TW200408041A - Method and apparatus for supplying substrates to a processing tool - Google Patents

Method and apparatus for supplying substrates to a processing tool Download PDF

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Publication number
TW200408041A
TW200408041A TW092124034A TW92124034A TW200408041A TW 200408041 A TW200408041 A TW 200408041A TW 092124034 A TW092124034 A TW 092124034A TW 92124034 A TW92124034 A TW 92124034A TW 200408041 A TW200408041 A TW 200408041A
Authority
TW
Taiwan
Prior art keywords
substrate
substrate carrier
carrier
loading
loading port
Prior art date
Application number
TW092124034A
Other languages
Chinese (zh)
Other versions
TWI355708B (en
Inventor
Michael R Rice
Jeffrey C Hudgens
Eric A Englhardt
Robert B Lowrance
Martin R Elliott
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200408041A publication Critical patent/TW200408041A/en
Application granted granted Critical
Publication of TWI355708B publication Critical patent/TWI355708B/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769Storage means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Feeding Of Workpieces (AREA)

Abstract

In one aspect, a substrate loading station for a processing tool includes plural load ports. Each load port is operatively coupled to the processing tool and has a mechanism for opening a substrate carrier. A carrier handler transports substrate carriers from a factory exchange location to the load ports without placing the carriers on any carrier support location other than the load ports. Numerous other aspects are provided.

Description

200408041 玖、發明說明: 【發明所屬之技術領域】 本申請案主張美國臨時專利申請案第60/407,3 36號, 申請曰2002年8月3 1曰之優先權。本文併呈於此以供參 考。 本發明係相關於基材之處理,並尤指相關於供應基材 至處理工具之設備和方法。 【先前技術】 本申請案係相關於下列共同讓予、共同申請之美國專 利申請案,本文併呈於此以供參考。 美國臨時專利申請案第60/407,45 1號,申請日2002年 8 月 31 日,案件名稱"System For Transporting Wafer Carriers” ; 美國臨時專利申請案第60/407,3 39號,申請曰2002年 8 月 31 日,案件名稱丨1 Method and Apparatus for Using Wafer Carrier Movement to Actuate Wafer Carrier Door Opening/Closing"; 美國臨時專利申請案第60/407,474號,申請曰2002年 8 月 31 日,案件名稱丨’Method and Apparatus for Unloading Wafer Carriers from Wafer Carrier Transport System"; 美國臨時專利申請案第60/407,452號,中請日2002年 8 月 31 日,案件名稱"End Effector Having Mechanism For Reorienting A Wafer Carrier Between Vertical And Horizontal Orientations” ; 美國臨時專利申請案第60/407,337號,申請曰2002年 200408041 8 月 31 日,案件名稱"Wafer Loading Station with Docking Grippers at Docking Stations” ; 美國臨時專利申請案第60/407,340號,申請曰2002年 8 月 31 日,案件名稱丨’ Wafer Carrier having Door Latching and Wafer Clamping Mechanisms” ; 美國臨時專利申請案第60/443,0 87號,申請日2003年 1 月 27 日,案件名稱丨’Methods and Apparatus for Transporting Wafer200408041 发明 Description of the invention: [Technical field to which the invention belongs] This application claims the priority of US Provisional Patent Application No. 60 / 407,3, 36, filed on August 31, 2002. This article is presented here for reference. The present invention relates to the processing of substrates, and more particularly to an apparatus and method for supplying a substrate to a processing tool. [Prior Art] This application is related to the following U.S. patent applications that are commonly assigned and co-filed, and this article is hereby incorporated by reference. US Provisional Patent Application No. 60 / 407,45 No. 1, Application Date August 31, 2002, Case Name " System For Transporting Wafer Carriers "; US Provisional Patent Application No. 60 / 407,3 39, Application No. On August 31, 2002, the name of the case 丨 1 Method and Apparatus for Using Wafer Carrier Movement to Actuate Wafer Carrier Door Opening / Closing "; US Provisional Patent Application No. 60 / 407,474, filed on August 31, 2002, the case Name 丨 'Method and Apparatus for Unloading Wafer Carriers from Wafer Carrier Transport System "; U.S. Provisional Patent Application No. 60 / 407,452, China Day, August 31, 2002, Case Name " End Effector Having Mechanism For Reorienting A Wafer "Carrier Between Vertical And Horizontal Orientations"; US Provisional Patent Application No. 60 / 407,337, Application No. 200204041 August 31, 2002, Case Name " Wafer Loading Station with Docking Grippers at Docking Stations "; US Provisional Patent Application No. Application No. 60 / 407,340, August 31, 2002 , The case name Shu 'Wafer Carrier having Door Latching and Wafer Clamping Mechanisms "; US Provisional Patent Application No. 60 443,0 / 87, filed January 27, 2003, the case name Shu' Methods and Apparatus for Transporting Wafer

Carriers"; 美國臨時專利申請案第60/407,463號,申請日2002年 8 月 31 日,案件名稱 ’’Wafer Carrier Handler That Unloads Wafer Carriers Directly From a Moving Conveyor” ; 美國臨時專利申請案第60/443,004號,申請曰2003年 1 月 27 日,案件名稱 ’’Wafer Carrier Handler That Unloads Wafer Carriers Directly From a Moving Conveyor";Carriers " U.S. Provisional Patent Application No. 60 / 407,463, dated August 31, 2002, case name `` Wafer Carrier Handler That Unloads Wafer Carriers Directly From a Moving Conveyor "; U.S. Provisional Patent Application No. 60 / 443,004 No., application date January 27, 2003, case name `` Wafer Carrier Handler That Unloads Wafer Carriers Directly From a Moving Conveyor ";

美國臨時專利申請案第60/443,1 53號,申請曰2003年 1 月 27 日,案件名稱"Overhead Transfer Flange and Support for Suspending Wafer Carrier"; 美國臨時專利申請案第60/443,00 1號,申請曰2003年 1 月 27 日,案件名稱 ’’Systems and Methods for Transferring Wafer Carriers Between Processing Tools丨’;及 美國臨時專利申請案第60/443,1 1 5號,申請曰2003年 1 月 27 日,案件名稱” Apparatus and Method for Storing and Loading Wafer Carriers” o 4 200408041 半導體元件通常製造於基材上,諸如,矽基材、 平板或其他相似者、通常稱之為晶圓者,以供電腦、 和其他相似者之用。這些元件係由一系列製造步驟 成,諸如薄膜沈積、氧化、钱刻、研磨、和熱處理及 製程。雖然可以在單一處理設備中執行多個生產步驟 般而言,為了至少某些生產步驟,基材仍需在不同的 處理工具中傳送。 為了在處理工具和其他位置中傳送,基材通常侮 承載件中。為了保證處理工具免於空轉,尚未處理的 應要能夠幾近於連續地供應該 具。因此,裝載和健 備通常位於處理工具附近。此類 題裝载和儲存設備通常 一或多個停靠站台,其中基材承 八戰件開啟並傳送至一 理工具’亦包含多個位於停靠 #站台之上的健存架、一 裝載和儲存設備中接收承載件的 丁町工廠裝載位置、和一 以在工廠裝載站台、停靠站台和 夕個儲存架間傳送承 的機器手臂。該機器手臂可以包 ^ S 一個連接至支撐結 終端受動器。典型的支撐結構包 — S、、& δ又疋的一個垂直 和一個水平導引,以使終端受 又助态可以在停靠站Α、 儲存架和工廠裝載站台中水平和 口 土且 〇 裝載和儲存設備可以是模組 、且化设計的(例如,且 件,其典型者安裝在單一處理工 八 ,、則方所延伸之框架 者非模組化設計的(例如,具有 ^ 干其可獨立安裝, 型者具有在多個處理工具前方 ^伸之水平和/或垂 引)。 玻璃 螢幕 所製 微影 9 — 多個 存在 基材 存設 包括 個處 個在 個用 载件 構的 導引 多個 有元 >,或 而典 直導 5 200408041 當工廠裝載位置接收一個承载 钤备# μ 取件之後,以機器手臂將 該承載件自工廠裝載位置移至儲 ^ ^ 儲存架之一。此後,該承載 件可以自儲存架移至停靠站台。 德、έ一奋 在基材獲取自承載件之 後、、座處理、而後傳回至該承載件。# $ i 臂自π & ρ ^ β 牛該承载件藉由機器手 #自#罪站台移至儲存架之一。 ψ ψ g ^ ^ ^ 而後,該承载件藉由機器 于#自儲存架移至工廠裝載站台。 動其 因為必需在儲存架間移 動基材承載件,工廠裝載位 的g〜 載置和停靠站台可能施加相當大 的負何在機器手臂,而且可能# # t ^ ^ ^ _ 廠中出現的基材承載 承載件的操控。 長目此,亟需流暢基材 【發明内容】 法。:::之第一個態樣,提出供應基材至處理工具的方 :第-個方法包括下列步驟⑴提供多個裝載埠其每 位:!用以開啟基材承載件的機構;(2)提供工廠交換 二材L基:承載件輸送裝置傳送和移動基材承載件 ::材承载件輸送裝置交換基材承載件;(3)提供—個 :材承載件搬運機’其具有—個用以接觸基材承載件的炊 裝Π二Γ載件搬運機係用以在工廠交換位置和多個 阜之間傳送基材承載件;和⑷在工廢交換位置 材承載件輸送裝置接收第一組多個基材承載件 —: :個基材承載件中的每-個而言,該方法包括下列步驟(;且) 、=廠交換位置直接傳送基材承載件至多個裝載埠中個別 的一個;(2)在個別的裝載埠,停靠並開啟基材承載件;(3) 2UU408041 在個別的裝載埠,離開並 的裝載埠傳送基材承载件至…換= 材承載件至基材承載件輪送裝置。 )專回該基 本發明之第二個離媒 坦山 二方法。該第二方达…’美出用以傳送基材承載件之第 载站台的A材!步驟⑴在—個連接至基材裝 ' 八载件輸送帶上傳送基材承載件,又 裝載站台包含一侗且^ 戰忏又該基材 件至處理工具的二承广件搬運機,用以傳送基材承載 承載件搬運機的:m 一個基材裝載站台的基材 移動該基材承載件時其材承載件輸送帶傳送及 脫離,·⑴將基材承載件自::承載件自基材承載件輸送帶 載 載件自基材承載件輸送帶直接傳送至裝 離開並關閉二載:停靠並開啟基材承載件;(5)在裝載崞 材承載件輸i帶7。載件,和(6)將基材承載件直接傳回至基 站台2㈣提供傳送基材承載件至基材裝載 #^^^ ^ 第一方法包括在臨近基材裝載站台之基 帶上傳送基材承載件。基材裝載站台包括- 7載件搬運機,用以運輸基材承載件到處理工具的 裳裁埠,兮其# 引 -土材承載件搬運機包括(1) 一個垂直導 個終端2受)動一:與該垂直導引連接的水平導引;和(3)- 直软 α用以支援基材承載件以相對於垂直導引垂 移動和以相對於水平導引水平移動。 第 一 翁杜^二方法進一步包括(1)使用基材裝載站台的基材承 運機的終端受動器,使基材承載件從基材承載件輸 200408041 送帶脫離;(2)將基材承载件自基材承載件輸送帶直接傳送 至第一裝載埠;(3)在第—裝料,#靠和開啟基材承载 件;(4)在第一裝載埠,離開和關閉基材承载件;和(5)直 接向基材承載件輸送帶傳回基材承載件。本發明亦提供許 多其他態樣,如同依據本發明此類和其他態樣之系統和設 備。利用基材搬運機所具有之終端受動器,用以接觸和運 輸一個別的基材,本發明之方法同樣可以提供個別基材(例 如’那些不是在基材承載件之中或之上的基材)之交換、運 輸和放置。 依據本發明之方法和設備,供應給處理工具之基材/ 基材承載件係直接由工廠裝載位置傳送至裝載埠。無需搬 運機將基材/基材承載件置於除了裝載埠之外的工廠交換 位置,基材/基材承載件「直接」由工廠裝載位置傳送至裝 載埠。 本發明之方法和設備提供基材和/或基材承載件之流 暢而高度有效的傳送。因而,運輸和處理基材所需之總時 間可以減少’在基材工作過程中所需要的費用和資本的投 資亦可以減少’而基材承載件搬運機的機器手臂的負擔可 以降低。 本發明的其他特徵和態樣將清楚呈現於下文中所詳述 之不例性實施例、本文之後的申請專利範圍和附圖。 【實施方式】 相關專有名詞 8 200408041 向 樣 潔 或 開 件 動 處 裴 不 處 例 置 之 圖 在本文中,專有名詞「停靠」意指基材或基材承载件 一埠口移動,如潔淨室牆上的埠口,藉以交換基材。同 地,「離開」意指基材或基材承載件離開埠口的移動,如 淨室牆上的埠口,藉以交換基材。 「工廠交換位置」包括空間中藉由一裝置搬運一基材 基材承載件之所有的點,其係從基材承載件輸送裝置移 基材或基材承載件或放置基材或基材承载件於基材承載 輸送裝置的期間。 基材或基材承載件輸送裝置」包括一個輸送帶、自 導引車輛(AGV)或任何其他將基材或基材承載件傳送至 理工具裝載位置(或反向傳送)之裝置。 一 「處理工具」包含一或多個處理室和一或多個用以 栽和卸載該處理室之基材搬運機,該基材搬運機可以或 為本身之處理室所涵蓋,如工廠界面處理室或傳送室。 理室可以在基材上執行真空、常壓或其他的製程,包括 如,物理氣相沉積(PVD)、化學氣相沉積(CVD)、蝕刻、 量、清潔、研磨等等。 一「裝載埠」包括一個基材或基材承載件所放置的位 ,供傳送基材至處理工具(或反方向)之用。 系統敛述 第1圖係一俯視平面圖,顯示在鄰接習知處理工具113 f,儲存基材之習知模組化的裝載和存儲設備1 u。第2 疋一前端視圖,顯示模組化的裝載和存儲設備ιη。以 200408041 參“、、第1圖開始,前端機器手臂處理室 顯不位在裝載和存儲設備丨丨丨與處理工^ 1圖所示之位於鄰接潔淨室牆117的第一 設備111,而前端機器手臂處理室則位於 鄰接之第二個面。前端機器手臂處理室1 119,其可以沿著一軌道水平移動(未見於 和存儲设備111提取基材和傳送它們至處 載鎖定至121。裝載和儲存設備Ul包 12:3,為了提取基材,基材承載件被置於 站台之裝備係供停靠動作之用,所以可稱 多個儲存架201(第2圖為最佳圖示)被置 之上(例如,在一較高位置)。在支撐框架 存架201。在支撐框架2〇3上亦同樣地安 搬運機器手臂205。機器手臂2〇5包括一布 為了垂直移動,終端受動器2〇9安裝在其 2〇7被安裝以沿著水平導引211水平運動 基材承載件之工廠裝載位置213係位於4 間。 藉助於垂直導引207和水平導引211 運機器手臂205的終端受動器209能. 213、儲存架201和停靠站台123之中,移 然而’如同先前所指出的,反覆移動基材 裝載位置213到到儲存架2〇1,然後到停| 回到工廠裝載位置213(可能藉由儲存架 1 1 5 (或工顧^界面) r 11 3之間。如第 面之裝載和存健 潔淨室牆1 1 7 & 1 5包含機器手臂 圖示),以從裝载 •理工具11 3的負 含一對裝載站台 其中(本例中裝载 作停靠站台),而 於停靠站台1 2 3 203上安裝了儲 裝了基材承载件 1垂直導引207, 中。該垂直導引 。一個用以接收 笋靠站台123之 ,基材承載件搬 t工廠裝載位置 動基材承載件。 承載件,從工廠 ^站台1 2 3,而後 201)可能導致在 10 200408041 向處理工具i丨3供給基材時,消耗大量的時間,從而增加 了 「工作處理中」(work-in-process)的量。 第3 A圖係一個正視概圖,圖示依據本發明所提供之 示例性基材裝載站台。標示號碼3 〇丨通常表示本發明之基 材裝载站台,裝載站台301包括多個裝載埠303。每一個 裝载埠3 03較佳的都具有停靠機構(未見於圖示),例如, 一機動化的夾鉗或平台,用以,支援基材承載件和用以使基 材承載件移向和遠離一個基材所欲傳送之開口。如第$ A 圖所示之特殊實施例中,在每一者具有三個裝載埠之兩堆 疊305、307中安裝裝載埠3〇3。因此,在第3八圖之實施 例中出現六個裝載埠303。亦可使用其他數量和/或配置之 裝載埠。堆疊307到被置於堆疊3〇5之一邊並隔開。每一 個裝載埠3 03都可以包括—個機構,通常以標示號碼3〇9 表示,用以開啟停靠在裝載埠303之基材承載件。在本發 明之一個實施例中,裝載埠303係用以接收單一基裁 件》專有名詞「單一基材承載件」係表示形狀和 基材承載件-次僅包含一個基材。一般而言,裝料如 可以包括基材承載件❹何類型(例如,單—基材承載件、 多個基材承載件、冑開式基材承載件、前開式標準莢、前US Provisional Patent Application No. 60 / 443,1 53, application date January 27, 2003, case name " Overhead Transfer Flange and Support for Suspending Wafer Carrier "; US Provisional Patent Application No. 60 / 443,00 1 No., application date January 27, 2003, case name `` Systems and Methods for Transferring Wafer Carriers Between Processing Tools 丨 '; and U.S. Provisional Patent Application No. 60 / 443,115, No. 5, application date January 2003 On the 27th, the case name was "Apparatus and Method for Storing and Loading Wafer Carriers". O 20042004041 Semiconductor components are usually manufactured on substrates, such as silicon substrates, flat plates or other similar, often called wafers, for Computer, and similar. These components are made from a series of manufacturing steps, such as thin film deposition, oxidation, engraving, grinding, and heat treatment and manufacturing processes. Although multiple production steps can be performed in a single processing facility, in general, the substrate needs to be transferred in different processing tools for at least some of the production steps. For transport in processing tools and other locations, substrates are often insulted into a carrier. In order to protect the processing tool from idling, the unprocessed should be able to be supplied almost continuously. As a result, loads and health are usually located near the processing tools. This type of problem loading and storage equipment usually has one or more docking stations, in which the substrate is opened and transferred to a management tool. It also includes multiple storage racks located on dock #station, a loading and storage device. The Dingcho factory loading position receiving the carrier, and a robotic arm that transfers the load between the factory loading platform, the docking station and the storage rack. The robotic arm can contain ^ S an end effector connected to a support knot. Typical support structure package — S ,, & δ, a vertical and a horizontal guide, so that the terminal assisted state can be horizontally and duly loaded in docking station A, storage rack and factory loading platform And storage equipment can be modular and modular design (for example, and pieces, which are typically installed in a single processor, or the framework extended by the party is non-modular design (for example, has ^ Qianqi It can be installed independently, and the model has horizontal and / or vertical extensions in front of multiple processing tools.) Photolithography 9 made of glass screen — Multiple existing substrates are stored including guides that are built on individual pieces. Introduce multiple elements, or direct guide 5 200408041 When the factory loading position receives a loader # μ pick-up, use a robotic arm to move the carrier from the factory loading position to one of the storage racks ^ ^ . Thereafter, the carrier can be moved from the storage rack to the docking station. After the substrate is obtained from the carrier, the carrier is processed, and then returned to the carrier. # $ 臂 自 π & ρ ^ β The pieces are moved to one of the storage racks by the robot hand #from # sin station. Ψ ψ g ^ ^ ^ ^ Then, the carrier is moved from the storage rack to the factory loading station by the machine. # Move it because it must be in the storage rack. Moving the substrate carrier, the g ~ of the factory loading position may place a considerable burden on the robot arm, and may ## t ^ ^ ^ _ _ the manipulation of the substrate carrier in the factory. Therefore, there is an urgent need for a smooth substrate. [Summary of the Invention] Method ::: The first aspect, which proposes a method for supplying a substrate to a processing tool: The first method includes the following steps: providing multiple loading ports each: The mechanism to open the substrate carrier; (2) Provide the factory to exchange the two materials L base: the carrier conveying device transfers and moves the substrate carrier :: the material carrier conveying device exchanges the substrate carrier; (3) provides A: a material carrier transporter 'having a cooker for contacting a substrate carrier, and a carrier carrier for transporting a substrate carrier between a factory exchange location and a plurality of fu; and ⑷The material carrier conveying device receives the first A set of multiple substrate carriers :: For each of the substrate carriers, the method includes the following steps (; and), = factory exchange position to directly transfer the substrate carrier to multiple individual loading ports One; (2) dock and open the substrate carrier at the individual loading port; (3) 2UU408041 at the individual loading port, leaving the loading port to transfer the substrate carrier to ... change = the carrier to the substrate Carrier rotation device.) The second method of separating the media from the basic invention is the second method. This second Fangda ... ’presents the A material of the first carrier platform for conveying the substrate carrier! Step 传送 The substrate carrier is transferred on an eight-piece carrier conveyor connected to the substrate, and the loading station contains a stack of two and a two-piece carrier for the substrate to the processing tool. Conveyor for conveying the substrate carrying carrier: m The substrate of a substrate loading station moves and detaches the material carrier conveyor belt when the substrate carrier is moved, and the substrate carrier is transferred from :: The substrate carrier conveyer belt carrier conveys the carrier directly from the substrate carrier conveyer belt to the loading and leaving and closes the second load: docking and opening the substrate carrier; (5) the i-belt 7 is loaded on the loading base carrier. The carrier, and (6) the substrate carrier is directly transferred back to the base station 2; providing the transport of the substrate carrier to the substrate loading # ^^^ ^ The first method includes transferring the substrate on a base tape adjacent to the substrate loading station Carrying pieces. The substrate loading station includes a 7-piece carrier, which is used to transport the substrate carrier to the processing port of the processing tool, and its # 引 -Earth material carrier carrier includes (1) a vertical guide terminal 2 receiving) Action one: a horizontal guide connected to the vertical guide; and (3)-Straight Soft α to support the substrate carrier to move vertically relative to the vertical guide and horizontally move relative to the horizontal guide. The first method of the second method further includes (1) using the terminal actuator of the substrate carrier of the substrate loading platform to disengage the substrate carrier from the substrate carrier 200408041; (2) carrying the substrate The pieces are directly transferred from the substrate carrier conveyor to the first loading port; (3) at the first loading, # lean and open the substrate carrier; (4) at the first loading port, leave and close the substrate carrier ; And (5) The substrate carrier is directly returned to the substrate carrier conveyor. The present invention also provides many other aspects, such as systems and devices according to this and other aspects of the invention. Using the end effector of the substrate handler to contact and transport another substrate, the method of the present invention can also provide individual substrates (such as those that are not in or on a substrate carrier). Materials) for exchange, transportation and placement. According to the method and apparatus of the present invention, the substrate / substrate carrier supplied to the processing tool is transferred directly from the factory loading location to the loading port. There is no need for a conveyor to place the substrate / substrate carrier in a factory exchange location other than the loading port, and the substrate / substrate carrier is transferred "directly" from the factory loading location to the loading port. The method and apparatus of the present invention provide smooth and highly efficient transfer of substrates and / or substrate carriers. As a result, the total time required to transport and handle the substrate can be reduced 'and the capital and capital investment required during the work of the substrate can also be reduced' while the burden on the robot arm of the substrate carrier handler can be reduced. Other features and aspects of the present invention will be clearly presented in the exemplary embodiments detailed below, the scope of patent applications and the drawings that follow. [Embodiment] Related proper nouns 8 200408041 Picture of Pei not being placed in the direction of moving clean or open parts. In this article, the proper term "dock" means that the substrate or the substrate carrier moves along the port, such as Ports on the walls of the clean room in which substrates are exchanged. Similarly, "leave" means the movement of a substrate or substrate carrier away from a port, such as a port on a clean room wall, in exchange for a substrate. "Factory exchange location" includes all points in a space that transport a substrate substrate carrier by a device, which is to move a substrate or substrate carrier or to place a substrate or substrate carrier from a substrate carrier conveying device While the substrate is carrying the conveying device. A "substrate or substrate carrier conveying device" includes a conveyor belt, a self-guided vehicle (AGV), or any other device that transfers a substrate or substrate carrier to a tool loading location (or vice versa). A "processing tool" includes one or more processing chambers and one or more substrate handlers for loading and unloading the processing chambers. The substrate handler may or be covered by its own processing chamber, such as factory interface processing Room or transfer room. The laboratory can perform vacuum, atmospheric pressure or other processes on the substrate, including, for example, physical vapor deposition (PVD), chemical vapor deposition (CVD), etching, volume, cleaning, grinding, and so on. A "loading port" includes a substrate or substrate carrier in which it is placed for transporting the substrate to a processing tool (or vice versa). System description Figure 1 is a top plan view showing a conventional modular loading and storage device 1 u for storing the substrate adjacent to the conventional processing tool 113 f. The second front view shows a modular loading and storage device. Starting from 20040041 reference, Figure 1, the front-end robot arm processing room is not located in the loading and storage equipment 丨 丨 丨 and processing workers ^ 1 shown in the first equipment 111 adjacent to the clean room wall 117, and the front end The robotic processing chamber is located on the second adjacent surface. The front-end robotic processing chamber 1 119 can be moved horizontally along a track (not seen with the storage device 111 to pick up substrates and transfer them to the load lock to 121). Loading and storage equipment Ul package 12: 3, in order to extract the substrate, the substrate carrier is placed on the platform equipment for docking operations, so it can be called multiple storage racks 201 (Figure 2 is the best illustration) It is placed on top (for example, in a high position). On the support frame stock 201. The robot arm 205 is also carried on the support frame 203. The robot arm 205 includes a cloth for vertical movement, the terminal The actuator 209 is installed in a factory loading position 213 in which 207 is installed to horizontally move the substrate carrier along the horizontal guide 211. The robot arm is transported by means of the vertical guide 207 and the horizontal guide 211. 205 terminal actuator 209 213, storage rack 201, and docking station 123, but moved 'as previously noted, repeatedly moving the substrate loading position 213 to storage rack 201, and then to the parking | back to the factory loading position 213 (possibly by borrowing The storage rack 1 1 5 (or the industrial customer interface) r 11 3. The loading and storage of the clean room wall 1 1 7 & 1 5 includes a robotic arm icon) to load and manage The negative of the tool 11 3 includes a pair of loading platforms (loaded as a docking platform in this example), and a vertical guide 207, which stores the substrate carrier 1, is installed on the docking platform 1 2 3 203. The vertical Guidance. One is used to receive the bamboo platform 123, the substrate carrier is moved to the factory loading position, and the substrate carrier is moved. The carrier from the factory ^ platform 1 2 3, and then 201) may lead to the processing tool at 10 200408041. When the substrate is supplied, a large amount of time is consumed, thereby increasing the amount of "work-in-process". Figure 3A is a front elevational view illustrating an exemplary substrate loading station provided in accordance with the present invention. The reference number 3 〇 丨 generally indicates a substrate loading station of the present invention. The loading station 301 includes a plurality of loading ports 303. Each loading port 303 preferably has a docking mechanism (not shown), for example, a motorized clamp or platform to support the substrate carrier and to move the substrate carrier toward And away from the opening that a substrate is intended to convey. In the special embodiment shown in Figure A, a load port 303 is installed in two stacks 305, 307 each having three load ports. Therefore, six loading ports 303 appear in the embodiment of Figs. Other numbers and / or configurations of loading ports are also available. Stack 307 to be placed on one side of stack 305 and spaced. Each loading port 303 can include a mechanism, usually indicated by the identification number 3009, for opening the substrate carrier docked at the loading port 303. In one embodiment of the present invention, the loading port 303 is used to receive a single base package. The proper term "single substrate carrier" means the shape and the substrate carrier-including only one substrate at a time. In general, the charge may include any type of substrate carrier (for example, single-substrate carrier, multiple substrate carriers, open-type substrate carriers, front-open standard pods, front

述之組合物等等)。繁I 寻)第3A圖所不為停靠在裝載埠303中的 兩個之基材承載件311。 本發明之一個實施例中,每一 母個裝载埠303係用作同 步開啟基材承载件311和停靠基 7執彳千(例如,在潔潘官 牆上,承載件向埠口的移動彡。^ & 、 )精由文排一個凸輪和跟隨器 11 200408041 可以達成此類的開啟。先前之共同申 案第_⑽號,申請曰2。。2年8月案31:國2申請 稱「使用晶圓承載件的移動以使晶圓承載件開啟/二:: =設備」’揭示了 一個此類型的裝載淳。尚有其他選擇, 載:以使用習知的間門開啟裝置(例如,在停靠後開啟承 載件)。此類裝置通常使用一個閉門接收器,以解鎖承載件 閘門和將基材自承載件移走,使能提取基材。 一個基材承載件輸送裝置,例如,一個輸送帶(示音、圖 圖示於3:13)經設定以傳送基材承載件至本發明的基=裝 载站台301,和從本發明的基材裝載站台3 砂開基材承 f件。關於本發明之裝載站台3〇1並臨接於輪送帶SB的 是一個基材承載件交換裝置315,其用以接收來自輸送帶 313的基材承載件,和對輸送帶313傳送基材承载件。因 此,可了解基材承載件交換裝置315定義了 一個工廠交換 位置317,而基材承載件與輸送帶313在其中交換。基材 承載件交換裝置3 1 5可能具有先前的申請案之型態,例 如’先前之美國專利申請案第60/407,45 1號,中請日2002 年8月3 1曰,申請案名稱「用以傳送晶圓承載件之系統」, 其揭露一個轉動的平台,其轉動用以接觸和連接/解除連接 晶圓承載件至或從上方之工廠運輸系統。 尚有另一種選擇’基材承載件交換裝置315可能具有 先前的共同申請案之型態,例如,美國專利申請案第 09/75 5,3 94號,其揭露的一個升高元件,其線性升高以接 觸和連接/解除連接基材承載件至或自上方的工廠輸送系 12 文參照其全部内容併呈於此)。尚有另-選擇,基材 件交換裝置3 1 5可能具有先前的共同申請案之= 例如’美國專利申請案第6〇/4〇7,474號,申請曰2咖“ 二:1曰,申請案名稱「用以自晶圓承載件運輸系統卸載晶 载件的方法和設備」,其揭露一個旋轉f,其旋轉^ 觸和連接/解除連接基材承載 秋1干主A目上方的工廠運輪李 、·先。尚有進一步的選擇,可以省略基材承載件交換裝置,、 並且承載件搬運機可以在工廠交換位置(例如,承載件在本 發明裝㈣台和纟載件冑送裝置之間交換的任何位置)與 承載件輸送…13交換基材承載件。此類方法詳述於: .同申請案,美國專利申請㈣6〇/4〇7,463號,申請日2〇〇2 年8月31日,和60/443,〇〇4 ,申請日2〇〇3年丄月η曰。 當輸送帶(或者在其上運輸的承載件)在移動時,可以 設定基材承載件交換裝置315,例如,從輸送帶313移走 基材承載件,和在輸送帶(或者沿著其上程動之基材承載件 傳送器)移動時,對輸送帶3丨3傳送基材承載件。因此,當 半導體生產設備運作時,輸送帶313維持持續地移動是可 實施的,從而改進基材在生產設備中的運輸,以減少穿過 生產設備的每一個特定基材所需之時間,並且據以在任何 給定的時間中,減少在工作過程令的基材總量。 本發明之裝載站台301進一步包括承載件搬運機 319。承載件搬運機319包括用以同基材承載件311接觸的 終端受動器321。例如,終端受動器321可用以從底部支 撐基材承載件3 11,或者從頂部抓住基材承載件3丨丨,等 13 等。 終端受動器32 1係用以沿著一個垂直導引 移動垂直導引323依次用以沿著一個水平導 平移動。因此,終端受動器321可以在工廠交 和所有裝載埠3 03中移動。吾人也將了解終端 亦可以在裝載埠303的堆疊3 05、3 〇7間之空間 移動。另一個選擇,垂直和水平的導引可以如 不般重新配置,以使終端受動器32丨可用以沿 3 25水平移動,以及使水平導引325沿著垂直 直移動。儘管未見於第3A或3B圖,本發明之 以包括一個或多個儲存架,以儲存基材和/或基 第4圖是說明本發明裝載站台3〇1佈局特 面俯視示意圖。在第4圖,標示號碼117表示 牆。標示號碼401表示裝載埠3〇3的堆疊3〇5 示號碼403表示裝載埠3〇3的堆疊3〇7的執跡 目「軌跡」(footprint)是在設備地板上之項目 不號碼405表示軌跡4〇丨和4〇3之間的區域。 明裝载站台的工具「虛線範圍」係意指在軌跡 再加上軌跡401和403之間的區域4〇5。標示 示用堆疊4〇1和403所定義的工具虛線範圍。 可操作承載件搬運機3 19以使其僅僅在由 3〇5、307的執跡401、4〇3所定義的虛線範圍 二承載件3H。依據本發明之第6 ®之流程圖 器C控制承載件搬運機3丨9的操作。 323以垂直 引3 25以水 換位置3 1 7 受動器321 327中垂直 第3B圖所 著水平導引 導引323垂 裝载站台可 材承載件。 徵的一個平 一面潔淨室 的轨跡。彳@ 。應了解項 的投影。# 應了解本發 4 0 1 和 4 〇 3 號碼407 | 裝载蟑堆疊 之内移動基 ,一個控制 14 200408041 再次參照第3 A或3 B圖,將了解工廠交換位置3 1 7之 高度位在高於裝載埠303的個別高度,也將了解裝載埠303 的堆疊305和工廠交換位置317具有實質相同的執跡。然 而,亦思及本發明之裝載站台3 0 1之其他配置。例如,工 廠交換位置317可能位在裝载埠303的高度或之下。同樣 地,工廠交換位置317的執跡亦可以與裝載埠3〇3的堆疊 3 07之軌跡403相符合(第4圖)。尚有另一選擇,工廠交 換位置317的軌跡可能不與裝載埠3〇3的堆疊3〇5、3〇7 之執跡4 0 1、4 0 3之任一個相符合。 第5圖是一個示意性側面視圖,圖示The composition described, etc.). Traditionally, FIG. 3A does not show the two substrate carriers 311 docked in the loading port 303. In one embodiment of the present invention, each female loading port 303 is used to simultaneously open the substrate carrier 311 and the docking base 7 (for example, on the Jiepan official wall, the carrier moves toward the port).彡. ^ &Amp;,) Jingyou Wen A cam and follower 11 200408041 can achieve this kind of opening. Previous joint application No. _⑽, application date 2. . Case 2 of August 2 31: Country 2 application states that "the use of wafer carrier movement to make the wafer carrier open / II :: = equipment" 'reveals a load of this type. There are other options, as well: use a conventional door opening device (for example, to open the carrier after docking). Such devices typically use a closed-door receiver to unlock the carrier gate and remove the substrate from the carrier to enable extraction of the substrate. A substrate carrier conveying device, for example, a conveyor belt (sound and picture shown at 3:13) is set to convey the substrate carrier to the substrate of the present invention = loading station 301, and from the substrate of the present invention. Material loading platform 3 sand-fed substrate bearing f pieces. Concerning the loading platform 301 of the present invention and adjacent to the conveyor belt SB is a substrate carrier exchange device 315 for receiving the substrate carrier from the conveyor belt 313 and transferring the substrate to the conveyor belt 313 Carrying pieces. Therefore, it can be understood that the substrate carrier exchange device 315 defines a factory exchange position 317, and the substrate carrier and the conveyor belt 313 are exchanged therein. The substrate carrier exchange device 3 1 5 may have the form of a previous application, for example, 'previous US patent application No. 60 / 407,45 No. 1, August 31, 2002, the name of the application "System for conveying wafer carriers" discloses a rotating platform that rotates to contact and connect / disconnect wafer carriers to or from a factory transportation system above. There is still another option, 'the substrate carrier exchange device 315 may have the form of a previous joint application, for example, U.S. Patent Application No. 09/75 5,3 94, which discloses a raised element whose linearity is Lifting to contact and connect / disconnect the substrate carrier to or from the factory conveyor system above (see 12 for its entirety and presented here). There is still another option-the base material exchange device 3 1 5 may have the previous common application = for example, 'US Patent Application No. 60 / 4〇7,474, Application No. 2 Coffee, "No. 1: Application No. The name "Method and Equipment for Unloading a Crystal Carrier from a Wafer Carrier Transport System" discloses a rotation f, which rotates ^ to touch and connect / disconnect the substrate carrying the factory wheel above the main A head Lee, first. There are further options, where the substrate carrier exchange device can be omitted, and the carrier transporter can exchange positions at the factory (for example, any position where the carrier is exchanged between the loading station and the carrier transport device of the present invention). ) Conveying with the carrier ... 13 Exchange the substrate carrier. Such methods are detailed in: .Same application, U.S. Patent Application No. 60 / 407,463, filed August 31, 2002, and 60 / 443,004, filed 2003 Year 丄 month η said. When the conveyor belt (or the carrier being transported thereon) is moving, the substrate carrier exchange device 315 can be set, for example, the substrate carrier is removed from the conveyor belt 313, and on the conveyor belt (or along its path) When the moving substrate carrier conveyor) moves, it transports the substrate carrier to the conveyor belt 3 丨 3. Therefore, it is practicable to maintain continuous movement of the conveyor belt 313 while the semiconductor production equipment is operating, thereby improving the transportation of the substrate in the production equipment to reduce the time required for each specific substrate passing through the production equipment, and This is to reduce the total amount of substrate required during the work process at any given time. The loading platform 301 of the present invention further includes a carrier conveyer 319. The carrier transporter 319 includes an end effector 321 for contacting the substrate carrier 311. For example, the end effector 321 may be used to support the substrate carrier 3 11 from the bottom, or grasp the substrate carrier 3 丨 丨 from the top, etc. 13 and so on. The terminal actuator 321 is used to move along a vertical guide. The vertical guide 323 is used to move along a horizontal guide in turn. Therefore, the end effector 321 can be moved in the factory port and all loading ports 303. I will also understand that the terminal can also move in the space between stacks 305 and 307 in loading port 303. Alternatively, the vertical and horizontal guides may be reconfigured as unusually so that the end effector 32 丨 can be used to move horizontally along 3 25, and the horizontal guide 325 can be moved vertically vertically. Although not shown in Figures 3A or 3B, the present invention includes one or more storage racks for storing substrates and / or substrates. Figure 4 is a schematic top plan view illustrating the layout of the loading platform 301 of the present invention. In Fig. 4, reference numeral 117 denotes a wall. The label number 401 indicates the stacking port 3 of the loading port 305. The number 403 indicates the track 3 of the stacking port 307 of the loading port. The "footprint" is an item on the equipment floor. The number 405 indicates the track 4. The area between 〇 丨 and 〇3. The tool "dotted line range" of the Ming loading station means the area 504 between the trajectory plus the trajectory 401 and 403. Marking shows the dotted area of the tool defined by stacks 401 and 403. The carrier carrier 3 19 can be operated so that it is only within the dashed area defined by the track 401, 403 of 305, 307, the second carrier 3H. The flow chart device C according to the 6th ® of the present invention controls the operation of the carrier transporter 3-9. 323 with vertical guide 3 25 with water for position 3 1 7 Actuator 321 327 Vertical guide in Figure 3B Horizontal guide guide 323 vertical loading platform can load the material. The trajectory of a flat clean room.彳 @. You should know the projection of the item. # You should understand this issue 4 0 1 and 4 〇3 No. 407 | Loading base inside the cockroach stack, a control 14 200408041 Referring again to Figure 3 A or 3 B, you will understand that the factory exchange position 3 1 7 is at the height Above the individual height of the loading port 303, it will also be understood that the stacking 305 of the loading port 303 and the plant exchange location 317 have substantially the same track. However, other configurations of the loading platform 301 of the present invention are also contemplated. For example, the plant swap location 317 may be located at or below the height of the loading port 303. Similarly, the track of the factory exchange position 317 can be matched with the track 403 of the stack 30 07 of the loading port 303 (Figure 4). There is still another option. The trajectory of the plant exchange position 317 may not correspond to any of the stacks 305, 307 of the loading port 303, 403, and 403. Figure 5 is a schematic side view showing

機,其相關於習知處理工具113和本發明裝載站台3〇1 ^ 裝載埠303(第3A或3B圖)。參照第5圖,標示號碼5( 表示依據本發明所提供的基材搬運機。可以把本發明之』 材搬運機501置於一個較低的位置(如標示號碼5〇3夺 不)。在該處,本發明之基材搬運機5〇丨能夠水平移動以巧 取裝載埠303最低的堆疊之—。也能夠把本發明基材搬$Machine, which is related to the conventional processing tool 113 and the loading station 301 of the present invention ^ loading port 303 (Figure 3A or 3B). Referring to FIG. 5, the reference number 5 (indicates the substrate conveyer provided according to the present invention. The material conveyer 501 of the present invention can be placed at a lower position (such as the reference number 503 is not available). Here, the substrate handler 50 of the present invention can be moved horizontally to take the lowest stack of the loading port 303. The substrate of the present invention can also be moved.

機501置於一個較高的位置(如圖和標示號碼5〇5所示) 在該處,本發明之基材搬運機5〇1能夠水平移動以存取Η 裝載埠303 t中最高處的堆疊。吾人將了解,也可以把; 發明基材搬運機501置於標示位置5〇3和5〇5之間的任4 位置(未特別標示於圖示),例如,在一個本發明基材搬; 機5〇1能夠水平移動以存取裝载淳3〇3的中間堆疊之^ 置0 在本文中 當基材搬運機延伸 進入至裝載埠區域時, 15 200408041 則5兒基材搬運機「存取」一個裝載埠(例如,用以 基材)。 吾人將了解’在本發明基材搬運機5〇1從_ 裝载埠303中的一個之基材承載件311移走—個7 於圖示)之後(第3A或3B圖,未見於第5圖),本 搬運機501可以向處理工具U3,或者,特別是 工具113的負載鎖定室121 (如第!圖所示,未單 第5圖)供給基材。 第6圖係一個流程圖,其說明依據本發明檇 裝載站台之操作,例如第3 A或3B圖中,本發明 載站台301。可以使控制器c與基材裝載站台連 才呆作執行以完成第6圖過程中的一或多個步驟。 根據第6圖的第一步驟6〇1,在工廠交換位 收了基材承載件3 1 1。在第3A或3B圖之示例性 站台301中,例如,承載件交換裝置315從輸送 走基材承载件311(例如,藉由終端受動器321)。 發生的’例如’當輸送帶3 1 3移動時。 在第6圖的第601步驟之後的是第6〇3步驟 步驟中,承載件搬運機319從工廠交換位置317 承載件311到裝載埠3〇3中的一個。依據本發明 交換位置317直接運輸基材承載件311至裝載埠 個。亦即,在從工廄交換位置3 1 7移走基材承 之後’和在放置基材承载件311至裝載埠3〇3中 别,承载件搬運機319除了裝載埠3〇3中的一個 ,運輸一個 >靠在多個 基材(未見 發明基材 .,向處理 獨顯示於 :成的基材 之基材裝 .接,並且 置317接 基材裝載 帶3 1 3移 它是可以 。在第603 運輸基材 ’從工廠 3 03中的 载件3 1 1 ^ 一個之 以外,在 16 200408041 任何承 在 步驟, 個,藉 埠303 生〇 在 步驟, 個並由 由基材 在處理 在 搬運機 停靠並 插入的 驟)。基 圖的第 承載件 廒交換 303直妻 在從裝 前,基; 置 3 17, 在\ 載件支撐位置皆不放置基材承載件3ιι。 第6圖的第603步驟之徭的 鄉乏傻的疋第6〇5步驟。在第605 基材承載件311 停靠並關;& a 非兀開敬在裝载埠303中的一 由承載件搬運機319放置於盆由 , 從罝於具中。如上所示,裝載 可能用以使基材承載俾^ 戰仵3 1 1的停靠和開啟同時發 第6圖的第605步驟之後的是第6〇7步驟。在第μ? 基材搬運機5〇1從在已經停靠在裝載槔3〇3中的一 其所開啟之基材承載件311提取一個基材。而後, 搬運機501供應所提取的基材給處理工具ιΐ3,並 工具113之内處理之(第6〇9步驟)。 完成處理工具Π3中的基材的處理程序之後,基材 5〇1傳回基材至在裝載埠3〇3(第611步驟)中的一個 開啟的基材承載件3 1 1。然後,經處理過的基材所 基材承載件311關閉並離開裝載埠3〇3(第613步 材承載件3 03的離開和關閉可以同時發生。在第6 613步驟之後的是第615步驟。在第615步驟中, 搬運機3丨9從裝載埠3 03運輸基材承載件311到工 置3 1 7。根據本發明的一個態樣,可以從裝載埠 運輸基材承載件3 11到工廠交換位置3丨7。亦即, 璋3 0 3移走之後’和在送到工廠交換位置3丨7之 承載件3 1 1可以從裝載埠3 〇 3運輸到工廠交換位 而無需置於任何承載件支撐位置上。 6圖的第615步驟之後的是第617步驟。在第617 17 200408041 乂驟中’承載件交換裝 帶3 13。在本發明 回基材承載件3U到輸送 時仍可以達A 例中,當輸送帶⑴在移動 吁仍了以達成。應注意的是 牡秒動 步驟可以在運輸個別的基材或或”基材承載件的 被省略。因此s 3不需要停罪基材的系統中 觫叮 ’第#口 613步驟是選擇性的。吾人將了 解可以用個別其紝品dfc甘η 口人將了 ,^ '"材而非基材承載件來完成本發明之方法。 在承载件輸送裝置和處理工 月之方法 具間的運輸,附加的數字係指The machine 501 is placed at a higher position (as shown in FIG. 5 and marked with the number 505). Here, the substrate carrier 501 of the present invention can be moved horizontally to access the highest position in the loading port 303 t. Stacked. I will understand that it is also possible to place; the inventive substrate carrier 501 is placed at any of the 4 positions between 503 and 505 (not specifically shown in the figure), for example, in a substrate of the present invention; The machine 501 can be moved horizontally to access the middle stack of the loader 303. In this paper, when the substrate handler extends into the loading port area, 15 200408041 is 5 Take a load port (for example, for substrates). I will understand 'after the substrate carrier 501 of the present invention is removed from the substrate carrier 311 of one of the _ loading port 303-a 7 in the figure) (Figure 3A or 3B, not shown in Figure 5 (Figure), the present conveyor 501 can supply the substrate to the processing tool U3 or, in particular, the load lock chamber 121 of the tool 113 (as shown in FIG.!, Not shown in FIG. 5). Fig. 6 is a flowchart illustrating the operation of a loading station according to the present invention. For example, Fig. 3 A or 3B shows a loading station 301 according to the present invention. The controller c may be connected to the substrate loading station and left to perform to complete one or more steps in the process of FIG. According to the first step 601 of Fig. 6, the substrate carrier 3 1 1 is received at the factory exchange position. In the exemplary station 301 of Fig. 3A or 3B, for example, the carrier exchange device 315 removes the substrate carrier 311 from the transport (for example, by the end effector 321). What happens, for example, when the conveyor belt 3 1 3 moves. After step 601 of FIG. 6 is followed by step 603, the carrier transporter 319 moves from the factory exchange position 317 to the carrier 311 to one of the loading ports 303. According to the present invention, the exchange position 317 directly transports the substrate carrier 311 to the loading port. That is, after the substrate carrier is removed from the job exchange position 3 1 7 and after the substrate carrier 311 is placed in the loading port 303, the carrier carrier 319 except for one of the loading port 303 , Transport one > lean on multiple substrates (no invention substrates have been seen, install the substrates that are shown separately on the finished substrates. Connect, and set 317 to the substrate loading belt 3 1 3 to move it is Yes, in the 603th transport substrate 'from the load 3 3 1 1 ^ in the factory 3 03, any in 16 200408041 in the step, the port 303 was born in the step, and by the substrate in the Handle steps where the conveyor is docked and inserted). The first carrier of the base figure 廒 Exchange 303 straight wife Before the installation, the base is set to 3 17, and no substrate carrier 3m is placed at the support position of the carrier. Step 6 of Figure 603 is a dumb step of Step 605. At 605th, the substrate carrier 311 is docked and closed; & a non-respectable one in the loading port 303 is placed by the carrier transporter 319 in the pot, and is held in the tool. As shown above, loading may be used to make the substrate carry the 俾 ^ Trench 3 1 1 docking and opening at the same time. Step 605 of Figure 6 is followed by Step 607. At the μ? Substrate carrier 501, one substrate is extracted from one of the opened substrate carriers 311 which has been docked in the loader 303. Then, the conveyor 501 supplies the extracted substrate to the processing tool ι3, and processes it in the tool 113 (step 609). After the processing procedure of the substrate in the processing tool Π3 is completed, the substrate 501 returns the substrate to the substrate carrier 3 1 1 which is opened at one of the loading ports 303 (step 611). Then, the substrate carrier 311 of the processed substrate is closed and leaves the loading port 303 (step 613, the departure and closing of the material carrier 303 can occur at the same time. After step 6 613 is followed by step 615 In step 615, the carrier 3 丨 9 transports the substrate carrier 311 from the loading port 3 03 to the station 3 1 7. According to one aspect of the present invention, the substrate carrier 3 11 can be transported from the loading port Factory exchange position 3 丨 7. That is, after 璋 3 03 is removed 'and the carrier 3 1 1 sent to the factory exchange position 3 丨 7 can be transported from the loading port 3 03 to the factory exchange position without being placed Any support position of the carrier. Step 615 of FIG. 6 is followed by step 617. In step 617 17 200408041, the step of “carrier exchange of the carrier tape 3 13.” The present invention still returns to the substrate carrier 3U when it is transported. In the case of A, when the conveyor belt is moving, it is still achieved. It should be noted that the tack-second step can be omitted when transporting individual substrates or “substrate carriers. Therefore, s 3 does not need to be stopped. Step # 613 of Step 613 is optional in our sin-based system. It is understood that the method of the present invention can be completed with individual counterfeit products dfc Gan ^ ^ "" material rather than a substrate carrier. The transport between the carrier conveying device and the processing tool of the processing month, additional Numbers refer to

別基材而非基材承载件,以避免重複。 本發明的方法和設備之優點在於,因為使在裝載埠間 返的基材承载件的運輸流暢,彳可以減少基材經過半導 體生產&備的總時間。它可以依序解釋為減少卫作過程、 降低的資本費帛、和降低單-基材的製造費用。 月J文中所揭露者僅是本發明之示例性實施例;對上文 所述揭露的方法和設備的修正若落入本發明之範圍内,對 熟知本項技藝者將是顯而易見的。例如,上文所述之相關 於第3 Α或3 Β圖之承載件搬運機包括一個可以沿著單一水 平導引水平移動的垂直導引。然而,亦思及使用一個承載 件搬運機類型,其中,在兩個平行水平導引之間安裝有可 滑動之垂直導引。尚有另一個選擇,使用一個承載件搬運 機類型,其中,在兩個平行垂直導引之間安裝有可滑動之 水平導引。當然,也包括那些不使用線性導引之其他類型 的承载件搬運機。 除了第3A或3B圖所示之每堆三個裝載淳的那兩個堆 疊之外,本發明亦思及使用其他架構之裝载埠。例如,可 18 200408041 能在裝 裝載埠 一堆疊 提供一 的裝載 有相同 的其他 上水平 第 單一基 以提供 給比多 及,可 用。 可 承载件 基材承 擇持續 雖 交換位 個或以 可使用 件使用 個基材 載埠的每一堆疊,只有兩個裝載埠,或者,可能在 的每一堆疊有四個或者更多個裝載埠。亦無需在每 提供相同的裝载埠數量。尚有另一個選擇,可以只 個堆疊的裝載埠,或者可以提供三個或者更多堆疊 埠。要強調的尚有,雖然所示每個堆疊的裝載埠具 的軌跡,亦可以使用部份重疊軌跡或者非重疊軌跡 種類配置。亦有使用單一裝載埠,或者使用二個以 鄰接的裝載埠的實施例。 5圖顯示為一個供一個堆疊中的所有裝載埠使用的 材搬運機。尚有可能的選擇,個別的基材搬運機可 給每一個裝载埠。亦思及可以供應單一基材搬運機 於一個堆疊的裝載埠的所有裝載埠使用。進一步思 以供應個別的基材搬運機給每一堆疊的裝載蟑使 以使用輸送帶之外的基材承載件輸送裝置來將基材 運至/運離工廠交換位置。如果使用一個輸送帶作為 载件輸送裝置,當半導體生產設備啟動時,可以選 運動。 然相關於本發明的基材裝载站台僅顯示了一個工廠 置’但亦思及提供與本發明相關的基材裝載站台二 上的工廠交換位置。例如,對於進入的基材承載件 第一工廠交換位置,並且可以對於外送的基材承載 第一個工廠交換位置。本文亦思及可以供應多於一 承载件輪送裝置給本發明的基材裝載站台使用。Do not use substrates instead of substrate carriers to avoid duplication. An advantage of the method and apparatus of the present invention is that, because the transportation of the substrate carrier returned between loading ports is smooth, the total time for the substrate to pass through semiconductor production & preparation can be reduced. It can be interpreted sequentially as reducing the farming process, reducing capital costs, and reducing the manufacturing cost of single-substrate. What is disclosed in the J article is only an exemplary embodiment of the present invention; it will be apparent to those skilled in the art that modifications to the methods and equipment disclosed above fall within the scope of the present invention. For example, the carrier handler described above with respect to Figure 3A or 3B includes a vertical guide that can move horizontally along a single horizontal guide. However, it is also considered to use a type of carrier conveyor in which a slidable vertical guide is installed between two parallel horizontal guides. Another option is to use a type of carrier conveyor in which a slidable horizontal guide is installed between two parallel vertical guides. Of course, other types of carrier handlers that do not use linear guidance are also included. In addition to the two stacks of each of the three loading stacks shown in Figure 3A or 3B, the present invention contemplates the use of other architecture loading ports. For example, may 18 200408041 be able to provide one stack at the loading port with a load of the same other up-level single base to provide more than, and is available. The loadable substrate can be selected continuously, although each stack of the substrate load ports can be exchanged or useable, there are only two loading ports, or there may be four or more loads in each stack. port. It is also not necessary to provide the same number of loading ports each time. There is another option, either only stacked loading ports or three or more stacked ports. It should be emphasized that although the trajectories of each stacked loading port are shown, it is also possible to use partially overlapping trajectories or non-overlapping trajectories. There are also embodiments using a single loading port, or using two adjacent loading ports. Figure 5 shows a material handler for all loading ports in a stack. It is possible to select individual substrate handlers for each loading port. It also takes into account that all single loading docks can be supplied to all loading ports in a stacked loading port. It is further thought to supply individual substrate handlers to each stack of loading cocks to use substrate carrier conveying devices other than a conveyor belt to transport / remove the substrate to / from a factory exchange location. If a conveyor belt is used as the carrier device, the movement can be selected when the semiconductor production equipment is started. Although the substrate loading station related to the present invention shows only one factory setting ', it is also considered to provide the factory exchange station on the substrate loading station 2 related to the present invention. For example, the first factory exchange position is for the incoming substrate carrier, and the first factory exchange position may be carried for the outgoing substrate. It is also contemplated herein that more than one carrier carousel can be supplied to the substrate loading station of the present invention.

19 200408041 二本發月之較佳實施例,把本發明使用於基材裝戴站 /、/、有與垂直導引和水平導引相連之框架。在該方法 争乂佳的基材裝載站台是模組化的,並可以迅速安鞮和 *準在該隋况下,基材裝載站台含有一或多個儲存架, 每個儲存架可以案裝在框架上。藉由在框架上安裝 承載件搬運機和儲少* 土何 储存架,基材承載件搬運機和儲存架具 彼此相關的預設位番 、有 置。它更有利於安裝和校準,並且有你 用模組化基材裝歲 、,使19 200408041 Two preferred embodiments of this month, the present invention is applied to a substrate mounting station /, /, has a frame connected to vertical guidance and horizontal guidance. The substrate loading station that is best in this method is modular, and can be quickly and safely installed. Under this condition, the substrate loading station contains one or more storage racks, and each storage rack can be installed. On the frame. By installing a carrier carrier and a storage unit * on the frame, the substrate carrier carrier and the storage rack are preset and arranged in relation to each other. It is more conducive to installation and calibration.

α的另一個優點。同樣地,用以裝 和/或從一個上方工缸、 戮 厥運輸系統卸載基材承載件的其他檣 構’例如’饋送機椹 ’ ’構’亦可擇優安裝在框架上。示例性 送機構可以包括轉動平台或者轉動臂,等等,_見於先; 之專利申叫案’果國專利申請案第60/407,45 1號,申請曰 2002年8月31日,宋口络“, 和第60/407,474號,中請日2002牟s 月31日。 干8 本發明之一個離楳 π ^ 4 ^ 〜、樣’可以在潔淨室牆上預定的安裝位 置安裝框架(例如,預生μ ^ β 頂先鑽好的螺栓洞,等等),或在處理 室前的牆上(例如,工麻w 各 礙界面爐)。本發明較佳的實施例中, 該^具有預定的安裝位^,供停靠夾鉗或者停靠平台安裝 之用。此外’該牆具有預定的安裝位置,#基材承載件開 啟機構安裝之用。當每一個框架、停靠機才冓、和基材承載 件開啟機構都安裝在相同表面上的預定位置時,每—個相 對位置都是預^的,並有助於基材裝載站台之安襄以及校 準。 本文已揭不了相關I » η ^於早一基材承载件之發明。然而, 20 200408041 亦思及應用 件,或者應用 件運輸)。吾 戶斤示和所述 作之設備(不 承载件(例如 明的範圍之 因此, 應了解本發 例如’下文 【圖式簡單 第1圖 承載件裝载 第2圖 備; 第3A ^ 承載件裝载 第4圖 埠之堆疊軌 第5圖 之側視圖; 第6圖 明基材承載 本發明在容納多於一個基材之相關基材承載 I本發明在相關的個別基材的運輸(未藉由承載 人將明白,本發日月之設備可以遠遠不同於本丈 的不例性實施例。任何根據第6圖之方法所操 論是否完成停靠並開啟’並不論是否使用基: ’個別的基材承載件系統))皆可以讀入於本發 内0 X 當藉由-個較佳之相關實施例揭露了本發明, 月亦包含可以讀入於本發明精神和範圍之内, 中之申請專利範圍,的其他實施例。 說明 係-平面俯視圖,圖示處理工具和储存設備之習知配置; '的基材 係一正視圖,圖 Η不第1圖之習知裝載和儲存設 b 3 Β圖係正視圖 _ 圖圖示依據本發明提供之美絲 設備之兩個示例怕杳、 忾之基材 啊性實施例; 係一平面概圖,圖一 圖不第3A或3B圖所示之襞 跡; 载 係第3 A或3 B图從一 及 鬮所示之基材搬運機存取裴載埠 係一流程圖,款 件裝載設備和相/處A或3B圖所示本發 相關處理工具之方法。Another advantage of alpha. Similarly, other structures' for example, 'feeder', 'structures' used for loading and / or unloading the substrate carrier from an upper cylinder, or transport system may be preferentially mounted on the frame. Exemplary delivery mechanisms may include a rotating platform or a rotating arm, etc., _ see in the previous; the patent application is called 'Guo Guo Patent Application No. 60 / 407,45 No. 1, application dated August 31, 2002, Songkou ", And No. 60 / 407,474, please request Japan 2002 on March 31. Dry 8 One of the present invention can be installed at a predetermined installation position on the wall of the clean room (such as , Pre-generated μ ^ β top drilled bolt holes, etc.), or on the wall in front of the processing chamber (for example, industrial hemp w interferes with the interface furnace). In a preferred embodiment of the present invention, the ^ has Predetermined mounting position ^ for docking clamp or docking platform installation. In addition, 'the wall has a predetermined mounting position, # substrate carrier opening mechanism for installation. When each frame, docking machine, and base When the material carrier opening mechanism is installed at a predetermined position on the same surface, each relative position is preset, and it is helpful for the support and calibration of the substrate loading platform. This article has not revealed the relevant I »η ^ Invention of a substrate carrier earlier. However, 20 200408041 also And application parts, or application parts for transportation. Our households show and describe the equipment (does not carry parts (such as the scope of the Ming, therefore, you should understand the present, such as the following [schematic simple 1st figure load carrier loading Figure 2 shows; Figure 3A ^ The loader is loaded with the stacking rail of Figure 4; Side view of Figure 5; Figure 6 shows that the substrate bears the present invention. Transportation of related individual substrates (without the carrier's understanding, the equipment of this sun and the moon can be far different from our exemplary embodiment. Any method based on the method in Figure 6 is used to determine whether the docking is completed and 'Open' and whether or not the base is used: 'Individual substrate carrier system)) can be read into the hair 0 X When the present invention is disclosed through a preferred related embodiment, the month also can be read in Within the spirit and scope of the present invention, there are other embodiments of the scope of patent application. Explanation is a plan top view, illustrating the conventional configuration of processing tools and storage equipment; the substrate is a front view, the figure is not the first 1 picture of loading and The storage device b 3 Β is a front view. The figure shows two examples of the beauty silk equipment provided by the present invention, which are examples of substrates that are afraid of 杳 and 忾. They are plan views, and the figure 1 is not 3A or 3B. The trace shown in the figure; the loading system is shown in Figure 3A or 3B. The flow chart for accessing Pei Zaobu from the substrate carrier shown in Figures 1 and 3 is a flow chart of the equipment for loading parts and the location of location A or 3B. The method of processing tools related to the present invention is shown.

21 200408041 【元件代表符號簡單說明】 111裝載和儲存設備 1 1 5工廠介面 1 1 9機器手臂 123傳送爐 203支撐框架 207垂直導引 211水平導引 301裝載站台 3 05堆疊 3 0 9開啟器 313輸送帶 3 1 7工廠交換位置 3 2 1終端受動器 40 1執跡 405執跡間的區域 5 0 1基材搬運機 5 0 5 —較高的位置 I 1 3處理工具 II 7潔淨室牆 1 2 1負載鎖定室 201儲存架 205機器手臂 209終端受動器 2 1 3工廠裝載位置 303裝載埠 307堆疊 3 11基材承載件 3 1 5基材承載件交換裝置 3 1 9承載件搬運機 323垂直導引 403執跡 4 0 7工具虛線範圍 5 0 3 —較低的位置 2221 200408041 [Simplified description of component representative symbols] 111 Loading and storage equipment 1 1 5 Factory interface 1 1 9 Robot arm 123 Conveying furnace 203 Support frame 207 Vertical guidance 211 Horizontal guidance 301 Loading platform 3 05 Stacking 3 0 9 Opener 313 Conveyor belt 3 1 7 Plant exchange position 3 2 1 End effector 40 1 Track 405 Area between tracks 5 0 1 Substrate handler 5 0 5 —Higher position I 1 3 Processing tool II 7 Clean room wall 1 2 1 Load lock chamber 201 Storage rack 205 Robot arm 209 Terminal actuator 2 1 3 Factory loading position 303 Loading port 307 Stacking 3 11 Substrate carrier 3 1 5 Substrate carrier exchange device 3 1 9 Carrier carrier 323 Vertical Guidance 403 track 4 0 7 tool dash range 5 0 3 —lower position 22

Claims (1)

‘叫4〇8〇41 才合、申請專利範圍: L 一種供應基材至一處理工具的方法,至少包括: 提供多個裝载埠,其每一者具有一用以打開一基材 承裁件的機構; 提供一工廠交換位置,當該基材承載件藉由一基材 承載件運送則f傳送和移動時,纟為與該基材承載件運送 設備交換該基材承載件之處; 提供-承載件搬運機,其具有—終端受動器,用以 接觸該基材承載件,該承載件搬運機係用以在該工廠交換 位置和該多個裝載埠之間運送該基材承載件; 在該工廠交換位置從該基材承載件運送設備接收第 一組多個基材承載件;及 對該第一組多個基材承載件之每一者: 從該工廠交換位晉亩垃W 置直接傳运該基材承載件向 個裝載埠中個別的裝載蜂; 在該個別的裝载蜂 在該個別的裝戴蜂 從該個別的裳载蜂 該基材承載件;及'Called 4〇08〇41 Caihe, patent application scope: L A method of supplying substrates to a processing tool, including at least: providing a plurality of loading ports, each of which has a substrate for opening a substrate A mechanism for providing a factory; when the substrate carrier is transported and moved by a substrate carrier, it is a place for exchanging the substrate carrier with the substrate carrier transport equipment; Provided is a carrier carrier having an end effector for contacting the substrate carrier, the carrier carrier is used to transport the substrate carrier between the factory exchange position and the plurality of loading ports ; Receiving a first plurality of substrate carriers from the substrate carrier transport facility at the plant exchange location; and each of the first plurality of substrate carriers: from the plant exchange location W directly transports the substrate carrier to an individual loading bee in each loading port; the individual loading bee carries the bee from the individual costume carrier to the substrate carrier in the individual wearing bee; and ,停靠並開啟該基材承载件; ,離開並關閉該基材承载件; 直接向該工廠交換位置傳送 23 3 3 如申請專利範圍第 栽件的停靠與該個 如申睛專利範圍第1項所、+、 乳固弟1項所述之方法,其中上述提供多 裴載埠之步驟包括提供兩個堆疊的裝載埠。 如申请專利範圍第3瑙所 、 固笫3項所述之方法,其中上述承載科 、幾在由該兩堆疊之裝載埠的執跡(f00tprint)所定 的一個範圍(envelope)之内移動該基材承載件。, Dock and open the substrate carrier; leave and close the substrate carrier; transfer directly to the factory exchange position 23 3 3 If the docking of the patent application scope of the plant and the first scope of the patent scope of the patent application The method described in item 1, +, and Rugudi, wherein the step of providing a multiple load port includes providing two stacked load ports. The method as described in item 3 of the patent application scope and item 3, wherein the above-mentioned load bearing section moves the base within an envelope defined by the two stack loading ports (f00tprint).材 carriage. 1項所述之方法,其中該每一基材 別基材承載件的開啟係同步發生 申喷專利靶圍第i項所述之方法,其中該工廠交換 置和該裝載埠具有實質相同的執跡。 申W月專利圍帛1項所述之方法,#中該工廠交換 置之一高度高於所有該裝載埠之個別高度。 8·—種供一處理工具用之基材裝載站台,至少包括: 〜 第一組多個裝載埠,其操作連接上述處理工具而 者皆具有用以打開一基材承載件的機構; 工廠交換位置,當該基材承載件藉由一基材承 牛輪送裝置傳送和移動時,其為與該基材承載件輸送裝 交換該基材承載件之處;及 個 搬 義 承 位 位 每 戴 置 24 X调,再具有一炊 一基材承載件 〜 以在 午 該承载件搬運ϋ及 和該第一组之y 運機係用 、,且多個裝载埠 載車之間運送該些基材承載件; ^ 述承载件搬運機罝古 弋从執行nr 4 /、有—個控制器,其經程 τ 列步驟·· 為了該第一 從該 組多個基材承載件之每一者·· 裁 工廠交換位置直接傳送該基材承The method described in item 1, wherein the opening of the substrate carrier of each substrate is the method described in item i of the patent spray target range, wherein the plant exchange device and the loading port have substantially the same performance. trace. According to the method described in item 1 of the patent application, the height of one of the plant exchanges in # is higher than the individual height of all the loading ports. 8 · —A substrate loading station for a processing tool, including at least: ~ The first group of a plurality of loading ports, which are operatively connected to the processing tools and each has a mechanism for opening a substrate carrier; factory exchange Position, when the substrate carrier is transported and moved by a substrate carrier rotation device, it is a place where the substrate carrier is exchanged with the substrate carrier transport device; and each of the relocation seats Wear a 24 X adjustment, and then have a cooker and a substrate carrier ~ to transport the carrier at noon and the first group of y aircraft, and transport the vehicle between multiple loading ports Some substrate carriers; ^ The carrier handling machine 罝 古 罝 from the implementation of nr 4 /, there is a controller, its process τ sequence of steps ... for the first from the group of multiple substrate carriers One ·· The cutting factory exchanges the substrate directly 件向多個裝载埠中個別的裝載埠; 在該個別的裝載埠,停靠並開啟該基材承 载件; 在該個別的裝载埠,離開和關閉該基材承 載件; 從該個別的裝載埠直接向該工廠交換位 置傳送該基材承載件;及To the individual loading port of the plurality of loading ports; at the individual loading port, docking and opening the substrate carrier; at the individual loading port, leaving and closing the substrate carrier; from the individual loading port The loading port transfers the substrate carrier directly to the plant exchange location; and 傳回該基材承載件至該基材承載件輸送 裝置。 申嗜專利範圍第8項所述之基材裝載站台,其中由該 栽件概運機運輸的該基材承載件係單一基材承載 件〇 1〇·如申 括: ♦專利範圍第8項所述之基材裝載站台,進一步包 25 4(38041 第二組多個裝载埠,該第二組多個裝载埠被 置於該第一組多個裝載埠的_側邊。 11 ·如申请專利範圍第1 〇項所述之基材裝載站台, 承載件搬運機係用以在該第一組和該第二組多 淳間的空間之中垂直移動。 • °申請專利範圍第1 1項所述之基材裝载站台, 享载件搬運機只在由該第一組和該第二組多個 、 跡所疋義的範圍之内移動該基材承載件。 月專利範圍第8項所述之基材裝載站台,其 母一者係用以在上述基材承載件停靠該 的同時開啟該基材承載件。 4·如申請專利範圍第8項所述之基材裝載站台,其 廠又換位置和該裝載埠具有實質相同的執跡。 1 5 .如申士主 %專利範圍第8項所述之基材裝載站台,其 承戴件運送裝置係一個輸送帶。 I 6.如由 清專利範圍第8項所述之基材裝载站台,盆 、位置之一高度高於所有該裝載埠的個別違 隔開且 其中該 個裝載 其中該 裝載埠 中該裝 裝載埠 中該工 中該基 中該工 丨度0 26 200408041 種用以供應基材至一處理工具 〜 〈°又備,至少包括: 處理工乙材承載件搬運機’用以運送-基材承載件至該 受動器,、的第一裝载埠’該基材承載件搬運機包含—終端 ’其用以支援該基材承載件;及 一控制器’耦接至該基材承載件搬運嬙* y仏 該基材 科什微運機和刼作控制 载件搬運機,當該基材承載件 輸送帶移戟千精由基材承载件 m 動和傳送時,該基材承載件搬運機的該終端受動 器使該基材承載件從該基材承載件輸送帶脫離,該控制器 進一步操作以執行下列步驟: 從該基材承載件輸送帶直接向第一裝載埠傳送 該基材承載件; 在該第一裝載埠,停靠並開啟該基材承載件,· 在該第一裝載埠,離開並關閉該基材承载件; 及 , 直接向該基材承載件輸送帶傳回該基材承裁 件。 1 8 · —種用以供應基材至一處理工具的設備,至少包括: 一基材承載件搬運機,用以運送一基材承載件至該 處理工具的第一裝载埠,該基材承載件搬運機包含·· 一垂直導引; —水平導引’其連接至上述垂直導引;及 27 200408041 一終端受動器,用以支援該基材承載件和相對於 直導引垂直移動和相對於該水平導引水平移 動;及 一控制器’其耦接至該基材承載件搬運機並操作控 制該該基材承载件搬運機,該基材承載件搬運機的終端 受動器使該基材承載件從該鄰接該基材承载件搬運機 之一基材承載件輸送帶脫離,該控制器進一步驟操作以 執行下列步驟: 從該基材承載件輸送帶直接向第一裝載埠傳送 該基材承载件; 在該第一裝載埠,停靠並開啟該基材承載件; 在該第一裝載埠,離開和關閉該基材承載件;及 直接向該基材承載件輸送帶傳回該基材承载 件。 19.一種傳送基材承載件的方法,包括·· 在一鄰接一基材裝載站台的基材承載件輸送帶上輸 送該基材承載件,該基材襄載站台包括-基材承栽件: 運機,用以運送該基材承載件至一處理工具的—裝載 埠; ’ 當該基材承載件蘚由— 取幵精由基材承載件輸送帶移動和傳 送時,使用該基材裝截站, w衣m站0的該基材承載件搬運機的一 終如受動使該基材承載件你 土w f取仵從該基材承载件輸送帶脫 28 200408041 離; 從該基材承截彳丰 載件輪送帶直接向該裝載谭傳送該基材 承載件; 在該裝載蟑,傳责廿0日 ’罪並開啟該基材承載件; 在該裝载璋,離雖^ κ千離開和關閉該基材承载件;及 直接向該基材承載件給 秋开%送帶傳回該基材承載件。The substrate carrier is returned to the substrate carrier conveying device. The substrate loading platform described in item 8 of the patent application scope, wherein the substrate carrier transported by the planting machine is a single substrate carrier 010. If claimed: ♦ item 8 of the patent scope The substrate loading platform further includes 25 4 (38041) a plurality of loading ports in the second group, which are placed on the side of the first plurality of loading ports. 11 · According to the substrate loading platform described in item 10 of the scope of patent application, the carrier conveyer is used to move vertically in the space between the first group and the second group of multi-chun. In the substrate loading platform described in item 1, the share carrier moves the substrate carrier only within a range defined by a plurality of tracks of the first group and the second group. The substrate loading platform described in item 8, one of its mothers is used to open the substrate bearing member while the substrate bearing member is docked there. 4. The substrate loading platform described in item 8 of the scope of patent application The location of the factory and that of the loading port have substantially the same track. 1 5. Such as the patent owner In the substrate loading platform described in item 8 of the scope, the wearing part conveying device is a conveyor belt. I 6. The substrate loading platform described in item 8 of the Qing patent scope, the height of one of the basin and the position is high Individually separated from all the loading ports and one of the loadings in the loading port, the loading port in the loading port, the base in the base, and the base in the base 丨 degrees 0 26 200408041 for supplying substrates to a processing tool ~ < ° Prepared at least, including: a handler B material carrier transporter 'for transporting-substrate carriers to the actuator, a first loading port' the substrate carrier transporter includes-terminal 'for its use To support the substrate carrier; and a controller 'coupled to the substrate carrier handling 嫱 * y 仏 the substrate Kosh micro-transporter and the operation control carrier handling machine, when the substrate carrier is transported When the belt shifter is moved and transported by the substrate carrier m, the terminal actuator of the substrate carrier transporter detaches the substrate carrier from the substrate carrier conveyor belt, and the controller further operates to Perform the following steps: Load from the substrate The conveyor belt directly conveys the substrate carrier to the first loading port; at the first loading port, docking and opening the substrate carrier, at the first loading port, leaving and closing the substrate carrier; and, The substrate cutting part is directly returned to the substrate carrier conveying belt. 1 8 · —A device for supplying substrates to a processing tool, at least including: a substrate carrier conveyer for transporting a substrate carrier A substrate carrier to the first loading port of the processing tool, the substrate carrier transporter includes a vertical guide; a horizontal guide which is connected to the vertical guide; and 27 200408041 a terminal actuator To support the substrate carrier and to move vertically with respect to the straight guide and horizontally with respect to the horizontal guide; and a controller 'which is coupled to the substrate carrier transporter and operates to control the substrate A carrier handler, the terminal actuator of the substrate carrier handler disengages the substrate carrier from the substrate carrier conveyor belt adjacent to the substrate carrier handler, and the controller further operates to execute under Steps: Transfer the substrate carrier directly from the substrate carrier conveyor to the first loading port; dock and open the substrate carrier at the first loading port; leave and close at the first loading port The substrate carrier; and returning the substrate carrier directly to the substrate carrier conveyor. 19. A method of transporting a substrate carrier, comprising: transporting the substrate carrier on a substrate carrier conveyor belt adjacent to a substrate loading station, the substrate supporting platform comprising a substrate carrier : A conveyor for transporting the substrate carrier to a loading port of a processing tool; 'When the substrate carrier is taken and transferred from the substrate carrier conveyor belt, the substrate is used At the loading station, the substrate carrier transporter at the clothing station 0 is finally activated, so that the substrate carrier is removed from the substrate carrier conveyor 28 200408041; from the substrate The loading belt of the carrier loader directly conveys the base material carrier to the loading tank; at the loading cock, accused of '0 day' crime and opened the base material carrier; at the loading unit, leaving though ^ Kappa thousand leaves and closes the substrate carrier; and directly sends to the substrate carrier a fall-off% belt to return to the substrate carrier. 20.—種傳送一基材承載件至一基材裝載站台之方法,包 括: 在鄰接該基材裝载站台的基材承載件輸送帶上輸 送該基材承載件,該基材裝載站台具有: 一垂直導引; 一水平導引,其連接至上述垂直導引;及 一終端受動H’u支援該基材承載件和相對於 該垂直導引垂直移動和相對於該水平導引水平移 動;20.-A method of transferring a substrate carrier to a substrate loading station, comprising: transporting the substrate carrier on a substrate carrier conveyor belt adjacent to the substrate loading station, the substrate loading station having : A vertical guide; a horizontal guide connected to the above-mentioned vertical guide; and a terminal driven H'u supporting the substrate carrier and vertical movement relative to the vertical guide and horizontal movement relative to the horizontal guide ; 使用該基材裝載站台的該基材承載件搬運機的該終 端受動器使該基材承载件從該基材承載件輸送帶脫 離; 從該基材承載件輸送帶直接向第一裝載埠傳送該基 材承載件; 在該第一裝載埠,停靠並開啟該基材承载件; 在該第一裝载埠,離開和關閉該基材承载件;及 29 200408041The terminal actuator of the substrate carrier conveyer using the substrate loading platform detaches the substrate carrier from the substrate carrier conveyor belt; and directly transmits from the substrate carrier conveyor belt to the first loading port The substrate carrier; docking and opening the substrate carrier at the first loading port; leaving and closing the substrate carrier at the first loading port; and 29 200408041
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