JP2002076057A5 - - Google Patents

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Publication number
JP2002076057A5
JP2002076057A5 JP2000262511A JP2000262511A JP2002076057A5 JP 2002076057 A5 JP2002076057 A5 JP 2002076057A5 JP 2000262511 A JP2000262511 A JP 2000262511A JP 2000262511 A JP2000262511 A JP 2000262511A JP 2002076057 A5 JP2002076057 A5 JP 2002076057A5
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JP
Japan
Prior art keywords
main surface
semiconductor chip
electronic device
wiring board
protruding electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000262511A
Other languages
English (en)
Japanese (ja)
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JP3822040B2 (ja
JP2002076057A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2000262511A external-priority patent/JP3822040B2/ja
Priority to JP2000262511A priority Critical patent/JP3822040B2/ja
Priority to US09/921,919 priority patent/US6492737B1/en
Priority to TW090119334A priority patent/TW563214B/zh
Priority to SG200104737A priority patent/SG99937A1/en
Priority to KR1020010053225A priority patent/KR100776867B1/ko
Priority to CNB011253703A priority patent/CN1235286C/zh
Publication of JP2002076057A publication Critical patent/JP2002076057A/ja
Priority to US10/279,865 priority patent/US20030102570A1/en
Publication of JP2002076057A5 publication Critical patent/JP2002076057A5/ja
Publication of JP3822040B2 publication Critical patent/JP3822040B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000262511A 2000-08-31 2000-08-31 電子装置及びその製造方法 Expired - Fee Related JP3822040B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2000262511A JP3822040B2 (ja) 2000-08-31 2000-08-31 電子装置及びその製造方法
US09/921,919 US6492737B1 (en) 2000-08-31 2001-08-06 Electronic device and a method of manufacturing the same
TW090119334A TW563214B (en) 2000-08-31 2001-08-08 An electronic device and a method of manufacturing the same
SG200104737A SG99937A1 (en) 2000-08-31 2001-08-08 An electronic device and a method of manufacturing the same
KR1020010053225A KR100776867B1 (ko) 2000-08-31 2001-08-31 전자 장치 및 그 제조 방법
CNB011253703A CN1235286C (zh) 2000-08-31 2001-08-31 一种电子装置与制作此装置的方法
US10/279,865 US20030102570A1 (en) 2000-08-31 2002-10-25 Electronic device and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000262511A JP3822040B2 (ja) 2000-08-31 2000-08-31 電子装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2002076057A JP2002076057A (ja) 2002-03-15
JP2002076057A5 true JP2002076057A5 (US20100223739A1-20100909-C00025.png) 2005-02-24
JP3822040B2 JP3822040B2 (ja) 2006-09-13

Family

ID=18750182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000262511A Expired - Fee Related JP3822040B2 (ja) 2000-08-31 2000-08-31 電子装置及びその製造方法

Country Status (6)

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US (2) US6492737B1 (US20100223739A1-20100909-C00025.png)
JP (1) JP3822040B2 (US20100223739A1-20100909-C00025.png)
KR (1) KR100776867B1 (US20100223739A1-20100909-C00025.png)
CN (1) CN1235286C (US20100223739A1-20100909-C00025.png)
SG (1) SG99937A1 (US20100223739A1-20100909-C00025.png)
TW (1) TW563214B (US20100223739A1-20100909-C00025.png)

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US7638861B2 (en) * 2005-12-08 2009-12-29 Fairchild Semiconductor Corporation Flip chip MLP with conductive ink
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JP6067408B2 (ja) * 2013-02-20 2017-01-25 スタンレー電気株式会社 フリップチップ型半導体発光素子、半導体装置及びその製造方法
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JP6167375B2 (ja) * 2013-12-19 2017-07-26 インテル・コーポレーション 集積回路ダイデバイス、柔軟性を伴って包まれた集積回路ダイデバイス、及び、柔軟性を伴って包まれた集積回路ダイを基板に実装する方法
KR102199991B1 (ko) 2014-05-28 2021-01-11 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛
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