Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67017—Apparatus for fluid treatment
  • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
  • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
  • B08B3/02—Cleaning by the force of jets or sprays
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S134/00—Cleaning and liquid contact with solids
  • Y10S134/902—Semiconductor wafer

Definitions

• the technical field of this invention is centrifugal processing equipment and methods used to process semiconductor wafers, photomasks, optical and glass disks, magnetic disks, flat panels, lenses or similar flat media.
• the production of semiconductor wafers, substrates and photomask plates used in the manufacture of semiconductor wafers has typically utilized processing equipment in which various types of processing fluids are used to treat the wafers.
• processing equipment in which various types of processing fluids are used to treat the wafers.
• One example of a semiconductor processor is a centrifugal rinser-dryer used to rinse acids, caustics, etchants and other processing fluids from wafers, photomask plates, and similar flat media.
• the rinser-dryers are also used to dry the rinsed units using a flow of heated gas, such as nitrogen, which is passed through the processing chamber after rinsing with the desired fluid.
• heated gas such as nitrogen
• the wafers are spun during processing to provide more even distribution of the processing fluids across the wafer surfaces, and to assist in removal of rinsing liquids in preparation for drying.
• semiconductor processors include acid, solvent, and caustic treatment machines which spray or otherwise apply acids, solvents and caustics to the wafers or other flat media. Stripping processors are used to remove photoresist from the wafers. Other specific processing of semiconductors may require other types of chemicals. Many of these processes are performed in centrifugal processing machines to provide for even distribution of fluids over the wafer and to aid in removal of liquids.
• a primary problem in the production of semiconductors is particle contamination. Contaminant particles can affect the photographic processes used to transfer the chip layouts onto the wafers being processed into chips. Contaminants on the photomasks can cause deterioration of the image being transferred onto the wafer.
• the direct processing of the wafers themselves is even more susceptible to contamination because of the numerous processing steps involved and the risk at each stage that contaminating particles can become adhered to the surface of the wafer.
• Particle contamination causes a large number of the chips in a wafer to be defective. Thus it is very important to reduce contamination to increase yields.
• the causes of contaminating particles on wafer surfaces occurs from numerous sources. Each of the processing fluids used is necessarily impure to some small degree.
• the water used in processing is deionized to remove metallic ions and other impurities, but such supplies also contain some impurities.
• Centrifugal processing is advantageous because spinning the wafers or other flat media flings off fluid droplets. This helps to prevent contamination by "spotting" which occurs if fluid droplets on the wafer evaporate. It is also advantageous to have the used rinse water or fluids removed from the processing chamber as quickly as possible, to prevent recontamination.
• Centrifugal processors such as spray solvent and spray acid processors, and spin rinser dryers, typically have a rotor which spins inside of a cylindrical processing chamber or bowl.
• the cylindrical rotor holds a removable cassette or non-removable combs which carry the wafers.
• the bowl typically has a drainage ditch or channel running from the front to the rear, near the bottom of the bowl, to drain fluids out of the bowl.
• the spinning rotor which is centered in the bowl, generates rapid counter-clockwise air movement within the bowl.
• This air movement hinders the clean drying or other processing operation of the centrifugal processor, as it tends to draw spent fluid droplets of e.g., water, solvent, or acid, up and around in the bowl, allowing droplets to be re-deposited on the wafers or other flat media.
• the air movement also tends to draw droplets away from the drainage channel, allowing them to be disadvantageously recycled back up and around the bowl.
• the present invention is directed to a centrifugal processor with a rotor contained within a bowl or chamber which is designed to better direct and scavenge fluids from the bowl. By doing so, a more complete process can be accomplished with less risk of contamination from spent fluid.
• the centrifugal processor includes a rotor offset from the centerline of the bowl.
• the offset provides an area of lower fluid velocities.
• the centrifugal processor includes drain openings in the form of staggered slots.
• the slots quickly remove spent fluid from the bowl and inhibit any re-entraining of the fluid into the air flow within the bowl.
• the slots of the second separate aspect include peripheries which are not perpendicular to the flow. With such a configuration, fluid droplets accumulate and more readily fall out of the bowl.
• any one or more of the foregoing separate aspects are contemplated to be combined to enhance removal of fluid droplets.
• an object of the present invention is to provide an improved centrifugal processor, which more effectively removes used fluid from the bowl, thereby reducing the potential for recontamination of the silicon wafers or other flat media.
• Fig. 1 is a perspective view of the centrifugal processor of the invention
• Fig. 2 is a perspective view of a bowl of a prior art machine
• Fig. 3. is a perspective view of the bowl of the present centrifugal processor shown in Fig. 1;
• Fig. 4 is a front elevation view of the bowl and rotor of the centrifugal processor shown in Fig. 1 ;
• Fig. 5 is a section view taken along line 5-5 of Fig. 4;
• Fig. 6 is a perspective view of a bowl according to a second embodiment of the invention.
• Fig. 7 is a section view taken along line 7-7 of Fig. 6;
• Fig. 8 is an enlarged detail of the openings shown in Figs. 6 and 7;
• Fig. 9 is a perspective view of a comb rotor having combs for directly holding wafers or other flat media.
• Fig. 10 is a perspective view of a cassette holding wafers, with the cassette placeable into the rotor shown in Figs. 3 and 6.
• the present centrifugal processor 10 has a cylindrical bowl 14 mounted within a housing 12.
• a cylindrical cassette rotor 18 is rotatably mounted within the bowl 14.
• the back end of the rotor 18 is connected to a drive motor 16, which spins the rotor within the bowl 14.
• the workpieces 22 are held within the rotor 18, in a wafer cassette 24, as shown in Fig. 10, placed within the rotor 18.
• a comb rotor 17, having combs 19 for directly holding the wafers 22, as shown in Fig. 9, may be used.
• the techniques for holding wafers in the combs, or for holding the wafer cassette, in a rotor, as shown in Figs. 9 and 10, are well known in the art.
• the workpieces 22 may be semiconductor wafers, metal or glass disks, flat panels, lenses, or other flat media.
• One or more fluid spray manifolds such as manifolds 20 and 26 are positioned near the top of the bowl 14.
• the wafers 22 or cassette 24 are loaded into the rotor 18 via a swing out door 30.
• the manifolds may spray out liquid such as water, solvents, or acids, or gases, such as nitrogen.
• an ionizer 28 may also be provided.
• the rotor horizontal centerline or spin axis 52 is offset above and to one side of the bowl centerline 50. As shown in Fig. 4, the rotor spin axis is diagonally displaced from the bowl centerline 50, by a distance D, and at an angle ⁇ from vertical.
• D is preferably about 1.3 cm and ⁇ is about 45°.
• E between the vertical centerline 56 of the rotor, and the vertical centerline 54 of the bowl 14 is about 0.9 cm.
• drain openings 41 are provided in a cluster 40 near the bottom of the bowl 14.
• the openings 41 pass through the cylindrical sidewall of the bowl 14.
• the openings 41 are arranged in a first row 42 staggered or offset from a second row 44.
• the rotor 18 spins counter-clockwise in Figs. 1, 3 and 4.
• the cluster 40 of drain openings 41 is located at or between the 5 o'clock (30° counter-clockwise up from bottom center) and 6 o'clock (bottom center) positions.
• the motor 16 spins the rotor 18. As shown in Fig. 4, the rotor 16 is offset in a direction away from the openings 41.
• This offset position helps to avoid low pressure over the openings 41, which reduces the tendency of the spinning rotor to draw fluid droplets up and away from the openings 41.
• the drainage route out of the bowl 14 is made up of individual openings 41, in contrast to the continuous drain channel used in prior designs, spent fluid drains more quickly from the bowl 14.
• the combination of the offset rotor and openings 41 also allows spent fluid droplets which fall to the bottom of the bowl to exit the bowl under gravity via the openings, rather than splashing back onto and contaminating the wafers or workpieces.
• a drainage channel under the openings 41 similar to the channel shown in Fig. 2, catches the droplets and carries them to a drain.
• Figs. 6 and 8 show an alternative embodiment having a bowl 60 including alternating pairs of aligned drainage holes 62.
• the drainage holes are elliptical or oval-shaped.
• the major axis of each hole extends at an angle of about 30° to the major axes of the adjacent holes in the adjacent row.
• fluid droplets clinging to an edge of an opening 62 move toward the down wind (right side in Fig. 6) of the openings 62, and collect at the down wind radius of the hole.
• the force of gravity surpasses the surface tension adhesion forces and aerodynamic forces.
• the droplet then falls through the opening, to a collection pipe or channel on the outside of the bowl 14.
• angles and dimensions S; T; U; V; W; and X are 15°; 29; 44; 22; and 57mm respectively, with the other dimensions shown proportionally to scale.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Cleaning Or Drying Semiconductors (AREA)
• Drying Of Solid Materials (AREA)
• Centrifugal Separators (AREA)
• Cleaning By Liquid Or Steam (AREA)
• Weting (AREA)
• Hydraulic Motors (AREA)
• Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
• Rotary Pumps (AREA)
• Separation Of Solids By Using Liquids Or Pneumatic Power (AREA)
• Holding Or Fastening Of Disk On Rotational Shaft (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

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ID=22318945

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Cited By (1)

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Citations (8)

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• 1998
  • 1998-06-30 US US09/107,878 patent/US6125863A/en not_active Expired - Lifetime
• 1999
  • 1999-06-21 JP JP2000556884A patent/JP2002519856A/ja active Pending
  • 1999-06-21 WO PCT/US1999/013984 patent/WO2000000301A1/en not_active Ceased
  • 1999-06-21 AT AT99930500T patent/ATE359132T1/de active
  • 1999-06-21 EP EP99930500A patent/EP1115511B1/en not_active Expired - Lifetime
  • 1999-06-21 DE DE69935795T patent/DE69935795T2/de not_active Expired - Lifetime

Patent Citations (9)

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