DE69935795T2 - Exzentrisch rotierendes bearbeitungsgerät für flache medien - Google Patents

Exzentrisch rotierendes bearbeitungsgerät für flache medien Download PDF

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Publication number
DE69935795T2
DE69935795T2 DE69935795T DE69935795T DE69935795T2 DE 69935795 T2 DE69935795 T2 DE 69935795T2 DE 69935795 T DE69935795 T DE 69935795T DE 69935795 T DE69935795 T DE 69935795T DE 69935795 T2 DE69935795 T2 DE 69935795T2
Authority
DE
Germany
Prior art keywords
tub
rotor
flat media
processing device
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69935795T
Other languages
German (de)
English (en)
Other versions
DE69935795D1 (de
Inventor
Daniel P. Kalispell BEXTEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc filed Critical Semitool Inc
Publication of DE69935795D1 publication Critical patent/DE69935795D1/de
Application granted granted Critical
Publication of DE69935795T2 publication Critical patent/DE69935795T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Centrifugal Separators (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Hydraulic Motors (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Rotary Pumps (AREA)
  • Separation Of Solids By Using Liquids Or Pneumatic Power (AREA)
  • Holding Or Fastening Of Disk On Rotational Shaft (AREA)
DE69935795T 1998-06-30 1999-06-21 Exzentrisch rotierendes bearbeitungsgerät für flache medien Expired - Lifetime DE69935795T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US107878 1998-06-30
US09/107,878 US6125863A (en) 1998-06-30 1998-06-30 Offset rotor flat media processor
PCT/US1999/013984 WO2000000301A1 (en) 1998-06-30 1999-06-21 Offset rotor flat media processor

Publications (2)

Publication Number Publication Date
DE69935795D1 DE69935795D1 (de) 2007-05-24
DE69935795T2 true DE69935795T2 (de) 2007-12-27

Family

ID=22318945

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69935795T Expired - Lifetime DE69935795T2 (de) 1998-06-30 1999-06-21 Exzentrisch rotierendes bearbeitungsgerät für flache medien

Country Status (6)

Country Link
US (1) US6125863A (enExample)
EP (1) EP1115511B1 (enExample)
JP (1) JP2002519856A (enExample)
AT (1) ATE359132T1 (enExample)
DE (1) DE69935795T2 (enExample)
WO (1) WO2000000301A1 (enExample)

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US20040025901A1 (en) * 2001-07-16 2004-02-12 Semitool, Inc. Stationary wafer spin/spray processor
US6691720B2 (en) * 2001-07-16 2004-02-17 Semitool, Inc. Multi-process system with pivoting process chamber
US6895981B2 (en) * 2002-07-19 2005-05-24 Semitool, Inc. Cross flow processor
TW200415674A (en) * 2002-07-26 2004-08-16 Applied Materials Inc Hydrophilic components for a spin-rinse-dryer
US7289734B2 (en) * 2002-12-24 2007-10-30 Tropic Networks Inc. Method and system for multi-level power management in an optical network
US20060201541A1 (en) * 2005-03-11 2006-09-14 Semiconductor Energy Laboratory Co., Ltd. Cleaning-drying apparatus and cleaning-drying method
KR100829923B1 (ko) * 2006-08-30 2008-05-16 세메스 주식회사 스핀헤드 및 이를 이용하는 기판처리방법
WO2009114043A1 (en) * 2008-03-07 2009-09-17 Automation Technology, Inc. Solar wafer cleaning systems, apparatus and methods
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
US8967935B2 (en) 2011-07-06 2015-03-03 Tel Nexx, Inc. Substrate loader and unloader
AT515531B1 (de) * 2014-09-19 2015-10-15 Siconnex Customized Solutions Gmbh Halterungssystem und Beschickungsverfahren für scheibenförmige Objekte
EP3817870B1 (en) * 2018-07-06 2024-04-17 Shellback Semiconductor Technology, LLC Systems and methods for a spray measurement apparatus
CN115228828B (zh) * 2022-09-20 2023-01-24 山东鲁西药业有限公司 一种药品原料清洗装置

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Also Published As

Publication number Publication date
EP1115511A4 (en) 2005-04-20
JP2002519856A (ja) 2002-07-02
DE69935795D1 (de) 2007-05-24
US6125863A (en) 2000-10-03
ATE359132T1 (de) 2007-05-15
EP1115511A1 (en) 2001-07-18
EP1115511B1 (en) 2007-04-11
WO2000000301A1 (en) 2000-01-06

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