EP1115511B1 - Offset rotor flat media processor - Google Patents

Offset rotor flat media processor Download PDF

Info

Publication number
EP1115511B1
EP1115511B1 EP99930500A EP99930500A EP1115511B1 EP 1115511 B1 EP1115511 B1 EP 1115511B1 EP 99930500 A EP99930500 A EP 99930500A EP 99930500 A EP99930500 A EP 99930500A EP 1115511 B1 EP1115511 B1 EP 1115511B1
Authority
EP
European Patent Office
Prior art keywords
bowl
rotor
processor
flat media
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP99930500A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1115511A4 (en
EP1115511A1 (en
Inventor
Daniel P. Bexten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitool Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc filed Critical Semitool Inc
Publication of EP1115511A1 publication Critical patent/EP1115511A1/en
Publication of EP1115511A4 publication Critical patent/EP1115511A4/en
Application granted granted Critical
Publication of EP1115511B1 publication Critical patent/EP1115511B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Definitions

  • the technical field of this invention is centrifugal processing equipment and methods used to process semiconductor wafers, photomasks, optical and glass disks, magnetic disks, flat panels, lenses or similar flat media.
  • the production of semiconductor wafers, substrates and photomask plates used in the manufacture of semiconductor wafers has typically utilized processing equipment in which various types of processing fluids are used to treat the wafers.
  • processing equipment in which various types of processing fluids are used to treat the wafers.
  • One example of a semiconductor processor is a centrifugal rinser-dryer used to rinse acids, caustics, etchants and other processing fluids from wafers, photomask plates, and similar flat media.
  • the rinser-dryers are also used to dry the rinsed units using a flow of heated gas, such as nitrogen, which is passed through the processing chamber after rinsing with the desired fluid.
  • heated gas such as nitrogen
  • the wafers are spun during processing to provide more even distribution of the processing fluids across the wafer surfaces, and to assist in removal of rinsing liquids in preparation for drying.
  • semiconductor processors include acid, solvent, and caustic treatment machines which spray or otherwise apply acids, solvents and caustics to the wafers or other flat media. Stripping processors are used to remove photoresist from the wafers. Other specific processing of semiconductors may require other types of chemicals. Many of these processes are performed in centrifugal processing machines to provide for even distribution of fluids over the wafer and to aid in removal of liquids.
  • a primary problem in the production of semiconductors is particle contamination. Contaminant particles can affect the photographic processes used to transfer the chip layouts onto the wafers being processed into chips. Contaminants on the photomasks can cause deterioration of the image being transferred onto the wafer.
  • the direct processing of the wafers themselves is even more susceptible to contamination because of the numerous processing steps involved and the risk at each stage that contaminating particles can become adhered to the surface of the wafer.
  • Particle contamination causes a large number of the chips in a wafer to be defective. Thus it is very important to reduce contamination to increase yields.
  • the causes of contaminating particles on wafer surfaces occurs from numerous sources. Each of the processing fluids used is necessarily impure to some small degree.
  • the water used in processing is deionized to remove metallic ions and other impurities, but such supplies also contain some impurities.
  • Centrifugal processing is advantageous because spinning the wafers or other flat media flings off fluid droplets. This helps to prevent contamination by "spotting" which occurs if fluid droplets on the wafer evaporate. It is also advantageous to have the used rinse water or fluids removed from the processing chamber as quickly as possible, to prevent recontamination.
  • Centrifugal processors such as spray solvent and spray acid processors, and spin rinser dryers, typically have a rotor which spins inside of a cylindrical processing chamber or bowl.
  • the cylindrical rotor holds a removable cassette or non-removable combs which carry the wafers.
  • the bowl typically has a drainage ditch or channel running from the front to the rear, near the bottom of the bowl, to drain fluids out of the bowl.
  • the spinning rotor which is centered in the bowl, generates rapid counter-clockwise air movement within the bowl.
  • This air movement hinders the clean drying or other processing operation of the centrifugal processor, as it tends to draw spent fluid droplets of e.g., water, solvent, or acid, up and around in the bowl, allowing droplets to be re-deposited on the wafers or other flat media.
  • the air movement also tends to draw droplets away from the drainage channel, allowing them to be disadvantageously recycled back up and around the bowl.
  • US 0 471 541 A describes a washing-machine having a base formed with lower converging ends, n vertically-adjustable cylinders within the base, and a cover adapted to rest on the converging ends when in its lowered position.
  • US 2 895 320 A describes a washing machine including a cabinet and a rotatable tub at an angle in said cabinet and provided with an inclined axis of rotation.
  • the machine for cleaning clothes and the like disclosed in US 3 388 410 A includes a rotatable chamber adapted to receive clothes to be cleaned in a cleaning solution and means for rotating the chamber about its central axis at a relatively high speed.
  • the closed cycle dry cleaning apparatus disclosed in US 3 410 118 A comprises a housing, an apertured basket rotatably mounted in said housing, and means for selectively rotating said basket.
  • US 4 153 551 A describes a centrifuge having a drum to which a wobble or nutating motion is applied to discharge the centrifuged material over the edge of a wall of the perforated basket.
  • the wobble or nutation is caused by tilting the axis of this wall relative to the axis rotation of the assembly.
  • the present invention is directed to a centrifugal semiconductor wafer spray processor with a rotor contained within a bowl which is designed to better direct and scavenge fluids from the bowl. By doing so, a more complete process can be accomplished with less risk of contamination from spent fluid.
  • the present invention provides a centrifugal semiconductor wafer spray processor as featured in independent claim. Preferred embodiments are described in the dependent claims.
  • the centrifugal processor includes a rotor offset from the centerline of the bowl.
  • the offset provides an area of lower fluid velocities.
  • the centrifugal processor includes drain openings in the form of staggered slots.
  • the slots quickly remove spent fluid from the bowl and inhibit any re-entraining of the fluid into the air flow within the bowl.
  • the slots of the second separate aspect include peripheries which are not perpendicular to the flow. With such a configuration, fluid droplets accumulate and more readily fall out of the bowl.
  • any one or more of the foregoing separate aspects are contemplated to be combined to enhance removal of fluid droplets.
  • an object of the present invention is to provide an improved centrifugal processor, which more effectively removes used fluid from the bowl, thereby reducing the potential for recontamination of the silicon wafers or other flat media.
  • the present centrifugal processor 10 has a cylindrical bowl 14 mounted within a housing 12.
  • a cylindrical cassette rotor 18 is rotatably mounted within the bowl 14 .
  • the back end of the rotor 18 is connected to a drive motor 16 , which spins the rotor within the bowl 14 .
  • the workpieces 22 are held within the rotor 18 , in a wafer cassette 24 , as shown in Fig. 10, placed within the rotor 18 .
  • a comb rotor 17 having combs 19 for directly holding the wafers 22 , as shown in Fig. 9, may be used.
  • the techniques for holding wafers in the combs, or for holding the wafer cassette, in a rotor, as shown in Figs. 9 and 10, are well known in the art.
  • the workpieces 22 may be semiconductor wafers, metal or glass disks, flat panels, lenses, or other flat media.
  • One or more fluid spray manifolds such as manifolds 20 and 26 are positioned near the top of the bowl 14 .
  • the wafers 22 or cassette 24 are loaded into the rotor 18 via a swing out door 30 .
  • the manifolds may spray out liquid such as water, solvents, or acids, or gases, such as nitrogen.
  • an ionizer 28 may also be provided.
  • the rotor horizontal centerline or spin axis 52 is offset above and to one side of the bowl centerline 50 .
  • the rotor spin axis is diagonally displaced from the bowl centerline 50 , by a distance D, and at an angle ⁇ from vertical.
  • D is preferably about 1.3 cm and ⁇ is about 45°.
  • E between the vertical centerline 56 of the rotor, and the vertical centerline 54 of the bowl 14 is about 0.9 cm.
  • drain openings 41 are provided in a cluster 40 near the bottom of the bowl 14 .
  • the openings 41 pass through the cylindrical sidewall of the bowl 14 .
  • the openings 41 are arranged in a first row 42 staggered or offset from a second row 44 .
  • the rotor 18 spins counter-clockwise in Figs. 1, 3 and 4.
  • the cluster 40 of drain openings 41 is located at or between the 5 o'clock (30° counter-clockwise up from bottom center) and 6 o'clock (bottom center) positions.
  • the motor 16 spins the rotor 18 .
  • the rotor 16 is offset in a direction away from the openings 41. This offset position helps to avoid low pressure over the openings 41 , which reduces the tendency of the spinning rotor to draw fluid droplets up and away from the openings 41 .
  • the drainage route out of the bowl 14 is made up of individual openings 41 , in contrast to the continuous drain channel used in prior designs, spent fluid drains more quickly from the bowl 14 .
  • the combination of the offset rotor and openings 41 also allows spent fluid droplets which fall to the bottom of the bowl to exit the bowl under gravity via the openings, rather than splashing back onto and contaminating the wafers or workpieces.
  • a drainage channel under the openings 41 similar to the channel shown in Fig. 2, catches the droplets and carries them to a drain.
  • Figs. 6 and 8 show an alternative embodiment having a bowl 60 including alternating pairs of aligned drainage holes 62.
  • the drainage holes are elliptical or oval-shaped.
  • the major axis of each hole extends at an angle of about 30° to the major axes of the adjacent holes in the adjacent row.
  • fluid droplets clinging to an edge of an opening 62 move toward the down wind (right side in Fig. 6) of the openings 62, and collect at the down wind radius of the hole.
  • the force of gravity surpasses the surface tension adhesion forces and aerodynamic forces.
  • the droplet then falls through the opening, to a collection pipe or channel on the outside of the bowl 14.
  • a bowl depth R of about 280mm three rows of openings 62 are provided, with each row having 5 openings.
  • the angles and dimensions S; T; U; V; W; and X are 15°; 29; 44; 22; and 57mm respectively, with the other dimensions shown proportionally to scale.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Centrifugal Separators (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Hydraulic Motors (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Rotary Pumps (AREA)
  • Separation Of Solids By Using Liquids Or Pneumatic Power (AREA)
  • Holding Or Fastening Of Disk On Rotational Shaft (AREA)
EP99930500A 1998-06-30 1999-06-21 Offset rotor flat media processor Expired - Lifetime EP1115511B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US107878 1998-06-30
US09/107,878 US6125863A (en) 1998-06-30 1998-06-30 Offset rotor flat media processor
PCT/US1999/013984 WO2000000301A1 (en) 1998-06-30 1999-06-21 Offset rotor flat media processor

Publications (3)

Publication Number Publication Date
EP1115511A1 EP1115511A1 (en) 2001-07-18
EP1115511A4 EP1115511A4 (en) 2005-04-20
EP1115511B1 true EP1115511B1 (en) 2007-04-11

Family

ID=22318945

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99930500A Expired - Lifetime EP1115511B1 (en) 1998-06-30 1999-06-21 Offset rotor flat media processor

Country Status (6)

Country Link
US (1) US6125863A (enExample)
EP (1) EP1115511B1 (enExample)
JP (1) JP2002519856A (enExample)
AT (1) ATE359132T1 (enExample)
DE (1) DE69935795T2 (enExample)
WO (1) WO2000000301A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6350322B1 (en) 1997-03-21 2002-02-26 Micron Technology, Inc. Method of reducing water spotting and oxide growth on a semiconductor structure
US6516816B1 (en) * 1999-04-08 2003-02-11 Applied Materials, Inc. Spin-rinse-dryer
US20040025901A1 (en) * 2001-07-16 2004-02-12 Semitool, Inc. Stationary wafer spin/spray processor
US6691720B2 (en) * 2001-07-16 2004-02-17 Semitool, Inc. Multi-process system with pivoting process chamber
US6895981B2 (en) * 2002-07-19 2005-05-24 Semitool, Inc. Cross flow processor
TW200415674A (en) * 2002-07-26 2004-08-16 Applied Materials Inc Hydrophilic components for a spin-rinse-dryer
US7289734B2 (en) * 2002-12-24 2007-10-30 Tropic Networks Inc. Method and system for multi-level power management in an optical network
US20060201541A1 (en) * 2005-03-11 2006-09-14 Semiconductor Energy Laboratory Co., Ltd. Cleaning-drying apparatus and cleaning-drying method
KR100829923B1 (ko) * 2006-08-30 2008-05-16 세메스 주식회사 스핀헤드 및 이를 이용하는 기판처리방법
WO2009114043A1 (en) * 2008-03-07 2009-09-17 Automation Technology, Inc. Solar wafer cleaning systems, apparatus and methods
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
US8967935B2 (en) 2011-07-06 2015-03-03 Tel Nexx, Inc. Substrate loader and unloader
AT515531B1 (de) * 2014-09-19 2015-10-15 Siconnex Customized Solutions Gmbh Halterungssystem und Beschickungsverfahren für scheibenförmige Objekte
EP3817870B1 (en) * 2018-07-06 2024-04-17 Shellback Semiconductor Technology, LLC Systems and methods for a spray measurement apparatus
CN115228828B (zh) * 2022-09-20 2023-01-24 山东鲁西药业有限公司 一种药品原料清洗装置

Family Cites Families (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US28135A (en) * 1860-05-01 Aaron williamson
US193222A (en) * 1877-07-17 Improvement in steam dish-cleaners
US1035480A (en) * 1907-10-09 1912-08-13 Milton Schnaier Area-drain.
US910882A (en) * 1908-10-15 1909-01-26 George Truesdell Bottle-washing apparatus.
US1405243A (en) * 1920-11-16 1922-01-31 Claude E Wing Dishwashing machine
US1793798A (en) * 1928-07-05 1931-02-24 Sarah B Harker Dishwashing machine
US2225501A (en) * 1938-06-04 1940-12-17 James R Lapham Machine for washing cream separator disks
US2699660A (en) * 1946-05-23 1955-01-18 Apex Electrical Mfg Co Washing and extracting machine
US2573128A (en) * 1947-04-05 1951-10-30 Cavicchioli Mario Device in dishwashing machine for recovering silverware and the like
US2677381A (en) * 1950-05-25 1954-05-04 Spray Blast Corp Spray blast cleaning cabinet
US2684585A (en) * 1951-08-01 1954-07-27 Carl D Smith Washing machine
US2669660A (en) * 1951-10-27 1954-02-16 Western Electric Co Leak detecting apparatus
US2721566A (en) * 1952-05-08 1955-10-25 William E Brucker Parts washer
US2675012A (en) * 1952-10-18 1954-04-13 Frank J Scales Washing apparatus for automotive and machine parts and assmeblies
US3214026A (en) * 1961-10-03 1965-10-26 Borg Warner Solvent recovery device
US3079286A (en) * 1962-03-02 1963-02-26 Detrex Chem Ind Enclosed cold solvent spray cleaner
US3116744A (en) * 1962-10-26 1964-01-07 Earl E Hager Washing machine for small articles
US3203434A (en) * 1963-12-06 1965-08-31 Western Electric Co Chemical polishing machine
US3242934A (en) * 1964-07-22 1966-03-29 Heinricke Instr Co Combination washer and drier
US3383255A (en) * 1964-11-05 1968-05-14 North American Rockwell Planar etching of fused silica
US3341016A (en) * 1965-08-23 1967-09-12 Jens A Paasche Spray booth
DE1477965A1 (de) * 1965-10-08 1969-06-04 Badische Maschinenfabrik Ag Se Schleuderstrahlmaschine
US3489608A (en) * 1965-10-26 1970-01-13 Kulicke & Soffa Ind Inc Method and apparatus for treating semiconductor wafers
US3443567A (en) * 1967-11-01 1969-05-13 Howard L Moore Automatic egg flat washer
US3464429A (en) * 1967-12-14 1969-09-02 Henry B Ehrhardt Automatic washer for small machine parts
US3607478A (en) * 1967-12-14 1971-09-21 Bosch Gmbh Robert Method of treating semiconductor elements of circular outline
US3514329A (en) 1968-03-27 1970-05-26 Charles Amory Hull Solid smooth-surface article washing device
US3526237A (en) * 1968-05-08 1970-09-01 Scott E Neill Jr Filter cleaner
US3585668A (en) * 1969-06-02 1971-06-22 Bell Telephone Labor Inc Brush cleaning apparatus for semiconductor slices
US3585128A (en) * 1969-07-28 1971-06-15 Gen Electric Pre-wash scrap basket for dishwasher
US3727620A (en) * 1970-03-18 1973-04-17 Fluoroware Of California Inc Rinsing and drying device
US3608567A (en) * 1970-06-26 1971-09-28 Scott E Neill Jr Filter cleaning process and apparatuses
US3748677A (en) * 1970-09-18 1973-07-31 Western Electric Co Methods and apparatus for scrubbing thin, fragile slices of material
US3664872A (en) * 1970-09-18 1972-05-23 Western Electric Co Method for scrubbing thin, fragile slices of material
DE2125102A1 (de) * 1971-05-19 1972-11-30 Anton Huber Gmbh & Co Kg, 8050 Freising Verfahren und Einrichtung zum Reinigen einer Anzahl kleiner Gegenstände
US3756410A (en) * 1971-11-08 1973-09-04 Moody Aquamatic System Inc Sewage disposal effluent purifier
US3769992A (en) * 1971-12-06 1973-11-06 Fluoroware Inc Spray processing machine
US3808065A (en) * 1972-02-28 1974-04-30 Rca Corp Method of polishing sapphire and spinel
US3760822A (en) * 1972-03-22 1973-09-25 A Evans Machine for cleaning semiconductive wafers
US3804758A (en) * 1972-03-29 1974-04-16 Cosham Eng Design Ltd Screen changer
US4027686A (en) * 1973-01-02 1977-06-07 Texas Instruments Incorporated Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water
US3964957A (en) * 1973-12-19 1976-06-22 Monsanto Company Apparatus for processing semiconductor wafers
US3939514A (en) * 1974-11-11 1976-02-24 Kayex Corporation Apparatus for cleaning thin, fragile wafers of a material
US3977926A (en) * 1974-12-20 1976-08-31 Western Electric Company, Inc. Methods for treating articles
US3970471A (en) * 1975-04-23 1976-07-20 Western Electric Co., Inc. Methods and apparatus for treating wafer-like articles
US3990462A (en) * 1975-05-19 1976-11-09 Fluoroware Systems Corporation Substrate stripping and cleaning apparatus
JPS5271871A (en) * 1975-12-11 1977-06-15 Nec Corp Washing apparatus
DE2710586C2 (de) * 1977-03-11 1981-12-24 Krauss-Maffei AG, 8000 München Taumelzentrifuge
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
US4208760A (en) * 1977-12-19 1980-06-24 Huestis Machine Corp. Apparatus and method for cleaning wafers
DE2901643A1 (de) * 1979-01-17 1980-07-31 Krauss Maffei Ag Zentrifugen-produktbeschleuniger
US4226642A (en) * 1979-02-06 1980-10-07 American Sterilizer Company System providing for decontamination washing and/or biocidal treatment
US4286541A (en) * 1979-07-26 1981-09-01 Fsi Corporation Applying photoresist onto silicon wafers
US4300581A (en) * 1980-03-06 1981-11-17 Thompson Raymon F Centrifugal wafer processor
JPS587830A (ja) * 1981-07-08 1983-01-17 Hitachi Ltd 薄片状物品の洗浄方法及び装置
US4370992A (en) * 1981-09-21 1983-02-01 Abbott Laboratories Washing apparatus for small parts
US4456022A (en) * 1981-10-16 1984-06-26 Roberts Donald E Flatware washing machine
DE3223703C2 (de) * 1982-06-25 1984-05-30 M.A.N. Maschinenfabrik Augsburg-Nürnberg AG, 4200 Oberhausen Gasgesperrte Wellendichtung mit radialem Dichtspalt
US4440185A (en) * 1982-08-18 1984-04-03 Wiltse Dean P Support stand for a food slicer
JPS6014244A (ja) * 1983-07-06 1985-01-24 Fujitsu Ltd マスク洗浄装置
US4982753A (en) * 1983-07-26 1991-01-08 National Semiconductor Corporation Wafer etching, cleaning and stripping apparatus
US4536845A (en) * 1983-08-31 1985-08-20 Culligan International Company Self-programmable controller for water conditioner recharging
US4571850A (en) * 1984-05-17 1986-02-25 The Fluorocarbon Company Centrifugal wafer processor
DE8430403U1 (de) * 1984-10-16 1985-04-25 Gebr. Steimel, 5202 Hennef Zentrifugiervorrichtung
JPS61164226A (ja) * 1985-01-17 1986-07-24 Toshiba Ceramics Co Ltd 半導体ウエ−ハ洗浄装置
JPS61178187U (enExample) * 1985-04-26 1986-11-06
US4682614A (en) * 1985-07-26 1987-07-28 Fsi Corporation Wafer processing machine
US4753258A (en) * 1985-08-06 1988-06-28 Aigo Seiichiro Treatment basin for semiconductor material
US4745422A (en) * 1985-11-18 1988-05-17 Kabushiki Kaisha Toshiba Automatic developing apparatus
US4731154A (en) * 1986-06-23 1988-03-15 The Dow Chemical Company Method and apparatus for quantitative measurement of organic contaminants remaining on cleaned surfaces
JPS6314434A (ja) * 1986-07-04 1988-01-21 Dainippon Screen Mfg Co Ltd 基板表面処理方法および装置
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
US4828660A (en) * 1986-10-06 1989-05-09 Athens Corporation Method and apparatus for the continuous on-site chemical reprocessing of ultrapure liquids
US5022419A (en) * 1987-04-27 1991-06-11 Semitool, Inc. Rinser dryer system
US5095927A (en) * 1987-04-27 1992-03-17 Semitool, Inc. Semiconductor processor gas-liquid separation
DE3815018A1 (de) * 1987-05-06 1988-12-01 Dan Science Co Traegerreinigungs- und -trocknungsvorrichtung
JPH069499Y2 (ja) * 1987-06-23 1994-03-09 黒谷 信子 半導体材料の水切乾燥装置
JPH01111338A (ja) * 1987-10-24 1989-04-28 Sony Corp 洗浄方法及び洗浄装置
AT389959B (de) * 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
JPH0264646A (ja) * 1988-08-31 1990-03-05 Toshiba Corp レジストパターンの現像方法及びこの方法に使用する現像装置
US5069236A (en) * 1990-03-07 1991-12-03 Pathway Systems, Inc. Method and apparatus for cleaning disks
US5027841A (en) * 1990-04-24 1991-07-02 Electronic Controls Design, Inc. Apparatus to clean printed circuit boards
US5000208A (en) * 1990-06-21 1991-03-19 Micron Technology, Inc. Wafer rinser/dryer
US5232328A (en) * 1991-03-05 1993-08-03 Semitool, Inc. Robot loadable centrifugal semiconductor processor with extendible rotor
US5174045A (en) * 1991-05-17 1992-12-29 Semitool, Inc. Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers
JP2877216B2 (ja) * 1992-10-02 1999-03-31 東京エレクトロン株式会社 洗浄装置
US5784797A (en) * 1994-04-28 1998-07-28 Semitool, Inc. Carrierless centrifugal semiconductor processing system
US5664337A (en) * 1996-03-26 1997-09-09 Semitool, Inc. Automated semiconductor processing systems

Also Published As

Publication number Publication date
EP1115511A4 (en) 2005-04-20
JP2002519856A (ja) 2002-07-02
DE69935795D1 (de) 2007-05-24
DE69935795T2 (de) 2007-12-27
US6125863A (en) 2000-10-03
ATE359132T1 (de) 2007-05-15
EP1115511A1 (en) 2001-07-18
WO2000000301A1 (en) 2000-01-06

Similar Documents

Publication Publication Date Title
EP1115511B1 (en) Offset rotor flat media processor
JP3556043B2 (ja) 基板乾燥装置
US7472713B2 (en) Substrate processing apparatus
JPH1092784A (ja) ウェーハ処理装置およびウェーハ処理方法
JP2008034779A (ja) 基板処理方法および基板処理装置
US6062239A (en) Cross flow centrifugal processor
JP3713447B2 (ja) 現像処理装置
JPH0878368A (ja) ワークの処理方法および装置
US7678199B2 (en) Substrate cleaning method
JPH10189511A (ja) ウェーハ洗浄装置
KR20090131207A (ko) 스핀척, 이를 구비하는 기판 세정장치 및 기판의 세정방법
JP4325831B2 (ja) 基板処理装置ならびに基板処理装置に備えられた回転板および周囲部材の洗浄方法
KR100408114B1 (ko) 기판처리장치
KR100998849B1 (ko) 매엽식 세정장치
KR101018963B1 (ko) 기판처리장치 및 세정방법
KR20200077119A (ko) 기판 세정 장치
JP2007005392A (ja) 基板処理装置
JP2000208466A (ja) 基板処理方法および基板処理装置
KR20230054170A (ko) 스핀 척 장치
JP2916409B2 (ja) スピン洗浄処理方法およびその装置
JP2001217218A (ja) ウェハ処理装置及び方法
JP4347765B2 (ja) 基板処理装置
KR100885242B1 (ko) 기판 처리 장치, 및 이를 이용한 기판 처리 방법
JP2007123559A (ja) 基板処理装置および基板処理方法
KR20250035663A (ko) 기판세정장치 및 기판세정장치의 회수컵

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20010129

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

A4 Supplementary search report drawn up and despatched

Effective date: 20050304

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070411

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070411

Ref country code: CH

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070411

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 69935795

Country of ref document: DE

Date of ref document: 20070524

Kind code of ref document: P

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070711

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070722

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070911

NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

EN Fr: translation not filed
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070411

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070411

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070630

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070411

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20080114

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070411

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070712

Ref country code: FR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071207

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070621

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070411

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20070411

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070621

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 69935795

Country of ref document: DE

Representative=s name: VIERING, JENTSCHURA & PARTNER, DE

REG Reference to a national code

Ref country code: GB

Ref legal event code: 732E

Free format text: REGISTERED BETWEEN 20120802 AND 20120808

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 69935795

Country of ref document: DE

Representative=s name: VIERING, JENTSCHURA & PARTNER, DE

Effective date: 20120801

Ref country code: DE

Ref legal event code: R081

Ref document number: 69935795

Country of ref document: DE

Owner name: APPLIED MATERIALS, INC. (N.D.GES.D. STAATES DE, US

Free format text: FORMER OWNER: SEMITOOL, INC., KALISPELL, MONT., US

Effective date: 20120801

Ref country code: DE

Ref legal event code: R081

Ref document number: 69935795

Country of ref document: DE

Owner name: APPLIED MATERIALS, INC. (N.D.GES.D. STAATES DE, US

Free format text: FORMER OWNER: SEMITOOL, INC., KALISPELL, US

Effective date: 20120801

REG Reference to a national code

Ref country code: AT

Ref legal event code: PC

Ref document number: 359132

Country of ref document: AT

Kind code of ref document: T

Owner name: APPLIED MATERIALS, INC., US

Effective date: 20120913

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 20120525

Year of fee payment: 14

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20130529

Year of fee payment: 15

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20130628

Year of fee payment: 15

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 69935795

Country of ref document: DE

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 359132

Country of ref document: AT

Kind code of ref document: T

Effective date: 20140621

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20140621

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 69935795

Country of ref document: DE

Effective date: 20150101

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150101

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140621

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140621