CN112437977B - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
CN112437977B
CN112437977B CN201980047542.5A CN201980047542A CN112437977B CN 112437977 B CN112437977 B CN 112437977B CN 201980047542 A CN201980047542 A CN 201980047542A CN 112437977 B CN112437977 B CN 112437977B
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reversing
substrate
unit
processing
section
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CN112437977A (en
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山本慎司
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Abstract

The first and second reversing sections (41 a, 41 b) are each provided with a feed-out tank, a feed-in tank, and a reversing mechanism. The reversing mechanism integrally reverses the feed-out tank and the take-in tank, thereby switching between a feed-out posture in which the feed-out tank is disposed at the lower side and a take-in posture in which the take-in tank is disposed at the lower side. An indexer robot (3) inserts an unprocessed substrate (9) into a feed slot of the first reversing section or the second reversing section in a feed posture; the central robot (5) inserts the processed substrate into the intake groove of the first inversion part or the second inversion part in the intake posture. Thus, the processed substrate can be prevented from being contaminated. In the high operation state, the first reversing section or the second reversing section in the take-in posture without inserting the substrate in the take-out groove and the take-in groove is set to the take-out posture, and the unprocessed substrate is inserted in the take-out groove of the reversing section. Thereby, a plurality of substrates can be efficiently processed.

Description

Substrate processing apparatus and substrate processing method
Technical Field
The present invention relates to a substrate processing apparatus and a substrate processing method.
Background
Conventionally, a substrate processing apparatus for performing various processes on a semiconductor substrate (hereinafter, simply referred to as a "substrate") has been used in the manufacture of semiconductor devices (semiconductor device). For example, in the substrate processing apparatus of japanese patent No. 4744426 (document 1), the front surface and the back surface of the substrate are reversed in the reversing unit, and the back surface is cleaned in the back surface cleaning unit. In this substrate processing apparatus, two reversing units are provided between an indexer robot (indexer robot) and a main robot (main robot), and the first reversing unit is used when transferring substrates before processing and the second reversing unit is used when transferring processed substrates. This prevents contamination of the processed substrate with the substrate before processing when the substrate is transferred.
Further, the following method is disclosed in the substrate processing apparatus of japanese patent No. 6331698: in the substrate container for carrying in, a plurality of storage positions adjacent to each other are set as storage blocks (blocks), and storage positions of substrates corresponding to the same processing task (process job) are set as common storage blocks when the processed substrates are carried in the substrate container for carrying in. In addition, the following methods are also disclosed: the substrate with low cleanliness is prevented from being accommodated above the substrate with high cleanliness to inhibit the substrate pollution caused by dust (durt) falling.
However, in the substrate processing apparatus of document 1, for example, when processing of a plurality of substrates is started, the substrates before processing are reversed by using only one reversing unit, and therefore, it is necessary to convey the plurality of substrates to the cleaning unit for a long time. Two reversing units may be used for transferring a plurality of substrates to the cleaning unit. However, in this case, since the inversion of the substrate before the processing and the inversion of the processed substrate are performed by the same inversion unit, dust of the substrate before the processing may adhere to the processed substrate by the inversion unit, and the processed substrate may be contaminated.
Disclosure of Invention
The invention is applicable to a substrate processing apparatus, and aims to efficiently process a plurality of substrates while suppressing contamination of the processed substrates.
The substrate processing apparatus of the present invention comprises: a container mounting portion for mounting a container for accommodating a plurality of substrates; a processing unit having a plurality of processing units for processing the substrates, respectively; a first reversing section which is disposed between the container mounting section and the processing unit and reverses a substrate; a second reversing unit which is disposed between the container mounting unit and the processing unit and reverses the substrate; a container-side conveying unit configured to convey a substrate between the storage container and the first and second reversing units; a processing unit-side conveying unit configured to convey a substrate between the first reversing unit and the second reversing unit and the plurality of processing units; and a control unit configured to control the first reversing unit, the second reversing unit, the container-side conveying unit, and the processing-unit-side conveying unit, thereby reversing and conveying an unprocessed substrate in the storage container to either one of the first reversing unit and the second reversing unit, and reversing and conveying a processed substrate processed by the processing unit back to the storage container in either the first reversing unit or the second reversing unit; each reversing section is provided with: a delivery slot (feeding slot) through which the unprocessed substrate in the storage container is inserted by the container-side conveying part; a receiving slot (receiving slot) through which the processed substrate processed by the processing unit is inserted by the processing unit side conveying unit; and a reversing mechanism that integrally reverses the delivery tank and the intake tank, thereby switching between a delivery posture in which the delivery tank is disposed at a position corresponding to a position where an unprocessed substrate is inserted by the container-side conveying section, and an intake posture in which the intake tank is disposed at a position corresponding to a position where a processed substrate is inserted by the processing-side conveying section; the container-side conveying section inserts an unprocessed substrate in the storage container into the feed-out groove of the first reversing section or the second reversing section in the feed-out posture according to an instruction of the control section, and the processing-section-side conveying section inserts a processed substrate processed by the processing section into the take-in groove of the first reversing section or the second reversing section in the take-in posture according to an instruction of the control section; in a high operation state in which an unprocessed substrate to be conveyed to the processing unit while waiting for completion of processing in any one of the processing units is present in the storage container, the control unit switches the first reversing unit or the second reversing unit in the carry-out posture in which no substrate is inserted into the carry-out groove and the carry-in groove, and the unprocessed substrate is inserted into the carry-out groove of the first reversing unit or the second reversing unit in the carry-in posture by the container-side conveying unit.
According to the present invention, it is possible to efficiently process a plurality of substrates while suppressing contamination of the processed substrates.
In a preferred aspect of the present invention, in the high operation state, the control unit switches the one reversing unit to the delivery posture when the delivery groove and the intake groove of the one reversing unit are not inserted into a substrate and the one reversing unit is in the delivery posture when the delivery groove of the other reversing unit is inserted into an unprocessed substrate.
In another preferred aspect of the present invention, the feed-out groove is located below the take-in groove in the feed-out posture of each of the reversing sections, or the take-in groove is located above the feed-out groove in the take-in posture of each of the reversing sections.
In this case, it is preferable that: when the carry-out groove is located below the carry-in groove in the carry-out posture of each reversing portion and each reversing portion is in the carry-in posture in a state in which an unprocessed substrate has been inserted into the carry-out groove, the unprocessed substrate of the carry-out groove is taken out by the processing portion side carrying portion, and thereafter, the processed substrate is inserted into the carry-in groove by the processing portion side carrying portion; alternatively, when the take-in groove is located above the take-out groove in the take-in posture of each of the reversing parts, and each of the reversing parts is in the take-out posture in a state where the processed substrate has been inserted into the take-in groove, the processed substrate of the take-in groove is taken out by the container-side conveying part, and thereafter, an unprocessed substrate is inserted into the take-out groove by the container-side conveying part.
In another preferred aspect of the present invention, the reversing operation by the reversing mechanism is prohibited in a state in which the substrate has entered both the carry-out tank and the carry-in tank.
In another preferred aspect of the present invention, each of the plurality of substrates has a pattern surface on which a pattern (pattern) is formed and a back surface on a side opposite to the pattern surface; in the storage container, the plurality of substrates are held with the pattern faces facing upward, respectively; the back surface of the substrate is processed in the plurality of processing units.
The present invention is also directed to a substrate processing method in a substrate processing apparatus. In the substrate processing method of the present invention, the substrate processing apparatus includes: a container mounting portion for mounting a container for accommodating a plurality of substrates; a processing unit having a plurality of processing units for processing the substrates, respectively; a first reversing section which is disposed between the container mounting section and the processing unit and reverses a substrate; a second reversing unit which is disposed between the container mounting unit and the processing unit and reverses the substrate; a container-side conveying unit configured to convey a substrate between the storage container and the first and second reversing units; and a processing unit-side conveying unit configured to convey a substrate between the first reversing unit and the second reversing unit and the plurality of processing units; each reversing section is provided with: a feed-out groove for inserting the unprocessed substrate in the storage container through the container-side conveying part; a loading slot into which the processed substrate processed by the processing unit is inserted by the processing unit-side conveying unit; and a reversing mechanism that integrally reverses the delivery tank and the intake tank, thereby switching between a delivery posture in which the delivery tank is disposed at a position corresponding to a position where an unprocessed substrate is inserted by the container-side conveying section, and an intake posture in which the intake tank is disposed at a position corresponding to a position where a processed substrate is inserted by the processing-side conveying section; the substrate processing method includes: a step (a) of inserting an unprocessed substrate in the storage container into the feed-out groove of any one of the reversing sections of the feed-out posture by the container-side conveying section; a step (b) of switching the reversing section to the picking-up posture to reverse the substrate; a step (c) of carrying the substrate from the reversing section to any one of the processing sections by the processing section-side carrying section; a step (d) of processing the substrate in the processing unit; a step (e) of inserting the processed substrate processed by the processing unit into the loading slot of any one of the reversing units of the loading posture by the processing unit side conveying unit; a step (f) of switching the reversing section to the feeding posture to reverse the substrate; a step (g) of returning the substrate from the reversing section into the storage container by the container-side conveying section; a step (h) of performing the same operations as those of the steps (a) to (g) on other unprocessed substrates in the storage container, in parallel with the steps (a) to (g) in part; a step (i) of switching the first reversing section or the second reversing section, which is in the take-in posture without inserting a substrate into the take-out groove and the take-in groove, to the take-out posture in a high operation state in which an unprocessed substrate to be conveyed to the processing section is present in the storage container while waiting for completion of processing in any one of the processing sections; and (j) inserting the unprocessed substrate into the feed slot of the first reversing portion or the second reversing portion switched to the feed posture in the step (i) by the container-side conveying portion.
The above objects, and other objects, features, aspects and advantages will become apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
Drawings
Fig. 1 is a diagram showing a configuration of a substrate processing apparatus.
Fig. 2 is a diagram showing the first reversing section, the second reversing section, and a center robot (center robot).
Fig. 3 is a diagram showing a configuration of the reversing section.
Fig. 4 is a diagram showing a configuration of the center manipulator.
Fig. 5 is a block diagram showing a functional configuration of the control unit.
Fig. 6 is a flowchart showing a back surface processing operation.
Fig. 7 is a diagram showing a flow of processing a plurality of substrates.
Fig. 8 is a diagram showing a time sequence (time chart) in the substrate processing apparatus.
Fig. 9 is a diagram showing operations of the first reversing section and the second reversing section.
Fig. 10 is a diagram showing a timing in the substrate processing apparatus.
Fig. 11 is a diagram showing a sequence in the substrate processing apparatus of the comparative example.
Fig. 12 is a diagram showing an operation of the reversing section in the substrate processing apparatus of the comparative example.
Fig. 13 is a diagram showing another example of the operation of the first reversing section and the second reversing section.
Fig. 14 is a diagram showing another example of the operation of the first reversing section and the second reversing section.
Detailed Description
Fig. 1 is a diagram showing a configuration of a substrate processing apparatus 1 according to an embodiment of the present invention. In fig. 1, three directions orthogonal to each other are indicated as an X direction, a Y direction, and a Z direction. Typically, the Z direction is the up-down direction (vertical direction), and the X direction and the Y direction are horizontal directions.
The substrate processing apparatus 1 is a single-sheet apparatus for processing a disk-shaped substrate 9 sheet by sheet in a processing unit 61 described later. The substrate 9 has one main surface (hereinafter referred to as a "pattern surface") as a device formation surface and the other main surface (hereinafter referred to as a "back surface") as a non-device formation surface. The pattern surface is formed with a pattern of devices during manufacture. The back surface is a surface opposite to the pattern surface. In the processing example described later, the processing unit 61 processes the rear surface of the substrate 9 held with the rear surface facing upward with a processing liquid or the like.
The substrate processing apparatus 1 includes a container mounting section 2, an indexer robot 3, a first reversing section 41a, a second reversing section 41b, a center robot 5, a processing unit 6, and a control unit 7. The control unit 7 is, for example, a computer (computer) including a CPU (Central Processing Unit; central processing unit) or the like, and is responsible for overall control of the substrate processing apparatus 1. The function of the control unit 7 will be described later. The container mounting portion 2, the indexer robot 3, the first reversing portion 41a, the second reversing portion 41b, and the center robot 5 are arranged in this order in the Y direction. The plurality of processing units 61 described later in the processing unit 6 are disposed around the center robot 5.
The container mounting portion 2 includes a plurality of container mounting tables 21. The plurality of container tables 21 are arranged in the X direction. A storage container C for storing a plurality of substrates 9 is placed on each container stage 21. The container C is a carrier (carrier) for storing a plurality of substrates 9 in a plurality of layers. The storage container C stores a plurality of substrates 9 with the pattern facing upward.
The indexer robot 3 is a container-side conveying section (or container-side conveying device) for conveying the substrate 9 between the storage container C and the first and second reversing sections 41a and 41 b. The indexer robot 3 is disposed between the container mounting section 2 and the first and second reversing sections 41a, 41 b. The indexer robot 3 includes a moving section 35. The moving unit 35 is movable in the X direction and rotatable about an axis parallel to the up-down direction (Z direction) as a center. The moving unit 35 is movable up and down. The indexer robot 3 is also provided with a hand (hand) set 310. The hand group 310 is connected to the moving unit 35 via a multi-joint arm (arm) 33. The articulated arm 33 advances and retreats in the horizontal direction while maintaining the hand group 310 in a constant posture. The hand group 310 has two hands 31. The two hands 31 are arranged in the up-down direction. Further, two holding portions are provided for each hand 31. The two holding portions are arranged in the vertical direction. Each holding portion contacts the outer periphery of the downward-facing rear surface of the substrate 9 to hold the substrate 9. A motor or the like is used as a driving source for the indexer robot 3.
In the following description, when the two hands 31 are distinguished, the hand 31 disposed on the upper side and the hand 31 disposed on the lower side are referred to as "upper hand 31" and "lower hand 31", respectively. In the case where two holding portions are distinguished in each hand 31, the upper and lower holding portions are referred to as "upper holding portion" and "lower holding portion", respectively. The substrate 9 held by the upper holding portion does not contact the lower holding portion, nor does the substrate 9 held by the lower holding portion contact the upper holding portion. The above-described structure of the indexer robot 3 is merely an example, and may be changed as appropriate. For example, the arm 33 may be provided separately for the two hands 31.
Fig. 2 is a view showing the substrate processing apparatus 1 as viewed from the (+ Y) side in the (-Y) direction, and shows the first reversing section 41a, the second reversing section 41b, and the center robot 5. As shown in fig. 1, the first reversing section 41a and the second reversing section 41b are arranged between the indexer robot 3 and the center robot 5 and the process unit 6. As shown in fig. 2, the first inversion portion 41a is disposed above the second inversion portion 41 b. The indexer robot 3 described above can access both the first reversing section 41a and the second reversing section 41 b. The same applies to the center robot 5. The first reversing section 41a and the second reversing section 41b have the same structure. The first reversing section 41a and the second reversing section 41b are not necessarily arranged in the vertical direction. In the following description, the first reversing section 41a and the second reversing section 41b will be simply referred to as "reversing sections 41" unless they are distinguished.
Fig. 3 is a diagram showing the configuration of the reversing section 41. The reversing section 41 includes a plurality of grooves 42, 43, a groove support section 44, and a reversing mechanism 45. The grooves 42 and 43 are substrate holding portions capable of holding the substrate 9 in a horizontal state. The substrate 9 can be held and released in the grooves 42 and 43 by a motor, a cylinder (air cylinder), or the like. In the example of fig. 3 four grooves 42, 43 are provided. Two grooves 42 among the four grooves 42, 43 are arranged adjacently in the up-down direction, and the remaining grooves 43 are arranged adjacently in the up-down direction. In the following description, the two grooves 42 disposed on the lower side are referred to as "feed grooves 42" and the two grooves 43 disposed on the upper side are referred to as "take-in grooves 43" in the state shown in fig. 3. The difference between the discharge groove 42 and the intake groove 43 will be described later.
The tank supporting portion 44 is a frame-like member integrally supporting the two delivery tanks 42 and the two intake tanks 43. The groove support 44 is opened on both sides in the Y direction. The indexer robot 3 can access the carry-out slot 42 and the carry-in slot 43 from the (-Y) side opening of the slot supporting portion 44. The center robot 5 can access the feed-out groove 42 and the take-in groove 43 from the opening on the (+ Y) side of the groove support portion 44. The reversing mechanism 45 has, for example, a motor, and can rotate the slot supporting portion 44 by 180 degrees with an axis parallel to the X direction as a center. Thus, the two discharge grooves 42 and the two intake grooves 43 are integrally reversed, and the substrate 9 held by the discharge grooves 42 or the intake grooves 43 is also reversed.
In the reversing section 41, the reversing operation is repeated by the instruction of the control unit 7. In other words, in the reversing section 41, the posture shown in fig. 3 in which the feed-out groove 42 is disposed below the take-in groove 43 (hereinafter referred to as "feed-out posture") and the posture in which the take-in groove 43 is disposed below the feed-out groove 42 (hereinafter referred to as "take-in posture") are switched. In the reversing section 41, the reversing operation by the reversing mechanism 45 is prohibited in a state where the substrate 9 enters both the feed-out tank 42 and the take-in tank 43. The above-described structure of the reversing section 41 may be changed as appropriate.
The center robot 5 shown in fig. 1 is a processing unit side conveying unit (or processing unit side conveying device) for conveying the substrate 9 between the first reversing unit 41a and the second reversing unit 41b and the plurality of processing units 61. The center manipulator 5 is disposed on the (+ Y) side of the first reversing section 41a and the second reversing section 41 b. Fig. 4 is a diagram showing the configuration of the center manipulator 5. The center manipulator 5 includes a base (base) 56 and a lifting/lowering rotation 55. The elevation rotation section 55 is rotatable about an axis parallel to the vertical direction with respect to the base section 56, and is vertically movable.
The center manipulator 5 further includes two hand groups 510. One hand group 510 is disposed above the other hand group 510. Each hand group 510 is connected to the lifting/lowering rotation unit 55 via the articulated arm 53. The two articulated arms 53 are independently driven by a driving mechanism, not shown, and advance and retreat in the horizontal direction while maintaining the hand group 510 in a constant posture. Each hand group 510 has two hands 51. The two hands 51 are arranged in the up-down direction. As described above, the substrate 9 is inverted by the first inverting part 41a and the second inverting part 41b, and the respective hands 51 contact the outer peripheral edge of the downward pattern surface of the substrate 9 to hold the substrate 9. A motor or the like is used as a driving source for the center manipulator 5.
In the following description, when two hand groups 510 are distinguished, the hand group 510 disposed on the upper side and the hand group 510 disposed on the lower side are referred to as "upper hand group 510" and "lower hand group 510", respectively. In the case of distinguishing the two hands 51, the hands 51 disposed on the upper side and the hands 51 disposed on the lower side are referred to as "upper hands 51" and "lower hands 51", respectively. The substrate 9 held by the upper hand 51 does not contact the lower hand 51, and the substrate 9 held by the lower hand 51 does not contact the upper hand 51. The above-described structure of the center manipulator 5 is merely an example, and may be changed as appropriate. For example, the four hands 51 may be individually provided with the multi-joint arms 53.
The processing unit 6 shown in fig. 1 has a plurality of processing sections 61. In each processing unit 61, the substrates 9 carried in by the center robot 5 are held in a horizontal state by a clamp (chuck) unit. The clamp portion rotates together with the substrate 9 as needed. For example, the processing liquid is supplied from a nozzle (nozzle) to the main surface of the substrate 9 facing upward, and the main surface is processed by the processing liquid. The processing unit 61 may process the substrate 9 with a process gas. In an example of the processing unit 6, as shown in fig. 2, four processing units 61 stacked in the up-down direction are provided as a stacking unit 62, and as shown in fig. 1, four stacking units 62 are arranged around the center robot 5. The above-described configuration of the processing unit 6 is merely an example, and the number and arrangement of the processing units 61 provided in the processing unit 6 may be changed as appropriate.
Fig. 5 is a block diagram showing a functional configuration of the control unit 7. In fig. 5, the indexer robot 3, the center robot 5, the first reversing section 41a, the second reversing section 41b, and the plurality of processing sections 61 are also illustrated in blocks. The control unit 7 includes a control unit 71, an input/output unit 72, and a storage unit 73. The output/input unit 72 receives an input from an operator, and notifies the operator by a display (display) or the like. The storage section 73 stores various information. The control unit 71 includes a scheduling (scheduling) unit 711 and a processing instruction unit 712. The scheduling unit 711 schedules the operations (timing) of the indexer robot 3, the center robot 5, the first reversing unit 41a, the second reversing unit 41b, and the plurality of processing units 61 for the plurality of substrates 9 to be processed based on the input from the operator. The processing instruction unit 712 outputs instruction signals to the dispenser robot 3, the center robot 5, the first reversing unit 41a, the second reversing unit 41b, and the plurality of processing units 61 in accordance with the operation sequence planned by the schedule planning unit 711, and receives completion responses or the like from these components. In the substrate processing apparatus 1, the operations of the indexer robot 3, the center robot 5, the first reversing section 41a, the second reversing section 41b, and the plurality of processing sections 61 are controlled by the control section 71.
Fig. 6 is a flowchart showing a back surface processing operation. The back surface processing operation is a series of operations for processing the back surface of the substrate 9 by the processing unit 61. Hereinafter, description will be made focusing on one substrate 9 (hereinafter referred to as "target substrate 9") and the back surface processing operation. In the substrate processing apparatus 1, the back surface processing operations for the plurality of substrates 9 are performed in parallel with each other based on the operation timing planned by the schedule planning unit 711, but the back surface processing operations for the plurality of substrates 9 will be described later.
In the back surface processing operation, first, the processing instruction unit 712 confirms which of the first reversing unit 41a and the second reversing unit 41b is to be used for reversing the unprocessed target substrate 9. When the first reversing section 41a is used (step S11), the target substrate 9 (unprocessed substrate 9) in the storage container C is taken out by the indexer robot 3 and inserted into the feed groove 42 of the first reversing section 41a (step S12 a). At this time, the first reversing portion 41a assumes a feeding posture in which the feeding groove 42 is located at the lower side. The groove support portion 44 is reversed in the first reversing portion 41 a. As a result, the first reversing section 41a is brought into the taking-in posture in which the feed-out groove 42 is located on the upper side, and the target substrate 9 is reversed (step S13 a). As described above, the target substrate 9 is stored in the storage container C with the pattern facing upward, and the back surface of the inverted target substrate 9 faces upward. The target substrate 9 in the feed-out slot 42 is taken out by the center robot 5 and carried into any one of the processing units 61 (step S14 a). Then, the processing unit 61 processes the upward back surface with a processing liquid or the like (step S15).
On the other hand, in step S11, when the second reversing section 41b is confirmed by the process command section 712, the indexer robot 3 inserts the target substrates 9 in the storage containers C into the feed grooves 42 of the second reversing section 41b (step S12 b). At this time, the second reversing portion 41b assumes a feeding posture in which the feeding groove 42 is located at the lower side. The groove support portion 44 is reversed in the second reversing portion 41 b. As a result, the second reversing section 41b is brought into the taking-in posture in which the feed-out groove 42 is located on the upper side, and the target substrate 9 is reversed (step S13 b). The target substrate 9 in the feed-out slot 42 is taken out by the center robot 5 and carried into any one of the processing units 61 (step S14 b). Then, the processing unit 61 processes the upward back surface with a processing liquid or the like (step S15).
When the processing in the processing section 61 is completed, the processing instruction section 712 confirms which of the first reversing section 41a and the second reversing section 41b is used in reversing the processed target substrate 9. When the first reversing section 41a is used (step S16), the central robot 5 takes out the target substrate 9 (processed substrate 9) in the processing section 61 and inserts the target substrate into the intake groove 43 of the first reversing section 41a (step S17 a). At this time, the first reversing portion 41a takes a taking posture in which the taking groove 43 is located at the lower side. The groove support portion 44 is reversed in the first reversing portion 41 a. As a result, the first reversing section 41a is brought into the feeding posture in which the intake groove 43 is located on the upper side, and the target substrate 9 is reversed (step S18 a). The pattern formation surface is directed upward on the inverted target substrate 9. The target substrate 9 in the take-in groove 43 is taken out by the indexer robot 3 and returned to the storage container C (step S19 a). The target substrate 9 may be returned to a different container C than the container C that was not processed.
On the other hand, in step S16, when the process command unit 712 confirms that the second reversing unit 41b is used, the central robot 5 takes out the target substrate 9 in the processing unit 61 and inserts it into the intake groove 43 of the second reversing unit 41b (step S17 b). At this time, the second reversing portion 41b assumes a taking-in posture in which the taking-in groove 43 is located at the lower side. The groove support portion 44 is reversed in the second reversing portion 41 b. Thereby, the second reversing section 41b becomes a feeding posture in which the intake groove 43 is located on the upper side, and the target substrate 9 is reversed (step S18 b). The target substrate 9 in the take-in groove 43 is taken out by the indexer robot 3 and returned to the storage container C (step S19 b).
In the scheduling unit 711, in the step S11, one of the first reversing unit 41a and the second reversing unit 41b is selected so that the target substrate 9 in the container C can be transported to the processing unit 61 faster. As described above, the indexer robot 3 inserts the substrate 9 into the feed grooves 42 of the first reversing section 41a and the second reversing section 41b in the feed posture. Thus, for example, the first reversing section 41a is selected in a state in which the first reversing section 41a is in the feed-out posture, the substrate 9 is not inserted into the feed-out groove 42, and the second reversing section 41b is in the take-in posture, and the substrate 9 is not inserted into the take-in groove 43. Thereby, the indexer robot 3 can insert the substrate 9 immediately into the feed slot 42.
The second reversing section 41b is selected in a state in which the first reversing section 41a is in the send-out posture, the substrate 9 has been inserted into the send-out groove 42, the second reversing section 41b is in the take-in posture, and the substrate 9 has been inserted into the take-in groove 43. In this case, it is assumed that when the first reversing section 41a is used, it is necessary to wait for the reversing operation of the first reversing section 41a, the removal of the substrate 9 by the center robot 5, and the reversing operation of the first reversing section 41 a. On the other hand, in the case of using the second reversing section 41b, the indexer robot 3 can insert the substrate 9 into the feed slot 42 by waiting only for the reversing operation of the second reversing section 41b.
In the scheduling unit 711, in the step S16, one of the first reversing unit 41a and the second reversing unit 41b is selected so that the target substrate 9 in the processing unit 61 can be transported to the storage container C faster. As described above, the center robot 5 inserts the substrate 9 into the take-in grooves 43 of the first reversing portion 41a and the second reversing portion 41b in the take-in posture. Thus, for example, the second reversing section 41b is selected in a state in which the first reversing section 41a is in the feed-out posture, the substrate 9 is not inserted into the feed-out groove 42, and the second reversing section 41b is in the take-in posture, and the substrate 9 is not inserted into the take-in groove 43. Thereby, the center robot 5 can immediately insert the substrate 9 into the intake groove 43.
As described above, in the preferred scheduling unit 711, the first reversing unit 41a and the second reversing unit 41b that can convey the target substrate 9 faster can be selected based on the posture of each reversing unit 41a, 41b and the presence or absence of the holding substrate 9 or the like in each reversing unit 41a, 41b.
As shown in fig. 7, in the actual substrate processing apparatus 1, a back surface processing operation is performed on a plurality of substrates 9 to be processed (step S21). At this time, as will be described later, the back surface processing operation is performed on the other unprocessed substrates 9 in the storage container C in parallel to the back surface processing operation portion for one substrate 9. In addition, in a high operation state in which all of the processing units 61 process the substrate 9 and the processing in any one of the processing units 61 is to be waited for and the unprocessed substrate 9 conveyed to that processing unit 61 is present in the storage container C, when a predetermined empty reversing condition is satisfied, the empty reversing of the first reversing unit 41a or the second reversing unit 41b is performed (step S22). The empty inversion in the present embodiment refers to an operation of switching the first inversion portion 41a or the second inversion portion 41b in the take-in posture without inserting the substrate 9 into the take-out groove 42 and the take-in groove 43 to the take-out posture, unless otherwise described. The empty inversion condition will be described later. When the back surface processing operation is completed for all the substrates 9 to be processed, the processing of the plurality of substrates 9 in the substrate processing apparatus 1 is completed (step S23).
Next, the operation sequence of each component in the back surface processing operation of the plurality of substrates 9 (that is, the operation sequence planned by the scheduler 711) will be described in detail. Fig. 8 is a diagram showing a sequence in the substrate processing apparatus 1 in the high operation state. In fig. 8 (and fig. 9 to 14 described later), ST denotes the container mounting portion 2, ir denotes the indexer robot 3, rvp1 denotes the first reversing portion 41a, rvp2 denotes the second reversing portion 41b, cr denotes the center robot 5, and SPIN1 to SPIN6 denote the first processing portion 61 to the sixth processing portion 61. Here, for convenience of illustration, only six processing units 61 are shown. The english letters (alphabets) shown in the blocks are used to identify the substrates 9 to be operated among the container mounting section 2, the indexer robot 3, the first reversing section 41a, the second reversing section 41b, the center robot 5, and the first to sixth processing sections 61.
The arrow between ST and IR indicates the transfer of the substrate 9 between the container mounting portion 2 and the indexer robot 3, and the arrow between IR and RVP1 or RVP2 indicates the transfer of the substrate 9 between the indexer robot 3 and the first reversing portion 41a or the second reversing portion 41 b. The arrow between RVP1 or RVP2 and CR indicates the transfer of the substrate 9 between the first inversion portion 41a or the second inversion portion 41b and the central robot 5, and the arrow between CR and SPIN1 to SPIN6 indicates the transfer of the substrate 9 between the central robot 5 and the first to sixth processing portions 61. "REVERSE" shown on the lower side of the square blocks in RVP1 and RVP2 indicates the reversing operation in the first reversing section 41a and the second reversing section 41 b. "PROCESS" shown on the lower side of the blocks in SPIN1 to SPIN6 indicates the start of processing in the first processing section 61 to the sixth processing section 61.
Fig. 9 is a diagram showing the operation of the first reversing section 41a and the second reversing section 41b in the high operation state. In fig. 9, the two intake grooves 43 of the respective reversing sections 41a, 41b (RVP 1 or RVP 2) are given the numbers of "1" and "2", and the two delivery grooves 42 are given the numbers of "3" and "4". The arrangement of the grooves immediately before the reversing operation is indicated by a number on the left side of an arrow A1 (one arrow is denoted by a reference numeral A1 a) indicating the reversing operation, and the arrangement of the grooves immediately after the reversing operation is indicated by a number on the right side of the arrow A1. The same applies to fig. 12 to 14 described later.
Fig. 9 also shows positions (holding portions or hand portions) where the substrates 9 are held by the indexer robot 3 and the center robot 5. Up-Up shown on the right side of IR represents the upper holding portion of the upper hand 31, lw-Up represents the lower holding portion of the upper hand 31, up-Lw represents the upper holding portion of the lower hand 31, and Lw-Lw represents the lower holding portion of the lower hand 31. In addition, up-Up shown on the right side of CR represents the upper hand 51 of the upper hand group 510, up-Lw represents the upper hand 51 of the lower hand group 510, lw-Up represents the lower hand 51 of the upper hand group 510, and Lw-Lw represents the lower hand 51 of the lower hand group 510. As described later, in the indexer robot 3, the unprocessed substrate 9 is held by the upper hand 31 or the lower holding portion of the lower hand 31, and the processed substrate 9 is held by the upper hand 31 or the upper holding portion of the lower hand 31. In the center robot 5, the unprocessed substrates 9 are held by the lower hand 51 of the upper hand group 510 or the lower hand group 510, and the processed substrates 9 are held by the upper hand 51 of the upper hand group 510 or the lower hand group 510.
Here, it is assumed that the substrate 9 is carried into all the processing units 61 and the unprocessed substrate 9 to be carried into any one of the processing units 61 should be kept in the storage container C after completion of the processing in that processing unit 61, that is, the high operation state. When the processing of the substrates 9 in the processing unit 61 is partially completed, the unprocessed substrates 9 of "F" and "G" in the storage container C on the container mounting unit 2 are taken out by the indexer robot 3. At this time, the unprocessed substrates 9 of "F" and "G" are held by the lower holding portion of the upper hand 31 and the lower holding portion of the lower hand 31, respectively.
The unprocessed substrates 9 of "F" and "G" are inserted into the feed grooves 42 of "3" and "4" of the first reversing section 41a, respectively. The feed grooves 42 of "3" and "4" are located at the lower side, and the first reversing portion 41a is in the feed posture. The unprocessed substrates 9 of "F" and "G" are inverted by the inverting operation of the first inverting part 41 a. The feed grooves 42 of "3" and "4" are located on the upper side, and the first reversing portion 41a is set in the intake posture. The unprocessed substrates 9 of "G" and "F" of the first reversing section 41a are taken out by the center robot 5. At this time, the unprocessed substrates 9 of "G" and "F" are held by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510, respectively. Then, in the upper hand group 510, the upper hand 51 takes out the processed substrate 9 of "a" in the first processing unit 61, and the unprocessed substrate 9 of "G" held by the lower hand 51 is transferred to the chuck portion in the first processing unit 61 (that is, the unprocessed substrate 9 of "G" is carried into the first processing unit 61). In the lower hand group 510, the upper hand 51 takes out the processed substrate 9 of "b" in the second processing unit 61, and the unprocessed substrate 9 of "F" held by the lower hand 51 is carried into the second processing unit 61. As a result, the center robot 5 is in a state of holding the processed substrates 9 of "a" and "b". The first processing unit 61 and the second processing unit 61 start processing the unprocessed substrates 9 of "G" and "F".
In the present embodiment, in the high operation state, the substrate 9 is not inserted into the feed-out groove 42 and the take-in groove 43 of one reversing portion, and the one reversing portion is in the take-in posture, and further, the unprocessed substrate is inserted into the feed-out groove 42 of the other reversing portion, which becomes the empty reversing condition of the one reversing portion. By taking out the unprocessed substrates 9 of "F" and "G", neither substrate 9 is inserted into the feed-out groove 42 and the take-in groove 43 of the first reversing section 41a, and the first reversing section 41a assumes the taken-in posture. As will be described later, the unprocessed substrates 9 are inserted into the feed grooves 42 of the second reversing section 41b in parallel with the reversing operation of the first reversing section 41a (the reversing operation of the unprocessed substrates 9 of "F" and "G"). Accordingly, the empty inversion condition of the first inversion unit 41a is satisfied, and the empty inversion of the first inversion unit 41a is performed as indicated by an arrow A1a in fig. 9. Thus, the first reversing section 41a assumes the feeding posture. In fig. 8, the empty inversion is indicated by a block B1 with parallel oblique lines inside. The operation of the first reversing section 41a after the empty reversing will be described later.
In the indexer robot 3, after the unprocessed substrates 9 of "F" and "G" are transported to the first reversing section 41a, the unprocessed substrates 9 of "H" and "I" in the storage container C are taken out. At this time, the unprocessed substrates 9 of "H" and "I" are held by the lower holding portion of the upper hand 31 and the lower holding portion of the lower hand 31, respectively. The unprocessed substrates 9 of "H" and "I" are inserted into the feed grooves 42 of "3" and "4" of the second reversing section 41b, respectively. The feed grooves 42 of "3" and "4" are located at the lower side, and the second reversing portion 41b is in the feed posture. The unprocessed substrates 9 of "H" and "I" are inverted by the inverting operation of the second inverting part 41 b. The feed grooves 42 of "3" and "4" are located on the upper side, and the second reversing portion 41b is set in the intake posture.
The unprocessed substrates 9 of "I" and "H" of the second reversing section 41b are held and taken out by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510 of the center robot 5, respectively. At this time, the center robot 5 holds the processed substrates 9 of "a" and "b" by the upper hand 51 of the upper hand group 510 and the upper hand 51 of the lower hand group 510. Next, the processed substrates 9 of "a" and "b" are inserted into the intake grooves 43 of "2" and "1" in the second reversing section 41b in the intake posture, respectively. In this way, the two unprocessed substrates 9 and the two processed substrates 9 can be exchanged between the center robot 5 and the second reversing section 41b (hereinafter, also simply referred to as "substrate exchange").
At this time, in the center robot 5, the processed substrates 9 of "a" and "b" and the unprocessed substrates 9 of "I" and "H" are temporarily held at the same time, but all the processed substrates 9 are held by the upper hand 51 and all the unprocessed substrates 9 are held by the lower hand 51. Thus, the processed substrate 9 is not contaminated by the falling of dust from the unprocessed substrate 9. In addition, dust of the unprocessed substrate 9 can be prevented from adhering to the processed substrate 9 via the hand 51. In the second reversing section 41b, the processed substrate 9 is inserted into the lower intake groove 43, but the unprocessed substrate 9 may be taken out from the delivery groove 42 before the processed substrate 9 is inserted. Thus, the processed substrate 9 in the intake groove 43 is not contaminated by the falling of the dust from the unprocessed substrate 9 in the discharge groove 42.
Thereafter, the processed substrates 9 of "a" and "b" are inverted by the inversion operation of the second inverting part 41 b. The intake grooves 43 of "1" and "2" are located on the upper side, and the second reversing portion 41b assumes the delivery posture. In the upper hand group 510 of the center robot 5, the processed substrate 9 of "c" in the third processing unit 61 is taken out, and the unprocessed substrate 9 of "I" is carried into the third processing unit 61. In the lower hand group 510, the processed substrate 9 of "d" in the fourth processing unit 61 is taken out, and the unprocessed substrate 9 of "H" is carried into the fourth processing unit 61. As a result, the center robot 5 holds the processed substrates 9 of "c" and "d". The processing of the unprocessed substrates 9 of "I" and "H" is started in the third processing unit 61 and the fourth processing unit 61.
In the indexer robot 3, the unprocessed substrates 9 of "J" and "K" in the storage container C are taken out in parallel with the above-described substrate exchange between the center robot 5 and the second reversing section 41 b. The unprocessed substrates 9 of "J" and "K" are inserted into the feed grooves 42 of "3" and "4" of the first reversing portion 41a which has been reversed by the empty direction to be in the feed posture, respectively. The unprocessed substrates 9 of "J" and "K" are inverted by the inversion operation two of the first inversion section 41a, and the first inversion section 41a takes in the posture.
The unprocessed substrates 9 of "K" and "J" of the first reversing section 41a are held and taken out by the lower hand 51 of the upper hand group 510 and the lower hand 51 of the lower hand group 510 of the center robot 5, respectively. At this time, the center robot 5 holds the processed substrates 9 of "c" and "d" by the upper hand 51 of the upper hand group 510 and the upper hand 51 of the lower hand group 510. Next, the processed substrates 9 of "c" and "d" are inserted into the intake grooves 43 of "2" and "1" in the first reversing section 41a in the intake posture, respectively. In this way, the two unprocessed substrates 9 and the two processed substrates 9 (i.e., the substrate exchange) can be exchanged between the center robot 5 and the first reversing portion 41 a. Here, the substrate exchange can be completed by empty reversing the first reversing section 41a in advance and putting two unprocessed substrates 9 into the first reversing section 41 a. Further, since the above-described reversing operation of the first reversing section 41a ("reversing operation of the unprocessed substrates 9 of J and K") is performed while the central robot 5 accesses the third processing section 61 and the fourth processing section 61, the substrate exchange with the first reversing section 41a can be performed without excessive waiting time in the central robot 5. Thereafter, the processed substrates 9 of "c" and "d" are reversed by the reversing operation of the first reversing section 41 a. The operation after the untreated substrates 9 of "K" and "J" is the same as the untreated substrate 9 described above, and therefore, the description thereof is omitted.
On the other hand, in the second reversing section 41b, the reversing of the processed substrates 9 of "a" and "b" in the intake groove 43 is completed, and the second reversing section 41b assumes the feeding posture. The unprocessed substrates 9 of "L" and "M" in the storage container C are held by the lower holding portion of the upper hand 31 and the lower holding portion of the lower hand 31 of the indexer robot 3, respectively, and are inserted into the feed grooves 42 of "3" and "4" of the second reversing portion 41b in the feed posture, respectively. Next, the processed substrates 9 of "b" and "a" in the "1" and "2" pickup grooves 43 are held by the upper holding portions of the upper hand 31 and the upper holding portions of the lower hand 31, and returned to the storage container C. In this way, the exchange (i.e., substrate exchange) of the two unprocessed substrates 9 and the two processed substrates 9 can be performed between the indexer robot 3 and the second reversing section 41 b.
At this time, in the indexer robot 3, all processed substrates 9 are held by the upper holding portion, and all unprocessed substrates 9 are held by the lower holding portion. Thus, the dust of the unprocessed substrate 9 can be prevented from adhering to the processed substrate 9 via the hand 31. In the second reversing section 41b, the processed substrates 9 of "b" and "a" and the unprocessed substrates 9 of "L" and "M" are temporarily held at the same time, but the processed substrates 9 are held in the intake groove 43 located at the upper side, and the unprocessed substrates 9 are held in the discharge groove 42 located at the lower side. Thus, the processed substrate 9 is not contaminated by the falling of dust from the unprocessed substrate 9 (the same applies to the first reversing section 41 a). The unprocessed substrate 9 is inserted into the feed-out groove 42, and the processed substrate 9 is inserted into the take-in groove 43. Thus, the adhesion of dust of the unprocessed substrate 9 to the processed substrate 9 through the groove can be prevented. The operation after the untreated substrates 9 of "L" and "M" is the same as the untreated substrate 9 described above, and therefore, the description thereof is omitted.
In the first reversing section 41a, the processed substrates 9 of "c" and "d" in the intake groove 43 are reversed as described above, and the first reversing section 41a assumes the feeding posture. In the indexer robot 3, the unprocessed substrates 9 of "N" and "O" in the storage container C are inserted into the two feed grooves 42 of the first reversing section 41a, respectively. At this time, in parallel with the above-described operation of the indexer robot 3 returning the processed substrates 9 of "a" and "b" to the storage container C, the above-described reversing operation of the first reversing section 41a ("reversing operation of the processed substrates 9 of" C "and" d ") is performed, whereby the input of the unprocessed substrates 9 of" N "and" O "to the first reversing section 41a can be performed without excessive waiting time in the indexer robot 3. Thereafter, the processed substrates 9 of "C" and "d" in the two pickup grooves 43 are returned to the storage container C. In this way, the exchange (i.e., substrate exchange) of the two unprocessed substrates 9 and the two processed substrates 9 can be performed between the indexer robot 3 and the first reversing section 41 a. The operation after the untreated substrates 9 of "N" and "O" is the same as the untreated substrate 9 described above, and therefore, the description thereof is omitted.
Fig. 10 is a diagram showing a sequence immediately after the back surface processing operation for the plurality of substrates 9 is started. As shown in fig. 10, it is necessary to sequentially carry in unprocessed substrates 9 in the storage container C to the plurality of processing units 61 immediately after the back surface processing operation for the plurality of substrates 9 is started. In this case, the untreated substrate 9 is inverted in the respective inverting sections 41a and 41B, and then the untreated substrate 9 is taken out, and then the blank inversion is performed as indicated by a block B2 with parallel oblique lines attached therein. Similarly, immediately before the back surface processing operation for the plurality of substrates 9 is completed, the processed substrates 9 need to be sequentially returned from the plurality of processing units 61 to the storage container C. In this case, the processed substrate 9 is inverted in the respective inverting sections 41a and 41b, and the processed substrate 9 is taken out and then subjected to the empty inversion. On the other hand, the blank inversion shown in block B1 in fig. 8 is performed in the high operation state in accordance with the blank inversion condition, and is different from the blank inversion performed immediately after the start of the back surface processing operation for the plurality of substrates 9 and immediately before the end of the back surface processing operation for the plurality of substrates 9.
The empty reversing condition in the high operation state may be a condition that can increase the throughput (throughput) of the substrate processing apparatus 1 by performing the empty reversing of the first reversing portion 41a or the second reversing portion 41b, and may be a condition other than the empty reversing condition described with reference to fig. 8 and 9. For example, when the first reversing section 41a or the second reversing section 41b can be subjected to the empty reversing, the empty reversing is preferably performed when the two unprocessed substrates 9 and the two processed substrates 9 are exchanged (i.e., substrate exchange) between the indexer robot 3 and the first reversing section 41a and the second reversing section 41b or between the center robot 5 and the first reversing section 41a and the second reversing section 41 b.
As an example, in the high operation state, it is preferable that when both the first reversing section 41a and the second reversing section 41b do not hold the unprocessed substrate 9 and both the first reversing section 41a and the second reversing section 41b are in the taking-in posture, the empty reversing of at least one reversing section 41a, 41b is performed. After the empty inversion, the unprocessed substrates 9 are inserted into the feed grooves 42 of the inversion sections 41a and 41b, and the inversion operation of the inversion sections 41a and 41b is further performed, whereby the inversion sections 41a and 41b take in the state where the unprocessed substrates 9 have been held. As described above, when the reversing sections 41a and 41b that do not hold the unprocessed substrates 9 are in the taking-in posture, it is considered that the center robot 5 holds the unprocessed substrates 9, accesses the processing section 61, and carries out the processed substrates 9 from the processing section 61. Although some time is required for the reversing operation in the reversing sections 41a and 41b, the first reversing section 41a or the second reversing section 41b is set in advance to the taking-in posture in a state where the unprocessed substrate 9 is held during the period in which the central robot 5 accesses the processing section 61, whereby the processed substrate 9 and the unprocessed substrate 9 can be exchanged without excessive waiting time.
Next, a substrate processing apparatus of a comparative example in which one of the first reversing section 41a and the second reversing section 41b is omitted and only one reversing section is used will be described. The carry-out tank 42 and the carry-in tank 43 are not distinguished in the reversing section in the substrate processing apparatus of the comparative example. The unprocessed substrates 9 are inserted into the two lower grooves by the indexer robot 3, and the processed substrates 9 are inserted into the two lower grooves by the center robot 5.
Fig. 11 is a diagram showing a sequence in the substrate processing apparatus of the comparative example, and fig. 12 is a diagram showing an operation of the reversing section. Fig. 11 and 12 correspond to fig. 8 and 9, respectively. RVP in fig. 11 and 12 indicates the one inversion portion. In the substrate processing apparatus of the comparative example, the time for the indexer robot 3 and the center robot 5 to wait for the completion of the operation of the reversing section becomes long and the overall operation rate decreases. In the reversing section, the groove into which the unprocessed substrate 9 is inserted and the groove into which the processed substrate 9 is inserted are not distinguished, and therefore, there is a possibility that dust of the unprocessed substrate 9 adheres to the processed substrate 9 through the groove.
In contrast, in the substrate processing apparatus 1 of fig. 1, two reversing sections 41a and 41b are provided. Thus, compared to the substrate processing apparatus of the comparative example, the indexer robot 3 and the center robot 5 can shorten (eliminate) the time for waiting for the completion of the operations of the first reversing section 41a and the second reversing section 41b, and can improve the operation rate. In one example, the operation rate can be substantially equal to that in the case where the substrate 9 is not reversed. The reversing sections 41a and 41b each include: a feed-out groove 42 into which the unprocessed substrate 9 is inserted; and a take-in groove 43 into which the processed substrate 9 is inserted. This can prevent dust from adhering to the unprocessed substrate 9 through the grooves to the processed substrate 9, and thus can prevent the processed substrate 9 from being contaminated.
In the high operation state, the first reversing portion 41a or the second reversing portion 41b in the taking-in posture without the substrate 9 being inserted into the feed-out groove 42 and the taking-in groove 43 is set to the feed-out posture by the air-out reversing under a predetermined condition. Then, the unprocessed substrates 9 are inserted into the feed grooves 42 of the reversing sections 41a and 41b set to the feed posture by the indexer robot 3. In this way, by reversing the first reversing section 41a or the second reversing section 41b (blank reversing) in which the substrates 9 are not inserted in the high-operation state, the untreated substrates 9 can be exchanged between the reversing sections 41a and 41b and the center robot 5 and the treated substrates 9, and a plurality of substrates 9 can be efficiently treated.
Preferably, it is: in the high operation state, when the substrate 9 is not inserted into the feed-out groove 42 and the take-in groove 43 of one of the first reversing portion 41a and the second reversing portion 41b and the one reversing portion has been set to the take-in posture, and further the unprocessed substrate 9 is inserted into the feed-out groove 42 of the other reversing portion, the one reversing portion is set to the feed-out posture by the empty reversing. This allows the unprocessed substrates 9 to be exchanged with the processed substrates 9 between the one reversing sections 41a and 41b and the center robot 5, and allows a plurality of substrates 9 to be efficiently processed.
In the substrate processing apparatus 1, the feed-out groove 42 is located below the take-in groove 43 in the feed-out posture of the respective reversing sections 41a, 41 b. This prevents the processed substrate 9 from being placed under the unprocessed substrate 9 in the reversing sections 41a and 41b in the delivery posture, and prevents the processed substrate 9 from being contaminated by the unprocessed substrate 9. When the respective reversing sections 41a and 41b are in the loading posture in a state where the unprocessed substrates 9 have been inserted into the feed-out groove 42, the center robot 5 takes out the unprocessed substrates 9 in the feed-out groove 42, and then the processed substrates 9 are inserted into the loading groove 43. This prevents the processed substrate 9 from being placed under the unprocessed substrate 9 in the reversing portions 41a and 41b of the taking-in posture, and prevents the processed substrate 9 from being contaminated by the unprocessed substrate 9.
In the reversing sections 41a and 41b, the reversing operation of the reversing mechanism 45 is prohibited in a state where the substrate 9 has entered both the feed-out groove 42 and the take-in groove 43. This prevents the processed substrate 9 from being placed under the unprocessed substrate 9 due to the reversing operation.
In each of the reversing sections 41a and 41b, the number of the feed-out grooves 42 and the take-in grooves 43 may be two or more. Fig. 13 shows a case where the number of the feed grooves 42 and the take-in grooves 43 is one, and fig. 14 shows a case where the number of the feed grooves 42 and the take-in grooves 43 is four. Even in the example of fig. 13 and 14, in the high operation state, when the substrate 9 is not inserted into the feed-out groove 42 and the take-in groove 43 of the first reversing portion 41a (RVP 1) and the first reversing portion 41a is in the take-in posture, the empty reversing condition of the first reversing portion 41a is satisfied when the unprocessed substrate 9 is inserted into the feed-out groove 42 of the second reversing portion 41 b. Thereby, the first reversing section 41a performs the empty reversing (see the reversing operation of arrow A1 a). As a result, the unprocessed substrates 9 and the processed substrates 9 can be exchanged between the first reversing section 41a and the center robot 5, and a plurality of substrates 9 can be efficiently processed. The same applies to the case where the empty inversion condition of the second inversion unit 41b is satisfied.
Although the back surface processing operation is performed on the plurality of substrates 9 in the processing example described above, in the substrate processing apparatus 1, the pattern surface of the substrate 9 may be directed upward in the processing section 61 and the pattern surface may be processed by a processing liquid or the like. In a series of operations for processing the pattern surface of the substrate 9 by the processing unit 61 (hereinafter referred to as "pattern surface processing operation"), the unprocessed substrate 9 is inserted into the feed-out groove 42 of the first reversing unit 41a or the second reversing unit 41b by the indexer robot 3, and the unprocessed substrate 9 is taken out by the center robot 5 without reversing the substrate in the reversing units 41a, 41 b. The unprocessed substrate 9 is carried into any one of the processing units 61. The processed substrate 9, which is the substrate 9 having the pattern surface processed in the processing unit 61, is taken out by the center robot 5 and inserted into the intake groove 43 of the first reversing unit 41a or the second reversing unit 41 b. Then, the processed substrate 9 is taken out by the indexer robot 3 without reversing the substrates in the first reversing section 41a and the second reversing section 41b, and returned to the storage container C.
The substrate processing apparatus 1 may perform a pattern surface processing operation and a back surface processing operation in combination. In this case, in the high operation state, when the back surface processing operation is performed on the unprocessed substrate 9 to be conveyed to the processing unit 61, the first reversing portion 41a or the second reversing portion 41b in the taking-in posture, which is not inserted into the feeding-out groove 42 and the taking-in groove 43, is preferably set to the feeding-out posture by the idle reversing. The unprocessed substrates 9 are inserted into the feed grooves 42 of the reversing sections 41a and 41b in the feed posture by the indexer robot 3, and the reversing operation of the reversing sections 41a and 41b is performed. Accordingly, between the reversing sections 41a and 41b and the center robot 5, the unprocessed substrates 9 with the back surfaces facing upward and the processed substrates 9 with the back surfaces or the pattern surfaces facing upward can be exchanged, and a plurality of substrates 9 can be efficiently processed.
Various modifications can be made in the substrate processing apparatus 1.
In the substrate processing apparatus 1, the intake groove 43 may be located above the discharge groove 42 in the intake posture of the respective reversing sections 41a, 41 b. This prevents the processed substrate 9 from being placed under the unprocessed substrate 9 in the reversing portions 41a and 41b of the taking-in posture, and prevents the processed substrate 9 from being contaminated. In the case where the respective reversing sections 41a and 41b are in the discharge posture in the state where the processed substrate 9 has been inserted into the take-in groove 43, that is, in the case where the take-in groove 43 is positioned below the discharge groove 42 in the discharge posture, it is preferable that the unprocessed substrate 9 is inserted into the discharge groove 42 after the processed substrate 9 in the take-in groove 43 is taken out by the indexer robot 3. This prevents the processed substrate 9 from being placed under the unprocessed substrate 9 in the reversing sections 41a and 41b in the delivery posture, and prevents the processed substrate 9 from being contaminated.
In the feeding-out posture and the taking-in posture of the respective reversing sections 41a, 41b, for example, the feeding-out groove 42 and the taking-in groove 43 may be disposed at positions separated in the horizontal direction. In the discharge postures of the reversing sections 41a and 41b, the discharge grooves 42 may be arranged at any position corresponding to the insertion of the indexer robot 3 into the unprocessed substrate 9, and in the intake postures of the reversing sections 41a and 41b, the intake grooves 43 may be arranged at any position corresponding to the insertion of the processed substrate 9 by the center robot 5.
The substrate to be processed in the substrate processing apparatus 1 is not limited to a semiconductor substrate, and may be a glass substrate or other substrates. The substrate processing apparatus 1 can also be used for processing substrates having shapes different from those of a disk.
The above-described embodiments and the configurations in the respective modifications may be appropriately combined without contradiction.
While the invention has been illustrated and described in detail, the description is intended to be illustrative and not restrictive. Thus, it is contemplated that various changes or modifications may be made without departing from the scope of the invention.
[ description of reference numerals ]
1. Substrate processing apparatus
2. Container mounting part
3. Indexer manipulator
5. Central mechanical arm
6. Processing unit
9. Substrate board
41a first reversing section
41b second reversing section
42. Delivery tank
43. Intake groove
45. Reversing mechanism
61. Processing unit
71. Control unit
C storage container
Steps S11, S12 a-S14 a, S12 b-S14 b, S15, S16, S17 a-S19 a, S17 b-S19 b, S21-S23

Claims (7)

1. A substrate processing apparatus is provided with:
a container mounting portion for mounting a container for accommodating a plurality of substrates;
a processing unit having a plurality of processing units for processing the substrates, respectively;
a first reversing section which is disposed between the container mounting section and the processing unit and reverses a substrate;
A second reversing unit which is disposed between the container mounting unit and the processing unit and reverses the substrate;
a container-side conveying unit configured to convey a substrate between the storage container and the first and second reversing units;
a processing unit-side conveying unit configured to convey a substrate between the first reversing unit and the second reversing unit and the plurality of processing units; and
a control unit configured to control the first reversing unit, the second reversing unit, the container-side conveying unit, and the processing-unit-side conveying unit, thereby reversing and conveying an unprocessed substrate in the storage container to one of the processing units in the first reversing unit or the second reversing unit, and reversing and conveying a processed substrate processed by the processing unit back to the storage container in the first reversing unit or the second reversing unit;
each reversing section is provided with:
a feed-out groove for inserting the unprocessed substrate in the storage container through the container-side conveying part;
a loading slot into which the processed substrate processed by the processing unit is inserted by the processing unit-side conveying unit; and
a reversing mechanism that integrally reverses the feed-out groove and the take-in groove, thereby switching between a feed-out posture in which the feed-out groove is disposed at a position corresponding to a position where an unprocessed substrate is inserted by the container-side conveying section and a take-in posture in which the take-in groove is disposed at a position corresponding to a position where a processed substrate is inserted by the processing-side conveying section;
The container-side conveying section inserts an unprocessed substrate in the storage container into the feed-out groove of the first reversing section or the second reversing section in the feed-out posture according to an instruction of the control section, and the processing-section-side conveying section inserts a processed substrate processed by the processing section into the take-in groove of the first reversing section or the second reversing section in the take-in posture according to an instruction of the control section;
in a high operation state in which an unprocessed substrate to be conveyed to the processing unit while waiting for completion of processing in any one of the processing units is present in the storage container, the control unit switches the first reversing unit or the second reversing unit in the carry-out posture in which no substrate is inserted into the carry-out groove and the carry-in groove, and the unprocessed substrate is inserted into the carry-out groove of the first reversing unit or the second reversing unit in the carry-in posture by the container-side conveying unit.
2. The substrate processing apparatus according to claim 1, wherein,
in the high operation state, the control unit may switch the one reversing unit to the delivery posture when the delivery groove and the pickup groove of the one reversing unit are not inserted into the substrate and the one reversing unit is in the pickup posture, and further when the delivery groove of the other reversing unit is inserted into an unprocessed substrate.
3. The substrate processing apparatus according to claim 1, wherein,
the feed-out groove is located below the take-in groove in the feed-out posture of each of the reversing sections, or the take-in groove is located above the feed-out groove in the take-in posture of each of the reversing sections.
4. The substrate processing apparatus according to claim 3, wherein,
when the carry-out groove is located below the carry-in groove in the carry-out posture of each reversing portion and each reversing portion is in the carry-in posture in a state in which an unprocessed substrate has been inserted into the carry-out groove, the unprocessed substrate of the carry-out groove is taken out by the processing portion side carrying portion, and thereafter, the processed substrate is inserted into the carry-in groove by the processing portion side carrying portion; or alternatively
When the take-in groove is located above the take-out groove in the take-in posture of each reversing portion, and each reversing portion is in the take-out posture in a state in which the processed substrate has been inserted into the take-in groove, the processed substrate of the take-in groove is taken out by the container-side conveying portion, and thereafter, an unprocessed substrate is inserted into the take-out groove by the container-side conveying portion.
5. The substrate processing apparatus according to claim 1, wherein,
in a state where the substrate has entered both the carry-out groove and the carry-in groove, the reversing operation by the reversing mechanism is prohibited.
6. The substrate processing apparatus according to any one of claims 1 to 5, wherein,
the plurality of substrates respectively have a pattern surface formed with a pattern and a back surface opposite to the pattern surface;
in the storage container, the plurality of substrates are held with the pattern faces facing upward, respectively;
the back surface of the substrate is processed in the plurality of processing units.
7. A substrate processing method in a substrate processing apparatus, wherein,
the substrate processing apparatus includes:
a container mounting portion for mounting a container for accommodating a plurality of substrates;
a processing unit having a plurality of processing units for processing the substrates, respectively;
a first reversing section which is disposed between the container mounting section and the processing unit and reverses a substrate;
a second reversing unit which is disposed between the container mounting unit and the processing unit and reverses the substrate;
a container-side conveying unit configured to convey a substrate between the storage container and the first and second reversing units; and
A processing unit-side conveying unit configured to convey a substrate between the first reversing unit and the second reversing unit and the plurality of processing units;
each reversing section is provided with:
a feed-out groove for inserting the unprocessed substrate in the storage container through the container-side conveying part;
a loading slot into which the processed substrate processed by the processing unit is inserted by the processing unit-side conveying unit; and
a reversing mechanism that integrally reverses the feed-out groove and the take-in groove, thereby switching between a feed-out posture in which the feed-out groove is disposed at a position corresponding to a position where an unprocessed substrate is inserted by the container-side conveying section and a take-in posture in which the take-in groove is disposed at a position corresponding to a position where a processed substrate is inserted by the processing-side conveying section;
the substrate processing method includes:
a step (a) of inserting an unprocessed substrate in the storage container into the feed-out groove of any one of the reversing sections of the feed-out posture by the container-side conveying section;
a step (b) of switching the reversing section to the picking-up posture to reverse the substrate;
A step (c) of carrying the substrate from the reversing section to any one of the processing sections by the processing section-side carrying section;
a step (d) of processing the substrate in the processing unit;
a step (e) of inserting the processed substrate processed by the processing unit into the loading slot of any one of the reversing units of the loading posture by the processing unit side conveying unit;
a step (f) of switching the reversing section to the feeding posture to reverse the substrate;
a step (g) of returning the substrate from the reversing section into the storage container by the container-side conveying section;
a step (h) of performing the same operations as those of the steps (a) to (g) on other unprocessed substrates in the storage container, in parallel with the steps (a) to (g) in part;
a step (i) of switching the first reversing section or the second reversing section, which is in the take-in posture without inserting a substrate into the take-out groove and the take-in groove, to the take-out posture in a high operation state in which an unprocessed substrate to be conveyed to the processing section is present in the storage container while waiting for completion of processing in any one of the processing sections; and
And (j) inserting the unprocessed substrate into the feed slot of the first reversing section or the second reversing section, which is switched to the feed posture in the step (i), by the container-side conveying section.
CN201980047542.5A 2018-09-13 2019-06-28 Substrate processing apparatus and substrate processing method Active CN112437977B (en)

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