JP2001179605A5 - - Google Patents

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Publication number
JP2001179605A5
JP2001179605A5 JP2000259152A JP2000259152A JP2001179605A5 JP 2001179605 A5 JP2001179605 A5 JP 2001179605A5 JP 2000259152 A JP2000259152 A JP 2000259152A JP 2000259152 A JP2000259152 A JP 2000259152A JP 2001179605 A5 JP2001179605 A5 JP 2001179605A5
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JP
Japan
Prior art keywords
polishing
top ring
holding
fluid pressure
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000259152A
Other languages
English (en)
Japanese (ja)
Other versions
JP4056205B2 (ja
JP2001179605A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000259152A priority Critical patent/JP4056205B2/ja
Priority claimed from JP2000259152A external-priority patent/JP4056205B2/ja
Publication of JP2001179605A publication Critical patent/JP2001179605A/ja
Publication of JP2001179605A5 publication Critical patent/JP2001179605A5/ja
Application granted granted Critical
Publication of JP4056205B2 publication Critical patent/JP4056205B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000259152A 1999-10-15 2000-08-29 ポリッシング装置および方法 Expired - Fee Related JP4056205B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000259152A JP4056205B2 (ja) 1999-10-15 2000-08-29 ポリッシング装置および方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP29450399 1999-10-15
JP11-294503 1999-10-15
JP2000259152A JP4056205B2 (ja) 1999-10-15 2000-08-29 ポリッシング装置および方法

Publications (3)

Publication Number Publication Date
JP2001179605A JP2001179605A (ja) 2001-07-03
JP2001179605A5 true JP2001179605A5 (enExample) 2004-12-24
JP4056205B2 JP4056205B2 (ja) 2008-03-05

Family

ID=26559865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000259152A Expired - Fee Related JP4056205B2 (ja) 1999-10-15 2000-08-29 ポリッシング装置および方法

Country Status (1)

Country Link
JP (1) JP4056205B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003311593A (ja) * 2002-02-20 2003-11-05 Ebara Corp ポリッシング装置
JP4597634B2 (ja) * 2004-11-01 2010-12-15 株式会社荏原製作所 トップリング、基板の研磨装置及び研磨方法
WO2006049269A1 (en) 2004-11-01 2006-05-11 Ebara Corporation Polishing apparatus
JP2008093810A (ja) * 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd リテーナリング及び研磨ヘッド並びに研磨装置
JP2009194134A (ja) 2008-02-14 2009-08-27 Ebara Corp 研磨方法及び研磨装置
JP5377873B2 (ja) * 2008-03-18 2013-12-25 株式会社東京精密 ウェーハ研磨装置及び該研磨装置を用いたウェーハ研磨方法
US8192248B2 (en) * 2008-05-30 2012-06-05 Memc Electronic Materials, Inc. Semiconductor wafer polishing apparatus and method of polishing
TWI639485B (zh) * 2012-01-31 2018-11-01 日商荏原製作所股份有限公司 Substrate holding device, polishing device, and polishing method
JP5922965B2 (ja) * 2012-03-29 2016-05-24 株式会社荏原製作所 基板保持装置、研磨装置、および研磨方法
JP5964064B2 (ja) * 2012-01-31 2016-08-03 株式会社荏原製作所 基板保持装置、研磨装置、および研磨方法
US9566687B2 (en) * 2014-10-13 2017-02-14 Sunedison Semiconductor Limited (Uen201334164H) Center flex single side polishing head having recess and cap
JP2016165792A (ja) * 2015-03-05 2016-09-15 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP2017064894A (ja) * 2015-10-02 2017-04-06 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
KR102459834B1 (ko) * 2017-11-22 2022-10-28 주식회사 케이씨텍 캐리어 및 이를 포함하는 화학 기계적 연마 장치
JP7662324B2 (ja) * 2020-10-30 2025-04-15 株式会社荏原製作所 基板を保持するためのヘッドおよび基板処理装置

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