JP2004154933A5 - - Google Patents

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Publication number
JP2004154933A5
JP2004154933A5 JP2003377691A JP2003377691A JP2004154933A5 JP 2004154933 A5 JP2004154933 A5 JP 2004154933A5 JP 2003377691 A JP2003377691 A JP 2003377691A JP 2003377691 A JP2003377691 A JP 2003377691A JP 2004154933 A5 JP2004154933 A5 JP 2004154933A5
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JP
Japan
Prior art keywords
polishing
subcarrier
substrate
polishing head
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003377691A
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English (en)
Japanese (ja)
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JP4673547B2 (ja
JP2004154933A (ja
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Publication of JP2004154933A publication Critical patent/JP2004154933A/ja
Publication of JP2004154933A5 publication Critical patent/JP2004154933A5/ja
Application granted granted Critical
Publication of JP4673547B2 publication Critical patent/JP4673547B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2003377691A 2002-11-07 2003-11-07 化学機械研磨装置およびその利用のための方法 Expired - Lifetime JP4673547B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42512502P 2002-11-07 2002-11-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010284361A Division JP5161294B2 (ja) 2002-11-07 2010-12-21 化学機械研磨装置および化学機械研磨方法

Publications (3)

Publication Number Publication Date
JP2004154933A JP2004154933A (ja) 2004-06-03
JP2004154933A5 true JP2004154933A5 (enExample) 2007-05-17
JP4673547B2 JP4673547B2 (ja) 2011-04-20

Family

ID=32108175

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2003377691A Expired - Lifetime JP4673547B2 (ja) 2002-11-07 2003-11-07 化学機械研磨装置およびその利用のための方法
JP2010284361A Expired - Lifetime JP5161294B2 (ja) 2002-11-07 2010-12-21 化学機械研磨装置および化学機械研磨方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010284361A Expired - Lifetime JP5161294B2 (ja) 2002-11-07 2010-12-21 化学機械研磨装置および化学機械研磨方法

Country Status (7)

Country Link
US (1) US7326103B2 (enExample)
EP (1) EP1418022B1 (enExample)
JP (2) JP4673547B2 (enExample)
KR (2) KR101164139B1 (enExample)
CN (1) CN1498725B (enExample)
DE (2) DE60330833D1 (enExample)
TW (1) TWI238754B (enExample)

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CN100513076C (zh) * 2001-05-29 2009-07-15 株式会社荏原制作所 抛光装置与抛光方法
JP2005039087A (ja) * 2003-07-16 2005-02-10 Yaskawa Electric Corp 基板処理装置
US8083571B2 (en) * 2004-11-01 2011-12-27 Ebara Corporation Polishing apparatus
US7207871B1 (en) * 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers
JP2008100295A (ja) * 2006-10-17 2008-05-01 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
US8152594B2 (en) * 2007-01-30 2012-04-10 Ebara Corporation Polishing apparatus
US20100210192A1 (en) * 2007-11-20 2010-08-19 Shin-Etsu Handotai Co., Ltd. Polishing head and polishing apparatus
JP5248127B2 (ja) * 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
DE102008045035B4 (de) * 2008-08-29 2017-11-16 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Verbessern der Strukturintegrität von Dielektrika mit kleinem ε in Metallisierungssystemen von Halbleiterbauelementen unter Anwendung einer Risse verhindernden Materialschicht
JP5648954B2 (ja) * 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
WO2013001719A1 (ja) * 2011-06-29 2013-01-03 信越半導体株式会社 研磨ヘッド及び研磨装置
JP6028410B2 (ja) * 2012-06-20 2016-11-16 不二越機械工業株式会社 ワーク研磨装置
KR102233392B1 (ko) * 2013-03-15 2021-03-30 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 폴리싱을 위한 웨이퍼 및 웨이퍼 에지/사면 클리닝 모듈을 이용하는 디스크/패드 클리닝의 설계
JP2015220402A (ja) * 2014-05-20 2015-12-07 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
CN105643419A (zh) * 2016-03-08 2016-06-08 成都广度进出口贸易有限公司 建筑用板材的智能抛光装置及其使用方法
TWI783037B (zh) 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
CN108723910A (zh) * 2018-05-28 2018-11-02 芜湖中驰机床制造有限公司 一种工件加工生产机床
CN108747753A (zh) * 2018-05-28 2018-11-06 芜湖中驰机床制造有限公司 一种用于打磨加工的机床
CN108723909A (zh) * 2018-05-28 2018-11-02 芜湖中驰机床制造有限公司 一种打磨机床
CN111266993B (zh) * 2018-12-05 2023-06-30 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
US11623320B2 (en) 2019-08-21 2023-04-11 Applied Materials, Inc. Polishing head with membrane position control
CN110948383B (zh) * 2019-11-27 2021-05-25 英展新能源科技(昆山)有限公司 用于片式枢轴盖体加工的载具系统
CN111571444A (zh) * 2020-05-15 2020-08-25 中国科学院微电子研究所 研磨垫修整装置
JP7662324B2 (ja) * 2020-10-30 2025-04-15 株式会社荏原製作所 基板を保持するためのヘッドおよび基板処理装置

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JP3070343B2 (ja) * 1993-06-29 2000-07-31 トヨタ自動車株式会社 ホーニング加工装置
US5423716A (en) * 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
JPH08300256A (ja) * 1995-05-09 1996-11-19 Speedfam Co Ltd ワーク厚さ測定装置付き平面研磨装置
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US6531397B1 (en) * 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
JP2973403B2 (ja) 1998-03-30 1999-11-08 株式会社東京精密 ウェーハ研磨装置
FR2778129B1 (fr) * 1998-05-04 2000-07-21 St Microelectronics Sa Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine
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JP2000167767A (ja) * 1998-12-07 2000-06-20 Mitsubishi Materials Corp ウェーハ研磨装置およびそれを用いたウェーハ製造方法
JP2000190212A (ja) * 1998-12-25 2000-07-11 Toshiba Mach Co Ltd ポリッシング装置
US6390908B1 (en) * 1999-07-01 2002-05-21 Applied Materials, Inc. Determining when to replace a retaining ring used in substrate polishing operations
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
WO2001087541A2 (en) 2000-05-12 2001-11-22 Multi-Planar Technologies, Inc. Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same
US6540590B1 (en) * 2000-08-31 2003-04-01 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a rotating retaining ring
JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
JP2002239894A (ja) * 2001-02-20 2002-08-28 Ebara Corp ポリッシング装置
JP2002264005A (ja) * 2001-03-09 2002-09-18 Toshiba Ceramics Co Ltd 半導体ウェーハの研磨方法及びその研磨装置
US6641461B2 (en) * 2001-03-28 2003-11-04 Multi Planar Technologyies, Inc. Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal
CN100513076C (zh) * 2001-05-29 2009-07-15 株式会社荏原制作所 抛光装置与抛光方法
US6893327B2 (en) * 2001-06-04 2005-05-17 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
US6579151B2 (en) * 2001-08-02 2003-06-17 Taiwan Semiconductor Manufacturing Co., Ltd Retaining ring with active edge-profile control by piezoelectric actuator/sensors
US20030060127A1 (en) * 2001-09-10 2003-03-27 Kaushal Tony S. Sensor for in-situ pad wear during CMP
US6835125B1 (en) * 2001-12-27 2004-12-28 Applied Materials Inc. Retainer with a wear surface for chemical mechanical polishing
US6872130B1 (en) * 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
US6705923B2 (en) * 2002-04-25 2004-03-16 Taiwan Semiconductor Manufacturing Co., Ltd Chemical mechanical polisher equipped with chilled wafer holder and polishing pad and method of using
JP2004154874A (ja) 2002-11-05 2004-06-03 Ebara Corp ポリッシング装置及びポリッシング方法
US6796887B2 (en) * 2002-11-13 2004-09-28 Speedfam-Ipec Corporation Wear ring assembly

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