JPH09225821A5 - - Google Patents

Info

Publication number
JPH09225821A5
JPH09225821A5 JP1996065315A JP6531596A JPH09225821A5 JP H09225821 A5 JPH09225821 A5 JP H09225821A5 JP 1996065315 A JP1996065315 A JP 1996065315A JP 6531596 A JP6531596 A JP 6531596A JP H09225821 A5 JPH09225821 A5 JP H09225821A5
Authority
JP
Japan
Prior art keywords
top ring
pressure
polishing
polished
pressurized fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1996065315A
Other languages
English (en)
Japanese (ja)
Other versions
JP3795128B2 (ja
JPH09225821A (ja
Filing date
Publication date
Priority claimed from JP6531596A external-priority patent/JP3795128B2/ja
Priority to JP6531596A priority Critical patent/JP3795128B2/ja
Application filed filed Critical
Priority to US08/807,463 priority patent/US5762539A/en
Publication of JPH09225821A publication Critical patent/JPH09225821A/ja
Priority to US09/589,388 priority patent/USRE38826E1/en
Priority to US10/142,980 priority patent/USRE38854E1/en
Priority to US10/976,330 priority patent/USRE39471E1/en
Publication of JPH09225821A5 publication Critical patent/JPH09225821A5/ja
Publication of JP3795128B2 publication Critical patent/JP3795128B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP6531596A 1996-02-27 1996-02-27 ポリッシング装置 Expired - Fee Related JP3795128B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP6531596A JP3795128B2 (ja) 1996-02-27 1996-02-27 ポリッシング装置
US08/807,463 US5762539A (en) 1996-02-27 1997-02-27 Apparatus for and method for polishing workpiece
US09/589,388 USRE38826E1 (en) 1996-02-27 2000-06-08 Apparatus for and method for polishing workpiece
US10/142,980 USRE38854E1 (en) 1996-02-27 2002-05-13 Apparatus for and method for polishing workpiece
US10/976,330 USRE39471E1 (en) 1996-02-27 2004-10-29 Apparatus for and method for polishing workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6531596A JP3795128B2 (ja) 1996-02-27 1996-02-27 ポリッシング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006080798A Division JP4342528B2 (ja) 2006-03-23 2006-03-23 ポリッシング方法

Publications (3)

Publication Number Publication Date
JPH09225821A JPH09225821A (ja) 1997-09-02
JPH09225821A5 true JPH09225821A5 (enExample) 2005-12-08
JP3795128B2 JP3795128B2 (ja) 2006-07-12

Family

ID=32587977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6531596A Expired - Fee Related JP3795128B2 (ja) 1996-02-27 1996-02-27 ポリッシング装置

Country Status (1)

Country Link
JP (1) JP3795128B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
KR100550034B1 (ko) 1998-04-06 2006-02-08 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
US6435956B1 (en) 1999-02-02 2002-08-20 Ebara Corporation Wafer holder and polishing device
US6491570B1 (en) 1999-02-25 2002-12-10 Applied Materials, Inc. Polishing media stabilizer
US6050882A (en) * 1999-06-10 2000-04-18 Applied Materials, Inc. Carrier head to apply pressure to and retain a substrate
JP3835122B2 (ja) * 2000-05-29 2006-10-18 信越半導体株式会社 ワークの研磨方法
US6561884B1 (en) 2000-08-29 2003-05-13 Applied Materials, Inc. Web lift system for chemical mechanical planarization
CN101524826A (zh) * 2001-05-29 2009-09-09 株式会社荏原制作所 基片托板系统与用于抛光基片的方法
US6503131B1 (en) 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
TWI238754B (en) * 2002-11-07 2005-09-01 Ebara Tech Inc Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof
KR100862847B1 (ko) * 2003-12-31 2008-10-09 동부일렉트로닉스 주식회사 곡선형 패드 컨디셔닝 장치
JP4762647B2 (ja) * 2005-02-25 2011-08-31 株式会社荏原製作所 研磨装置及び研磨方法
TWI386989B (zh) * 2005-02-25 2013-02-21 荏原製作所股份有限公司 研磨裝置及研磨方法
JP5377873B2 (ja) * 2008-03-18 2013-12-25 株式会社東京精密 ウェーハ研磨装置及び該研磨装置を用いたウェーハ研磨方法
JP6266493B2 (ja) * 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
CN109648460A (zh) * 2018-12-20 2019-04-19 丰豹智能科技(上海)有限公司 一种无电流多分区可拆卸感应装置
CN119328669B (zh) * 2024-12-19 2025-03-18 荣芯半导体(宁波)有限公司 研磨头的吸附装置、化学机械研磨设备及控制方法

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