JP4056205B2 - ポリッシング装置および方法 - Google Patents

ポリッシング装置および方法 Download PDF

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Publication number
JP4056205B2
JP4056205B2 JP2000259152A JP2000259152A JP4056205B2 JP 4056205 B2 JP4056205 B2 JP 4056205B2 JP 2000259152 A JP2000259152 A JP 2000259152A JP 2000259152 A JP2000259152 A JP 2000259152A JP 4056205 B2 JP4056205 B2 JP 4056205B2
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JP
Japan
Prior art keywords
polishing
pressure
top ring
fluid
fluid pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000259152A
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English (en)
Japanese (ja)
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JP2001179605A5 (enExample
JP2001179605A (ja
Inventor
誠司 勝岡
穂積 安田
忠一 曽根
俊市朗 兒嶋
学 辻村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
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Publication date
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Priority to JP2000259152A priority Critical patent/JP4056205B2/ja
Publication of JP2001179605A publication Critical patent/JP2001179605A/ja
Publication of JP2001179605A5 publication Critical patent/JP2001179605A5/ja
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Publication of JP4056205B2 publication Critical patent/JP4056205B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000259152A 1999-10-15 2000-08-29 ポリッシング装置および方法 Expired - Fee Related JP4056205B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000259152A JP4056205B2 (ja) 1999-10-15 2000-08-29 ポリッシング装置および方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-294503 1999-10-15
JP29450399 1999-10-15
JP2000259152A JP4056205B2 (ja) 1999-10-15 2000-08-29 ポリッシング装置および方法

Publications (3)

Publication Number Publication Date
JP2001179605A JP2001179605A (ja) 2001-07-03
JP2001179605A5 JP2001179605A5 (enExample) 2004-12-24
JP4056205B2 true JP4056205B2 (ja) 2008-03-05

Family

ID=26559865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000259152A Expired - Fee Related JP4056205B2 (ja) 1999-10-15 2000-08-29 ポリッシング装置および方法

Country Status (1)

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JP (1) JP4056205B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003311593A (ja) * 2002-02-20 2003-11-05 Ebara Corp ポリッシング装置
JP4597634B2 (ja) * 2004-11-01 2010-12-15 株式会社荏原製作所 トップリング、基板の研磨装置及び研磨方法
EP2838110B1 (en) 2004-11-01 2016-04-27 Ebara Corporation Polishing apparatus
JP2008093810A (ja) * 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd リテーナリング及び研磨ヘッド並びに研磨装置
JP2009194134A (ja) 2008-02-14 2009-08-27 Ebara Corp 研磨方法及び研磨装置
JP5377873B2 (ja) * 2008-03-18 2013-12-25 株式会社東京精密 ウェーハ研磨装置及び該研磨装置を用いたウェーハ研磨方法
US8192248B2 (en) * 2008-05-30 2012-06-05 Memc Electronic Materials, Inc. Semiconductor wafer polishing apparatus and method of polishing
TWI639485B (zh) 2012-01-31 2018-11-01 日商荏原製作所股份有限公司 Substrate holding device, polishing device, and polishing method
JP5964064B2 (ja) * 2012-01-31 2016-08-03 株式会社荏原製作所 基板保持装置、研磨装置、および研磨方法
JP5922965B2 (ja) * 2012-03-29 2016-05-24 株式会社荏原製作所 基板保持装置、研磨装置、および研磨方法
US9566687B2 (en) * 2014-10-13 2017-02-14 Sunedison Semiconductor Limited (Uen201334164H) Center flex single side polishing head having recess and cap
JP2016165792A (ja) * 2015-03-05 2016-09-15 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP2017064894A (ja) * 2015-10-02 2017-04-06 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
KR102459834B1 (ko) * 2017-11-22 2022-10-28 주식회사 케이씨텍 캐리어 및 이를 포함하는 화학 기계적 연마 장치
JP7662324B2 (ja) * 2020-10-30 2025-04-15 株式会社荏原製作所 基板を保持するためのヘッドおよび基板処理装置

Also Published As

Publication number Publication date
JP2001179605A (ja) 2001-07-03

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