TWI243084B - Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure - Google Patents

Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure Download PDF

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Publication number
TWI243084B
TWI243084B TW089103613A TW89103613A TWI243084B TW I243084 B TWI243084 B TW I243084B TW 089103613 A TW089103613 A TW 089103613A TW 89103613 A TW89103613 A TW 89103613A TW I243084 B TWI243084 B TW I243084B
Authority
TW
Taiwan
Prior art keywords
wafer
polishing
substrate
pneumatic
pressure
Prior art date
Application number
TW089103613A
Other languages
English (en)
Chinese (zh)
Inventor
Malek Charif
Jiro Kajiwara
Scott Chin
Jason Price
Gerard S Maloney
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/261,112 external-priority patent/US6231428B1/en
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of TWI243084B publication Critical patent/TWI243084B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW089103613A 1999-03-03 2000-03-01 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure TWI243084B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/261,112 US6231428B1 (en) 1999-03-03 1999-03-03 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US09/294,547 US6309290B1 (en) 1999-03-03 1999-04-19 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
US09/390,142 US6368189B1 (en) 1999-03-03 1999-09-03 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

Publications (1)

Publication Number Publication Date
TWI243084B true TWI243084B (en) 2005-11-11

Family

ID=27401376

Family Applications (2)

Application Number Title Priority Date Filing Date
TW089103613A TWI243084B (en) 1999-03-03 2000-03-01 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
TW089103841A TW534850B (en) 1999-03-03 2000-03-03 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW089103841A TW534850B (en) 1999-03-03 2000-03-03 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control

Country Status (7)

Country Link
US (3) US6368189B1 (enExample)
EP (5) EP1371449A3 (enExample)
JP (3) JP4212776B2 (enExample)
AT (3) ATE249909T1 (enExample)
DE (3) DE60005270T2 (enExample)
TW (2) TWI243084B (enExample)
WO (2) WO2000054933A2 (enExample)

Cited By (4)

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TWI505909B (zh) * 2010-08-31 2015-11-01 Fujikoshi Machinery Corp 研磨裝置
TWI609741B (zh) * 2013-12-02 2018-01-01 荏原製作所股份有限公司 研磨裝置
CN113752159A (zh) * 2021-08-21 2021-12-07 浙江晶盛机电股份有限公司 一种可在线测厚的抛光载体
CN115431169A (zh) * 2022-08-24 2022-12-06 中国电子科技集团公司第十三研究所 真空连接转换装置、载片抛光方法及抛光机

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI505909B (zh) * 2010-08-31 2015-11-01 Fujikoshi Machinery Corp 研磨裝置
TWI609741B (zh) * 2013-12-02 2018-01-01 荏原製作所股份有限公司 研磨裝置
CN113752159A (zh) * 2021-08-21 2021-12-07 浙江晶盛机电股份有限公司 一种可在线测厚的抛光载体
CN115431169A (zh) * 2022-08-24 2022-12-06 中国电子科技集团公司第十三研究所 真空连接转换装置、载片抛光方法及抛光机
CN115431169B (zh) * 2022-08-24 2023-09-01 中国电子科技集团公司第十三研究所 真空连接转换装置、载片抛光方法及抛光机

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US7029382B2 (en) 2006-04-18
EP1091829A2 (en) 2001-04-18
US7311586B2 (en) 2007-12-25
EP1837122A2 (en) 2007-09-26
WO2000054933A3 (en) 2001-01-25
WO2000051782B1 (en) 2001-05-25
TW534850B (en) 2003-06-01
EP1437197B1 (en) 2006-07-19
JP2002539620A (ja) 2002-11-19
EP1437197A1 (en) 2004-07-14
JP2002538611A (ja) 2002-11-12
EP1837122A3 (en) 2007-10-17
ATE333342T1 (de) 2006-08-15
DE60011193D1 (de) 2004-07-08
HK1037156A1 (en) 2002-02-01
US20060128277A1 (en) 2006-06-15
DE60005270T2 (de) 2004-09-30
EP1091829B1 (en) 2003-09-17
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WO2000054933A2 (en) 2000-09-21
DE60011193T2 (de) 2005-07-07
JP4212776B2 (ja) 2009-01-21
ATE268247T1 (de) 2004-06-15
DE60029490D1 (de) 2006-08-31
JP3595266B2 (ja) 2004-12-02
EP1075351A1 (en) 2001-02-14
ATE249909T1 (de) 2003-10-15
US6368189B1 (en) 2002-04-09
EP1075351B1 (en) 2004-06-02
EP1371449A3 (en) 2004-04-21
WO2000054933B1 (en) 2001-03-01
US20020077045A1 (en) 2002-06-20
WO2000051782A1 (en) 2000-09-08
EP1837122B1 (en) 2009-12-02
EP1371449A2 (en) 2003-12-17
DE60005270D1 (de) 2003-10-23
DE60029490T2 (de) 2007-02-08

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