JP2002519856A - オフセットロータ付き平板状媒体処理装置 - Google Patents

オフセットロータ付き平板状媒体処理装置

Info

Publication number
JP2002519856A
JP2002519856A JP2000556884A JP2000556884A JP2002519856A JP 2002519856 A JP2002519856 A JP 2002519856A JP 2000556884 A JP2000556884 A JP 2000556884A JP 2000556884 A JP2000556884 A JP 2000556884A JP 2002519856 A JP2002519856 A JP 2002519856A
Authority
JP
Japan
Prior art keywords
bowl
rotor
axis
centrifugal
central axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000556884A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002519856A5 (enExample
Inventor
ダニエル・ピー・ベックステン
Original Assignee
セミトゥール・インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セミトゥール・インコーポレイテッド filed Critical セミトゥール・インコーポレイテッド
Publication of JP2002519856A publication Critical patent/JP2002519856A/ja
Publication of JP2002519856A5 publication Critical patent/JP2002519856A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Centrifugal Separators (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Hydraulic Motors (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Rotary Pumps (AREA)
  • Separation Of Solids By Using Liquids Or Pneumatic Power (AREA)
  • Holding Or Fastening Of Disk On Rotational Shaft (AREA)
JP2000556884A 1998-06-30 1999-06-21 オフセットロータ付き平板状媒体処理装置 Pending JP2002519856A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/107,878 1998-06-30
US09/107,878 US6125863A (en) 1998-06-30 1998-06-30 Offset rotor flat media processor
PCT/US1999/013984 WO2000000301A1 (en) 1998-06-30 1999-06-21 Offset rotor flat media processor

Publications (2)

Publication Number Publication Date
JP2002519856A true JP2002519856A (ja) 2002-07-02
JP2002519856A5 JP2002519856A5 (enExample) 2006-08-10

Family

ID=22318945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000556884A Pending JP2002519856A (ja) 1998-06-30 1999-06-21 オフセットロータ付き平板状媒体処理装置

Country Status (6)

Country Link
US (1) US6125863A (enExample)
EP (1) EP1115511B1 (enExample)
JP (1) JP2002519856A (enExample)
AT (1) ATE359132T1 (enExample)
DE (1) DE69935795T2 (enExample)
WO (1) WO2000000301A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021529092A (ja) * 2018-07-06 2021-10-28 オーイーエム グループ リミテッド ライアビリティ カンパニー スプレー測定機器のためのシステム及び方法

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US20040025901A1 (en) * 2001-07-16 2004-02-12 Semitool, Inc. Stationary wafer spin/spray processor
US6691720B2 (en) * 2001-07-16 2004-02-17 Semitool, Inc. Multi-process system with pivoting process chamber
US6895981B2 (en) * 2002-07-19 2005-05-24 Semitool, Inc. Cross flow processor
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US7289734B2 (en) * 2002-12-24 2007-10-30 Tropic Networks Inc. Method and system for multi-level power management in an optical network
US20060201541A1 (en) * 2005-03-11 2006-09-14 Semiconductor Energy Laboratory Co., Ltd. Cleaning-drying apparatus and cleaning-drying method
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WO2009114043A1 (en) * 2008-03-07 2009-09-17 Automation Technology, Inc. Solar wafer cleaning systems, apparatus and methods
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
US8967935B2 (en) 2011-07-06 2015-03-03 Tel Nexx, Inc. Substrate loader and unloader
AT515531B1 (de) * 2014-09-19 2015-10-15 Siconnex Customized Solutions Gmbh Halterungssystem und Beschickungsverfahren für scheibenförmige Objekte
CN115228828B (zh) * 2022-09-20 2023-01-24 山东鲁西药业有限公司 一种药品原料清洗装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021529092A (ja) * 2018-07-06 2021-10-28 オーイーエム グループ リミテッド ライアビリティ カンパニー スプレー測定機器のためのシステム及び方法
JP7450844B2 (ja) 2018-07-06 2024-03-18 シェルバック セミコンダクター テクノロジー リミテッド ライアビリティ カンパニー スプレー測定機器のためのシステム及び方法

Also Published As

Publication number Publication date
EP1115511A4 (en) 2005-04-20
DE69935795D1 (de) 2007-05-24
DE69935795T2 (de) 2007-12-27
US6125863A (en) 2000-10-03
ATE359132T1 (de) 2007-05-15
EP1115511A1 (en) 2001-07-18
EP1115511B1 (en) 2007-04-11
WO2000000301A1 (en) 2000-01-06

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