JP2004048082A5 - - Google Patents

Download PDF

Info

Publication number
JP2004048082A5
JP2004048082A5 JP2003380241A JP2003380241A JP2004048082A5 JP 2004048082 A5 JP2004048082 A5 JP 2004048082A5 JP 2003380241 A JP2003380241 A JP 2003380241A JP 2003380241 A JP2003380241 A JP 2003380241A JP 2004048082 A5 JP2004048082 A5 JP 2004048082A5
Authority
JP
Japan
Prior art keywords
substrate
polishing
polishing pad
retaining ring
diaphragm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003380241A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004048082A (ja
Filing date
Publication date
Priority claimed from US09/261,112 external-priority patent/US6231428B1/en
Priority claimed from US09/390,142 external-priority patent/US6368189B1/en
Application filed filed Critical
Publication of JP2004048082A publication Critical patent/JP2004048082A/ja
Publication of JP2004048082A5 publication Critical patent/JP2004048082A5/ja
Pending legal-status Critical Current

Links

JP2003380241A 1999-03-03 2003-11-10 直接気圧式ウェハ研磨圧力システムを有するヘッドを用いた化学機械的研磨（ｃｍｐ）装置及びその方法 Pending JP2004048082A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/261,112 US6231428B1 (en) 1999-03-03 1999-03-03 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US09/294,547 US6309290B1 (en) 1999-03-03 1999-04-19 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
US09/390,142 US6368189B1 (en) 1999-03-03 1999-09-03 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000602435A Division JP3595266B2 (ja) 1999-03-03 2000-03-01 直接気圧式ウェハ研磨圧力システムを有するヘッドを用いた化学機械的研磨（ｃｍｐ）装置及びその方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010020663A Division JP5185958B2 (ja) 1999-03-03 2010-02-01 研磨ヘッド

Publications (2)

Publication Number Publication Date
JP2004048082A JP2004048082A (ja) 2004-02-12
JP2004048082A5 true JP2004048082A5 (enExample) 2007-04-12

Family

ID=27401376

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2000604992A Expired - Fee Related JP4212776B2 (ja) 1999-03-03 2000-02-24 化学機械的研磨ヘッド
JP2000602435A Expired - Lifetime JP3595266B2 (ja) 1999-03-03 2000-03-01 直接気圧式ウェハ研磨圧力システムを有するヘッドを用いた化学機械的研磨（ｃｍｐ）装置及びその方法
JP2003380241A Pending JP2004048082A (ja) 1999-03-03 2003-11-10 直接気圧式ウェハ研磨圧力システムを有するヘッドを用いた化学機械的研磨（ｃｍｐ）装置及びその方法

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP2000604992A Expired - Fee Related JP4212776B2 (ja) 1999-03-03 2000-02-24 化学機械的研磨ヘッド
JP2000602435A Expired - Lifetime JP3595266B2 (ja) 1999-03-03 2000-03-01 直接気圧式ウェハ研磨圧力システムを有するヘッドを用いた化学機械的研磨（ｃｍｐ）装置及びその方法

Country Status (7)

Country Link
US (3) US6368189B1 (enExample)
EP (5) EP1371449A3 (enExample)
JP (3) JP4212776B2 (enExample)
AT (3) ATE249909T1 (enExample)
DE (3) DE60005270T2 (enExample)
TW (2) TWI243084B (enExample)
WO (2) WO2000054933A2 (enExample)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6776692B1 (en) * 1999-07-09 2004-08-17 Applied Materials Inc. Closed-loop control of wafer polishing in a chemical mechanical polishing system
US6206768B1 (en) * 1999-07-29 2001-03-27 Chartered Semiconductor Manufacturing, Ltd. Adjustable and extended guide rings
US7140956B1 (en) 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6390905B1 (en) 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
JP3816297B2 (ja) * 2000-04-25 2006-08-30 株式会社荏原製作所 研磨装置
TW579319B (en) * 2000-05-12 2004-03-11 Multi Planar Technologies Inc System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US6808443B2 (en) * 2000-07-01 2004-10-26 Lam Research Corporation Projected gimbal point drive
TWI246448B (en) * 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
JP2002187060A (ja) 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
JP2008188767A (ja) * 2000-10-11 2008-08-21 Ebara Corp 基板保持装置
JP4620072B2 (ja) * 2000-10-11 2011-01-26 株式会社荏原製作所 ポリッシング装置
JP2004515918A (ja) 2000-12-04 2004-05-27 株式会社荏原製作所 基板処理装置及びその方法
US6863771B2 (en) * 2001-07-25 2005-03-08 Micron Technology, Inc. Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
US6746318B2 (en) * 2001-10-11 2004-06-08 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
SG101493A1 (en) * 2001-10-17 2004-01-30 Yi Hsu Hung Wafer retaining ring
US6628886B2 (en) * 2002-01-04 2003-09-30 Iphotonics, Inc. Integrated processing system for optical devices
US6817102B2 (en) * 2002-04-23 2004-11-16 David Harris Trimmer head
US20060180486A1 (en) * 2003-04-21 2006-08-17 Bennett David W Modular panel and storage system for flat items such as media discs and holders therefor
US6964597B2 (en) * 2003-06-27 2005-11-15 Khuu's Inc. Retaining ring with trigger for chemical mechanical polishing apparatus
US20050070205A1 (en) * 2003-09-30 2005-03-31 Speedfam-Ipec Corporation Integrated pressure control system for workpiece carrier
US11260500B2 (en) 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
KR101252751B1 (ko) 2003-11-13 2013-04-09 어플라이드 머티어리얼스, 인코포레이티드 성형 표면을 갖는 유지 링
US7033252B2 (en) * 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
US7063604B2 (en) * 2004-03-05 2006-06-20 Strasbaugh Independent edge control for CMP carriers
US8037896B2 (en) 2004-03-09 2011-10-18 Mks Instruments, Inc. Pressure regulation in remote zones
US6986359B2 (en) * 2004-03-09 2006-01-17 Mks Instruments, Inc. System and method for controlling pressure in remote zones
JP4583207B2 (ja) * 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置
JP5112061B2 (ja) 2004-07-02 2013-01-09 ストラスボー ウエハ処理方法およびシステム
JP4273056B2 (ja) * 2004-08-12 2009-06-03 不二越機械工業株式会社 研磨装置
CN105904335B (zh) * 2004-11-01 2019-04-30 株式会社荏原制作所 抛光设备
US20070026772A1 (en) * 2005-07-28 2007-02-01 Dolechek Kert L Apparatus for use in processing a semiconductor workpiece
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
US20070246839A1 (en) * 2006-04-21 2007-10-25 Applied Materials, Inc. Method of proximity pin manufacture
JP2007307623A (ja) * 2006-05-16 2007-11-29 Elpida Memory Inc 研磨装置
JP5009101B2 (ja) * 2006-10-06 2012-08-22 株式会社荏原製作所 基板研磨装置
US7575504B2 (en) * 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
JP4534165B2 (ja) 2006-12-18 2010-09-01 エルピーダメモリ株式会社 半導体装置の製造装置及び、半導体装置の製造方法
US20090124183A1 (en) * 2007-02-28 2009-05-14 Edgar Carballo Pneumatic adjustable sanding device
KR101057228B1 (ko) * 2008-10-21 2011-08-16 주식회사 엘지실트론 경면연마장치의 가압헤드
US8560111B2 (en) * 2008-12-31 2013-10-15 Stmicroelectronics, Inc. Method of determining pressure to apply to wafers during a CMP
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
KR101160266B1 (ko) * 2009-10-07 2012-06-27 주식회사 엘지실트론 웨이퍼 지지 부재, 그 제조방법 및 이를 포함하는 웨이퍼 연마 유닛
JP4927962B2 (ja) * 2010-01-21 2012-05-09 株式会社クレハ 研磨装置用ワークピース保持リング
JP5648954B2 (ja) * 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
KR101196652B1 (ko) 2011-05-31 2012-11-02 주식회사 케이씨텍 캐리어 헤드의 멤브레인 결합체 및 이를 구비한 캐리어 헤드
JPWO2013001719A1 (ja) * 2011-06-29 2015-02-23 信越半導体株式会社 研磨ヘッド及び研磨装置
CN103889656B (zh) * 2011-09-12 2017-03-15 应用材料公司 具有复合塑胶部分的载体头部
TWI674171B (zh) * 2012-01-31 2019-10-11 日商荏原製作所股份有限公司 基板保持裝置、研磨裝置、及研磨方法
KR101597870B1 (ko) * 2012-04-02 2016-02-25 강준모 화학 기계적 연마 장치 용 캐리어 헤드
US8998676B2 (en) 2012-10-26 2015-04-07 Applied Materials, Inc. Retaining ring with selected stiffness and thickness
WO2014183091A1 (en) * 2013-05-09 2014-11-13 Lawrence Baker Blade sharpening system for a log saw machine
US9662761B2 (en) * 2013-12-02 2017-05-30 Ebara Corporation Polishing apparatus
JP2015196224A (ja) * 2014-04-01 2015-11-09 株式会社フジミインコーポレーテッド 研磨方法、及び保持具
CN105127890A (zh) * 2015-06-10 2015-12-09 上海新傲科技股份有限公司 抛光头
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
JP2018001290A (ja) * 2016-06-28 2018-01-11 株式会社ディスコ 加工装置
WO2018052816A1 (en) 2016-09-15 2018-03-22 Applied Materials, Inc. Chemical mechanical polishing smart ring
JP6833591B2 (ja) 2016-10-28 2021-02-24 株式会社荏原製作所 基板保持装置、弾性膜、研磨装置、および弾性膜の交換方法
US11179823B2 (en) 2016-10-28 2021-11-23 Ebara Corporation Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane
CN108240612B (zh) * 2018-01-11 2020-01-31 深圳市百欧森环保科技股份有限公司 一种光等离子灯管快拆易维护结构
CN108098555B (zh) * 2018-02-09 2023-08-22 佛山市东信机械有限公司 一种曲面抛光机
JP7117171B2 (ja) * 2018-06-20 2022-08-12 株式会社荏原製作所 研磨装置、研磨方法、及び研磨制御プログラム
CN111266993B (zh) * 2018-12-05 2023-06-30 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
JP7300297B2 (ja) * 2019-04-02 2023-06-29 株式会社荏原製作所 積層メンブレン、積層メンブレンを備える基板保持装置および基板処理装置
CN110411344B (zh) * 2019-08-06 2021-07-20 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种校准方法、校准装置、校准系统及电子设备
CN111168561B (zh) * 2019-12-26 2022-05-13 西安奕斯伟材料科技有限公司 研磨头及晶圆研磨装置
CN112903178A (zh) * 2021-02-05 2021-06-04 台州辉腾泵业有限公司 一种油浸式压力传感器
CN113752159B (zh) * 2021-08-21 2022-11-15 浙江晶盛机电股份有限公司 一种可在线测厚的抛光载体
CN114718767B (zh) * 2022-03-31 2023-06-23 西安航天动力研究所 一种双路密封栓式喷注器装配测试方法
CN115091359B (zh) * 2022-05-26 2023-09-05 浙江晶盛机电股份有限公司 抛光载体
CN115431169B (zh) * 2022-08-24 2023-09-01 中国电子科技集团公司第十三研究所 真空连接转换装置、载片抛光方法及抛光机
CN115847263B (zh) * 2022-12-01 2023-11-03 张家港杰茂铝业有限公司 一种铝型材表面抛光设备
EP4644045A1 (en) * 2022-12-27 2025-11-05 Ebara Corporation Substrate suction member, top ring, and substrate processing device
CN117245542B (zh) * 2023-11-17 2024-01-23 苏州博宏源机械制造有限公司 晶圆双面抛光设备及工艺

Family Cites Families (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR557656A (fr) 1922-10-20 1923-08-13 Procédé et dispositif pour le nettoyage des filtres à sable de grande surface
US3579916A (en) 1968-11-15 1971-05-25 Speedfam Corp Polishing machine
US3631634A (en) 1970-01-26 1972-01-04 John L Weber Polishing machine
US3841028A (en) 1972-08-24 1974-10-15 Crane Packing Co Apparatus for handling workpieces to be polished
JPS5911423B2 (ja) 1974-04-10 1984-03-15 株式会社日立製作所 ラツピング装置
US4081928A (en) 1974-05-16 1978-04-04 Texas Instruments Incorporated Silicon slice carrier block and plug assembly
DK276678A (da) 1977-06-28 1978-12-29 Woellner Werke Klaebemiddel indeholdende fintfordelt uorganisk pulver og organiske polymerer
JPS5943051B2 (ja) 1977-10-26 1984-10-19 日本原子力研究所 プラスチツクス表面処理剤
DE2809274A1 (de) 1978-03-03 1979-09-13 Wacker Chemitronic Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren
JPS55157473A (en) 1979-05-22 1980-12-08 Nippon Telegr & Teleph Corp <Ntt> Polishing method
US4270314A (en) 1979-09-17 1981-06-02 Speedfam Corporation Bearing mount for lapping machine pressure plate
US4519168A (en) 1979-09-18 1985-05-28 Speedfam Corporation Liquid waxless fixturing of microsize wafers
US4316757A (en) 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
JPS56146667A (en) 1980-04-18 1981-11-14 Hitachi Ltd Mirror surface grinder
JPS5879216A (ja) 1981-11-06 1983-05-13 Hitachi Ltd ２ビ−ム走査光学系
JPS5919671A (ja) 1982-07-22 1984-02-01 Disco Abrasive Sys Ltd ポリツシング装置
JPS60129522A (ja) 1983-12-15 1985-07-10 Shimizu Constr Co Ltd スタツクレイン防止装置
JPS6152967A (ja) 1984-08-22 1986-03-15 Nippon Kokan Kk <Nkk> 連続鋳造における鋳込方法
JPS61193781A (ja) 1985-02-20 1986-08-28 Akira Hina 溶接ｈ形鋼もしくはｔ形鋼自動製作機
US4680893A (en) 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
JPH0775825B2 (ja) 1986-01-07 1995-08-16 東芝機械株式会社 片面研磨装置
US4918870A (en) 1986-05-16 1990-04-24 Siltec Corporation Floating subcarriers for wafer polishing apparatus
JP2552306B2 (ja) 1987-09-30 1996-11-13 東芝機械株式会社 片面研磨装置
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
JPH02503174A (ja) 1988-02-17 1990-10-04 グルジンスキイ　ポリテフニチエスキイ　インスチトウト　イメニ　ヴイ・アイ・レーニナ 工作片表面の研摩方法と該方法を実施するためのジグ
JPH01216768A (ja) 1988-02-25 1989-08-30 Showa Denko Kk 半導体基板の研磨方法及びその装置
US4954142A (en) 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US5212910A (en) 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5205082A (en) 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5216843A (en) 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5635083A (en) 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
US5554064A (en) 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
US5443416A (en) 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
JP2891068B2 (ja) * 1993-10-18 1999-05-17 信越半導体株式会社 ウエーハの研磨方法および研磨装置
US5643053A (en) 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
US5820448A (en) 1993-12-27 1998-10-13 Applied Materials, Inc. Carrier head with a layer of conformable material for a chemical mechanical polishing system
US5582534A (en) 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5624299A (en) 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5547417A (en) 1994-03-21 1996-08-20 Intel Corporation Method and apparatus for conditioning a semiconductor polishing pad
JPH0811055A (ja) * 1994-06-28 1996-01-16 Sony Corp 研磨装置、研磨装置の被研磨材の保持方法、及び被研磨材の保持構造
US5651724A (en) * 1994-09-08 1997-07-29 Ebara Corporation Method and apparatus for polishing workpiece
JPH08218783A (ja) * 1995-02-17 1996-08-27 Kajima Corp シールド機テールシール交換方法
JP3158934B2 (ja) 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
US5775983A (en) 1995-05-01 1998-07-07 Applied Materials, Inc. Apparatus and method for conditioning a chemical mechanical polishing pad
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6024630A (en) 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5681215A (en) 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JP3129172B2 (ja) * 1995-11-14 2001-01-29 日本電気株式会社 研磨装置及び研磨方法
GB2307432B (en) 1995-11-21 1999-05-26 Rolls Royce & Ass A sample removing tool
ATE228915T1 (de) 1996-01-24 2002-12-15 Lam Res Corp Halbleiterscheiben-polierkopf
JPH09225819A (ja) * 1996-02-21 1997-09-02 Shin Etsu Handotai Co Ltd 被加工物の保持機構
US5679065A (en) * 1996-02-23 1997-10-21 Micron Technology, Inc. Wafer carrier having carrier ring adapted for uniform chemical-mechanical planarization of semiconductor wafers
JP3133249B2 (ja) * 1996-02-26 2001-02-05 株式会社東芝 原子力発電プラント
JP3106418B2 (ja) * 1996-07-30 2000-11-06 株式会社東京精密 研磨装置
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
US5716258A (en) * 1996-11-26 1998-02-10 Metcalf; Robert L. Semiconductor wafer polishing machine and method
JP3784477B2 (ja) * 1996-12-06 2006-06-14 株式会社荏原製作所 ウェーハ研磨装置及びそれに用いるウェーハ保持ヘッド
DE19651761A1 (de) 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
US5857899A (en) * 1997-04-04 1999-01-12 Ontrak Systems, Inc. Wafer polishing head with pad dressing element
US6110025A (en) 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
EP0881039B1 (en) 1997-05-28 2003-04-16 Tokyo Seimitsu Co.,Ltd. Wafer polishing apparatus with retainer ring
DE19755975A1 (de) 1997-12-16 1999-06-17 Wolters Peter Werkzeugmasch Halter für flache Werkstücke, insbesondere Halbleiterwafer
US6116992A (en) 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US6113480A (en) 1998-06-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus for polishing semiconductor wafers and method of testing same
US6413459B1 (en) * 1998-08-05 2002-07-02 Micron Technology, Inc. Method for handling and processing microelectronic-device substrate assemblies
US6093089A (en) 1999-01-25 2000-07-25 United Microelectronics Corp. Apparatus for controlling uniformity of polished material
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6231428B1 (en) 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6077151A (en) 1999-05-17 2000-06-20 Vlsi Technology, Inc. Temperature control carrier head for chemical mechanical polishing process

Similar Documents

Publication Publication Date Title
JP2004048082A5 (enExample)
TWI223318B (en) A workpiece carrier with adjustable pressure zones and barriers
JP2006128582A5 (enExample)
US6623343B2 (en) System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US20040029503A1 (en) System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
WO2000054933B1 (en) Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
WO2002004172A3 (en) Carrier head with flexible membranes to control the applied load and the dimension of the loading area
CN100509289C (zh) 研磨头及研磨装置
JPH0919863A (ja) 流体圧制御式ウエハポリシングヘッド
KR101183783B1 (ko) 연마 장치
CN115741423B (zh) 一种化学机械抛光机用抛光头装置
EP1860689A4 (en) POLISHING HEAD FOR SEMICONDUCTOR WAFER, POLISHING DEVICE AND POLISHING METHOD
AU2002353628A1 (en) Carrier head for chemical mechanical polishing apparatus
JPH09225821A5 (enExample)
CN112519017A (zh) 一种金刚石加工用复套装夹夹具
US7140956B1 (en) Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
KR20040015768A (ko) 기판 폴리싱기계
TWI680827B (zh) 研磨頭的製造方法、研磨頭以及研磨裝置
CN209954455U (zh) 背壳打磨用负压定位治具
JP3649612B2 (ja) 圧縮天然ガス用レギュレータ
CN208497739U (zh) 一种石材气囊压机
KR20050031752A (ko) 웨이퍼 연마장치의 연마헤드
CN202127000U (zh) 定位环及研磨头
CN218853744U (zh) 一种复合型袋式精细过滤器
CN208010642U (zh) 屏蔽深井泵