IL135139A0 - Stage apparatus, scanning type exposure apparatus, and device produced with the same - Google Patents

Stage apparatus, scanning type exposure apparatus, and device produced with the same

Info

Publication number
IL135139A0
IL135139A0 IL13513998A IL13513998A IL135139A0 IL 135139 A0 IL135139 A0 IL 135139A0 IL 13513998 A IL13513998 A IL 13513998A IL 13513998 A IL13513998 A IL 13513998A IL 135139 A0 IL135139 A0 IL 135139A0
Authority
IL
Israel
Prior art keywords
same
scanning type
device produced
type exposure
exposure apparatus
Prior art date
Application number
IL13513998A
Other languages
English (en)
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of IL135139A0 publication Critical patent/IL135139A0/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
IL13513998A 1997-09-19 1998-09-18 Stage apparatus, scanning type exposure apparatus, and device produced with the same IL135139A0 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP27342097 1997-09-19
JP27950097 1997-09-26
JP29324997 1997-10-10
JP22650098 1998-07-27
PCT/JP1998/004223 WO1999016113A1 (fr) 1997-09-19 1998-09-18 Platine, dispositif d'alignement de balayage et procede d'exposition de balayage, et dispositif fabrique par ce moyen

Publications (1)

Publication Number Publication Date
IL135139A0 true IL135139A0 (en) 2001-05-20

Family

ID=27477216

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13513998A IL135139A0 (en) 1997-09-19 1998-09-18 Stage apparatus, scanning type exposure apparatus, and device produced with the same

Country Status (7)

Country Link
US (3) US6331885B1 (xx)
EP (1) EP1028456A4 (xx)
KR (1) KR100521704B1 (xx)
AU (1) AU9095798A (xx)
IL (1) IL135139A0 (xx)
TW (1) TW408364B (xx)
WO (1) WO1999016113A1 (xx)

Families Citing this family (123)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6603562B1 (en) * 1999-10-29 2003-08-05 Yokogawa Electric Corporation Two-dimensional positioning apparatus and method for measuring laser light from the apparatus
US6718227B1 (en) * 1999-12-16 2004-04-06 Texas Instruments Incorporated System and method for determining a position error in a wafer handling device
TWI231405B (en) * 1999-12-22 2005-04-21 Asml Netherlands Bv Lithographic projection apparatus, position detection device, and method of manufacturing a device using a lithographic projection apparatus
TW522287B (en) * 2000-01-14 2003-03-01 Asml Netherlands Bv Lithographic projection apparatus, method of calibrating a lithographic projection apparatus, method of manufacturing a device using a lithographic projection apparatus, and device manufactured thereby
US6622111B1 (en) * 2000-03-08 2003-09-16 Advanced Micro Devices, Inc. Wafer rotation in semiconductor processing
US6625556B1 (en) * 2000-03-08 2003-09-23 Advanced Micro Devices, Inc. Wafer rotation randomization for process defect detection in semiconductor fabrication
CN1223258C (zh) * 2000-03-28 2005-10-12 西门子公司 在基板插装机中检查电气元件的方法和装置
JP2002025886A (ja) * 2000-07-03 2002-01-25 Canon Inc ステップ＆スキャン式投影露光装置、その保守方法並びに同装置を用いた半導体デバイス製造方法および半導体製造工場
US7136159B2 (en) * 2000-09-12 2006-11-14 Kla-Tencor Technologies Corporation Excimer laser inspection system
US6668099B1 (en) * 2000-10-26 2003-12-23 General Phosphorix Llc Method of measuring an angle of inclination of trapezoidal micro object side faces
EP1271605A4 (en) * 2000-11-02 2009-09-02 Ebara Corp ELECTRON BEAM APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE COMPRISING SAID APPARATUS
US6807332B1 (en) * 2000-11-06 2004-10-19 Western Digital (Fremont), Inc. Piezoelectric actuated optical switch
JP2002217084A (ja) * 2001-01-15 2002-08-02 Semiconductor Leading Edge Technologies Inc ウェハ周辺露光装置およびウェハ周辺露光方法
JP4174972B2 (ja) * 2001-02-09 2008-11-05 三菱電機株式会社 位置決め制御方法
US6558883B2 (en) * 2001-03-08 2003-05-06 Infineon Technologies Ag Apparatus and method for patterning a semiconductor wafer
JP2002333721A (ja) * 2001-05-10 2002-11-22 Adtec Engineeng Co Ltd 露光装置
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
JP2003022962A (ja) * 2001-07-10 2003-01-24 Canon Inc 露光システム、デバイス製造方法、半導体製造工場および露光装置の保守方法
EP1280008B2 (en) * 2001-07-27 2011-09-14 Canon Kabushiki Kaisha Illumination system, projection exposure apparatus and device manufacturing method
KR100816340B1 (ko) * 2001-08-27 2008-03-24 삼성전자주식회사 액정 표시 장치 제조용 노광 마스크와 이를 이용한 액정표시 장치 제조에서의 기판의 노광 방법
JP2003086492A (ja) * 2001-09-12 2003-03-20 Canon Inc 露光装置及びその制御方法並びにデバイスの製造方法
US7034296B2 (en) * 2001-11-21 2006-04-25 Hitachi High-Technologies Corporation Method of forming a sample image and charged particle beam apparatus
US7361894B2 (en) * 2002-10-22 2008-04-22 Hitachi High-Technologies Corporation Method of forming a sample image and charged particle beam apparatus
JP4011919B2 (ja) * 2002-01-16 2007-11-21 キヤノン株式会社 移動装置及び露光装置並びに半導体デバイスの製造方法
US7089672B2 (en) * 2002-02-08 2006-08-15 Robert Bosch Gmbh Optical angle and torque sensor
JP3967935B2 (ja) * 2002-02-25 2007-08-29 株式会社日立製作所 合わせ精度計測装置及びその方法
US6677167B2 (en) * 2002-03-04 2004-01-13 Hitachi High-Technologies Corporation Wafer processing apparatus and a wafer stage and a wafer processing method
US20030183337A1 (en) * 2002-03-28 2003-10-02 James Fordemwalt Apparatus and method for use of optical diagnostic system with a plasma processing system
KR101013347B1 (ko) * 2002-04-09 2011-02-10 가부시키가이샤 니콘 노광방법, 노광장치, 및 디바이스 제조방법
KR100461024B1 (ko) 2002-04-15 2004-12-13 주식회사 이오테크닉스 칩 스케일 마커 및 마킹 방법
JP2004072076A (ja) * 2002-06-10 2004-03-04 Nikon Corp 露光装置及びステージ装置、並びにデバイス製造方法
KR100855038B1 (ko) * 2002-06-28 2008-08-29 매그나칩 반도체 유한회사 미세패턴 형성을 위한 노광장치
EP1396757A3 (en) * 2002-09-06 2008-12-17 ASML Holding N.V. Reticle focus measurement system and method using multiple interferometric beams
US6934005B2 (en) * 2002-09-06 2005-08-23 Asml Holding N.V. Reticle focus measurement method using multiple interferometric beams
US6744058B1 (en) * 2002-12-20 2004-06-01 Taiwan Semiconductor Manufacturing Co., Ltd Geometric compensation method for charged particle beam irradiation
US20040119436A1 (en) * 2002-12-23 2004-06-24 Michael Binnard Method and apparatus for reducing countermass stroke with initial velocity
JP3785141B2 (ja) * 2002-12-27 2006-06-14 株式会社東芝 荷電粒子ビーム描画装置の縮小率測定方法、荷電粒子ビーム描画装置のステージ位相測定方法、荷電粒子ビーム描画装置の制御方法、及び荷電粒子ビーム描画装置
KR100575230B1 (ko) * 2002-12-28 2006-05-02 엘지.필립스 엘시디 주식회사 노광 장치를 이용한 노광 방법
US6765734B1 (en) * 2003-03-14 2004-07-20 Hinds Instruments, Inc. Adjustable sample holder for optical equipment
EP1457834A3 (en) * 2003-03-14 2008-10-29 Canon Kabushiki Kaisha Positioning apparatus, exposure apparatus and method for producing device
EP1616220B1 (en) 2003-04-11 2013-05-01 Nikon Corporation Apparatus and method for maintaining immersion fluid under a lithographic projection lens
TW201415536A (zh) * 2003-05-23 2014-04-16 尼康股份有限公司 曝光方法及曝光裝置以及元件製造方法
US7060990B2 (en) * 2003-06-16 2006-06-13 Sumitomo Heavy Industries, Ltd. Stage base, substrate processing apparatus, and maintenance method for stage
TWI457981B (zh) 2003-06-19 2014-10-21 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
ATE502323T1 (de) * 2003-07-30 2011-04-15 Zeiss Carl Smt Gmbh Beleuchtungssystem für die mikrolithographie
DE10335321A1 (de) * 2003-08-01 2005-03-03 Siemens Ag Betriebsverfahren für eine medizintechnische Anlage, insbesondere eine Röntgenanlage
KR101441844B1 (ko) * 2003-08-21 2014-09-17 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US7102729B2 (en) * 2004-02-03 2006-09-05 Asml Netherlands B.V. Lithographic apparatus, measurement system, and device manufacturing method
US20050275944A1 (en) 2004-06-11 2005-12-15 Wang Jian J Optical films and methods of making the same
US7670758B2 (en) * 2004-04-15 2010-03-02 Api Nanofabrication And Research Corporation Optical films and methods of making the same
US8289384B2 (en) * 2004-06-07 2012-10-16 Nuflare Technology, Inc. Electron beam displacement measuring method, electron beam displacement measuring device, and electron beam recording apparatus
US20060001969A1 (en) * 2004-07-02 2006-01-05 Nanoopto Corporation Gratings, related optical devices and systems, and methods of making such gratings
KR100712115B1 (ko) * 2004-09-21 2007-04-27 삼성에스디아이 주식회사 레이저 조사 장치 및 그를 이용한 유기 전계 발광 소자의제조 방법
JP4041109B2 (ja) * 2004-09-27 2008-01-30 株式会社東芝 荷電粒子ビーム処理装置
US7388663B2 (en) * 2004-10-28 2008-06-17 Asml Netherlands B.V. Optical position assessment apparatus and method
US7411657B2 (en) 2004-11-17 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7436524B2 (en) * 2004-11-26 2008-10-14 Olympus Corporation Apparatus and method for three-dimensional measurement and program for allowing computer to execute method for three-dimensional measurement
US7619816B2 (en) * 2004-12-15 2009-11-17 Api Nanofabrication And Research Corp. Structures for polarization and beam control
US20060127830A1 (en) * 2004-12-15 2006-06-15 Xuegong Deng Structures for polarization and beam control
KR101193432B1 (ko) * 2005-01-24 2012-10-24 가부시키가이샤 니콘 계측 방법, 계측 시스템, 검사 방법, 검사 시스템, 노광방법 및 노광 시스템
US9280069B2 (en) * 2005-03-29 2016-03-08 Nikon Corporation Exposure apparatus, producing method of exposure apparatus, and producing method of microdevice
US8693006B2 (en) 2005-06-28 2014-04-08 Nikon Corporation Reflector, optical element, interferometer system, stage device, exposure apparatus, and device fabricating method
US7679029B2 (en) * 2005-10-28 2010-03-16 Cymer, Inc. Systems and methods to shape laser light as a line beam for interaction with a substrate having surface variations
US20070139771A1 (en) * 2005-12-15 2007-06-21 Jian Wang Optical retarders and methods of making the same
US20070165308A1 (en) * 2005-12-15 2007-07-19 Jian Wang Optical retarders and methods of making the same
JP4801996B2 (ja) * 2006-01-05 2011-10-26 株式会社ニューフレアテクノロジー 試料移動機構及び荷電粒子ビーム描画装置
TWI393171B (zh) * 2006-01-19 2013-04-11 尼康股份有限公司 A moving body driving method and a moving body driving system, a pattern forming method and a pattern forming apparatus, an exposure method and an exposure apparatus, and an element manufacturing method
TWI292031B (en) * 2006-02-10 2008-01-01 Ind Tech Res Inst Dimension measuring method and optical measuring system implemented with the method
US20070217008A1 (en) * 2006-03-17 2007-09-20 Wang Jian J Polarizer films and methods of making the same
KR101444632B1 (ko) * 2006-09-01 2014-09-26 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 디바이스 제조 방법, 그리고 캘리브레이션 방법
US7834980B2 (en) * 2006-12-21 2010-11-16 Asml Netherlands B. V. Lithographic apparatus and method
US7746465B2 (en) * 2007-01-18 2010-06-29 Hinds Instruments, Inc. Sample holder for an optical element
TWI407244B (zh) * 2007-08-03 2013-09-01 Hon Hai Prec Ind Co Ltd Ｘ射線成像設備
EP2026373B1 (de) * 2007-08-07 2010-02-17 Micronas GmbH Positioniereinrichtung zum Positionieren einer Blende in einem lonenstrahl
KR100853801B1 (ko) * 2007-08-23 2008-08-25 주식회사 동부하이텍 반도체 소자의 마스크 및 그를 이용한 패터닝 방법
KR20090062027A (ko) * 2007-12-12 2009-06-17 삼성전기주식회사 3차원자세측정장치 및 이를 이용한 3차원자세측정방법
JP2009236819A (ja) * 2008-03-28 2009-10-15 Topcon Corp 光学装置、フォトマスク検査装置および露光装置
DE102008048660B4 (de) * 2008-09-22 2015-06-18 Carl Zeiss Sms Gmbh Verfahren und Vorrichtung zur Vermessung von Strukturen auf Photolithographiemasken
US8120304B2 (en) * 2008-12-12 2012-02-21 Formfactor, Inc. Method for improving motion times of a stage
JP5369720B2 (ja) * 2009-01-29 2013-12-18 三洋電機株式会社 観察装置、観察システム、制御装置、および制御プログラム
US8422026B2 (en) * 2009-06-15 2013-04-16 Artur G. Olszak Spectrally controllable light sources in interferometry
US8488109B2 (en) * 2009-08-25 2013-07-16 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
JP4939583B2 (ja) * 2009-09-09 2012-05-30 日東電工株式会社 回路付きサスペンション基板集合体シートおよびその製造方法
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
JP5294489B2 (ja) * 2009-12-14 2013-09-18 株式会社ブイ・テクノロジー 露光方法及び露光装置
US8488106B2 (en) * 2009-12-28 2013-07-16 Nikon Corporation Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
CN103081128B (zh) 2010-06-18 2016-11-02 西奥尼克斯公司 高速光敏设备及相关方法
JPWO2012081234A1 (ja) 2010-12-14 2014-05-22 株式会社ニコン 露光方法及び露光装置、並びにデバイス製造方法
US8575791B2 (en) * 2010-12-17 2013-11-05 National Formosa University Manufacturing-process equipment
EP2691733B1 (en) 2011-03-30 2020-06-24 ASML Netherlands B.V. Interferometer module
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
EP2732402A2 (en) 2011-07-13 2014-05-21 Sionyx, Inc. Biometric imaging devices and associated methods
JP2013042114A (ja) * 2011-07-19 2013-02-28 Canon Inc 描画装置、及び、物品の製造方法
NL2009197A (en) * 2011-08-25 2013-02-27 Asml Netherlands Bv System for detection motion, lithographic apparatus and device manufacturing method.
US20150176973A1 (en) * 2011-12-09 2015-06-25 Kla-Tencor Corporation A dual interferometer system with a short reference flat distance for wafer shape and thickness variation measurement
JP5971965B2 (ja) * 2012-02-07 2016-08-17 キヤノン株式会社 面形状計測方法、面形状計測装置、プログラム、および、光学素子の製造方法
CN103246170B (zh) * 2012-02-09 2015-07-08 中芯国际集成电路制造(上海)有限公司 曝光装置及曝光方法
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
TWI624862B (zh) * 2012-06-11 2018-05-21 應用材料股份有限公司 在脈衝式雷射退火中使用紅外線干涉技術之熔化深度測定
DE102012210071A1 (de) * 2012-06-15 2013-12-19 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage sowie Verfahren zum Steuern einer Projektionsbelichtungsanlage
US20140154891A1 (en) * 2012-08-22 2014-06-05 Sionyx, Inc. Beam Delivery Systems for Laser Processing Materials and Associated Methods
US9551563B2 (en) 2012-09-27 2017-01-24 Mapper Lithography Ip B.V. Multi-axis differential interferometer
JP6466346B2 (ja) 2013-02-15 2019-02-06 サイオニクス、エルエルシー アンチブルーミング特性を有するハイダイナミックレンジｃｍｏｓ画像センサおよび関連づけられた方法
KR20140114500A (ko) 2013-03-14 2014-09-29 삼성전자주식회사 스테이지 장치 및 이의 구동 방법
WO2014151093A1 (en) 2013-03-15 2014-09-25 Sionyx, Inc. Three dimensional imaging utilizing stacked imager devices and associated methods
US9209345B2 (en) 2013-06-29 2015-12-08 Sionyx, Inc. Shallow trench textured regions and associated methods
US10732372B2 (en) * 2015-04-24 2020-08-04 Commscope, Inc. Of North Carolina Shelf for communications rack or cabinet
JP6233538B2 (ja) * 2016-03-23 2017-11-22 旭硝子株式会社 マスクブランク用基板およびマスクブランク
CA3055249A1 (en) * 2017-03-03 2018-09-07 Apton Biosystems, Inc. High speed scanning system with acceleration tracking
WO2019044489A1 (ja) 2017-08-28 2019-03-07 キヤノン株式会社 駆動装置および撮像装置の制御方法
US10600614B2 (en) * 2017-09-29 2020-03-24 Hitachi High-Technologies Corporation Stage device and charged particle beam device
CN111971622A (zh) * 2018-03-29 2020-11-20 Asml荷兰有限公司 位置测量系统、干涉仪系统和光刻装置
JP7134790B2 (ja) * 2018-08-28 2022-09-12 キオクシア株式会社 インプリント装置、インプリント方法、および半導体装置の製造方法
KR20220143743A (ko) 2020-02-21 2022-10-25 온투 이노베이션 아이엔씨. 리소그래피 공정에서 오버레이 오류를 보정하기 위한 시스템 및 방법
US11226194B1 (en) 2020-06-25 2022-01-18 International Business Machines Corporation Apparatus and method for measuring distance between fiducial features, such as magnetic transducers, to an accuracy of within one nanometer
KR20220044016A (ko) 2020-09-29 2022-04-06 삼성전자주식회사 극자외선(euv) 포토마스크 및 이를 이용한 반도체 장치 제조 방법
TW202217929A (zh) * 2020-10-09 2022-05-01 日商東京威力科創股份有限公司 基板處理方法、基板處理裝置及記錄媒體
US11556065B2 (en) * 2021-04-29 2023-01-17 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer stage and method thereof
KR102590798B1 (ko) * 2023-04-05 2023-10-19 한국기계연구원 리소그래피 장치 및 방법

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60123716A (ja) * 1983-12-08 1985-07-02 Toshiba Corp Ｘｙステ−ジのｘｙ交差角測定方法及びその測定装置
US4780617A (en) 1984-08-09 1988-10-25 Nippon Kogaku K.K. Method for successive alignment of chip patterns on a substrate
JPS6145988A (ja) * 1984-08-09 1986-03-06 キヤノン株式会社 防振構造
JPS62108185A (ja) 1985-11-06 1987-05-19 大日本スクリ−ン製造株式会社 移動テ−ブル装置
JPS62150106A (ja) 1985-12-25 1987-07-04 Nippon Kogaku Kk <Nikon> 位置検出装置
JPS6347926A (ja) 1986-08-18 1988-02-29 Hitachi Ltd 半導体露光方法
US5307207A (en) 1988-03-16 1994-04-26 Nikon Corporation Illuminating optical apparatus
US4924257A (en) 1988-10-05 1990-05-08 Kantilal Jain Scan and repeat high resolution projection lithography system
DE69009841T2 (de) 1989-04-17 1994-12-22 Sharp Kk Linearantriebsgerät.
US5151749A (en) * 1989-06-08 1992-09-29 Nikon Corporation Method of and apparatus for measuring coordinate position and positioning an object
US5220454A (en) 1990-03-30 1993-06-15 Nikon Corporation Cata-dioptric reduction projection optical system
US5473410A (en) 1990-11-28 1995-12-05 Nikon Corporation Projection exposure apparatus
JP2691319B2 (ja) 1990-11-28 1997-12-17 株式会社ニコン 投影露光装置および走査露光方法
JP2830492B2 (ja) 1991-03-06 1998-12-02 株式会社ニコン 投影露光装置及び投影露光方法
NL9100407A (nl) * 1991-03-07 1992-10-01 Philips Nv Optisch lithografische inrichting met een krachtgecompenseerd machinegestel.
US5506684A (en) 1991-04-04 1996-04-09 Nikon Corporation Projection scanning exposure apparatus with synchronous mask/wafer alignment system
JP3084773B2 (ja) 1991-04-04 2000-09-04 株式会社ニコン 走査露光装置
US5227839A (en) * 1991-06-24 1993-07-13 Etec Systems, Inc. Small field scanner
JPH0540184A (ja) 1991-08-07 1993-02-19 Nikon Corp ステージ位置検出装置
US5504407A (en) 1992-02-21 1996-04-02 Canon Kabushiki Kaisha Stage driving system
JP3412704B2 (ja) 1993-02-26 2003-06-03 株式会社ニコン 投影露光方法及び装置、並びに露光装置
JP3747951B2 (ja) 1994-11-07 2006-02-22 株式会社ニコン 反射屈折光学系
JP3285105B2 (ja) * 1993-04-02 2002-05-27 株式会社ニコン ステージ駆動方法、及び走査露光方法
US5464715A (en) * 1993-04-02 1995-11-07 Nikon Corporation Method of driving mask stage and method of mask alignment
US5534970A (en) 1993-06-11 1996-07-09 Nikon Corporation Scanning exposure apparatus
JP3401769B2 (ja) 1993-12-28 2003-04-28 株式会社ニコン 露光方法、ステージ装置、及び露光装置
US5715064A (en) 1994-06-17 1998-02-03 International Business Machines Corporation Step and repeat apparatus having enhanced accuracy and increased throughput
JP3800616B2 (ja) * 1994-06-27 2006-07-26 株式会社ニコン 目標物移動装置、位置決め装置及び可動ステージ装置
US6246204B1 (en) 1994-06-27 2001-06-12 Nikon Corporation Electromagnetic alignment and scanning apparatus
JP3893626B2 (ja) 1995-01-25 2007-03-14 株式会社ニコン 投影光学装置の調整方法、投影光学装置、露光装置及び露光方法
US5677758A (en) 1995-02-09 1997-10-14 Mrs Technology, Inc. Lithography System using dual substrate stages
JPH08241845A (ja) * 1995-03-06 1996-09-17 Nikon Corp 投影露光方法
EP0772800B1 (en) 1995-05-30 2000-05-10 Asm Lithography B.V. Lithographic device with a three-dimensionally positionable mask holder
JP3629772B2 (ja) * 1995-09-05 2005-03-16 株式会社ニコン 除振装置、ステージ装置、露光装置及び走査型露光装置
JPH09120224A (ja) * 1995-10-25 1997-05-06 Ricoh Co Ltd 定着装置
JPH09190224A (ja) * 1996-01-08 1997-07-22 Canon Inc Ｘｙステージ制御装置
DE69610691T2 (de) * 1996-01-08 2001-05-03 Canon Kk Belichtungsverfahren und Belichtungsvorrichtung
JPH09251955A (ja) * 1996-01-08 1997-09-22 Canon Inc 露光方法および装置、ならびにデバイス製造方法
JPH09320933A (ja) * 1996-05-28 1997-12-12 Nikon Corp 走査型露光装置
JP3659529B2 (ja) 1996-06-06 2005-06-15 キヤノン株式会社 露光装置およびデバイス製造方法
JPH10116779A (ja) * 1996-10-11 1998-05-06 Nikon Corp ステージ装置
DE69738910D1 (de) 1996-11-28 2008-09-25 Nikon Corp Ausrichtvorrichtung und belichtungsverfahren
US5815246A (en) 1996-12-24 1998-09-29 U.S. Philips Corporation Two-dimensionally balanced positioning device, and lithographic device provided with such a positioning device
EP1197801B1 (en) 1996-12-24 2005-12-28 ASML Netherlands B.V. Lithographic device with two object holders
WO1998040791A1 (en) 1997-03-10 1998-09-17 Koninklijke Philips Electronics N.V. Positioning device having two object holders
US6028376A (en) 1997-04-22 2000-02-22 Canon Kabushiki Kaisha Positioning apparatus and exposure apparatus using the same
US5959427A (en) 1998-03-04 1999-09-28 Nikon Corporation Method and apparatus for compensating for reaction forces in a stage assembly

Also Published As

Publication number Publication date
US6906782B2 (en) 2005-06-14
TW408364B (en) 2000-10-11
WO1999016113A1 (fr) 1999-04-01
EP1028456A1 (en) 2000-08-16
US20030128348A1 (en) 2003-07-10
AU9095798A (en) 1999-04-12
US6331885B1 (en) 2001-12-18
KR100521704B1 (ko) 2005-10-14
KR20010024070A (ko) 2001-03-26
US20020018192A1 (en) 2002-02-14
EP1028456A4 (en) 2003-03-05

Similar Documents

Publication Publication Date Title
IL135139A0 (en) Stage apparatus, scanning type exposure apparatus, and device produced with the same
EP0685987A3 (en) Apparatus and method for electric heating.
ZA976374B (en) Exercise methods and apparatus.
ZA976375B (en) Exercise methods and apparatus.
EP0677732A3 (en) Photometric measurement device.
EP0837162A4 (en) MULTI-FILAMENT CLAVED THREAD TAPE, METHOD AND DEVICE FOR MANUFACTURING THE SAME
ZA986072B (en) Adsorption apparatus and methods.
GB2328280B (en) Scanning apparatus and methods
ZA977130B (en) Method and apparatus.
AU2746799A (en) Scanning exposure method, scanning exposure apparatus and its manufacturing method, and device and its manufacturing method
EP0756206A3 (en) Scanning exposure apparatus and exposure method using the same
EP0685968A3 (en) Frame frequency converter device.
AU1682899A (en) Stage device and exposure apparatus
EP0665629A3 (en) Power control device and image forming apparatus using the same.
DE69623698T2 (de) Druckapparat und diesen verwendenden Faksimileapparat
EP0785472A3 (en) Scan type projection exposure apparatus and device manufacturing method using the same
HK1002085A1 (en) Portable scanner.
GB9618923D0 (en) Scanning device
EP0670656A3 (en) Image sensor.
GB2289885B (en) Scanning device
ZA972687B (en) Finger-protective device.
HK1017473A1 (en) Connection device.
GB2299726B (en) Diffusers for film scanners and the like
KR0185798B1 (en) Illumination device and exposure method using the same
AU1261699A (en) Substrate retaining apparatus and exposure apparatus using the same