JP3795128B2 - ポリッシング装置 - Google Patents

ポリッシング装置 Download PDF

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Publication number
JP3795128B2
JP3795128B2 JP6531596A JP6531596A JP3795128B2 JP 3795128 B2 JP3795128 B2 JP 3795128B2 JP 6531596 A JP6531596 A JP 6531596A JP 6531596 A JP6531596 A JP 6531596A JP 3795128 B2 JP3795128 B2 JP 3795128B2
Authority
JP
Japan
Prior art keywords
polishing
top ring
pressing
semiconductor wafer
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP6531596A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09225821A5 (enExample
JPH09225821A (ja
Inventor
方通 中柴
憲雄 木村
勇 渡辺
香里 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP6531596A priority Critical patent/JP3795128B2/ja
Priority to US08/807,463 priority patent/US5762539A/en
Publication of JPH09225821A publication Critical patent/JPH09225821A/ja
Priority to US09/589,388 priority patent/USRE38826E1/en
Priority to US10/142,980 priority patent/USRE38854E1/en
Priority to US10/976,330 priority patent/USRE39471E1/en
Publication of JPH09225821A5 publication Critical patent/JPH09225821A5/ja
Application granted granted Critical
Publication of JP3795128B2 publication Critical patent/JP3795128B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP6531596A 1996-02-27 1996-02-27 ポリッシング装置 Expired - Fee Related JP3795128B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP6531596A JP3795128B2 (ja) 1996-02-27 1996-02-27 ポリッシング装置
US08/807,463 US5762539A (en) 1996-02-27 1997-02-27 Apparatus for and method for polishing workpiece
US09/589,388 USRE38826E1 (en) 1996-02-27 2000-06-08 Apparatus for and method for polishing workpiece
US10/142,980 USRE38854E1 (en) 1996-02-27 2002-05-13 Apparatus for and method for polishing workpiece
US10/976,330 USRE39471E1 (en) 1996-02-27 2004-10-29 Apparatus for and method for polishing workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6531596A JP3795128B2 (ja) 1996-02-27 1996-02-27 ポリッシング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006080798A Division JP4342528B2 (ja) 2006-03-23 2006-03-23 ポリッシング方法

Publications (3)

Publication Number Publication Date
JPH09225821A JPH09225821A (ja) 1997-09-02
JPH09225821A5 JPH09225821A5 (enExample) 2005-12-08
JP3795128B2 true JP3795128B2 (ja) 2006-07-12

Family

ID=32587977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6531596A Expired - Fee Related JP3795128B2 (ja) 1996-02-27 1996-02-27 ポリッシング装置

Country Status (1)

Country Link
JP (1) JP3795128B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6293858B1 (en) 1998-04-06 2001-09-25 Ebara Corporation Polishing device
US6435956B1 (en) 1999-02-02 2002-08-20 Ebara Corporation Wafer holder and polishing device
US6491570B1 (en) 1999-02-25 2002-12-10 Applied Materials, Inc. Polishing media stabilizer
US6050882A (en) * 1999-06-10 2000-04-18 Applied Materials, Inc. Carrier head to apply pressure to and retain a substrate
JP3835122B2 (ja) * 2000-05-29 2006-10-18 信越半導体株式会社 ワークの研磨方法
US6561884B1 (en) 2000-08-29 2003-05-13 Applied Materials, Inc. Web lift system for chemical mechanical planarization
KR100939096B1 (ko) 2001-05-29 2010-01-28 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치, 폴리싱방법 및 기판캐리어 시스템
US6503131B1 (en) 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
TWI238754B (en) * 2002-11-07 2005-09-01 Ebara Tech Inc Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof
KR100862847B1 (ko) * 2003-12-31 2008-10-09 동부일렉트로닉스 주식회사 곡선형 패드 컨디셔닝 장치
JP4762647B2 (ja) * 2005-02-25 2011-08-31 株式会社荏原製作所 研磨装置及び研磨方法
TWI386989B (zh) * 2005-02-25 2013-02-21 荏原製作所股份有限公司 研磨裝置及研磨方法
JP5377873B2 (ja) * 2008-03-18 2013-12-25 株式会社東京精密 ウェーハ研磨装置及び該研磨装置を用いたウェーハ研磨方法
JP6266493B2 (ja) * 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
CN109648460A (zh) * 2018-12-20 2019-04-19 丰豹智能科技(上海)有限公司 一种无电流多分区可拆卸感应装置
CN119328669B (zh) * 2024-12-19 2025-03-18 荣芯半导体(宁波)有限公司 研磨头的吸附装置、化学机械研磨设备及控制方法

Also Published As

Publication number Publication date
JPH09225821A (ja) 1997-09-02

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