AU1261699A - Substrate retaining apparatus and exposure apparatus using the same - Google Patents

Substrate retaining apparatus and exposure apparatus using the same

Info

Publication number
AU1261699A
AU1261699A AU12616/99A AU1261699A AU1261699A AU 1261699 A AU1261699 A AU 1261699A AU 12616/99 A AU12616/99 A AU 12616/99A AU 1261699 A AU1261699 A AU 1261699A AU 1261699 A AU1261699 A AU 1261699A
Authority
AU
Australia
Prior art keywords
same
substrate retaining
exposure apparatus
exposure
retaining apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU12616/99A
Inventor
Hiroaki Narushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU1261699A publication Critical patent/AU1261699A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AU12616/99A 1997-11-28 1998-11-27 Substrate retaining apparatus and exposure apparatus using the same Abandoned AU1261699A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP9-341959 1997-11-28
JP34195997 1997-11-28
JP15556698 1998-06-04
JP10-155566 1998-06-04
PCT/JP1998/005349 WO1999028957A1 (en) 1997-11-28 1998-11-27 Substrate retaining apparatus and exposure apparatus using the same

Publications (1)

Publication Number Publication Date
AU1261699A true AU1261699A (en) 1999-06-16

Family

ID=26483530

Family Applications (1)

Application Number Title Priority Date Filing Date
AU12616/99A Abandoned AU1261699A (en) 1997-11-28 1998-11-27 Substrate retaining apparatus and exposure apparatus using the same

Country Status (2)

Country Link
AU (1) AU1261699A (en)
WO (1) WO1999028957A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4544706B2 (en) * 2000-06-29 2010-09-15 京セラ株式会社 Board holder
JP4039036B2 (en) * 2001-11-06 2008-01-30 日立金属株式会社 Alignment mark manufacturing method
EP1475666A1 (en) * 2003-05-06 2004-11-10 ASML Netherlands B.V. Substrate holder for lithographic apparatus
EP1530089B1 (en) * 2003-11-05 2011-04-06 ASML Netherlands B.V. Lithographic apparatus and method for clamping an article
US7061579B2 (en) * 2003-11-13 2006-06-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4537087B2 (en) * 2004-02-12 2010-09-01 キヤノン株式会社 Exposure apparatus and device manufacturing method
US7978308B2 (en) * 2006-05-15 2011-07-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN109686695A (en) * 2018-12-25 2019-04-26 上海致领半导体科技发展有限公司 A kind of marker recognition device and method of silicon wafer bearing disk

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2638649B2 (en) * 1989-12-22 1997-08-06 東京エレクトロン株式会社 Electrostatic chuck
JP2748181B2 (en) * 1990-07-26 1998-05-06 キヤノン株式会社 Wafer chuck
JPH04360512A (en) * 1991-06-07 1992-12-14 Canon Inc Manufacture of wafer chuck
JP3258042B2 (en) * 1991-08-21 2002-02-18 キヤノン株式会社 Wafer chuck

Also Published As

Publication number Publication date
WO1999028957A1 (en) 1999-06-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase