reversing units 41a and 41b.
  • the take-in slot 43 may be arranged at an arbitrary position associated with the insertion of the processed substrate 9 according to (1).
  • the substrate on which the processing is performed in the substrate processing apparatus 1 is not limited to a semiconductor substrate, and may be a glass substrate or another substrate. Further, the substrate processing apparatus 1 may be used for processing a substrate having an outer shape different from a disk shape.

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Abstract

Each of a first and a second inversion unit (41a, 41b) is provided with a delivery slot, a loading slot, and an inversion mechanism. The inversion mechanism inverts the delivery slot and the loading slot integrally to switch between a delivery attitude in which the delivery slot is disposed on the lower side and a loading attitude in which the loading slot is disposed on the lower side. An indexer robot (3) inserts an unprocessed substrate (9) into the delivery slot of the first or the second inversion unit in the delivery attitude, and a center robot (5) inserts a processed substrate into the loading slot of the first or the second inversion unit in the loading attitude. In this way, contamination of the processed substrate is suppressed. In a high operating state, the first or the second inversion unit which has no substrate inserted into the delivery slot and the loading slot thereof and which is in the loading attitude is placed in the delivery attitude, and an unprocessed substrate is inserted into the delivery slot of the inversion unit. In this way, a plurality of substrates are processed efficiently.

Description

基板処理装置および基板処理方法Substrate processing apparatus and substrate processing method
　本発明は、基板処理装置および基板処理方法に関する。 The present invention relates to a substrate processing apparatus and a substrate processing method.
　従来、半導体デバイスの製造では、半導体基板（以下、単に「基板」という。）に対して様々な処理を行う基板処理装置が用いられている。例えば、特許第４７４４４２６号公報（文献１）の基板処理装置では、反転ユニットにおいて基板の表面と裏面とが反転され、裏面洗浄ユニットにおいて裏面の洗浄が行われる。また、当該基板処理装置では、インデクサロボットとメインロボットとの間に、２つの反転ユニットが設けられ、第１の反転ユニットが処理前の基板の受け渡しの際に用いられ、第２の反転ユニットが処理後の基板の受け渡しの際に用いられる。これにより、基板の受け渡し時に、処理後の基板が処理前の基板により汚染されることが防止される。 Conventionally, in the manufacture of semiconductor devices, a substrate processing apparatus that performs various processes on a semiconductor substrate (hereinafter, simply referred to as “substrate”) has been used. For example, in the substrate processing apparatus disclosed in Japanese Patent No. 4744426 (Document 1), the front surface and the back surface of the substrate are reversed in the reversing unit, and the back surface is cleaned in the back surface cleaning unit. Further, in the substrate processing apparatus, two reversing units are provided between the indexer robot and the main robot, the first reversing unit is used when transferring a substrate before processing, and the second reversing unit is used. It is used at the time of delivery of a substrate after processing. This prevents the processed substrate from being contaminated by the unprocessed substrate when the substrate is delivered.
　なお、特許第６３３１６９８号公報の基板処理装置では、搬入用基板収容器において、互いに隣り合う複数の収容位置を収容ブロックとして、複数の収容ブロックを設け、処理済みの基板を搬入用基板収容器に搬入する際に、同一のプロセスジョブに対応する基板の収容位置を共通の収容ブロックとする手法が開示されている。また、清浄度の高い基板の上方に、清浄度の低い基板が収容されることを防止して、ダストの落下による基板汚染を抑制する手法も開示されている。 In the substrate processing apparatus disclosed in Japanese Patent No. 6331698, a plurality of storage blocks are provided in a carry-in substrate container with a plurality of storage positions adjacent to each other as a storage block, and the processed substrate is placed in the carry-in substrate container. A method is disclosed in which, when a substrate is carried in, a substrate storage position corresponding to the same process job is used as a common storage block. Also disclosed is a method of preventing a substrate having a low degree of cleanness from being accommodated above a substrate having a high degree of cleanliness, thereby suppressing substrate contamination due to dust falling.
　ところで、文献１の基板処理装置では、例えば、複数の基板に対する処理を開始する際に、１つの反転ユニットのみを用いて処理前の基板を反転することになるため、複数の基板の洗浄ユニットへの搬送に長時間を要してしまう。複数の基板の洗浄ユニットへの搬送において、２つの反転ユニットを用いることも考えられる。しかしながら、この場合、処理前の基板の反転、および、処理済みの基板の反転が、同一の反転ユニットにより行われることとなるため、処理前の基板のダストが反転ユニットを介して処理済みの基板に付着し、処理済みの基板が汚染される可能性がある。 By the way, in the substrate processing apparatus of Document 1, for example, when starting processing on a plurality of substrates, the substrate before processing is reversed using only one reversing unit. Takes a long time to transport In transporting a plurality of substrates to the cleaning unit, it is conceivable to use two reversing units. However, in this case, since the reversal of the substrate before processing and the reversal of the processed substrate are performed by the same reversing unit, dust of the substrate before processing is processed through the reversing unit. And may contaminate the processed substrate.
　本発明は、基板処理装置に向けられており、処理済みの基板が汚染されることを抑制しつつ、複数の基板を効率よく処理することを目的としている。 The present invention is directed to a substrate processing apparatus, and an object of the present invention is to efficiently process a plurality of substrates while suppressing contamination of a processed substrate.
　本発明に係る基板処理装置は、複数の基板を収納する収納容器が載置される容器載置部と、それぞれが基板に対して処理を行う複数の処理部を有する処理ユニットと、前記容器載置部と前記処理ユニットとの間に配置され、基板を反転する第１反転部と、前記容器載置部と前記処理ユニットとの間に配置され、基板を反転する第２反転部と、前記収納容器と前記第１および第２反転部との間で基板を搬送する容器側搬送部と、前記第１および第２反転部と前記複数の処理部との間で基板を搬送する処理部側搬送部と、前記第１反転部、前記第２反転部、前記容器側搬送部および前記処理部側搬送部を制御することにより、前記収納容器内の未処理の基板を前記第１または第２反転部で反転していずれかの処理部に搬入するとともに、前記処理部による処理済みの基板を前記第１または第２反転部で反転して前記収納容器内に戻す制御部とを備え、各反転部が、前記容器側搬送部により前記収納容器内の未処理の基板が挿入される送出スロットと、前記処理部側搬送部により前記処理部による処理済みの基板が挿入される取込スロットと、前記送出スロットおよび前記取込スロットを一体的に反転することにより、前記容器側搬送部による未処理の基板の挿入に対応付けられた位置に前記送出スロットを配置した送出姿勢と、前記処理部側搬送部による処理済みの基板の挿入に対応付けられた位置に前記取込スロットを配置した取込姿勢とを切り替える反転機構とを備え、前記制御部の指令により、前記容器側搬送部が、前記収納容器内の未処理の基板を前記送出姿勢の前記第１または第２反転部の前記送出スロットに挿入し、前記処理部側搬送部が、前記処理部による処理済みの基板を前記取込姿勢の前記第１または第２反転部の前記取込スロットに挿入し、いずれかの処理部における処理の完了を待って当該処理部へと搬送されるべき未処理の基板が前記収納容器内に存在する高稼働状態において、前記制御部が、前記送出スロットおよび前記取込スロットに基板が挿入されておらず、かつ、前記取込姿勢である前記第１または第２反転部を前記送出姿勢とし、前記送出姿勢とされた前記第１または第２反転部の前記送出スロットに、前記容器側搬送部により前記未処理の基板を挿入する。 A substrate processing apparatus according to the present invention includes: a container mounting unit on which a storage container that stores a plurality of substrates is mounted; a processing unit including a plurality of processing units each performing a process on a substrate; A first reversing unit disposed between the mounting unit and the processing unit and reversing the substrate, a second reversing unit disposed between the container mounting unit and the processing unit and reversing the substrate, A container-side transfer unit that transfers a substrate between a storage container and the first and second reversing units; and a processing unit side that transfers a substrate between the first and second reversal units and the plurality of processing units. By controlling the transport unit and the first reversing unit, the second reversing unit, the container-side transport unit, and the processing unit-side transport unit, the unprocessed substrate in the storage container is moved to the first or second substrate. After being reversed by the reversing unit and carried into one of the processing units, A control unit that reverses the substrate processed by the unit in the first or second reversing unit and returns the substrate to the inside of the storage container. A sending slot in which a substrate is inserted, an intake slot in which a substrate processed by the processing unit is inserted by the processing unit side transport unit, and the sending slot and the intake slot are integrally inverted. A delivery attitude in which the delivery slot is arranged at a position corresponding to the insertion of an unprocessed substrate by the container-side transport section, and a delivery attitude at which the processed slot is inserted by the processing section-side transport section. A reversing mechanism for switching between a take-up attitude in which a take-in slot is disposed, and the container-side transport section transfers an unprocessed substrate in the storage container to the first or second position in the send-out posture according to a command from the control section. Is inserted into the sending slot of the second reversing unit, and the processing unit side transport unit inserts the substrate processed by the processing unit into the taking slot of the first or second reversing unit in the taking posture. Then, in a high operation state in which an unprocessed substrate to be transported to the processing unit after the completion of the processing in any of the processing units is present in the storage container, the control unit controls the transmission slot and the The board is not inserted into the take-in slot, and the first or second inverting portion in the take-up posture is the sending posture, and the first or second inverting portion in the sending posture is The unprocessed substrate is inserted into the delivery slot by the container-side transfer unit.
　本発明によれば、処理済みの基板が汚染されることを抑制しつつ、複数の基板を効率よく処理することができる。 According to the present invention, it is possible to efficiently process a plurality of substrates while suppressing contamination of a processed substrate.
　本発明の一の好ましい形態では、前記高稼働状態において、前記第１および第２反転部のうち、一方の反転部の前記送出スロットおよび前記取込スロットに基板が挿入されておらず、かつ、前記一方の反転部が前記取込姿勢となっており、さらに、他方の反転部の前記送出スロットに未処理の基板が挿入される場合に、前記制御部が、前記一方の反転部を前記送出姿勢とする。 In one preferred embodiment of the present invention, in the high operation state, the substrate is not inserted into the sending slot and the intake slot of one of the first and second reversing sections, and When the one reversing unit is in the take-in posture and the unprocessed substrate is inserted into the sending slot of the other reversing unit, the control unit sends the one reversing unit to the sending slot. Posture.
　本発明の他の好ましい形態では、前記各反転部の前記送出姿勢において、前記送出スロットが前記取込スロットの下方に位置する、または、前記各反転部の前記取込姿勢において、前記取込スロットが前記送出スロットの上方に位置する。 In another preferred embodiment of the present invention, in the sending posture of each of the reversing parts, the sending slot is located below the intake slot, or in the taking posture of each of the inverting parts, the taking slot Is located above the delivery slot.
　この場合に、前記各反転部の前記送出姿勢において、前記送出スロットが前記取込スロットの下方に位置し、かつ、前記各反転部が、前記送出スロットに未処理の基板が挿入された状態で前記取込姿勢となる場合に、前記処理部側搬送部により、前記送出スロットの前記未処理の基板が取り出された後、前記取込スロットに処理済みの基板が挿入される、または、前記各反転部の前記取込姿勢において、前記取込スロットが前記送出スロットの上方に位置し、かつ、前記各反転部が、前記取込スロットに処理済みの基板が挿入された状態で前記送出姿勢となる場合に、前記容器側搬送部により、前記取込スロットの前記処理済みの基板が取り出された後、前記送出スロットに未処理の基板が挿入されることが好ましい。 In this case, in the sending posture of each of the inverting portions, the sending slot is located below the take-in slot, and each of the inverting portions is in a state where an unprocessed substrate is inserted into the sending slot. In the case of the taking-in posture, after the unprocessed substrate in the sending slot is taken out by the processing unit-side transport unit, a processed substrate is inserted into the taking-in slot, or In the capturing posture of the reversing part, the capturing slot is located above the sending slot, and each of the reversing parts is in the state where the processed substrate is inserted in the capturing slot and the sending posture. In this case, it is preferable that an unprocessed substrate is inserted into the delivery slot after the processed substrate in the intake slot is taken out by the container-side transport unit.
　本発明の他の好ましい形態では、前記送出スロットおよび前記取込スロットの両方に基板が入った状態において、前記反転機構による反転動作が禁止される。 In another preferred embodiment of the present invention, the reversing operation by the reversing mechanism is prohibited in a state where the substrate is in both the sending slot and the taking-in slot.
　本発明の他の好ましい形態では、前記複数の基板のそれぞれが、パターンが形成されたパターン面と、前記パターン面とは反対側の裏面とを有し、前記収納容器において、前記複数の基板のそれぞれが前記パターン面を上方に向けて保持され、前記複数の処理部において、基板の前記裏面に対して処理が行われる。 In another preferred embodiment of the present invention, each of the plurality of substrates has a pattern surface on which a pattern is formed, and a back surface opposite to the pattern surface. Each is held with the pattern surface facing upward, and processing is performed on the back surface of the substrate in the plurality of processing units.
　本発明は、基板処理装置における基板処理方法にも向けられている。本発明に係る基板処理方法では、前記基板処理装置が、複数の基板を収納する収納容器が載置される容器載置部と、それぞれが基板に対して処理を行う複数の処理部を有する処理ユニットと、前記容器載置部と前記処理ユニットとの間に配置され、基板を反転する第１反転部と、前記容器載置部と前記処理ユニットとの間に配置され、基板を反転する第２反転部と、前記収納容器と前記第１および第２反転部との間で基板を搬送する容器側搬送部と、前記第１および第２反転部と前記複数の処理部との間で基板を搬送する処理部側搬送部とを備え、各反転部が、前記容器側搬送部により前記収納容器内の未処理の基板が挿入される送出スロットと、前記処理部側搬送部により前記処理部による処理済みの基板が挿入される取込スロットと、前記送出スロットおよび前記取込スロットを一体的に反転することにより、前記容器側搬送部による未処理の基板の挿入に対応付けられた位置に前記送出スロットを配置した送出姿勢と、前記処理部側搬送部による処理済みの基板の挿入に対応付けられた位置に前記取込スロットを配置した取込姿勢とを切り替える反転機構とを備え、前記基板処理方法が、ａ）前記容器側搬送部により、前記収納容器内の未処理の基板を前記送出姿勢のいずれかの反転部の前記送出スロットに挿入する工程と、ｂ）前記反転部を前記取込姿勢として前記基板を反転する工程と、ｃ）前記処理部側搬送部により、前記基板を前記反転部からいずれかの処理部に搬入する工程と、ｄ）前記処理部において前記基板に対して処理を行う工程と、ｅ）前記処理部による処理済みの前記基板を、前記処理部側搬送部により前記取込姿勢のいずれかの反転部の前記取込スロットに挿入する工程と、ｆ）前記反転部を前記送出姿勢として前記基板を反転する工程と、ｇ）前記容器側搬送部により、前記基板を前記反転部から前記収納容器内に戻す工程と、ｈ）前記ａ）ないしｇ）工程に部分的に並行しつつ、前記収納容器内の他の未処理の基板に対して前記ａ）ないしｇ）工程と同様の動作を行う工程と、ｉ）いずれかの処理部における処理の完了を待って当該処理部へと搬送されるべき未処理の基板が前記収納容器内に存在する高稼働状態において、前記送出スロットおよび前記取込スロットに基板が挿入されておらず、かつ、前記取込姿勢である前記第１または第２反転部を前記送出姿勢とする工程と、ｊ）前記ｉ）工程において前記送出姿勢とされた前記第１または第２反転部の前記送出スロットに、前記容器側搬送部により前記未処理の基板を挿入する工程とを備える。 The present invention is also directed to a substrate processing method in a substrate processing apparatus. In the substrate processing method according to the present invention, the substrate processing apparatus includes a container mounting portion on which a storage container for storing a plurality of substrates is mounted, and a plurality of processing units each performing a process on the substrate. A unit, a first reversing unit disposed between the container mounting unit and the processing unit for reversing the substrate, and a first reversing unit disposed between the container mounting unit and the processing unit for reversing the substrate. (2) a reversing section, a container-side transport section for transporting a substrate between the storage container and the first and second reversing sections, and a substrate between the first and second reversing sections and the plurality of processing sections. And a reversing section, wherein each of the reversing sections includes a delivery slot into which an unprocessed substrate in the storage container is inserted by the container-side transport section, and the processing section by the processor-side transport section. Slot, into which the substrate processed by By integrally reversing the delivery slot and the take-in slot, a delivery attitude in which the delivery slot is arranged at a position corresponding to the insertion of an unprocessed substrate by the container-side delivery unit, And a reversing mechanism for switching between a take-up posture in which the take-up slot is arranged at a position corresponding to the insertion of the processed substrate by the unit. The substrate processing method comprises the steps of: Inserting an unprocessed substrate in a storage container into the delivery slot of any of the reversing portions in the delivery position; b) reversing the substrate with the reversing portion in the taking position; A step of transporting the substrate from the reversing section to any of the processing sections by a processing section side transport section; a step of performing processing on the substrate in the processing section; Inserting the processed substrate into the take-in slot of one of the reversing units in the taking-up posture by the processing unit-side transfer unit; and f) reversing the substrate with the reversing unit as the sending-out posture. And g) returning the substrate from the reversing unit into the storage container by the container-side transfer unit; and h) partially paralleling the steps a) to g). Performing the same operation as the above steps a) to g) on the other unprocessed substrates; and i) waiting for the completion of the processing in any one of the processing units and transferring the unprocessed substrates to the processing unit. In the high operation state in which the substrate is present in the storage container, the substrate is not inserted in the sending slot and the intake slot, and the first or second reversing unit in the intake posture is A step of setting a sending posture; i) inserting the unprocessed substrate into the delivery slot of the first or second reversing unit in the delivery posture in the delivery posture by the container-side transport unit.
　上述の目的および他の目的、特徴、態様および利点は、添付した図面を参照して以下に行うこの発明の詳細な説明により明らかにされる。 The above and other objects, features, aspects and advantages will be made clear by the following detailed description of the present invention with reference to the accompanying drawings.
基板処理装置の構成を示す図である。FIG. 2 is a diagram illustrating a configuration of a substrate processing apparatus. 第１および第２反転部とセンタロボットとを示す図である。FIG. 4 is a diagram illustrating first and second reversing units and a center robot. 反転部の構成を示す図である。It is a figure showing composition of an inversion part. センタロボットの構成を示す図である。FIG. 3 is a diagram illustrating a configuration of a center robot. 制御ユニットの機能構成を示すブロック図である。FIG. 3 is a block diagram illustrating a functional configuration of a control unit. 裏面処理動作の流れを示す図である。It is a figure showing the flow of back side processing operation. 複数の基板を処理する流れを示す図である。It is a figure showing the flow which processes a plurality of substrates. 基板処理装置におけるタイムチャートを示す図である。It is a figure showing a time chart in a substrate processing device. 第１および第２反転部の動作を示す図である。FIG. 7 is a diagram illustrating operations of first and second inversion units. 基板処理装置におけるタイムチャートを示す図である。It is a figure showing a time chart in a substrate processing device. 比較例の基板処理装置におけるタイムチャートを示す図である。FIG. 9 is a diagram illustrating a time chart in the substrate processing apparatus of the comparative example. 比較例の基板処理装置における反転部の動作を示す図である。FIG. 9 is a diagram illustrating an operation of a reversing unit in the substrate processing apparatus of the comparative example. 第１および第２反転部の他の例の動作を示す図である。It is a figure showing operation of other examples of the 1st and 2nd inversion parts. 第１および第２反転部の他の例の動作を示す図である。It is a figure showing operation of other examples of the 1st and 2nd inversion parts.
　図１は、本発明の一の実施の形態に係る基板処理装置１の構成を示す図である。図１では、互いに直交する３つの方向をＸ方向、Ｙ方向およびＺ方向として示している。典型的には、Ｚ方向は上下方向（鉛直方向）であり、Ｘ方向およびＹ方向は水平方向である。 FIG. 1 is a diagram showing a configuration of a substrate processing apparatus 1 according to one embodiment of the present invention. In FIG. 1, three directions orthogonal to each other are shown as an X direction, a Y direction, and a Z direction. Typically, the Z direction is a vertical direction (vertical direction), and the X direction and the Y direction are horizontal directions.
　基板処理装置１は、後述の処理部６１において円板状の基板９を１枚ずつ処理する枚葉式の装置である。基板９は、デバイス形成面である一の主面（以下、「パターン面」という。）と、デバイス非形成面である他の主面（以下、「裏面」という。）とを有する。パターン面には、製造途上のデバイスのパターンが形成される。裏面は、パターン面とは反対側の面である。後述の処理例では、処理部６１において、裏面を上方に向けた状態で保持される基板９の当該裏面に対して処理液等による処理が行われる。 The substrate processing apparatus 1 is a single-wafer processing apparatus that processes the disk-shaped substrates 9 one by one in a processing unit 61 described below. The substrate 9 has one main surface (hereinafter, referred to as a “pattern surface”) that is a device formation surface and another main surface (hereinafter, “back surface”) that is a device non-formation surface. The pattern of the device being manufactured is formed on the pattern surface. The back surface is a surface opposite to the pattern surface. In a processing example described later, the processing unit 61 performs a processing using a processing liquid or the like on the rear surface of the substrate 9 held with the rear surface facing upward.
　基板処理装置１は、容器載置部２と、インデクサロボット３と、第１および第２反転部４１ａ，４１ｂと、センタロボット５と、処理ユニット６と、制御ユニット７とを備える。制御ユニット７は、例えばＣＰＵ等を含むコンピュータであり、基板処理装置１の全体制御を担う。制御ユニット７の機能については後述する。容器載置部２、インデクサロボット３、第１および第２反転部４１ａ，４１ｂ、並びに、センタロボット５は、この順序でＹ方向に並ぶ。処理ユニット６における、後述する複数の処理部６１は、センタロボット５の周囲に配置される。 The substrate processing apparatus 1 includes the container mounting section 2, the indexer robot 3, the first and second reversing sections 41a and 41b, the center robot 5, the processing unit 6, and the control unit 7. The control unit 7 is, for example, a computer including a CPU and the like, and performs overall control of the substrate processing apparatus 1. The function of the control unit 7 will be described later. The container placement unit 2, the indexer robot 3, the first and second reversing units 41a and 41b, and the center robot 5 are arranged in this order in the Y direction. A plurality of processing units 61 described later in the processing unit 6 are arranged around the center robot 5.
　容器載置部２は、複数の容器載置台２１を有する。複数の容器載置台２１はＸ方向に並ぶ。各容器載置台２１には、複数の基板９を収納する収納容器Ｃが載置される。収納容器Ｃは、複数の基板９を多段に収納するキャリアである。収納容器Ｃでは、パターン面を上方に向けた状態で、複数の基板９が収納される。 The container mounting part 2 has a plurality of container mounting tables 21. The plurality of container mounting tables 21 are arranged in the X direction. A storage container C for storing a plurality of substrates 9 is mounted on each container mounting table 21. The storage container C is a carrier that stores the plurality of substrates 9 in multiple stages. In the storage container C, the plurality of substrates 9 are stored with the pattern surface facing upward.
　インデクサロボット３は、収納容器Ｃと第１および第２反転部４１ａ，４１ｂとの間で基板９を搬送する容器側搬送部（または、容器側搬送装置）である。インデクサロボット３は、容器載置部２と第１および第２反転部４１ａ，４１ｂとの間に配置される。インデクサロボット３は、移動部３５を備える。移動部３５は、Ｘ方向に移動可能であり、かつ、上下方向（Ｚ方向）に平行な軸を中心として回動可能である。また、移動部３５は、上下方向に昇降可能である。インデクサロボット３は、１つのハンド群３１０をさらに備える。ハンド群３１０は、多関節型アーム３３を介して移動部３５に接続される。多関節型アーム３３は、ハンド群３１０を一定姿勢に維持しつつ水平方向に進退させる。ハンド群３１０は、２つのハンド３１を有する。２つのハンド３１は、上下方向に並んで設けられる。また、各ハンド３１には、２つの保持部が設けられる。２つの保持部は、上下方向に並んで設けられる。各保持部は、基板９の下方を向く裏面の外周縁に接触して当該基板９を保持する。インデクサロボット３では、駆動源としてモータ等が用いられる。 The indexer robot 3 is a container-side transfer unit (or a container-side transfer device) that transfers the substrate 9 between the storage container C and the first and second reversing units 41a and 41b. The indexer robot 3 is disposed between the container placement unit 2 and the first and second reversing units 41a and 41b. The indexer robot 3 includes a moving unit 35. The moving unit 35 is movable in the X direction, and is rotatable about an axis parallel to the vertical direction (Z direction). The moving unit 35 can move up and down. The indexer robot 3 further includes one hand group 310. The hand group 310 is connected to the moving unit 35 via the articulated arm 33. The articulated arm 33 moves the hand group 310 horizontally while maintaining the hand group 310 in a constant posture. The hand group 310 has two hands 31. The two hands 31 are provided side by side in the vertical direction. Each hand 31 is provided with two holding units. The two holding units are provided side by side in the up-down direction. Each holding portion contacts the outer peripheral edge of the back surface of the substrate 9 facing downward, and holds the substrate 9. In the indexer robot 3, a motor or the like is used as a drive source.
　以下の説明では、２つのハンド３１を区別する場合に、上側に配置されるハンド３１、および、下側に配置されるハンド３１をそれぞれ「上ハンド３１」および「下ハンド３１」という。また、各ハンド３１において、２つの保持部を区別する場合に、上側および下側の保持部をそれぞれ「上保持部」および「下保持部」という。上保持部にて保持される基板９が下保持部に接触することはなく、下保持部にて保持される基板９が上保持部に接触することもない。なお、インデクサロボット３の上記構造は一例に過ぎず、適宜変更されてよい。例えば、２つのハンド３１に対して多関節型アーム３３が個別に設けられてもよい。 In the following description, when distinguishing the two hands 31, the hand 31 arranged on the upper side and the hand 31 arranged on the lower side are referred to as an “upper hand 31” and a “lower hand 31”, respectively. In each hand 31, when distinguishing the two holding units, the upper and lower holding units are referred to as “upper holding unit” and “lower holding unit”, respectively. The substrate 9 held by the upper holder does not contact the lower holder, and the substrate 9 held by the lower holder does not contact the upper holder. Note that the above structure of the indexer robot 3 is merely an example, and may be appropriately changed. For example, the articulated arms 33 may be individually provided for the two hands 31.
　図２は、（＋Ｙ）側から（－Ｙ）方向を向いて見た基板処理装置１を示す図であり、第１および第２反転部４１ａ，４１ｂとセンタロボット５とを示している。図１に示すように、第１および第２反転部４１ａ，４１ｂは、インデクサロボット３と、センタロボット５および処理ユニット６との間に配置される。図２に示すように、第１反転部４１ａは、第２反転部４１ｂの上方に配置される。既述のインデクサロボット３は、第１および第２反転部４１ａ，４１ｂの双方にアクセス可能である。センタロボット５も同様である。第１および第２反転部４１ａ，４１ｂは互いに同様の構造を有する。なお、第１および第２反転部４１ａ，４１ｂは、必ずしも上下方向に並ぶ必要はない。以下の説明では、第１および第２反転部４１ａ，４１ｂを区別しない場合に、両者を単に「反転部４１」という。 FIG. 2 is a view showing the substrate processing apparatus 1 viewed from the (+ Y) side in the (−Y) direction, and shows the first and second reversing units 41 a and 41 b and the center robot 5. As shown in FIG. 1, the first and second reversing units 41a and 41b are arranged between the indexer robot 3, the center robot 5, and the processing unit 6. As shown in FIG. 2, the first reversing unit 41a is disposed above the second reversing unit 41b. The above-described indexer robot 3 can access both the first and second reversing units 41a and 41b. The same applies to the center robot 5. The first and second reversing sections 41a and 41b have the same structure as each other. Note that the first and second reversing sections 41a and 41b do not necessarily have to be lined up and down. In the following description, when the first and second reversing units 41a and 41b are not distinguished, they are simply referred to as “reversing unit 41”.
　図３は、反転部４１の構成を示す図である。反転部４１は、複数のスロット４２，４３と、スロット支持部４４と、反転機構４５とを備える。各スロット４２，４３は、水平状態で基板９を保持可能な基板保持部である。各スロット４２，４３では、モータまたはエアシリンダ等を利用して、基板９の保持および解除が可能である。図３の例では、４個のスロット４２，４３が設けられる。４個のスロット４２，４３のうち、２つのスロット４２が上下方向に互いに隣接して配置され、残りのスロット４３が上下方向に互いに隣接して配置される。以下の説明では、図３に示す状態において、下側に配置される２つのスロット４２を「送出スロット４２」といい、上側に配置される２つのスロット４３を「取込スロット４３」という。送出スロット４２と取込スロット４３の違いについては後述する。 FIG. 3 is a diagram showing the configuration of the reversing unit 41. The reversing section 41 includes a plurality of slots 42 and 43, a slot support section 44, and a reversing mechanism 45. Each of the slots 42 and 43 is a substrate holding unit that can hold the substrate 9 in a horizontal state. In each of the slots 42 and 43, the substrate 9 can be held and released using a motor, an air cylinder, or the like. In the example of FIG. 3, four slots 42 and 43 are provided. Of the four slots 42, 43, two slots 42 are arranged vertically adjacent to each other, and the remaining slots 43 are arranged vertically adjacent to each other. In the following description, in the state shown in FIG. 3, the two slots 42 arranged on the lower side are referred to as “sending slots 42”, and the two slots 43 arranged on the upper side are referred to as “intake slots 43”. The difference between the sending slot 42 and the receiving slot 43 will be described later.
　スロット支持部４４は、２つの送出スロット４２および２つの取込スロット４３を一体的に支持する枠状部材である。スロット支持部４４では、Ｙ方向の両側が開口する。インデクサロボット３は、スロット支持部４４の（－Ｙ）側の開口から送出スロット４２および取込スロット４３にアクセス可能である。センタロボット５は、スロット支持部４４の（＋Ｙ）側の開口から送出スロット４２および取込スロット４３にアクセス可能である。反転機構４５は、例えば、モータを有し、Ｘ方向に平行な軸を中心としてスロット支持部４４を１８０度だけ回動する。これにより、２つの送出スロット４２および２つの取込スロット４３が一体的に反転し、送出スロット４２または取込スロット４３に保持される基板９も反転される。 The slot support 44 is a frame-like member that integrally supports the two sending slots 42 and the two taking slots 43. In the slot support portion 44, both sides in the Y direction are open. The indexer robot 3 can access the sending slot 42 and the taking slot 43 from the opening on the (−Y) side of the slot supporting section 44. The center robot 5 can access the sending slot 42 and the receiving slot 43 from the opening on the (+ Y) side of the slot support 44. The reversing mechanism 45 has, for example, a motor, and rotates the slot support 44 by 180 degrees about an axis parallel to the X direction. Thereby, the two sending slots 42 and the two taking slots 43 are integrally inverted, and the substrate 9 held in the sending slot 42 or the taking slot 43 is also inverted.
　反転部４１では、制御ユニット７の指令により、上記反転動作が繰り返される。換言すると、反転部４１において、送出スロット４２が取込スロット４３の下方に配置される図３に示す姿勢（以下、「送出姿勢」という。）と、取込スロット４３が送出スロット４２の下方に配置される姿勢（以下、「取込姿勢」という。）とが切り替えられる。反転部４１では、送出スロット４２および取込スロット４３の両方に基板９が入った状態において、反転機構４５による反転動作が禁止されている。反転部４１の上記構造は、適宜変更されてよい。 In the reversing unit 41, the reversing operation is repeated according to a command from the control unit 7. In other words, in the reversing unit 41, the posture shown in FIG. 3 in which the sending slot 42 is arranged below the receiving slot 43 (hereinafter, referred to as “sending posture”), and the taking slot 43 is positioned below the sending slot 42. The posture to be arranged (hereinafter, referred to as “acquisition posture”) is switched. In the reversing section 41, the reversing operation by the reversing mechanism 45 is prohibited when the substrate 9 is in both the sending slot 42 and the taking slot 43. The above structure of the reversing unit 41 may be changed as appropriate.
　図１に示すセンタロボット５は、第１および第２反転部４１ａ，４１ｂと複数の処理部６１との間で基板９を搬送する処理部側搬送部（または、処理部側搬送装置）である。センタロボット５は、第１および第２反転部４１ａ，４１ｂの（＋Ｙ）側に配置される。図４は、センタロボット５の構成を示す図である。センタロボット５は、ベース部５６と、昇降回動部５５とを備える。昇降回動部５５は、ベース部５６に対して、上下方向に平行な軸を中心として回動可能であり、上下方向に昇降可能である。 The center robot 5 shown in FIG. 1 is a processing unit-side transfer unit (or a processing unit-side transfer device) that transfers the substrate 9 between the first and second reversing units 41a and 41b and the plurality of processing units 61. . The center robot 5 is disposed on the (+ Y) side of the first and second reversing units 41a and 41b. FIG. 4 is a diagram illustrating a configuration of the center robot 5. The center robot 5 includes a base unit 56 and a vertically rotating unit 55. The elevating / lowering rotating unit 55 is rotatable about an axis parallel to the up-down direction with respect to the base unit 56, and is able to move up and down in the up-down direction.
　センタロボット５は、２つのハンド群５１０をさらに備える。一方のハンド群５１０は、他方のハンド群５１０よりも上方に配置される。各ハンド群５１０は、多関節型アーム５３を介して昇降回動部５５に接続される。２つの多関節型アーム５３は、図示省略の駆動機構により互いに独立して駆動され、ハンド群５１０を一定姿勢に維持しつつ水平方向に進退させる。各ハンド群５１０は、２つのハンド５１を有する。２つのハンド５１は、上下方向に並んで設けられる。既述のように、第１および第２反転部４１ａ，４１ｂでは、基板９が反転されており、各ハンド５１は、基板９の下方を向くパターン面の外周縁に接触して当該基板９を保持する。センタロボット５では、駆動源としてモータ等が用いられる。 The center robot 5 further includes two hand groups 510. One hand group 510 is arranged above the other hand group 510. Each hand group 510 is connected to the lifting / lowering rotating unit 55 via the articulated arm 53. The two articulated arms 53 are driven independently of each other by a drive mechanism (not shown), and move the hand group 510 in the horizontal direction while maintaining a constant posture. Each hand group 510 has two hands 51. The two hands 51 are provided side by side in the vertical direction. As described above, in the first and second reversing sections 41a and 41b, the substrate 9 is inverted, and each hand 51 contacts the outer peripheral edge of the pattern surface facing the lower side of the substrate 9 to hold the substrate 9 in place. Hold. In the center robot 5, a motor or the like is used as a drive source.
　以下の説明では、２つのハンド群５１０を区別する場合に、上側に配置されるハンド群５１０、および、下側に配置されるハンド群５１０をそれぞれ「上ハンド群５１０」および「下ハンド群５１０」という。また、２つのハンド５１を区別する場合に、上側に配置されるハンド５１、および、下側に配置されるハンド５１をそれぞれ「上ハンド５１」および「下ハンド５１」という。上ハンド５１にて保持される基板９が下ハンド５１に接触することはなく、下ハンド５１にて保持される基板９が上ハンド５１に接触することもない。なお、センタロボット５の上記構造は一例に過ぎず、適宜変更されてよい。例えば、４個のハンド５１に対して多関節型アーム５３が個別に設けられてもよい。 In the following description, when distinguishing the two hand groups 510, the upper hand group 510 and the lower hand group 510 are referred to as an “upper hand group 510” and a “lower hand group 510,” respectively. " When the two hands 51 are distinguished from each other, the hand 51 disposed on the upper side and the hand 51 disposed on the lower side are referred to as an “upper hand 51” and a “lower hand 51”, respectively. The substrate 9 held by the upper hand 51 does not contact the lower hand 51, and the substrate 9 held by the lower hand 51 does not contact the upper hand 51. Note that the above structure of the center robot 5 is merely an example, and may be appropriately changed. For example, articulated arms 53 may be individually provided for four hands 51.
　図１に示す処理ユニット６は、複数の処理部６１を有する。各処理部６１では、センタロボット５により搬入される基板９がチャック部により水平状態で保持される。チャック部は、必要に応じて基板９と共に回転する。例えば、当該基板９の上方を向く主面に向けて、ノズルから処理液が供給され、当該主面に対して処理液による処理が行われる。処理部６１では、基板９に対して処理ガスによる処理が行われてもよい。処理ユニット６の一例では、図２に示すように、上下方向に積層された４個の処理部６１が積層ユニット６２として設けられ、図１に示すように、センタロボット５の周囲に４個の積層ユニット６２が配置される。処理ユニット６の上記構成は一例に過ぎず、処理ユニット６に設けられる処理部６１の個数および配置は適宜変更されてよい。 処理 The processing unit 6 shown in FIG. 1 has a plurality of processing units 61. In each processing unit 61, the substrate 9 carried in by the center robot 5 is held in a horizontal state by the chuck unit. The chuck rotates together with the substrate 9 as needed. For example, a processing liquid is supplied from a nozzle toward a main surface facing upward of the substrate 9, and the main surface is processed with the processing liquid. In the processing unit 61, the processing with the processing gas may be performed on the substrate 9. In an example of the processing unit 6, as shown in FIG. 2, four processing units 61 stacked vertically are provided as a stacking unit 62, and as shown in FIG. The stacking unit 62 is arranged. The above configuration of the processing unit 6 is merely an example, and the number and arrangement of the processing units 61 provided in the processing unit 6 may be appropriately changed.
　図５は、制御ユニット７の機能構成を示すブロック図である。図５では、インデクサロボット３、センタロボット５、第１反転部４１ａ、第２反転部４１ｂおよび複数の処理部６１もブロックで図示している。制御ユニット７は、制御部７１と、出入力部７２と、記憶部７３とを備える。出入力部７２は、操作者からの入力を受け付けるとともに、ディスプレイへの表示等により操作者に対する通知を行う。記憶部７３は、各種情報を記憶する。制御部７１は、スケジューリング部７１１と、処理指令部７１２とを備える。スケジューリング部７１１は、操作者からの入力に基づいて、処理対象の複数の基板９に対して、インデクサロボット３、センタロボット５、第１反転部４１ａ、第２反転部４１ｂおよび複数の処理部６１における動作のタイミングを計画する。処理指令部７１２は、スケジューリング部７１１により計画された動作タイミングに従って、インデクサロボット３、センタロボット５、第１反転部４１ａ、第２反転部４１ｂおよび複数の処理部６１に対して指令信号を出力するとともに、これらからの完了応答等を受け取る。基板処理装置１では、インデクサロボット３、センタロボット５、第１反転部４１ａ、第２反転部４１ｂおよび複数の処理部６１の動作が、制御部７１により制御される。 FIG. 5 is a block diagram showing a functional configuration of the control unit 7. In FIG. 5, the indexer robot 3, the center robot 5, the first reversing unit 41a, the second reversing unit 41b, and the plurality of processing units 61 are also shown in blocks. The control unit 7 includes a control unit 71, an input / output unit 72, and a storage unit 73. The input / output unit 72 receives an input from the operator and notifies the operator of the input / output by displaying it on a display or the like. The storage unit 73 stores various information. The control unit 71 includes a scheduling unit 711 and a processing command unit 712. The scheduling unit 711 performs the indexer robot 3, the center robot 5, the first reversing unit 41a, the second reversing unit 41b, and the plurality of processing units 61 on the plurality of substrates 9 to be processed based on the input from the operator. Plan the timing of the operation in. The processing command unit 712 outputs a command signal to the indexer robot 3, the center robot 5, the first reversing unit 41a, the second reversing unit 41b, and the plurality of processing units 61 according to the operation timing planned by the scheduling unit 711. At the same time, a completion response and the like from these are received. In the substrate processing apparatus 1, the operations of the indexer robot 3, the center robot 5, the first reversing unit 41 a, the second reversing unit 41 b, and the plurality of processing units 61 are controlled by the control unit 71.
　図６は、裏面処理動作の流れを示す図である。裏面処理動作は、基板９の裏面に対して処理部６１による処理を行うための一連の動作である。以下、１つの基板９（以下、「注目基板９」という。）に注目して、裏面処理動作について説明する。基板処理装置１では、スケジューリング部７１１により計画された動作タイミングに基づいて、複数の基板９に対する裏面処理動作が互いに並行して行われるが、複数の基板９に対する裏面処理動作については後述する。 FIG. 6 is a diagram showing a flow of the back surface processing operation. The back surface processing operation is a series of operations for performing processing by the processing unit 61 on the back surface of the substrate 9. Hereinafter, the back surface processing operation will be described by focusing on one substrate 9 (hereinafter, referred to as “target substrate 9”). In the substrate processing apparatus 1, the back surface processing operations on the plurality of substrates 9 are performed in parallel with each other based on the operation timing planned by the scheduling unit 711. The back surface processing operations on the plurality of substrates 9 will be described later.
　裏面処理動作では、まず、第１または第２反転部４１ａ，４１ｂのいずれを未処理の注目基板９の反転に利用するかが、処理指令部７１２により確認される。第１反転部４１ａを利用する場合に（ステップＳ１１）、インデクサロボット３により、収納容器Ｃ内の注目基板９（未処理の基板９）が取り出され、第１反転部４１ａの送出スロット４２に挿入される（ステップＳ１２ａ）。このとき、第１反転部４１ａは、送出スロット４２が下側に位置する送出姿勢となっている。第１反転部４１ａでは、スロット支持部４４が反転される。これにより、第１反転部４１ａが、送出スロット４２が上側に位置する取込姿勢となるとともに、注目基板９が反転される（ステップＳ１３ａ）。既述のように、収納容器Ｃでは、パターン面を上方に向けた状態で注目基板９が収納されており、反転後の注目基板９では、裏面が上方を向く。センタロボット５により、送出スロット４２の注目基板９が取り出され、いずれかの処理部６１に搬入される（ステップＳ１４ａ）。そして、当該処理部６１において上方を向く裏面に対して処理液等による処理が行われる（ステップＳ１５）。 In the back surface processing operation, first, the processing command unit 712 confirms which of the first and second reversing units 41a and 41b is to be used for reversing the unprocessed target substrate 9. When the first reversing unit 41a is used (Step S11), the target substrate 9 (unprocessed substrate 9) in the storage container C is taken out by the indexer robot 3 and inserted into the sending slot 42 of the first reversing unit 41a. Is performed (step S12a). At this time, the first reversing part 41a is in the sending posture in which the sending slot 42 is located on the lower side. In the first reversing section 41a, the slot supporting section 44 is reversed. Thereby, the first reversing unit 41a assumes the taking posture in which the sending slot 42 is located on the upper side, and the substrate 9 of interest is reversed (step S13a). As described above, in the storage container C, the target substrate 9 is stored with the pattern surface facing upward, and the rear surface of the inverted target substrate 9 faces upward. The center robot 5 takes out the board 9 of interest in the sending slot 42 and carries it into one of the processing units 61 (step S14a). Then, the processing unit 61 performs a process using a processing liquid or the like on the rear surface facing upward (step S15).
　一方、ステップＳ１１において、第２反転部４１ｂを利用することが処理指令部７１２により確認された場合、インデクサロボット３により、収納容器Ｃ内の注目基板９が、第２反転部４１ｂの送出スロット４２に挿入される（ステップＳ１２ｂ）。このとき、第２反転部４１ｂは、送出スロット４２が下側に位置する送出姿勢となっている。第２反転部４１ｂでは、スロット支持部４４が反転される。これにより、第２反転部４１ｂが、送出スロット４２が上側に位置する取込姿勢となるとともに、注目基板９が反転される（ステップＳ１３ｂ）。センタロボット５により、送出スロット４２の注目基板９が取り出され、いずれかの処理部６１に搬入される（ステップＳ１４ｂ）。そして、当該処理部６１において上方を向く裏面に対して処理液等による処理が行われる（ステップＳ１５）。 On the other hand, when the processing command unit 712 confirms that the second inverting unit 41b is to be used in step S11, the indexer robot 3 moves the target substrate 9 in the storage container C to the sending slot 42 of the second inverting unit 41b. (Step S12b). At this time, the second reversing part 41b is in the sending posture in which the sending slot 42 is located on the lower side. In the second reversing section 41b, the slot supporting section 44 is reversed. Thereby, the second reversing unit 41b is brought into the taking posture in which the sending slot 42 is located on the upper side, and the target substrate 9 is reversed (step S13b). The board 9 of interest in the sending slot 42 is taken out by the center robot 5 and carried into one of the processing units 61 (step S14b). Then, the processing unit 61 performs a process using a processing liquid or the like on the rear surface facing upward (step S15).
　処理部６１における処理が完了すると、処理指令部７１２により、処理済みの注目基板９の反転において第１または第２反転部４１ａ，４１ｂのいずれを利用するかが確認される。第１反転部４１ａを利用する場合に（ステップＳ１６）、センタロボット５により、処理部６１内の注目基板９（処理済みの基板９）が取り出され、第１反転部４１ａの取込スロット４３に挿入される（ステップＳ１７ａ）。このとき、第１反転部４１ａは、取込スロット４３が下側に位置する取込姿勢となっている。第１反転部４１ａでは、スロット支持部４４が反転される。これにより、第１反転部４１ａが、取込スロット４３が上側に位置する送出姿勢となるとともに、注目基板９が反転される（ステップＳ１８ａ）。反転後の注目基板９では、パターン形成面が上方を向く。インデクサロボット３により、取込スロット４３の注目基板９が取り出され、収納容器Ｃ内に戻される（ステップＳ１９ａ）。なお、注目基板９は、未処理時に収納されていた収納容器Ｃとは異なる収納容器Ｃに戻されてもよい。 When the processing in the processing section 61 is completed, the processing command section 712 confirms which of the first and second reversing sections 41a and 41b is to be used for reversing the processed target substrate 9. When the first reversing unit 41a is used (step S16), the target substrate 9 (the processed substrate 9) in the processing unit 61 is taken out by the center robot 5, and is taken into the taking-in slot 43 of the first reversing unit 41a. It is inserted (step S17a). At this time, the first reversing portion 41a is in the taking posture in which the taking slot 43 is located on the lower side. In the first reversing section 41a, the slot supporting section 44 is reversed. Accordingly, the first reversing unit 41a assumes the sending posture in which the intake slot 43 is positioned on the upper side, and the substrate 9 of interest is reversed (step S18a). On the target substrate 9 after the inversion, the pattern formation surface faces upward. The target substrate 9 in the take-in slot 43 is taken out by the indexer robot 3 and returned into the storage container C (step S19a). Note that the target substrate 9 may be returned to a storage container C different from the storage container C that has been stored at the time of unprocessing.
　一方、ステップＳ１６において、第２反転部４１ｂを利用することが処理指令部７１２により確認された場合、センタロボット５により、処理部６１内の注目基板９が取り出され、第２反転部４１ｂの取込スロット４３に挿入される（ステップＳ１７ｂ）。このとき、第２反転部４１ｂは、取込スロット４３が下側に位置する取込姿勢となっている。第２反転部４１ｂでは、スロット支持部４４が反転される。これにより、第２反転部４１ｂが、取込スロット４３が上側に位置する送出姿勢となるとともに、注目基板９が反転される（ステップＳ１８ｂ）。インデクサロボット３により、取込スロット４３の注目基板９が取り出され、収納容器Ｃ内に戻される（ステップＳ１９ｂ）。 On the other hand, in step S16, when the processing command unit 712 confirms that the second inversion unit 41b is to be used, the center robot 5 takes out the target substrate 9 in the processing unit 61 and takes out the second inversion unit 41b. It is inserted into the insertion slot 43 (step S17b). At this time, the second reversing part 41b is in the taking posture in which the taking slot 43 is located on the lower side. In the second reversing section 41b, the slot supporting section 44 is reversed. Thereby, the second reversing unit 41b assumes the sending posture in which the intake slot 43 is located on the upper side, and the substrate 9 of interest is reversed (step S18b). The target substrate 9 in the take-in slot 43 is taken out by the indexer robot 3 and returned into the storage container C (step S19b).
　上記ステップＳ１１に関して、スケジューリング部７１１では、原則として、収納容器Ｃ内の注目基板９が処理部６１により早く搬送可能なように、第１または第２反転部４１ａ，４１ｂの一方が選択されている。既述のように、インデクサロボット３は、送出姿勢の反転部４１ａ，４１ｂの送出スロット４２に基板９を挿入する。したがって、例えば、第１反転部４１ａが送出姿勢であり、かつ、送出スロット４２に基板９が挿入されておらず、第２反転部４１ｂが取込姿勢であり、かつ、取込スロット４３に基板９が挿入されていない状態では、第１反転部４１ａが選択される。これにより、インデクサロボット３が、基板９を直ぐに送出スロット４２に挿入することが可能である。 Regarding step S11, in the scheduling unit 711, one of the first and second reversing units 41a and 41b is selected in principle such that the target substrate 9 in the storage container C can be transported earlier by the processing unit 61. . As described above, the indexer robot 3 inserts the substrate 9 into the sending slot 42 of the sending posture reversing units 41a and 41b. Therefore, for example, the first reversing part 41a is in the sending posture, the board 9 is not inserted into the sending slot 42, the second reversing part 41b is in the taking posture, and the board is placed in the taking slot 43. In a state where 9 is not inserted, the first reversing unit 41a is selected. This allows the indexer robot 3 to insert the substrate 9 into the sending slot 42 immediately.
　また、第１反転部４１ａが送出姿勢であり、かつ、送出スロット４２に基板９が挿入されており、第２反転部４１ｂが取込姿勢であり、かつ、取込スロット４３に基板９が挿入されている状態では、第２反転部４１ｂが選択される。この場合に、仮に、第１反転部４１ａを利用するときには、第１反転部４１ａの反転動作、センタロボット５による基板９の取り出し、および、第１反転部４１ａの反転動作を待つ必要がある。一方、第２反転部４１ｂを利用する場合、第２反転部４１ｂの反転動作のみを待てば、インデクサロボット３が、基板９を送出スロット４２に挿入することが可能である。 Further, the first reversing part 41a is in the sending posture, the substrate 9 is inserted in the sending slot 42, the second reversing part 41b is in the taking posture, and the substrate 9 is inserted in the taking slot 43. In this state, the second inverting unit 41b is selected. In this case, if the first reversing unit 41a is used, it is necessary to wait for the reversing operation of the first reversing unit 41a, the removal of the substrate 9 by the center robot 5, and the reversing operation of the first reversing unit 41a. On the other hand, when the second reversing unit 41b is used, the indexer robot 3 can insert the substrate 9 into the sending slot 42 if only the reversing operation of the second reversing unit 41b is waited.
　上記ステップＳ１６に関して、スケジューリング部７１１では、原則として、処理部６１内の注目基板９が収納容器Ｃにより早く搬送可能なように、第１または第２反転部４１ａ，４１ｂの一方が選択されている。既述のように、センタロボット５は、取込姿勢の反転部４１ａ，４１ｂの取込スロット４３に基板９を挿入する。したがって、例えば、第１反転部４１ａが送出姿勢であり、かつ、送出スロット４２に基板９が挿入されておらず、第２反転部４１ｂが取込姿勢であり、かつ、取込スロット４３に基板９が挿入されていない状態では、第２反転部４１ｂが選択される。これにより、センタロボット５が、基板９を直ぐに取込スロット４３に挿入することが可能である。 Regarding step S16, the scheduling unit 711 selects one of the first and second reversing units 41a and 41b so that, in principle, the target substrate 9 in the processing unit 61 can be transported to the storage container C earlier. . As described above, the center robot 5 inserts the substrate 9 into the intake slot 43 of the reversing portion 41a, 41b of the intake posture. Therefore, for example, the first reversing part 41a is in the sending posture, the board 9 is not inserted into the sending slot 42, the second reversing part 41b is in the taking posture, and the board is placed in the taking slot 43. In a state where 9 is not inserted, the second inverting unit 41b is selected. Thus, the center robot 5 can immediately insert the substrate 9 into the take-in slot 43.
　以上のように、好ましいスケジューリング部７１１では、各反転部４１ａ，４１ｂの姿勢、および、各反転部４１ａ，４１ｂにおける基板９の保持の有無等に基づいて、注目基板９をより早く搬送可能な反転部４１ａ，４１ｂが選択される。 As described above, in the preferable scheduling unit 711, the reversal that can transport the target substrate 9 faster based on the posture of the reversing units 41a and 41b, the presence or absence of holding of the substrate 9 in the reversing units 41a and 41b, and the like. The units 41a and 41b are selected.
　実際の基板処理装置１では、図７に示すように、処理対象の複数の基板９に対して裏面処理動作が行われる（ステップＳ２１）。このとき、後述するように、一の基板９に対する裏面処理動作に部分的に並行しつつ、収納容器Ｃ内の他の未処理の基板９に対して裏面処理動作が行われる。また、全ての処理部６１において基板９が処理されており、いずれかの処理部６１における処理の完了を待って当該処理部６１へと搬送されるべき未処理の基板９が収納容器Ｃ内に存在する高稼働状態では、所定の空反転条件が成立する場合に、第１または第２反転部４１ａ，４１ｂの空反転が行われる（ステップＳ２２）。本実施の形態における空反転は、特に言及する場合を除き、送出スロット４２および取込スロット４３に基板９が挿入されておらず、かつ、取込姿勢である第１または第２反転部４１ａ，４１ｂを送出姿勢とする動作である。空反転条件については後述する。そして、処理対象の全ての基板９に対する裏面処理動作が終了すると、基板処理装置１における複数の基板９の処理が完了する（ステップＳ２３）。 In the actual substrate processing apparatus 1, as shown in FIG. 7, the back surface processing operation is performed on the plurality of substrates 9 to be processed (Step S21). At this time, as described later, the back surface processing operation is performed on another unprocessed substrate 9 in the storage container C while partially paralleling the back surface processing operation on one substrate 9. Further, the substrates 9 are processed in all the processing units 61, and the unprocessed substrates 9 to be transported to the processing units 61 after the completion of the processing in any one of the processing units 61 are stored in the storage container C. In the existing high operation state, the idle inversion of the first or second inversion unit 41a, 41b is performed when a predetermined idle inversion condition is satisfied (step S22). Except for the case where the substrate 9 is not inserted into the sending slot 42 and the receiving slot 43 and the first or second reversing part 41a, 41a, This is an operation of setting the sending posture to 41b. The sky inversion condition will be described later. When the back surface processing operation for all the substrates 9 to be processed is completed, the processing of the plurality of substrates 9 in the substrate processing apparatus 1 is completed (Step S23).
　次に、複数の基板９に対する裏面処理動作における各構成要素の動作タイミング（すなわち、スケジューリング部７１１により計画された動作タイミング）について詳細に説明する。図８は、高稼働状態の基板処理装置１におけるタイムチャートを示す図である。図８（並びに、後述の図９ないし図１４）において、ＳＴは容器載置部２、ＩＲはインデクサロボット３、ＲＶＰ１は第１反転部４１ａ、ＲＶＰ２は第２反転部４１ｂ、ＣＲはセンタロボット５、ＳＰＩＮ１～ＳＰＩＮ６は第１ないし第６処理部６１を示す。ここでは、図示の都合上、６個の処理部６１のみを示している。ブロック内に示すアルファベットは、容器載置部２、インデクサロボット３、第１反転部４１ａ、第２反転部４１ｂ、センタロボット５、第１ないし第６処理部６１における動作の対象となる基板９を識別するためのものである。 Next, the operation timing of each component in the back surface processing operation on the plurality of substrates 9 (that is, the operation timing planned by the scheduling unit 711) will be described in detail. FIG. 8 is a diagram showing a time chart in the substrate processing apparatus 1 in a high operation state. In FIG. 8 (and FIGS. 9 to 14 to be described later), ST is the container placing section 2, IR is the indexer robot 3, RVP1 is the first reversing section 41a, RVP2 is the second reversing section 41b, and CR is the center robot 5. , SPIN1 to SPIN6 indicate first to sixth processing units 61. Here, only six processing units 61 are shown for convenience of illustration. The alphabets shown in the blocks indicate the substrates 9 to be operated in the container mounting unit 2, the indexer robot 3, the first reversing unit 41a, the second reversing unit 41b, the center robot 5, and the first to sixth processing units 61. It is for identification.
　ＳＴとＩＲとの間の矢印は、容器載置部２とインデクサロボット３との間の基板９の受け渡しを示し、ＩＲとＲＶＰ１またはＲＶＰ２との間の矢印は、インデクサロボット３と第１または第２反転部４１ａ，４１ｂとの間の基板９の受け渡しを示す。ＲＶＰ１またはＲＶＰ２とＣＲとの間の矢印は、第１または第２反転部４１ａ，４１ｂとセンタロボット５との間の基板９の受け渡しを示し、ＣＲとＳＰＩＮ１～ＳＰＩＮ６との間の矢印は、センタロボット５と第１ないし第６処理部６１との間の基板９の受け渡しを示す。ＲＶＰ１およびＲＶＰ２におけるブロックの下側に示す「ＲＥＶＥＲＳＥ」は、第１および第２反転部４１ａ，４１ｂにおける反転動作を示す。ＳＰＩＮ１～ＳＰＩＮ６におけるブロックの下側に示す「ＰＲＯＣＥＳＳ」は、第１ないし第６処理部６１における処理の開始を示す。 The arrow between ST and IR indicates the transfer of the substrate 9 between the container mounting unit 2 and the indexer robot 3, and the arrow between IR and RVP1 or RVP2 indicates the transfer between the indexer robot 3 and the first or the second. 9 shows the transfer of the substrate 9 between the two reversing units 41a and 41b. The arrow between RVP1 or RVP2 and CR indicates the transfer of the substrate 9 between the first or second reversing unit 41a, 41b and the center robot 5, and the arrow between CR and SPIN1 to SPIN6 indicates the center. The transfer of the substrate 9 between the robot 5 and the first to sixth processing units 61 is shown. “REVERSE” shown below the block in RVP1 and RVP2 indicates the inversion operation in the first and second inversion units 41a and 41b. “PROCESS” shown below the block in SPIN1 to SPIN6 indicates the start of processing in the first to sixth processing units 61.
　図９は、高稼働状態における第１および第２反転部４１ａ，４１ｂの動作を示す図である。図９では、各反転部４１ａ，４１ｂ（ＲＶＰ１またはＲＶＰ２）の２つの取込スロット４３に対して「１」および「２」の番号を付し、２つの送出スロット４２に対して「３」および「４」の番号を付している。また、反転動作を示す矢印Ａ１（１つの矢印に符号Ａ１ａを付す。）の左側に、反転動作の直前におけるスロットの並びを番号で示し、矢印Ａ１の右側に、反転動作の直後におけるスロットの並びを番号で示している。後述の図１２ないし図１４において同様である。 FIG. 9 is a diagram showing the operation of the first and second reversing units 41a and 41b in the high operation state. In FIG. 9, the numbers “1” and “2” are assigned to the two intake slots 43 of each of the reversing units 41 a and 41 b (RVP1 or RVP2), and “3” and “2” are assigned to the two sending slots 42. The number “4” is assigned. In addition, the sequence of slots immediately before the inversion operation is indicated by a number on the left side of an arrow A1 indicating one of the inversion operations (one arrow is denoted by the symbol A1a), and the arrangement of slots immediately after the inversion operation is on the right side of the arrow A1. Are indicated by numbers. The same applies to FIGS. 12 to 14 described later.
　図９では、インデクサロボット３およびセンタロボット５において基板９を保持する位置（保持部またはハンド）も示している。ＩＲの右側に示すＵｐ－Ｕｐは上ハンド３１の上保持部を示し、Ｌｗ－Ｕｐは上ハンド３１の下保持部を示し、Ｕｐ－Ｌｗは下ハンド３１の上保持部を示し、Ｌｗ－Ｌｗは下ハンド３１の下保持部を示す。また、ＣＲの右側に示すＵｐ－Ｕｐは上ハンド群５１０の上ハンド５１を示し、Ｕｐ－Ｌｗは下ハンド群５１０の上ハンド５１を示し、Ｌｗ－Ｕｐは上ハンド群５１０の下ハンド５１を示し、Ｌｗ－Ｌｗは下ハンド群５１０の下ハンド５１を示す。後述するように、インデクサロボット３では、未処理の基板９は、上ハンド３１または下ハンド３１の下保持部で保持され、処理済みの基板９は、上ハンド３１または下ハンド３１の上保持部で保持される。また、センタロボット５では、未処理の基板９は、上ハンド群５１０または下ハンド群５１０の下ハンド５１で保持され、処理済みの基板９は、上ハンド群５１０または下ハンド群５１０の上ハンド５１で保持される。 FIG. 9 also shows the position (holding unit or hand) where the substrate 9 is held in the indexer robot 3 and the center robot 5. Up-Up shown on the right side of the IR indicates the upper holder of the upper hand 31, Lw-Up indicates the lower holder of the upper hand 31, Up-Lw indicates the upper holder of the lower hand 31, Lw-Lw Indicates a lower holding portion of the lower hand 31. Up-Up shown on the right side of the CR indicates the upper hand 51 of the upper hand group 510, Up-Lw indicates the upper hand 51 of the lower hand group 510, and Lw-Up indicates the lower hand 51 of the upper hand group 510. Lw-Lw indicates the lower hand 51 of the lower hand group 510. As described later, in the indexer robot 3, the unprocessed substrate 9 is held by the lower holding portion of the upper hand 31 or the lower hand 31, and the processed substrate 9 is held by the upper holding portion of the upper hand 31 or the lower hand 31. Is held. In the center robot 5, the unprocessed substrate 9 is held by the upper hand group 510 or the lower hand group 510 by the lower hand 51, and the processed substrate 9 is processed by the upper hand group 510 or the lower hand group 510. It is held at 51.
　ここでは、全ての処理部６１に基板９が搬入されており、いずれかの処理部６１における処理の完了を待って当該処理部６１へと搬送されるべき未処理の基板９が収納容器Ｃ内に存在する状態、すなわち、高稼働状態であるものとする。一部の処理部６１における基板９の処理の完了が近づくと、容器載置部２上の収納容器Ｃ内の「Ｆ」および「Ｇ」の未処理基板９がインデクサロボット３により取り出される。このとき、「Ｆ」および「Ｇ」の未処理基板９は、上ハンド３１の下保持部、および、下ハンド３１の下保持部によりそれぞれ保持される。 Here, the substrate 9 is carried into all the processing units 61, and the unprocessed substrate 9 to be transported to the processing unit 61 after the completion of the processing in any one of the processing units 61 is stored in the storage container C. , That is, a high operation state. When the processing of the substrate 9 in some of the processing units 61 is nearly completed, the unprocessed substrates 9 of “F” and “G” in the storage container C on the container mounting unit 2 are taken out by the indexer robot 3. At this time, the unprocessed substrates 9 of “F” and “G” are respectively held by the lower holding unit of the upper hand 31 and the lower holding unit of the lower hand 31.
　「Ｆ」および「Ｇ」の未処理基板９は、第１反転部４１ａの「３」および「４」の送出スロット４２にそれぞれ挿入される。「３」および「４」の送出スロット４２は下側に位置しており、第１反転部４１ａは送出姿勢である。第１反転部４１ａの反転動作により、「Ｆ」および「Ｇ」の未処理基板９が反転される。また、「３」および「４」の送出スロット４２が上側に位置し、第１反転部４１ａが取込姿勢となる。第１反転部４１ａの「Ｇ」および「Ｆ」の未処理基板９は、センタロボット５により取り出される。このとき、「Ｇ」および「Ｆ」の未処理基板９は、上ハンド群５１０の下ハンド５１、および、下ハンド群５１０の下ハンド５１によりそれぞれ保持される。その後、上ハンド群５１０では、上ハンド５１で第１処理部６１内の「ａ」の処理済み基板９が取り出され、下ハンド５１で保持している「Ｇ」の未処理基板９が第１処理部６１内のチャック部に受け渡される（すなわち、「Ｇ」の未処理基板９が第１処理部６１内に搬入される）。また、下ハンド群５１０では、上ハンド５１で第２処理部６１内の「ｂ」の処理済み基板９が取り出され、下ハンド５１で保持している「Ｆ」の未処理基板９が第２処理部６１内に搬入される。これにより、センタロボット５では、「ａ」および「ｂ」の処理済み基板９を保持した状態となる。第１および第２処理部６１では、「Ｇ」および「Ｆ」の未処理基板９に対して処理が開始される。 未 The unprocessed substrates 9 of “F” and “G” are inserted into the sending slots 42 of “3” and “4” of the first reversing unit 41a, respectively. The “3” and “4” sending slots 42 are located on the lower side, and the first reversing unit 41a is in the sending posture. The “F” and “G” unprocessed substrates 9 are reversed by the reversing operation of the first reversing unit 41a. The “3” and “4” sending slots 42 are located on the upper side, and the first reversing part 41a is in the taking posture. The “G” and “F” unprocessed substrates 9 in the first reversing unit 41 a are taken out by the center robot 5. At this time, the unprocessed substrates 9 of “G” and “F” are held by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510, respectively. Thereafter, in the upper hand group 510, the processed substrate 9 of “a” in the first processing unit 61 is taken out by the upper hand 51, and the unprocessed substrate 9 of “G” held by the lower hand 51 is removed by the first hand. The unprocessed substrate 9 of “G” is transferred into the first processing unit 61 (ie, transferred to the chuck unit in the processing unit 61). In the lower hand group 510, the processed substrate 9 of “b” in the second processing unit 61 is taken out by the upper hand 51, and the unprocessed substrate 9 of “F” held by the lower hand 51 is removed by the second hand. It is carried into the processing section 61. Thus, the center robot 5 is in a state of holding the processed substrates 9 of “a” and “b”. In the first and second processing units 61, processing is started on the unprocessed substrates 9 of "G" and "F".
　ここで、本実施の形態では、高稼働状態において、一方の反転部の送出スロット４２および取込スロット４３に基板９が挿入されておらず、かつ、当該一方の反転部が取込姿勢となっており、さらに、他方の反転部の送出スロット４２に未処理基板が挿入されることが、当該一方の反転部の空反転条件となる。「Ｆ」および「Ｇ」の未処理基板９が取り出されることにより、第１反転部４１ａの送出スロット４２および取込スロット４３にいずれの基板９も挿入されておらず、かつ、第１反転部４１ａが取込姿勢となっている。また、後述するように、第１反転部４１ａの上記反転動作（「Ｆ」および「Ｇ」の未処理基板９の反転動作）に並行して、第２反転部４１ｂの送出スロット４２に未処理基板９が挿入される。したがって、第１反転部４１ａの空反転条件が成立し、図９中に矢印Ａ１ａで示すように、第１反転部４１ａの空反転が行われる。これにより、第１反転部４１ａが送出姿勢となる。図８では、内部に平行斜線を付すブロックＢ１により空反転を示している。空反転後の第１反転部４１ａの動作については後述する。 Here, in the present embodiment, in the high operation state, the board 9 is not inserted into the sending slot 42 and the taking slot 43 of one of the reversing parts, and the one reversing part is in the taking posture. In addition, the insertion of an unprocessed substrate into the sending slot 42 of the other inverting unit is a condition of the empty inverting of the one inverting unit. When the unprocessed substrates 9 of “F” and “G” are taken out, no substrates 9 are inserted in the sending slot 42 and the taking-in slot 43 of the first reversing unit 41a, and the first reversing unit 41a is in the taking posture. Further, as described later, in parallel with the above-described reversing operation of the first reversing unit 41a (the reversing operation of the unprocessed substrates 9 of “F” and “G”), the unprocessed transmission slot 42 of the second reversing unit 41b is used. The substrate 9 is inserted. Therefore, the empty reversal condition of the first reversing unit 41a is satisfied, and the empty reversal of the first reversing unit 41a is performed as indicated by an arrow A1a in FIG. As a result, the first reversing unit 41a assumes the sending posture. In FIG. 8, empty reversal is indicated by a block B1 with a parallel oblique line inside. The operation of the first reversing unit 41a after the empty reversal will be described later.
　インデクサロボット３では、上述の「Ｆ」および「Ｇ」の未処理基板９の第１反転部４１ａへの搬送後、収納容器Ｃ内の「Ｈ」および「Ｉ」の未処理基板９が取り出される。このとき、「Ｈ」および「Ｉ」の未処理基板９は、上ハンド３１の下保持部、および、下ハンド３１の下保持部によりそれぞれ保持される。「Ｈ」および「Ｉ」の未処理基板９は、第２反転部４１ｂの「３」および「４」の送出スロット４２にそれぞれ挿入される。「３」および「４」の送出スロット４２は下側に位置しており、第２反転部４１ｂは送出姿勢である。第２反転部４１ｂの反転動作により、「Ｈ」および「Ｉ」の未処理基板９が反転される。また、「３」および「４」の送出スロット４２が上側に位置し、第２反転部４１ｂが取込姿勢となる。 In the indexer robot 3, after the above-described “F” and “G” unprocessed substrates 9 are transported to the first reversing portion 41a, the “H” and “I” unprocessed substrates 9 in the storage container C are taken out. . At this time, the unprocessed substrates 9 of “H” and “I” are respectively held by the lower holding unit of the upper hand 31 and the lower holding unit of the lower hand 31. The “H” and “I” unprocessed substrates 9 are inserted into the “3” and “4” transmission slots 42 of the second reversing unit 41b, respectively. The “3” and “4” sending slots 42 are located on the lower side, and the second reversing unit 41b is in the sending posture. The “H” and “I” unprocessed substrates 9 are inverted by the inversion operation of the second inversion unit 41b. The “3” and “4” sending slots 42 are located on the upper side, and the second reversing part 41b is in the taking posture.
　第２反転部４１ｂの「Ｉ」および「Ｈ」の未処理基板９は、センタロボット５の上ハンド群５１０の下ハンド５１、および、下ハンド群５１０の下ハンド５１によりそれぞれ保持され、取り出される。このとき、センタロボット５は、「ａ」および「ｂ」の処理済み基板９を、上ハンド群５１０の上ハンド５１、および、下ハンド群５１０の上ハンド５１により保持している。続いて、「ａ」および「ｂ」の処理済み基板９が、取込姿勢の第２反転部４１ｂにおける、「２」および「１」の取込スロット４３にそれぞれ挿入される。このようにして、センタロボット５と第２反転部４１ｂとの間において、２つの未処理基板９と２つの処理済み基板９との交換（以下、単に「基板交換」ともいう。）が行われる。 The unprocessed substrates 9 of “I” and “H” of the second reversing unit 41b are held and taken out by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510 of the center robot 5, respectively. . At this time, the center robot 5 holds the processed substrates 9 of “a” and “b” by the upper hand 51 of the upper hand group 510 and the upper hand 51 of the lower hand group 510. Subsequently, the processed substrates 9 of “a” and “b” are inserted into the “2” and “1” capture slots 43 in the second reversing portion 41b in the capture posture, respectively. In this way, the exchange between the two unprocessed substrates 9 and the two processed substrates 9 (hereinafter, simply referred to as “substrate exchange”) is performed between the center robot 5 and the second reversing unit 41b. .
　このとき、センタロボット５では、「ａ」および「ｂ」の処理済み基板９、および、「Ｉ」および「Ｈ」の未処理基板９が一時的に同時に保持されるが、いずれの処理済み基板９も上ハンド５１に保持され、いずれの未処理基板９も下ハンド５１に保持される。したがって、未処理基板９からのダストの落下により処理済み基板９が汚染されることはない。また、未処理基板９のダストがハンド５１を介して処理済み基板９に付着することも防止される。さらに、第２反転部４１ｂでは、下側に位置する取込スロット４３に処理済み基板９が挿入されるが、処理済み基板９の挿入前に、送出スロット４２から未処理基板９が取り出される。したがって、送出スロット４２内の未処理基板９からのダストの落下により、取込スロット４３内の処理済み基板９が汚染されることはない。 At this time, in the center robot 5, the processed substrates 9 of “a” and “b” and the unprocessed substrates 9 of “I” and “H” are temporarily held simultaneously. 9 are also held by the upper hand 51, and any unprocessed substrates 9 are held by the lower hand 51. Therefore, the processed substrate 9 is not contaminated by dust falling from the unprocessed substrate 9. Further, dust of the unprocessed substrate 9 is prevented from adhering to the processed substrate 9 via the hand 51. Further, in the second reversing section 41b, the processed substrate 9 is inserted into the lower intake slot 43, but the unprocessed substrate 9 is taken out from the sending slot 42 before the processed substrate 9 is inserted. Therefore, the processed substrate 9 in the intake slot 43 is not contaminated by the fall of dust from the unprocessed substrate 9 in the sending slot 42.
　その後、第２反転部４１ｂの反転動作により、「ａ」および「ｂ」の処理済み基板９が反転される。また、「１」および「２」の取込スロット４３が上側に位置し、第２反転部４１ｂが送出姿勢となる。センタロボット５の上ハンド群５１０では、第３処理部６１内の「ｃ」の処理済み基板９が取り出され、「Ｉ」の未処理基板９が第３処理部６１内に搬入される。下ハンド群５１０では、第４処理部６１内の「ｄ」の処理済み基板９が取り出され、「Ｈ」の未処理基板９が第４処理部６１内に搬入される。これにより、センタロボット５では、「ｃ」および「ｄ」の処理済み基板９を保持した状態となる。第３および第４処理部６１では、「Ｉ」および「Ｈ」の未処理基板９に対して処理が開始される。 Thereafter, the processed substrates 9 of “a” and “b” are inverted by the inversion operation of the second inversion unit 41b. The “1” and “2” intake slots 43 are located on the upper side, and the second reversing unit 41b is in the sending posture. In the upper hand group 510 of the center robot 5, the processed substrate 9 of “c” in the third processing unit 61 is taken out, and the unprocessed substrate 9 of “I” is carried into the third processing unit 61. In the lower hand group 510, the “d” processed substrate 9 in the fourth processing unit 61 is taken out, and the “H” unprocessed substrate 9 is carried into the fourth processing unit 61. As a result, the center robot 5 is in a state of holding the processed substrates 9 of “c” and “d”. In the third and fourth processing units 61, processing is started on the unprocessed substrates 9 of "I" and "H".
　インデクサロボット３では、センタロボット５と第２反転部４１ｂとの間における上記基板交換に並行して、収納容器Ｃ内の「Ｊ」および「Ｋ」の未処理基板９が取り出される。「Ｊ」および「Ｋ」の未処理基板９は、空反転により送出姿勢となった第１反転部４１ａの「３」および「４」の送出スロット４２にそれぞれ挿入される。第１反転部４１ａの反転動作により、「Ｊ」および「Ｋ」の未処理基板９が反転されるとともに、第１反転部４１ａが取込姿勢となる。 In the indexer robot 3, unprocessed substrates 9 of "J" and "K" in the storage container C are taken out in parallel with the substrate exchange between the center robot 5 and the second reversing section 41b. The unprocessed substrates 9 of “J” and “K” are respectively inserted into the “3” and “4” transmission slots 42 of the first reversing unit 41a that has been in the transmission posture due to the empty reversal. By the reversing operation of the first reversing unit 41a, the unprocessed substrates 9 of “J” and “K” are reversed, and the first reversing unit 41a is in the taking posture.
　第１反転部４１ａの「Ｋ」および「Ｊ」の未処理基板９は、センタロボット５の上ハンド群５１０の下ハンド５１、および、下ハンド群５１０の下ハンド５１によりそれぞれ保持され、取り出される。このとき、センタロボット５は、「ｃ」および「ｄ」の処理済み基板９を、上ハンド群５１０の上ハンド５１、および、下ハンド群５１０の上ハンド５１により保持している。続いて、「ｃ」および「ｄ」の処理済み基板９が、取込姿勢の第１反転部４１ａにおける、「２」および「１」の取込スロット４３にそれぞれ挿入される。このようにして、センタロボット５と第１反転部４１ａとの間において、２つの未処理基板９と２つの処理済み基板９との交換（すなわち、基板交換）が行われる。ここでの基板交換は、第１反転部４１ａを空反転し、第１反転部４１ａに２つの未処理基板９を投入しておくことにより可能となる。また、センタロボット５が第３および第４処理部６１にアクセスしている間に、第１反転部４１ａの上記反転動作（「Ｊ」および「Ｋ」の未処理基板９の反転動作）が行われるため、センタロボット５では過度な待ち時間なく、第１反転部４１ａとの間の基板交換が可能となる。その後、第１反転部４１ａの反転動作により、「ｃ」および「ｄ」の処理済み基板９が反転される。「Ｋ」および「Ｊ」の未処理基板９に対するその後の動作は、既述の未処理基板９と同様であるため、説明を省略する。 The unprocessed substrates 9 of “K” and “J” of the first reversing unit 41a are held and taken out by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510 of the center robot 5, respectively. . At this time, the center robot 5 holds the processed substrates 9 of “c” and “d” by the upper hand 51 of the upper hand group 510 and the upper hand 51 of the lower hand group 510. Subsequently, the processed substrates 9 of “c” and “d” are inserted into the “2” and “1” capture slots 43 in the first reversing portion 41a in the capture posture, respectively. In this way, the exchange between the two unprocessed substrates 9 and the two processed substrates 9 (that is, substrate exchange) is performed between the center robot 5 and the first reversing unit 41a. The substrate exchange here can be performed by emptying the first reversing unit 41a and putting two unprocessed substrates 9 into the first reversing unit 41a. Further, while the center robot 5 is accessing the third and fourth processing units 61, the above-described reversing operation of the first reversing unit 41a (reversing operation of the unprocessed substrates 9 of “J” and “K”) is performed. Therefore, the center robot 5 can exchange the board with the first reversing unit 41a without an excessive waiting time. Thereafter, the processed substrates 9 of “c” and “d” are reversed by the reversing operation of the first reversing unit 41a. Subsequent operations on the unprocessed substrates 9 of “K” and “J” are the same as those of the unprocessed substrate 9 described above, and thus description thereof will be omitted.
　一方、第２反転部４１ｂでは、取込スロット４３内の「ａ」および「ｂ」の処理済み基板９の反転が完了しており、第２反転部４１ｂが送出姿勢となっている。収納容器Ｃ内の「Ｌ」および「Ｍ」の未処理基板９が、インデクサロボット３の上ハンド３１の下保持部、および、下ハンド３１の下保持部によりそれぞれ保持され、送出姿勢の第２反転部４１ｂの「３」および「４」の送出スロット４２にそれぞれ挿入される。続いて、「１」および「２」の取込スロット４３内の「ｂ」および「ａ」の処理済み基板９が、上ハンド３１の上保持部、および、下ハンド３１の上保持部により保持され、収納容器Ｃ内に戻される。このようにして、インデクサロボット３と第２反転部４１ｂとの間において、２つの未処理基板９と２つの処理済み基板９との交換（すなわち、基板交換）が行われる。 On the other hand, in the second reversing unit 41b, the reversal of the processed substrates 9 of “a” and “b” in the intake slot 43 has been completed, and the second reversing unit 41b is in the sending posture. The “L” and “M” unprocessed substrates 9 in the storage container C are respectively held by the lower holding part of the upper hand 31 and the lower holding part of the lower hand 31 of the indexer robot 3, and the second attitude of the sending posture is maintained. They are inserted into the “3” and “4” transmission slots 42 of the reversing unit 41b, respectively. Subsequently, the processed substrates 9 of “b” and “a” in the intake slots 43 of “1” and “2” are held by the upper holding unit of the upper hand 31 and the upper holding unit of the lower hand 31. Is returned to the storage container C. In this way, the exchange between the two unprocessed substrates 9 and the two processed substrates 9 (that is, substrate exchange) is performed between the indexer robot 3 and the second reversing unit 41b.
　このとき、インデクサロボット３では、いずれの処理済み基板９も上保持部に保持され、いずれの未処理基板９も下保持部に保持される。したがって、未処理基板９のダストがハンド３１を介して処理済み基板９に付着することが防止される。また、第２反転部４１ｂでは、「ｂ」および「ａ」の処理済み基板９、および、「Ｌ」および「Ｍ」の未処理基板９が一時的に同時に保持されるが、上側に位置する取込スロット４３に処理済み基板９が保持され、下側に位置する送出スロット４２に未処理基板９が保持される。したがって、未処理基板９からのダストの落下により処理済み基板９が汚染されることはない（第１反転部４１ａにおいて同様）。また、未処理基板９は送出スロット４２に挿入され、処理済み基板９は取込スロット４３に挿入される。したがって、未処理基板９のダストがスロットを介して処理済み基板９に付着することも防止される。「Ｌ」および「Ｍ」の未処理基板９に対するその後の動作は、既述の未処理基板９と同様であるため、説明を省略する。 At this time, in the indexer robot 3, all processed substrates 9 are held by the upper holding unit, and all unprocessed substrates 9 are held by the lower holding unit. Therefore, the dust of the unprocessed substrate 9 is prevented from adhering to the processed substrate 9 via the hand 31. In the second reversing unit 41b, the processed substrates 9 of “b” and “a” and the unprocessed substrates 9 of “L” and “M” are temporarily held at the same time, but are located on the upper side. The processed substrate 9 is held in the intake slot 43, and the unprocessed substrate 9 is held in the lower sending slot 42. Therefore, the processed substrate 9 is not contaminated by the drop of dust from the unprocessed substrate 9 (similarly in the first reversing section 41a). The unprocessed substrate 9 is inserted into the sending slot 42, and the processed substrate 9 is inserted into the intake slot 43. Therefore, the dust of the unprocessed substrate 9 is prevented from adhering to the processed substrate 9 via the slot. Subsequent operations on the unprocessed substrates 9 of “L” and “M” are the same as those of the unprocessed substrate 9 described above, and a description thereof will be omitted.
　また、第１反転部４１ａでは、既述のように、取込スロット４３内の「ｃ」および「ｄ」の処理済み基板９の反転が行われ、第１反転部４１ａが送出姿勢となっている。インデクサロボット３では、収納容器Ｃ内の「Ｎ」および「Ｏ」の未処理基板９が、第１反転部４１ａの２つの送出スロット４２にそれぞれ挿入される。このとき、インデクサロボット３が、「ａ」および「ｂ」の処理済み基板９を収納容器Ｃに戻す上記動作に並行して、第１反転部４１ａの上記反転動作（「ｃ」および「ｄ」の処理済み基板９の反転動作）が行われていることにより、インデクサロボット３では、過度な待ち時間なく、「Ｎ」および「Ｏ」の未処理基板９の第１反転部４１ａへの投入が可能である。その後、２つの取込スロット４３内の「ｃ」および「ｄ」の処理済み基板９が、収納容器Ｃ内に戻される。このようにして、インデクサロボット３と第１反転部４１ａとの間において、２つの未処理基板９と２つの処理済み基板９との交換（すなわち、基板交換）が行われる。「Ｎ」および「Ｏ」の未処理基板９に対するその後の動作は、既述の未処理基板９と同様であるため、説明を省略する。 Further, in the first reversing unit 41a, as described above, the processed substrates 9 of “c” and “d” in the intake slot 43 are reversed, and the first reversing unit 41a is in the sending posture. I have. In the indexer robot 3, the “N” and “O” unprocessed substrates 9 in the storage container C are inserted into the two sending slots 42 of the first reversing part 41a, respectively. At this time, in parallel with the above operation of returning the processed substrates 9 of “a” and “b” to the storage container C, the indexer robot 3 performs the above inversion operation (“c” and “d”) of the first inversion unit 41a. Of the processed substrate 9), the indexer robot 3 can input the unprocessed substrates 9 of “N” and “O” into the first reversing unit 41a without an excessive waiting time. It is possible. Thereafter, the processed substrates 9 of “c” and “d” in the two intake slots 43 are returned to the storage container C. In this way, the exchange between the two unprocessed substrates 9 and the two processed substrates 9 (that is, substrate exchange) is performed between the indexer robot 3 and the first reversing unit 41a. Subsequent operations on the unprocessed substrates 9 of “N” and “O” are the same as those of the unprocessed substrate 9 described above, and a description thereof will be omitted.
　図１０は、複数の基板９に対する裏面処理動作の開始直後におけるタイムチャートを示す図である。図１０に示すように、複数の基板９に対する裏面処理動作の開始直後には、複数の処理部６１に対して収納容器Ｃ内の未処理基板９を順次搬入する必要がある。この場合、各反転部４１ａ，４１ｂにおいて未処理基板９を反転し、当該未処理基板９を取り出した後、内部に平行斜線を付すブロックＢ２に示すように、空反転が行われる。同様に、複数の基板９に対する裏面処理動作の終了直前には、複数の処理部６１から収納容器Ｃ内に処理済み基板９を順次戻す必要がある。この場合も、各反転部４１ａ，４１ｂにおいて処理済み基板９を反転し、当該処理済み基板９を取り出した後、空反転が行われる。一方、図８中にブロックＢ１に示す空反転は、高稼働状態において空反転条件に従って行われるものであり、複数の基板９に対する裏面処理動作の開始直後、および、終了直前に行われる上記空反転とは異なる。 FIG. 10 is a diagram showing a time chart immediately after the start of the back surface processing operation on a plurality of substrates 9. As shown in FIG. 10, immediately after the start of the back surface processing operation on the plurality of substrates 9, the unprocessed substrates 9 in the storage container C need to be sequentially loaded into the plurality of processing units 61. In this case, after the unprocessed substrate 9 is inverted in each of the reversing sections 41a and 41b, and the unprocessed substrate 9 is taken out, the empty inversion is performed as shown in a block B2 with parallel oblique lines inside. Similarly, the processed substrates 9 need to be sequentially returned from the plurality of processing units 61 to the storage container C immediately before the end of the back surface processing operation on the plurality of substrates 9. Also in this case, after the processed substrate 9 is inverted in each of the reversing sections 41a and 41b, and the processed substrate 9 is taken out, the empty inversion is performed. On the other hand, the empty reversal indicated by block B1 in FIG. 8 is performed according to the empty reversal condition in the high operation state, and is performed immediately after the start of the back surface processing operation on a plurality of substrates 9 and immediately before the end. And different.
　高稼働状態における空反転条件は、第１または第２反転部４１ａ，４１ｂの空反転を行うことにより、基板処理装置１におけるスループットが向上する条件であればよく、図８および図９を参照して説明した空反転条件以外であってもよい。例えば、第１または第２反転部４１ａ，４１ｂの空反転を行うことにより、インデクサロボット３と当該反転部４１ａ，４１ｂとの間、または、センタロボット５と当該反転部４１ａ，４１ｂとの間で、２つの未処理基板９と２つの処理済み基板９との交換（すなわち、基板交換）が可能となる場合に、空反転が行われることが好ましい。 The idle reversal condition in the high operation state may be any condition that improves the throughput in the substrate processing apparatus 1 by performing the idle reversal of the first or second reversing unit 41a, 41b, and refer to FIG. 8 and FIG. Other than the empty inversion condition described above. For example, by performing idle reversal of the first or second reversing unit 41a, 41b, between the indexer robot 3 and the reversing unit 41a, 41b, or between the center robot 5 and the reversing unit 41a, 41b. When it is possible to exchange two unprocessed substrates 9 with two processed substrates 9 (that is, substrate exchange), it is preferable that the empty inversion is performed.
　一例では、高稼働状態において、第１および第２反転部４１ａ，４１ｂの双方が未処理基板９を保持しておらず、かつ、双方の反転部４１ａ，４１ｂが取込姿勢である場合、少なくとも一方の反転部４１ａ，４１ｂの空反転が行われることが好ましい。空反転の後、当該反転部４１ａ，４１ｂの送出スロット４２に未処理基板９が挿入され、さらに、当該反転部４１ａ，４１ｂの反転動作が行われることにより、当該反転部４１ａ，４１ｂが未処理基板９を保持した状態で取込姿勢となる。上記のように、未処理基板９を保持していない双方の反転部４１ａ，４１ｂが取込姿勢である場合、センタロボット５が未処理基板９を保持して処理部６１にアクセスしており、処理部６１から処理済み基板９を搬出すると考えられる。反転部４１ａ，４１ｂにおける反転動作にはある程度の時間を要するが、センタロボット５が処理部６１にアクセスしている間に、第１または第２反転部４１ａ，４１ｂを、未処理基板９を保持した状態で取込姿勢としておくことにより、上記処理済み基板９と未処理基板９との交換を過度な待ち時間なく行うことが可能となる。 In one example, at least in a case where both the first and second reversing units 41a and 41b do not hold the unprocessed substrate 9 and the two reversing units 41a and 41b are in the taking-up posture in the high operation state. It is preferable that one of the reversing portions 41a and 41b be idle-reversed. After the empty reversal, the unprocessed substrate 9 is inserted into the sending slot 42 of the reversing unit 41a, 41b, and the reversing unit 41a, 41b is further subjected to the reversing operation. With the substrate 9 held, the posture is taken. As described above, when both the reversing units 41a and 41b that do not hold the unprocessed substrate 9 are in the taking-in posture, the center robot 5 holds the unprocessed substrate 9 and accesses the processing unit 61, It is considered that the processed substrate 9 is unloaded from the processing unit 61. The reversing operation in the reversing units 41a and 41b requires some time, but the first or second reversing units 41a and 41b hold the unprocessed substrate 9 while the center robot 5 accesses the processing unit 61. By setting the loading posture in this state, it is possible to exchange the processed substrate 9 and the unprocessed substrate 9 without an excessive waiting time.
　次に、第１または第２反転部４１ａ，４１ｂの一方を省略し、１つの反転部のみを用いる比較例の基板処理装置について述べる。比較例の基板処理装置における反転部では、送出スロット４２と取込スロット４３とは区別されない。また、インデクサロボット３により下側の２つのスロットに未処理基板９が挿入され、センタロボット５により下側の２つのスロットに処理済み基板９が挿入される。 Next, a description will be given of a substrate processing apparatus of a comparative example in which one of the first and second reversing units 41a and 41b is omitted and only one reversing unit is used. In the reversing unit in the substrate processing apparatus of the comparative example, the sending slot 42 and the taking slot 43 are not distinguished. The unprocessed substrate 9 is inserted into the lower two slots by the indexer robot 3, and the processed substrate 9 is inserted into the lower two slots by the center robot 5.
　図１１は、比較例の基板処理装置におけるタイムチャートを示す図であり、図１２は、反転部の動作を示す図である。図１１および図１２は、図８および図９にそれぞれ対応する。また、図１１および図１２中のＲＶＰは上記１つの反転部を示す。比較例の基板処理装置では、インデクサロボット３およびセンタロボット５が反転部の動作の完了を待つ時間が長くなり、全体としての稼働率が低下してしまう。また、反転部では、未処理基板９が挿入されるスロットと、処理済み基板９が挿入されるスロットとが区別されないため、未処理基板９のダストがスロットを介して処理済み基板９に付着する可能性がある。 FIG. 11 is a diagram showing a time chart in the substrate processing apparatus of the comparative example, and FIG. 12 is a diagram showing the operation of the reversing unit. 11 and 12 correspond to FIGS. 8 and 9, respectively. In addition, RVP in FIGS. 11 and 12 indicates the one inversion unit. In the substrate processing apparatus of the comparative example, the time required for the indexer robot 3 and the center robot 5 to complete the operation of the reversing unit becomes longer, and the operating rate as a whole decreases. In the reversing unit, the slot into which the unprocessed substrate 9 is inserted is not distinguished from the slot into which the processed substrate 9 is inserted, so that dust of the unprocessed substrate 9 adheres to the processed substrate 9 via the slot. there is a possibility.
　これに対し、図１の基板処理装置１では、２つの反転部４１ａ，４１ｂが設けられる。これにより、インデクサロボット３およびセンタロボット５が、反転部４１ａ，４１ｂの動作の完了を待つ時間を、比較例の基板処理装置に比べて短くする（または、無くす）ことができ、稼働率を向上することができる。一例では、基板９の反転を行わない場合とほぼ同等の稼働率を実現することができる。また、各反転部４１ａ，４１ｂが、未処理基板９が挿入される送出スロット４２と、処理済み基板９が挿入される取込スロット４３とを備える。これにより、未処理基板９のダストがスロットを介して処理済み基板９に付着して、処理済み基板９が汚染されることを抑制することができる。 In contrast, in the substrate processing apparatus 1 of FIG. 1, two reversing sections 41a and 41b are provided. Accordingly, the time for the indexer robot 3 and the center robot 5 to wait for the completion of the operation of the reversing units 41a and 41b can be shortened (or eliminated) as compared with the substrate processing apparatus of the comparative example, and the operation rate is improved. can do. In one example, it is possible to realize an operation rate substantially equal to that when the substrate 9 is not inverted. Each of the reversing sections 41a and 41b includes a sending slot 42 into which the unprocessed substrate 9 is inserted and a take-in slot 43 into which the processed substrate 9 is inserted. Thereby, it is possible to prevent the dust of the unprocessed substrate 9 from adhering to the processed substrate 9 via the slot and contaminating the processed substrate 9.
　また、高稼働状態において、送出スロット４２および取込スロット４３に基板９が挿入されておらず、かつ、取込姿勢である第１または第２反転部４１ａ，４１ｂが、所定の条件において、空反転により送出姿勢とされる。そして、送出姿勢とされた当該反転部４１ａ，４１ｂの送出スロット４２に、インデクサロボット３により未処理基板９が挿入される。このように、高稼働状態において、基板９が挿入されていない第１または第２反転部４１ａ，４１ｂの反転（空反転）を行うことにより、当該反転部４１ａ，４１ｂとセンタロボット５との間で未処理基板９と処理済み基板９との交換を行うことができ、複数の基板９を効率よく処理することができる。 Further, in the high operation state, the first or second reversing portions 41a and 41b in which the substrate 9 is not inserted into the sending slot 42 and the taking slot 43 and the taking posture is empty under predetermined conditions. The sending posture is set by the inversion. Then, the unprocessed substrate 9 is inserted by the indexer robot 3 into the sending slot 42 of the reversing unit 41a, 41b in the sending posture. In this way, in the high operation state, the first or second reversing unit 41a, 41b in which the substrate 9 is not inserted is reversed (empty reversal), so that the position between the reversing units 41a, 41b and the center robot 5 is changed. Thus, the unprocessed substrate 9 and the processed substrate 9 can be exchanged, and a plurality of substrates 9 can be efficiently processed.
　好ましくは、高稼働状態において、第１および第２反転部４１ａ，４１ｂのうち、一方の反転部の送出スロット４２および取込スロット４３に基板９が挿入されておらず、かつ、当該一方の反転部が取込姿勢となっており、さらに、他方の反転部の送出スロット４２に未処理基板９が挿入される場合に、当該一方の反転部が空反転により送出姿勢とされる。これにより、当該一方の反転部４１ａ，４１ｂとセンタロボット５との間で未処理基板９と処理済み基板９との交換を行って、複数の基板９を効率よく処理することができる。 Preferably, in the high operation state, the substrate 9 is not inserted into the sending slot 42 and the take-in slot 43 of one of the first and second reversing sections 41a and 41b, and the other of the first and second reversing sections 41a and 41b. When the unprocessed substrate 9 is inserted into the sending slot 42 of the other inverting unit, the one inverting unit is set to the sending posture by idle inversion. Thus, the unprocessed substrate 9 and the processed substrate 9 are exchanged between the one of the reversing units 41a and 41b and the center robot 5, and the plurality of substrates 9 can be efficiently processed.
　基板処理装置１では、各反転部４１ａ，４１ｂの送出姿勢において、送出スロット４２が取込スロット４３の下方に位置する。これにより、送出姿勢の当該反転部４１ａ，４１ｂにおいて、処理済み基板９が未処理基板９の下方に配置されることを防止して、処理済み基板９が未処理基板９により汚染されることを抑制することができる。加えて、各反転部４１ａ，４１ｂが、送出スロット４２に未処理基板９が挿入された状態で取込姿勢となる場合に、センタロボット５により、送出スロット４２の未処理基板９が取り出された後、取込スロット４３に処理済み基板９が挿入される。これにより、取込姿勢の反転部４１ａ，４１ｂにおいて、処理済み基板９が未処理基板９の下方に配置されることを防止して、処理済み基板９が未処理基板９により汚染されることを抑制することができる。 In the substrate processing apparatus 1, the sending slot 42 is located below the take-in slot 43 in the sending posture of each of the reversing sections 41 a and 41 b. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 in the reversing sections 41 a and 41 b in the sending posture, and prevents the processed substrate 9 from being contaminated by the unprocessed substrate 9. Can be suppressed. In addition, when each of the reversing portions 41a and 41b is in the taking posture in a state where the unprocessed substrate 9 is inserted into the sending slot 42, the unprocessed substrate 9 in the sending slot 42 is taken out by the center robot 5. Thereafter, the processed substrate 9 is inserted into the intake slot 43. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 in the reversing portions 41 a and 41 b in the take-up posture, and prevents the processed substrate 9 from being contaminated by the unprocessed substrate 9. Can be suppressed.
　各反転部４１ａ，４１ｂでは、送出スロット４２および取込スロット４３の両方に基板９が入った状態において、反転機構４５による反転動作が禁止される。これにより、反転動作により、処理済み基板９が未処理基板９の下方に配置されることを防止することができる。 In each of the reversing units 41a and 41b, the reversing operation by the reversing mechanism 45 is prohibited when the substrate 9 is in both the sending slot 42 and the receiving slot 43. Thereby, it is possible to prevent the processed substrate 9 from being disposed below the unprocessed substrate 9 due to the inversion operation.
　各反転部４１ａ，４１ｂにおいて、送出スロット４２および取込スロット４３のそれぞれの個数は、２以外であってもよい。図１３では、送出スロット４２および取込スロット４３のそれぞれの個数が１である場合を示し、図１４では、送出スロット４２および取込スロット４３のそれぞれの個数が４である場合を示している。図１３および図１４の例でも、高稼働状態において、第１反転部４１ａ（ＲＶＰ１）の送出スロット４２および取込スロット４３に基板９が挿入されておらず、かつ、第１反転部４１ａが取込姿勢となっており、さらに、第２反転部４１ｂの送出スロット４２に未処理基板９が挿入される場合に、第１反転部４１ａの空反転条件が成立する。これにより、第１反転部４１ａの空反転が行われる（矢印Ａ１ａの反転動作参照）。その結果、当該第１反転部４１ａとセンタロボット５との間で未処理基板９と処理済み基板９との交換を行って、複数の基板９を効率よく処理することができる。第２反転部４１ｂの空反転条件が成立する場合も同様である。 に お い て In each of the reversing units 41a and 41b, the number of the sending slot 42 and the number of the receiving slot 43 may be other than two. FIG. 13 shows a case where the number of each of the sending slot 42 and the taking slot 43 is 1, and FIG. 14 shows a case where the number of each of the sending slot 42 and the taking slot 43 is 4. Also in the examples of FIGS. 13 and 14, in the high operation state, the board 9 is not inserted into the sending slot 42 and the receiving slot 43 of the first reversing unit 41a (RVP1), and the first reversing unit 41a is not When the unprocessed substrate 9 is inserted into the sending slot 42 of the second reversing section 41b, the empty reversing condition of the first reversing section 41a is satisfied. As a result, the first inverting section 41a is idle-inverted (see the inverting operation of the arrow A1a). As a result, the unprocessed substrate 9 and the processed substrate 9 are exchanged between the first reversing unit 41a and the center robot 5, and the plurality of substrates 9 can be efficiently processed. The same applies to the case where the empty reversal condition of the second reversing unit 41b is satisfied.
　上記処理例では、複数の基板９に対して裏面処理動作が行われるが、基板処理装置１では、処理部６１において、基板９のパターン面を上方に向けて、パターン面に対して処理液等による処理が行われてもよい。基板９のパターン面に対して処理部６１による処理を行うための一連の動作（以下、「パターン面処理動作」という。）では、インデクサロボット３により第１または第２反転部４１ａ，４１ｂの送出スロット４２に未処理基板９が挿入され、当該反転部４１ａ，４１ｂにおいて反転動作を行うことなく、センタロボット５により当該未処理基板９が取り出される。当該未処理基板９は、いずれかの処理部６１に搬入される。また、処理部６１においてパターン面に対する処理が行われた基板９、すなわち、処理済み基板９は、センタロボット５により取り出され、第１または第２反転部４１ａ，４１ｂの取込スロット４３に挿入される。そして、当該反転部４１ａ，４１ｂにおいて反転動作を行うことなく、インデクサロボット３により当該処理済み基板９が取り出され、収納容器Ｃに戻される。 In the above processing example, the back surface processing operation is performed on the plurality of substrates 9. However, in the substrate processing apparatus 1, the processing unit 61 faces the pattern surface of the substrate 9 upward, and the processing liquid or the like May be performed. In a series of operations for performing processing on the pattern surface of the substrate 9 by the processing unit 61 (hereinafter, referred to as “pattern surface processing operation”), the indexer robot 3 sends the first or second inverting units 41a and 41b. The unprocessed substrate 9 is inserted into the slot 42, and the center robot 5 takes out the unprocessed substrate 9 without performing the reversing operation in the reversing units 41a and 41b. The unprocessed substrate 9 is carried into one of the processing units 61. The substrate 9 on which the pattern surface has been processed in the processing unit 61, that is, the processed substrate 9 is taken out by the center robot 5, and inserted into the take-in slot 43 of the first or second reversing unit 41a, 41b. You. Then, the processed substrate 9 is taken out by the indexer robot 3 and returned to the storage container C without performing the reversing operation in the reversing units 41a and 41b.
　基板処理装置１では、パターン面処理動作と、裏面処理動作とが混在して行われてもよい。この場合に、高稼働状態において、次に処理部６１へと搬送されるべき未処理基板９に対して裏面処理動作が行われる場合には、送出スロット４２および取込スロット４３に基板９が挿入されておらず、かつ、取込姿勢である第１または第２反転部４１ａ，４１ｂを、空反転により送出姿勢とすることが好ましい。送出姿勢とされた当該反転部４１ａ，４１ｂの送出スロット４２には、インデクサロボット３により当該未処理基板９が挿入され、当該反転部４１ａ，４１ｂの反転動作が行われる。これにより、当該反転部４１ａ，４１ｂとセンタロボット５との間で、裏面が上方を向いた未処理基板９と、裏面またはパターン面が上方を向いた処理済み基板９との交換を行うことができ、複数の基板９を効率よく処理することができる。 In the substrate processing apparatus 1, the pattern surface processing operation and the back surface processing operation may be performed in a mixed manner. In this case, when the back surface processing operation is performed on the unprocessed substrate 9 to be transported next to the processing unit 61 in the high operation state, the substrate 9 is inserted into the sending slot 42 and the receiving slot 43. It is preferable that the first or second reversing unit 41a, 41b, which is not performed and is in the taking-in posture, is set to the sending posture by idle reversal. The unprocessed substrate 9 is inserted by the indexer robot 3 into the sending slot 42 of the reversing unit 41a, 41b in the sending posture, and the reversing operation of the reversing unit 41a, 41b is performed. Thereby, between the reversing parts 41a and 41b and the center robot 5, the exchange of the unprocessed substrate 9 whose back surface faces upward and the processed substrate 9 whose back surface or pattern surface faces upward can be performed. Thus, a plurality of substrates 9 can be efficiently processed.
　上記基板処理装置１では様々な変形が可能である。 で は Various modifications are possible in the substrate processing apparatus 1 described above.
　基板処理装置１では、各反転部４１ａ，４１ｂの取込姿勢において、取込スロット４３が送出スロット４２の上方に位置してもよい。これにより、取込姿勢の反転部４１ａ，４１ｂにおいて、処理済み基板９が未処理基板９の下方に配置されることを防止して、処理済み基板９が汚染されることを抑制することができる。加えて、各反転部４１ａ，４１ｂが、取込スロット４３に処理済み基板９が挿入された状態で送出姿勢となる場合、すなわち、送出姿勢において取込スロット４３が送出スロット４２の下方に位置する場合に、インデクサロボット３により、取込スロット４３の処理済み基板９が取り出された後、送出スロット４２に未処理基板９が挿入されることが好ましい。これにより、送出姿勢の反転部４１ａ，４１ｂにおいて、処理済み基板９が未処理基板９の下方に配置されることを防止して、処理済み基板９が汚染されることを抑制することができる。 In the substrate processing apparatus 1, the take-in slot 43 may be located above the sending slot 42 in the take-up posture of each of the reversing sections 41 a and 41 b. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 in the reversing portions 41a and 41b in the take-in attitude, thereby suppressing contamination of the processed substrate 9. . In addition, when each of the reversing portions 41a and 41b is in the sending posture in a state where the processed substrate 9 is inserted into the taking slot 43, that is, the taking slot 43 is located below the sending slot 42 in the sending posture. In this case, it is preferable that the unprocessed substrate 9 is inserted into the sending slot 42 after the processed substrate 9 in the intake slot 43 is taken out by the indexer robot 3. This prevents the processed substrate 9 from being disposed below the unprocessed substrate 9 in the reversing portions 41a and 41b in the sending posture, thereby suppressing contamination of the processed substrate 9.
　また、各反転部４１ａ，４１ｂにおける送出姿勢および取込姿勢において、例えば、送出スロット４２と取込スロット４３とが水平方向に離れた位置に配置されてもよい。反転部４１ａ，４１ｂにおける送出姿勢では、インデクサロボット３による未処理基板９の挿入に対応付けられた任意の位置に送出スロット４２が配置され、反転部４１ａ，４１ｂにおける取込姿勢では、センタロボット５による処理済み基板９の挿入に対応付けられた任意の位置に取込スロット４３が配置されてよい。 In addition, in the sending posture and the taking posture in each of the reversing parts 41a and 41b, for example, the sending slot 42 and the taking slot 43 may be arranged at positions horizontally separated from each other. In the sending posture in the reversing units 41a and 41b, the sending slot 42 is arranged at an arbitrary position corresponding to the insertion of the unprocessed substrate 9 by the indexer robot 3, and in the taking posture in the reversing units 41a and 41b, the center robot 5 is used. The take-in slot 43 may be arranged at an arbitrary position associated with the insertion of the processed substrate 9 according to (1).
　基板処理装置１において処理が行われる基板は半導体基板には限定されず、ガラス基板や他の基板であってもよい。また、基板処理装置１が、円板状とは異なる外形の基板の処理に用いられてもよい。 The substrate on which the processing is performed in the substrate processing apparatus 1 is not limited to a semiconductor substrate, and may be a glass substrate or another substrate. Further, the substrate processing apparatus 1 may be used for processing a substrate having an outer shape different from a disk shape.
　上記実施の形態および各変形例における構成は、相互に矛盾しない限り適宜組み合わされてよい。 The configurations in the above-described embodiment and each modified example may be appropriately combined as long as they do not conflict with each other.
　発明を詳細に描写して説明したが、既述の説明は例示的であって限定的なものではない。したがって、本発明の範囲を逸脱しない限り、多数の変形や態様が可能であるといえる。 Although the invention has been described and described in detail, the foregoing description is illustrative and not restrictive. Therefore, it can be said that many modifications and aspects are possible without departing from the scope of the present invention.
　１　　基板処理装置
　２　　容器載置部
　３　　インデクサロボット
　５　　センタロボット
　６　　処理ユニット
　９　　基板
　４１ａ　　第１反転部
　４１ｂ　　第２反転部
　４２　　送出スロット
　４３　　取込スロット
　４５　　反転機構
　６１　　処理部
　７１　　制御部
　Ｃ　　収納容器
　Ｓ１１，Ｓ１２ａ～Ｓ１４ａ，Ｓ１２ｂ～Ｓ１４ｂ，Ｓ１５，Ｓ１６，Ｓ１７ａ～Ｓ１９ａ，Ｓ１７ｂ～Ｓ１９ｂ，Ｓ２１～Ｓ２３　　ステップ DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Container mounting part 3 Indexer robot 5 Center robot 6 Processing unit 9 Substrate 41a 1st reversing part 41b 2nd reversing part 42 Sending slot 43 Take-in slot 45 Reversing mechanism 61 Processing part 71 Control part C Storage container S11 , S12a to S14a, S12b to S14b, S15, S16, S17a to S19a, S17b to S19b, S21 to S23

Claims (7)

  1. 　基板処理装置であって、
    　複数の基板を収納する収納容器が載置される容器載置部と、
    　それぞれが基板に対して処理を行う複数の処理部を有する処理ユニットと、
    　前記容器載置部と前記処理ユニットとの間に配置され、基板を反転する第１反転部と、
    　前記容器載置部と前記処理ユニットとの間に配置され、基板を反転する第２反転部と、
    　前記収納容器と前記第１および第２反転部との間で基板を搬送する容器側搬送部と、
    　前記第１および第２反転部と前記複数の処理部との間で基板を搬送する処理部側搬送部と、
    　前記第１反転部、前記第２反転部、前記容器側搬送部および前記処理部側搬送部を制御することにより、前記収納容器内の未処理の基板を前記第１または第２反転部で反転していずれかの処理部に搬入するとともに、前記処理部による処理済みの基板を前記第１または第２反転部で反転して前記収納容器内に戻す制御部と、
    を備え、
    　各反転部が、
    　前記容器側搬送部により前記収納容器内の未処理の基板が挿入される送出スロットと、
    　前記処理部側搬送部により前記処理部による処理済みの基板が挿入される取込スロットと、
    　前記送出スロットおよび前記取込スロットを一体的に反転することにより、前記容器側搬送部による未処理の基板の挿入に対応付けられた位置に前記送出スロットを配置した送出姿勢と、前記処理部側搬送部による処理済みの基板の挿入に対応付けられた位置に前記取込スロットを配置した取込姿勢とを切り替える反転機構と、
    を備え、
    　前記制御部の指令により、前記容器側搬送部が、前記収納容器内の未処理の基板を前記送出姿勢の前記第１または第２反転部の前記送出スロットに挿入し、前記処理部側搬送部が、前記処理部による処理済みの基板を前記取込姿勢の前記第１または第２反転部の前記取込スロットに挿入し、
    　いずれかの処理部における処理の完了を待って当該処理部へと搬送されるべき未処理の基板が前記収納容器内に存在する高稼働状態において、前記制御部が、前記送出スロットおよび前記取込スロットに基板が挿入されておらず、かつ、前記取込姿勢である前記第１または第２反転部を前記送出姿勢とし、前記送出姿勢とされた前記第１または第２反転部の前記送出スロットに、前記容器側搬送部により前記未処理の基板を挿入する。     A substrate processing apparatus,
    A container mounting portion on which a storage container for storing a plurality of substrates is mounted,
    A processing unit having a plurality of processing units each performing processing on the substrate,
    A first reversing unit that is disposed between the container mounting unit and the processing unit and that reverses a substrate;
    A second reversing unit that is disposed between the container mounting unit and the processing unit and that reverses a substrate;
    A container-side transfer unit that transfers a substrate between the storage container and the first and second reversing units;
    A processing unit-side transfer unit that transfers a substrate between the first and second reversing units and the plurality of processing units;
    By controlling the first reversing unit, the second reversing unit, the container-side transport unit, and the processing unit-side transport unit, an unprocessed substrate in the storage container is reversed by the first or second reversing unit. And a control unit for carrying the substrate into any one of the processing units, inverting the substrate processed by the processing unit in the first or second inverting unit, and returning the substrate into the storage container,
    With
    Each reversing part is
    A delivery slot into which an unprocessed substrate in the storage container is inserted by the container-side transfer unit,
    An intake slot into which the substrate processed by the processing unit is inserted by the processing unit-side transfer unit,
    By inverting the sending slot and the intake slot integrally, a sending attitude in which the sending slot is arranged at a position corresponding to the insertion of an unprocessed substrate by the container-side transfer unit, A reversing mechanism for switching between a capturing position in which the capturing slot is arranged at a position corresponding to the insertion of the processed substrate by the transport unit,
    With
    According to a command from the control unit, the container-side transport unit inserts an unprocessed substrate in the storage container into the delivery slot of the first or second reversing unit in the delivery attitude, and the processing-unit-side transport unit Inserts the substrate processed by the processing unit into the intake slot of the first or second reversing unit in the intake posture,
    In a high operation state in which an unprocessed substrate to be transported to the processing unit after the completion of the processing in any of the processing units is present in the storage container, the control unit may control the transmission slot and the loading. The board is not inserted into the slot, and the first or second reversing portion in the taking-in posture is the sending posture, and the sending slot of the first or second reversing portion in the sending posture is set. Then, the unprocessed substrate is inserted by the container-side transfer unit.
  2. 　請求項１に記載の基板処理装置であって、
    　前記高稼働状態において、前記第１および第２反転部のうち、一方の反転部の前記送出スロットおよび前記取込スロットに基板が挿入されておらず、かつ、前記一方の反転部が前記取込姿勢となっており、さらに、他方の反転部の前記送出スロットに未処理の基板が挿入される場合に、前記制御部が、前記一方の反転部を前記送出姿勢とする。     The substrate processing apparatus according to claim 1,
    In the high operation state, the board is not inserted into the sending slot and the take-in slot of one of the first and second reversing sections, and the one of the first and second reversing sections has When the unprocessed substrate is inserted into the sending slot of the other inverting unit, the control unit sets the one inverting unit to the sending posture.
  3. 　請求項１または２に記載の基板処理装置であって、
    　前記各反転部の前記送出姿勢において、前記送出スロットが前記取込スロットの下方に位置する、または、前記各反転部の前記取込姿勢において、前記取込スロットが前記送出スロットの上方に位置する。     The substrate processing apparatus according to claim 1, wherein:
    In the sending posture of each of the reversing parts, the sending slot is located below the intake slot, or in the taking posture of each of the inverting parts, the intake slot is located above the sending slot. .
  4. 　請求項３に記載の基板処理装置であって、
    　前記各反転部の前記送出姿勢において、前記送出スロットが前記取込スロットの下方に位置し、かつ、前記各反転部が、前記送出スロットに未処理の基板が挿入された状態で前記取込姿勢となる場合に、前記処理部側搬送部により、前記送出スロットの前記未処理の基板が取り出された後、前記取込スロットに処理済みの基板が挿入される、または、前記各反転部の前記取込姿勢において、前記取込スロットが前記送出スロットの上方に位置し、かつ、前記各反転部が、前記取込スロットに処理済みの基板が挿入された状態で前記送出姿勢となる場合に、前記容器側搬送部により、前記取込スロットの前記処理済みの基板が取り出された後、前記送出スロットに未処理の基板が挿入される。     The substrate processing apparatus according to claim 3, wherein
    In the sending posture of each of the reversing sections, the sending slot is located below the take-in slot, and each of the inverting sections is placed in the taking-up posture in a state where an unprocessed substrate is inserted into the sending slot. In this case, after the unprocessed substrate in the sending slot is taken out by the processing unit side transport unit, a processed substrate is inserted into the take-in slot, or the In the taking posture, when the taking slot is located above the sending slot, and each of the reversing parts is in the sending posture in a state where the processed substrate is inserted into the taking slot, After the processed substrate in the take-in slot is taken out by the container-side transport section, an unprocessed substrate is inserted into the delivery slot.
  5. 　請求項１ないし４のいずれか１つに記載の基板処理装置であって、
    　前記送出スロットおよび前記取込スロットの両方に基板が入った状態において、前記反転機構による反転動作が禁止される。     The substrate processing apparatus according to claim 1, wherein:
    In a state where the substrate is inserted into both the sending slot and the intake slot, the reversing operation by the reversing mechanism is prohibited.
  6. 　請求項１ないし５のいずれか１つに記載の基板処理装置であって、
    　前記複数の基板のそれぞれが、パターンが形成されたパターン面と、前記パターン面とは反対側の裏面とを有し、
    　前記収納容器において、前記複数の基板のそれぞれが前記パターン面を上方に向けて保持され、
    　前記複数の処理部において、基板の前記裏面に対して処理が行われる。     The substrate processing apparatus according to claim 1, wherein:
    Each of the plurality of substrates has a pattern surface on which a pattern is formed, and a back surface opposite to the pattern surface,
    In the storage container, each of the plurality of substrates is held with the pattern surface facing upward,
    In the plurality of processing units, processing is performed on the back surface of the substrate.
  7. 　基板処理装置における基板処理方法であって、
    　前記基板処理装置が、
    　複数の基板を収納する収納容器が載置される容器載置部と、
    　それぞれが基板に対して処理を行う複数の処理部を有する処理ユニットと、
    　前記容器載置部と前記処理ユニットとの間に配置され、基板を反転する第１反転部と、
    　前記容器載置部と前記処理ユニットとの間に配置され、基板を反転する第２反転部と、
    　前記収納容器と前記第１および第２反転部との間で基板を搬送する容器側搬送部と、
    　前記第１および第２反転部と前記複数の処理部との間で基板を搬送する処理部側搬送部と、
    を備え、
    　各反転部が、
    　前記容器側搬送部により前記収納容器内の未処理の基板が挿入される送出スロットと、
    　前記処理部側搬送部により前記処理部による処理済みの基板が挿入される取込スロットと、
    　前記送出スロットおよび前記取込スロットを一体的に反転することにより、前記容器側搬送部による未処理の基板の挿入に対応付けられた位置に前記送出スロットを配置した送出姿勢と、前記処理部側搬送部による処理済みの基板の挿入に対応付けられた位置に前記取込スロットを配置した取込姿勢とを切り替える反転機構と、
    を備え、
    　前記基板処理方法が、
    　ａ）前記容器側搬送部により、前記収納容器内の未処理の基板を前記送出姿勢のいずれかの反転部の前記送出スロットに挿入する工程と、
    　ｂ）前記反転部を前記取込姿勢として前記基板を反転する工程と、
    　ｃ）前記処理部側搬送部により、前記基板を前記反転部からいずれかの処理部に搬入する工程と、
    　ｄ）前記処理部において前記基板に対して処理を行う工程と、
    　ｅ）前記処理部による処理済みの前記基板を、前記処理部側搬送部により前記取込姿勢のいずれかの反転部の前記取込スロットに挿入する工程と、
    　ｆ）前記反転部を前記送出姿勢として前記基板を反転する工程と、
    　ｇ）前記容器側搬送部により、前記基板を前記反転部から前記収納容器内に戻す工程と、
    　ｈ）前記ａ）ないしｇ）工程に部分的に並行しつつ、前記収納容器内の他の未処理の基板に対して前記ａ）ないしｇ）工程と同様の動作を行う工程と、
    　ｉ）いずれかの処理部における処理の完了を待って当該処理部へと搬送されるべき未処理の基板が前記収納容器内に存在する高稼働状態において、前記送出スロットおよび前記取込スロットに基板が挿入されておらず、かつ、前記取込姿勢である前記第１または第２反転部を前記送出姿勢とする工程と、
    　ｊ）前記ｉ）工程において前記送出姿勢とされた前記第１または第２反転部の前記送出スロットに、前記容器側搬送部により前記未処理の基板を挿入する工程と、
    を備える。     A substrate processing method in a substrate processing apparatus,
    The substrate processing apparatus,
    A container mounting portion on which a storage container for storing a plurality of substrates is mounted,
    A processing unit having a plurality of processing units each performing processing on the substrate,
    A first reversing unit that is disposed between the container mounting unit and the processing unit and that reverses a substrate;
    A second reversing unit that is disposed between the container mounting unit and the processing unit and that reverses a substrate;
    A container-side transfer unit that transfers a substrate between the storage container and the first and second reversing units;
    A processing unit-side transfer unit that transfers a substrate between the first and second reversing units and the plurality of processing units;
    With
    Each reversing part is
    A delivery slot into which an unprocessed substrate in the storage container is inserted by the container-side transfer unit,
    An intake slot into which the substrate processed by the processing unit is inserted by the processing unit-side transfer unit,
    By inverting the sending slot and the intake slot integrally, a sending attitude in which the sending slot is arranged at a position corresponding to the insertion of an unprocessed substrate by the container-side transfer unit, A reversing mechanism for switching between a capturing position in which the capturing slot is arranged at a position corresponding to the insertion of the processed substrate by the transport unit,
    With
    The substrate processing method,
    a) inserting the unprocessed substrate in the storage container into the delivery slot of any of the reversing units in the delivery posture by the container-side transfer unit;
    b) a step of inverting the substrate with the inverting portion in the take-in position;
    c) a step of loading the substrate from the reversing unit into any of the processing units by the processing unit-side transfer unit;
    d) performing a process on the substrate in the processing unit;
    e) inserting the substrate processed by the processing unit into the capture slot of any of the reversing units in the capture attitude by the processing unit-side transfer unit;
    f) a step of inverting the substrate with the inverting section being in the sending posture;
    g) returning the substrate from the reversing unit into the storage container by the container-side transfer unit;
    h) performing the same operation as in the steps a) to g) on the other unprocessed substrates in the storage container while partially paralleling the steps a) to g);
    i) In a high operation state in which an unprocessed substrate to be transported to the processing unit after completion of the processing in any of the processing units is present in the storage container, the substrate is placed in the sending slot and the intake slot. Is not inserted, and the first or second reversing part in the taking-in posture is set to the sending posture;
    j) inserting the unprocessed substrate into the delivery slot of the first or second reversing unit in the delivery posture in the step i) by the container-side transport unit;
    Is provided.
PCT/JP2019/025957 2018-09-13 2019-06-28 Substrate processing device and substrate processing method WO2020054182A1 (en)

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