KR101164139B1 - 피봇기구를 구비한 수직방향으로 조정가능한 화학적기계적 폴리싱 헤드 및 그 사용방법 - Google Patents

피봇기구를 구비한 수직방향으로 조정가능한 화학적기계적 폴리싱 헤드 및 그 사용방법 Download PDF

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Publication number
KR101164139B1
KR101164139B1 KR1020030078471A KR20030078471A KR101164139B1 KR 101164139 B1 KR101164139 B1 KR 101164139B1 KR 1020030078471 A KR1020030078471 A KR 1020030078471A KR 20030078471 A KR20030078471 A KR 20030078471A KR 101164139 B1 KR101164139 B1 KR 101164139B1
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South Korea
Prior art keywords
polishing
subcarrier
pad
delete delete
substrate
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Korean (ko)
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KR20040041042A (ko
Inventor
사쿠라이구니히코
몰로니제라드
왕휴에이-밍
리우준
라오피터
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에바라 테크놀로지즈 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020030078471A 2002-11-07 2003-11-06 피봇기구를 구비한 수직방향으로 조정가능한 화학적기계적 폴리싱 헤드 및 그 사용방법 Expired - Lifetime KR101164139B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42512502P 2002-11-07 2002-11-07
US60/425,125 2002-11-07

Related Child Applications (1)

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KR1020110034892A Division KR101151766B1 (ko) 2002-11-07 2011-04-14 피봇기구를 구비한 수직방향으로 조정가능한 화학적 기계적 폴리싱 헤드 및 그 사용방법

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KR20040041042A KR20040041042A (ko) 2004-05-13
KR101164139B1 true KR101164139B1 (ko) 2012-07-11

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KR1020030078471A Expired - Lifetime KR101164139B1 (ko) 2002-11-07 2003-11-06 피봇기구를 구비한 수직방향으로 조정가능한 화학적기계적 폴리싱 헤드 및 그 사용방법
KR1020110034892A Expired - Lifetime KR101151766B1 (ko) 2002-11-07 2011-04-14 피봇기구를 구비한 수직방향으로 조정가능한 화학적 기계적 폴리싱 헤드 및 그 사용방법

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KR1020110034892A Expired - Lifetime KR101151766B1 (ko) 2002-11-07 2011-04-14 피봇기구를 구비한 수직방향으로 조정가능한 화학적 기계적 폴리싱 헤드 및 그 사용방법

Country Status (7)

Country Link
US (1) US7326103B2 (enExample)
EP (1) EP1418022B1 (enExample)
JP (2) JP4673547B2 (enExample)
KR (2) KR101164139B1 (enExample)
CN (1) CN1498725B (enExample)
DE (2) DE60330833D1 (enExample)
TW (1) TWI238754B (enExample)

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US8152594B2 (en) * 2007-01-30 2012-04-10 Ebara Corporation Polishing apparatus
US20100210192A1 (en) * 2007-11-20 2010-08-19 Shin-Etsu Handotai Co., Ltd. Polishing head and polishing apparatus
JP5248127B2 (ja) * 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
DE102008045035B4 (de) * 2008-08-29 2017-11-16 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Verbessern der Strukturintegrität von Dielektrika mit kleinem ε in Metallisierungssystemen von Halbleiterbauelementen unter Anwendung einer Risse verhindernden Materialschicht
JP5648954B2 (ja) * 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
WO2013001719A1 (ja) * 2011-06-29 2013-01-03 信越半導体株式会社 研磨ヘッド及び研磨装置
JP6028410B2 (ja) * 2012-06-20 2016-11-16 不二越機械工業株式会社 ワーク研磨装置
KR102233392B1 (ko) * 2013-03-15 2021-03-30 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 폴리싱을 위한 웨이퍼 및 웨이퍼 에지/사면 클리닝 모듈을 이용하는 디스크/패드 클리닝의 설계
JP2015220402A (ja) * 2014-05-20 2015-12-07 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法
CN105643419A (zh) * 2016-03-08 2016-06-08 成都广度进出口贸易有限公司 建筑用板材的智能抛光装置及其使用方法
TWI783037B (zh) 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
CN108723910A (zh) * 2018-05-28 2018-11-02 芜湖中驰机床制造有限公司 一种工件加工生产机床
CN108747753A (zh) * 2018-05-28 2018-11-06 芜湖中驰机床制造有限公司 一种用于打磨加工的机床
CN108723909A (zh) * 2018-05-28 2018-11-02 芜湖中驰机床制造有限公司 一种打磨机床
CN111266993B (zh) * 2018-12-05 2023-06-30 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
US11623320B2 (en) 2019-08-21 2023-04-11 Applied Materials, Inc. Polishing head with membrane position control
CN110948383B (zh) * 2019-11-27 2021-05-25 英展新能源科技(昆山)有限公司 用于片式枢轴盖体加工的载具系统
CN111571444A (zh) * 2020-05-15 2020-08-25 中国科学院微电子研究所 研磨垫修整装置
JP7662324B2 (ja) * 2020-10-30 2025-04-15 株式会社荏原製作所 基板を保持するためのヘッドおよび基板処理装置

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Also Published As

Publication number Publication date
CN1498725A (zh) 2004-05-26
JP4673547B2 (ja) 2011-04-20
JP2011098436A (ja) 2011-05-19
TW200414972A (en) 2004-08-16
JP2004154933A (ja) 2004-06-03
US7326103B2 (en) 2008-02-05
US20040121704A1 (en) 2004-06-24
DE03025624T1 (de) 2005-03-31
DE60330833D1 (de) 2010-02-25
KR101151766B1 (ko) 2012-05-31
KR20040041042A (ko) 2004-05-13
TWI238754B (en) 2005-09-01
EP1418022A1 (en) 2004-05-12
JP5161294B2 (ja) 2013-03-13
EP1418022B1 (en) 2010-01-06
KR20110058752A (ko) 2011-06-01
CN1498725B (zh) 2010-08-04

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