HK1121243A1 - Pattern replication with intermediate stamp - Google Patents

Pattern replication with intermediate stamp

Info

Publication number
HK1121243A1
HK1121243A1 HK09100929.7A HK09100929A HK1121243A1 HK 1121243 A1 HK1121243 A1 HK 1121243A1 HK 09100929 A HK09100929 A HK 09100929A HK 1121243 A1 HK1121243 A1 HK 1121243A1
Authority
HK
Hong Kong
Prior art keywords
polymer stamp
moldable layer
template
pattern
target surface
Prior art date
Application number
HK09100929.7A
Other languages
English (en)
Inventor
Babak Heidari
Marc Beck
Erik Bolmsjoe
Anette Loefstrand
Erik Ehrenborg
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP05105100A external-priority patent/EP1731961B1/en
Application filed by Obducat Ab filed Critical Obducat Ab
Publication of HK1121243A1 publication Critical patent/HK1121243A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
HK09100929.7A 2005-06-10 2007-03-30 Pattern replication with intermediate stamp HK1121243A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US59515405P 2005-06-10 2005-06-10
EP05105100A EP1731961B1 (en) 2005-06-10 2005-06-10 Template replication method
HK07103467.1A HK1096162A1 (en) 2005-06-10 2007-03-30 Pattern replication with intermediate stamp

Publications (1)

Publication Number Publication Date
HK1121243A1 true HK1121243A1 (en) 2009-04-17

Family

ID=35717449

Family Applications (2)

Application Number Title Priority Date Filing Date
HK09100929.7A HK1121243A1 (en) 2005-06-10 2007-03-30 Pattern replication with intermediate stamp
HK07103467.1A HK1096162A1 (en) 2005-06-10 2007-03-30 Pattern replication with intermediate stamp

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK07103467.1A HK1096162A1 (en) 2005-06-10 2007-03-30 Pattern replication with intermediate stamp

Country Status (12)

Country Link
US (1) US7704425B2 (zh)
EP (2) EP1731962B1 (zh)
JP (1) JP5276436B2 (zh)
KR (1) KR101229100B1 (zh)
CN (1) CN101198903B (zh)
AT (1) ATE419560T1 (zh)
DE (1) DE602005012068D1 (zh)
ES (1) ES2317159T3 (zh)
HK (2) HK1121243A1 (zh)
MY (1) MY152606A (zh)
TW (2) TWI313788B (zh)
WO (1) WO2006131153A1 (zh)

Families Citing this family (129)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1542074A1 (en) * 2003-12-11 2005-06-15 Heptagon OY Manufacturing a replication tool, sub-master or replica
US9040090B2 (en) 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
US20070228608A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
EP1731965B1 (en) * 2005-06-10 2012-08-08 Obducat AB Imprint stamp comprising cyclic olefin copolymer
US7854873B2 (en) 2005-06-10 2010-12-21 Obducat Ab Imprint stamp comprising cyclic olefin copolymer
US7715003B2 (en) 2005-06-14 2010-05-11 President & Fellows Of Harvard College Metalized semiconductor substrates for raman spectroscopy
WO2006138442A2 (en) 2005-06-14 2006-12-28 Ebstein Steven M Applications of laser-processed substrate for molecular diagnostics
US8184284B2 (en) 2005-06-14 2012-05-22 Ebstein Steven M Laser-processed substrate for molecular diagnostics
JP2009509331A (ja) * 2005-09-15 2009-03-05 ダウ・コーニング・コーポレイション ナノ成形法
JP2007133970A (ja) * 2005-11-10 2007-05-31 Canon Inc 光記録媒体およびその製造方法
ATE549294T1 (de) * 2005-12-09 2012-03-15 Obducat Ab Vorrichtung und verfahren zum transfer von mustern mit zwischenstempel
US7500431B2 (en) * 2006-01-12 2009-03-10 Tsai-Wei Wu System, method, and apparatus for membrane, pad, and stamper architecture for uniform base layer and nanoimprinting pressure
US7377765B2 (en) 2006-02-14 2008-05-27 Hitachi Global Storage Technologies System, method, and apparatus for non-contact and diffuse curing exposure for making photopolymer nanoimprinting stamper
US7862756B2 (en) * 2006-03-30 2011-01-04 Asml Netherland B.V. Imprint lithography
US20070257396A1 (en) * 2006-05-05 2007-11-08 Jian Wang Device and method of forming nanoimprinted structures
US7998651B2 (en) 2006-05-15 2011-08-16 Asml Netherlands B.V. Imprint lithography
US8318253B2 (en) * 2006-06-30 2012-11-27 Asml Netherlands B.V. Imprint lithography
US20080047930A1 (en) * 2006-08-23 2008-02-28 Graciela Beatriz Blanchet Method to form a pattern of functional material on a substrate
CN101755237B (zh) * 2006-12-05 2014-04-09 纳诺泰拉公司 使表面形成图案的方法
US8608972B2 (en) 2006-12-05 2013-12-17 Nano Terra Inc. Method for patterning a surface
US20100208237A1 (en) * 2007-01-23 2010-08-19 President & Fellows Of Harvard College Polymeric substrates for raman spectroscopy
US8294891B2 (en) 2007-01-23 2012-10-23 President And Fellows Of Harvard College Non-invasive optical analysis using surface enhanced raman spectroscopy
EP1982757A1 (de) * 2007-04-10 2008-10-22 Stichting Voor De Technische Wetenschappen Ionendurchlässige Membran und ihre Herstellung
US20100304087A1 (en) * 2007-06-04 2010-12-02 Maruzen Petrochemical Co., Ltd Mold, Fine Pattern Product, and Method of Manufacturing Those
JP4448868B2 (ja) 2007-06-29 2010-04-14 株式会社日立産機システム インプリント用スタンパとその製造方法
KR101415570B1 (ko) * 2007-07-26 2014-07-04 삼성디스플레이 주식회사 임프린트 장치 및 이를 이용한 임프린트 방법
US7864312B2 (en) 2007-07-30 2011-01-04 President And Fellows Of Harvard College Substrates for Raman spectroscopy having discontinuous metal coatings
US20090056575A1 (en) * 2007-08-31 2009-03-05 Bartman Jon A Pattern transfer apparatus
KR20100080785A (ko) 2007-09-06 2010-07-12 쓰리엠 이노베이티브 프로퍼티즈 컴파니 광 출력의 영역 제어를 제공하는 광 추출 구조물을 갖는 도광체
CN101795961B (zh) * 2007-09-06 2013-05-01 3M创新有限公司 用于制备微结构化制品的工具
JP2010537867A (ja) 2007-09-06 2010-12-09 スリーエム イノベイティブ プロパティズ カンパニー 型を形成する方法及びかかる型を使用して物品を成形する方法
EP2207820A4 (en) * 2007-10-11 2011-10-26 3M Innovative Properties Co HIGHLY FUNCTIONAL REACTIVE SPECIES WITH MULTIPHOTONIC HARDENING
EP2208100B8 (en) 2007-10-11 2017-08-16 3M Innovative Properties Company Chromatic confocal sensor
JP5524856B2 (ja) * 2007-12-12 2014-06-18 スリーエム イノベイティブ プロパティズ カンパニー エッジ明瞭性が向上した構造の製造方法
US20110039033A1 (en) * 2008-01-31 2011-02-17 Erika Merschrod Method of depositing a polymer micropattern on a substrate
WO2009108543A2 (en) 2008-02-26 2009-09-03 3M Innovative Properties Company Multi-photon exposure system
CN101960559A (zh) * 2008-03-07 2011-01-26 昭和电工株式会社 Uv纳米压印方法、树脂制复制模及其制造方法、磁记录介质及其制造方法和磁记录再生装置
JP4815464B2 (ja) * 2008-03-31 2011-11-16 株式会社日立製作所 微細構造転写スタンパ及び微細構造転写装置
JP5121549B2 (ja) * 2008-04-21 2013-01-16 株式会社東芝 ナノインプリント方法
TWI416514B (zh) * 2008-05-23 2013-11-21 Showa Denko Kk 樹脂模製作用疊層體、疊層體、樹脂模、及磁性記錄媒體的製造方法
EP2138896B1 (en) * 2008-06-25 2014-08-13 Obducat AB Nano imprinting method and apparatus
US8833430B2 (en) * 2008-06-26 2014-09-16 President And Fellows Of Harvard College Versatile high aspect ratio actuatable nanostructured materials through replication
US20110236639A1 (en) * 2008-07-17 2011-09-29 Agency For Science, Technology And Research Method of making an imprint on a polymer structure
JP2010080680A (ja) * 2008-09-26 2010-04-08 Bridgestone Corp 凹凸パターンの形成方法及び凹凸パターンの製造装置
TW201022017A (en) * 2008-09-30 2010-06-16 Molecular Imprints Inc Particle mitigation for imprint lithography
US9122148B2 (en) * 2008-11-03 2015-09-01 Canon Nanotechnologies, Inc. Master template replication
TWI421162B (zh) * 2008-11-03 2014-01-01 Molecular Imprints Inc 母模板複製方法
TWI508846B (zh) * 2008-12-12 2015-11-21 麻省理工學院 不規則表面之楔形壓印圖案化
EP2199854B1 (en) 2008-12-19 2015-12-16 Obducat AB Hybrid polymer mold for nano-imprinting and method for making the same
EP2199855B1 (en) * 2008-12-19 2016-07-20 Obducat Methods and processes for modifying polymer material surface interactions
JP2010171338A (ja) * 2009-01-26 2010-08-05 Toshiba Corp パターン生成方法及びパターン形成方法
JP2010218597A (ja) * 2009-03-13 2010-09-30 Toshiba Corp パターン転写用樹脂スタンパ、及びこれを用いた磁気記録媒体の製造方法
JP2010218605A (ja) 2009-03-13 2010-09-30 Toshiba Corp パターン転写用紫外線硬化性樹脂材料、及びこれを用いた磁気記録媒体の製造方法
JP4543117B1 (ja) * 2009-03-13 2010-09-15 株式会社東芝 パターン転写用紫外線硬化性樹脂材料、及びこれを用いた磁気記録媒体の製造方法
JP4729114B2 (ja) * 2009-03-18 2011-07-20 株式会社東芝 磁気記録媒体の製造方法
CN101900936A (zh) * 2009-05-26 2010-12-01 鸿富锦精密工业（深圳）有限公司 压印模具及其制作方法
US8178011B2 (en) * 2009-07-29 2012-05-15 Empire Technology Development Llc Self-assembled nano-lithographic imprint masks
NL2005265A (en) 2009-10-07 2011-04-11 Asml Netherlands Bv Imprint lithography apparatus and method.
JP5542404B2 (ja) * 2009-10-08 2014-07-09 東レエンジニアリング株式会社 マイクロニードルスタンパーの製造方法
JP5558772B2 (ja) * 2009-10-08 2014-07-23 東レエンジニアリング株式会社 マイクロニードルシートのスタンパー及びその製造方法とそれを用いたマイクロニードルの製造方法
DK2496989T3 (da) * 2009-11-02 2014-01-20 Univ Danmarks Tekniske Fremgangsmåde og indretning til nanotryknings-litografi
US8980751B2 (en) * 2010-01-27 2015-03-17 Canon Nanotechnologies, Inc. Methods and systems of material removal and pattern transfer
WO2011095217A1 (en) 2010-02-05 2011-08-11 Obducat Ab Method and process for metallic stamp replication for large area nanopatterns
JP2011216808A (ja) * 2010-04-02 2011-10-27 Toshiba Mach Co Ltd 転写装置、転写システム及び転写方法
CN102958555A (zh) 2010-04-28 2013-03-06 金伯利-克拉克环球有限公司 注射成型微针阵列和用于形成该微针阵列的方法
WO2011139882A2 (en) * 2010-05-04 2011-11-10 Unipixel Displays, Inc. Method of fabricating micro structured surfaces with electrically conductive patterns
US9168679B2 (en) * 2010-07-16 2015-10-27 Northwestern University Programmable soft lithography: solvent-assisted nanoscale embossing
JP5546066B2 (ja) * 2010-09-01 2014-07-09 東芝機械株式会社 転写システムおよび転写方法
US9034233B2 (en) * 2010-11-30 2015-05-19 Infineon Technologies Ag Method of processing a substrate
TWI409161B (zh) * 2010-12-10 2013-09-21 Chenming Mold Ind Corp 均壓成型模具及其均壓成型方法
KR101200562B1 (ko) * 2011-01-17 2012-11-13 부산대학교 산학협력단 광정렬 일체형 대면적 금속 스탬프의 제조 방법 그리고 그를 이용한 고분자 광소자의 제조 방법
EP2726299A4 (en) * 2011-06-30 2015-03-18 3M Innovative Properties Co METHOD FOR MANUFACTURING, INKING AND MOUNTING BUFFERS FOR MICROCONTACT PRINTING
CN103732374B (zh) * 2011-08-18 2018-10-30 迈图高新材料股份有限公司 照射和成型单元
PL3542851T3 (pl) 2011-10-27 2022-04-25 Sorrento Therapeutics, Inc. Wszczepialne urządzenia do dostarczania środków biologicznie czynnych
TW201330053A (zh) * 2011-11-14 2013-07-16 Orthogonal Inc 於薄膜元件中壓印圖案化材料的製程
JP5891075B2 (ja) 2012-03-08 2016-03-22 東京応化工業株式会社 ブロックコポリマー含有組成物及びパターンの縮小方法
US10391485B2 (en) 2013-09-25 2019-08-27 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Microfluidic electrocage device and cell medium for trapping and rotating cells for live-cell computed tomography (CT)
US9513543B2 (en) 2013-11-20 2016-12-06 Eastman Kodak Company Method for forming a non-deformable patterned template
US9193199B2 (en) 2013-11-20 2015-11-24 Eastman Kodak Company PDMS imprinting stamp with embedded flexure
KR101617952B1 (ko) * 2014-07-31 2016-05-09 한국과학기술원 소프트리소그래피를 이용한 경사진 관통 구멍을 구비한 구조체의 제조방법
US10162162B2 (en) 2014-09-24 2018-12-25 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Microfluidic systems and methods for hydrodynamic microvortical cell rotation in live-cell computed tomography
JP2016164977A (ja) * 2015-02-27 2016-09-08 キヤノン株式会社 ナノインプリント用液体材料、ナノインプリント用液体材料の製造方法、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、および電子部品の製造方法
WO2017056894A1 (ja) * 2015-09-30 2017-04-06 富士フイルム株式会社 モールドの作製方法、パターンシートの製造方法、電鋳金型の作製方法、及び電鋳金型を用いたモールドの作製方法
CN105372734B (zh) * 2015-11-02 2018-01-19 中国科学院重庆绿色智能技术研究院 微棱镜反光材料制作方法
CN105399046A (zh) * 2015-11-02 2016-03-16 中国科学院重庆绿色智能技术研究院 无机微光学元件批量化制作方法
JP6924006B2 (ja) 2016-05-09 2021-08-25 デクセリアルズ株式会社 レプリカ原盤の製造方法、および被形成体の製造方法
WO2017195633A1 (ja) 2016-05-09 2017-11-16 デクセリアルズ株式会社 レプリカ原盤、レプリカ原盤の製造方法、物品および被形成体の製造方法
CN106500886B (zh) * 2016-09-22 2019-05-10 太原理工大学 一种基于纳米导电材料的柔性应力传感器的制备方法
US10969680B2 (en) * 2016-11-30 2021-04-06 Canon Kabushiki Kaisha System and method for adjusting a position of a template
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10847360B2 (en) 2017-05-25 2020-11-24 Applied Materials, Inc. High pressure treatment of silicon nitride film
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
CN110678973B (zh) 2017-06-02 2023-09-19 应用材料公司 碳化硼硬掩模的干式剥除
KR102246631B1 (ko) * 2017-07-10 2021-04-30 주식회사 엘지화학 리튬 금속 전극용 3d 패턴 타발기
US10234630B2 (en) * 2017-07-12 2019-03-19 Applied Materials, Inc. Method for creating a high refractive index wave guide
CN111095513B (zh) 2017-08-18 2023-10-31 应用材料公司 高压高温退火腔室
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
JP7274461B2 (ja) 2017-09-12 2023-05-16 アプライド マテリアルズ インコーポレイテッド 保護バリア層を使用して半導体構造を製造する装置および方法
JP2019056025A (ja) 2017-09-19 2019-04-11 東芝メモリ株式会社 パターン形成材料及びパターン形成方法
CN107814353A (zh) * 2017-10-26 2018-03-20 武汉大学 在透明柔性衬底上制备纳米针尖阵列的方法
US10643867B2 (en) 2017-11-03 2020-05-05 Applied Materials, Inc. Annealing system and method
CN117936420A (zh) 2017-11-11 2024-04-26 微材料有限责任公司 用于高压处理腔室的气体输送系统
SG11202003438QA (en) 2017-11-16 2020-05-28 Applied Materials Inc High pressure steam anneal processing apparatus
JP2021503714A (ja) 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧処理システムのためのコンデンサシステム
JP7299898B2 (ja) 2018-01-24 2023-06-28 アプライド マテリアルズ インコーポレイテッド 高圧アニールを用いたシーム修復
KR20230079236A (ko) 2018-03-09 2023-06-05 어플라이드 머티어리얼스, 인코포레이티드 금속 함유 재료들을 위한 고압 어닐링 프로세스
RU183906U1 (ru) * 2018-03-23 2018-10-08 Акционерное общество "Центральный научно-исследовательский технологический институт "Техномаш" Устройство для формирования планарной микроструктуры с рельефной поверхностью из фотоотверждаемой полимерной композиции методом контактного копирования
US10714331B2 (en) 2018-04-04 2020-07-14 Applied Materials, Inc. Method to fabricate thermally stable low K-FinFET spacer
EP3788443B1 (de) * 2018-05-04 2022-06-15 EV Group E. Thallner GmbH Stempel und verfahren zum prägen
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10566188B2 (en) 2018-05-17 2020-02-18 Applied Materials, Inc. Method to improve film stability
KR102083308B1 (ko) * 2018-05-23 2020-04-23 한국표준과학연구원 탐침형 원자 현미경을 이용한 리소그래피 방법
US10704141B2 (en) 2018-06-01 2020-07-07 Applied Materials, Inc. In-situ CVD and ALD coating of chamber to control metal contamination
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
CN109110728A (zh) * 2018-07-25 2019-01-01 江西理工大学 基于离心力的微纳结构复制方法及制备得到的聚合物微纳结构
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
KR102528076B1 (ko) 2018-10-30 2023-05-03 어플라이드 머티어리얼스, 인코포레이티드 반도체 응용들을 위한 구조를 식각하기 위한 방법들
JP2022507390A (ja) 2018-11-16 2022-01-18 アプライド マテリアルズ インコーポレイテッド 強化拡散プロセスを使用する膜の堆積
CN109765687B (zh) * 2018-12-04 2021-12-14 上海安翰医疗技术有限公司 曲面外壳上疏水涂层的制作方法及内窥镜
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
DE102019101346A1 (de) 2019-01-18 2020-07-23 Osram Opto Semiconductors Gmbh Nanostempelverfahren und nanooptisches bauteil
KR102237716B1 (ko) * 2019-07-19 2021-04-08 한국과학기술원 미세 금속 마스크를 제작하는 방법
CN110412684A (zh) * 2019-08-01 2019-11-05 国家纳米科学中心 一种近眼显示器衍射光栅波导的制备方法
CN111081624A (zh) * 2019-11-28 2020-04-28 北京纳米能源与系统研究所 电子器件的柔性化方法
CN111142329A (zh) * 2019-12-16 2020-05-12 合肥元旭创芯半导体科技有限公司 一种非破坏性的半导体材料sem监控方法
KR102217103B1 (ko) * 2019-12-31 2021-02-18 전북대학교산학협력단 미세복합 표면구조의 제조방법 및 이를 이용한 미세복합 표면 탄성 폴리머 필름의 제조방법
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
DE102020204766A1 (de) * 2020-04-15 2021-10-21 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von Dämpferstrukturen an einem mikromechanischen Wafer
EP4057066A1 (en) 2021-03-11 2022-09-14 Obducat AB Apparatus and method for surface treatment of an imprint stamp

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2305433A (en) * 1940-09-11 1942-12-15 Jesse B Hawley Method and apparatus for molding articles of thermoplastic, thermosetting, or resinous materials
BE479683A (zh) * 1947-01-17
JPS5772823A (en) * 1980-10-27 1982-05-07 Mitsui Toatsu Chem Inc Production of duplicate disk for information recording
JPS62178309A (ja) * 1986-01-31 1987-08-05 Tanazawa Hatsukoushiya:Kk マスタ除去方法
DD251847A1 (de) * 1986-07-31 1987-11-25 Zeiss Jena Veb Carl Verfahren und anordnung zum bildvergleich
JP2760381B2 (ja) * 1988-12-09 1998-05-28 大日本印刷株式会社 スタンパ
JPH02192045A (ja) * 1989-01-20 1990-07-27 Fujitsu Ltd 光ディスク基板の製造方法
JPH05114174A (ja) * 1991-10-21 1993-05-07 Ricoh Co Ltd 光デイスク基板製造装置
US5312794A (en) * 1992-12-29 1994-05-17 Shell Oil Company Catalyst system for olefin polymerization
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
JPH09330864A (ja) * 1996-06-10 1997-12-22 Ge Yokogawa Medical Syst Ltd 複合圧電物質製造方法及び複合圧電物質製造用マスク
JP3888485B2 (ja) * 1997-06-27 2007-03-07 大日本インキ化学工業株式会社 紫外線硬化性組成物
JP3577903B2 (ja) * 1997-08-12 2004-10-20 セイコーエプソン株式会社 樹脂板製造用鋳型の製造方法および樹脂板の製造方法
JP2000071257A (ja) * 1998-09-02 2000-03-07 Kuraray Co Ltd 成形品の製造方法
US6334960B1 (en) 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
SE515607C2 (sv) * 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
KR100694036B1 (ko) * 2000-06-01 2007-03-12 삼성전자주식회사 그루브와 피트의 깊이가 다른 디스크 및 그 제조방법
JP4192414B2 (ja) 2000-09-14 2008-12-10 凸版印刷株式会社 レンズシートの製造方法
US6953332B1 (en) * 2000-11-28 2005-10-11 St. Jude Medical, Inc. Mandrel for use in forming valved prostheses having polymer leaflets by dip coating
US6422528B1 (en) * 2001-01-17 2002-07-23 Sandia National Laboratories Sacrificial plastic mold with electroplatable base
WO2002096166A1 (en) * 2001-05-18 2002-11-28 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates
US20030071016A1 (en) 2001-10-11 2003-04-17 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
TWI258142B (en) * 2002-01-08 2006-07-11 Tdk Corp Manufacturing method of stamper for manufacturing data medium, the stamper, and the stamper spacer with template
JP3749520B2 (ja) 2002-01-08 2006-03-01 Ｔｄｋ株式会社 情報媒体製造用スタンパの製造方法、スタンパ、及び原盤付スタンパ中間体
US6759180B2 (en) * 2002-04-23 2004-07-06 Hewlett-Packard Development Company, L.P. Method of fabricating sub-lithographic sized line and space patterns for nano-imprinting lithography
US6849558B2 (en) * 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
US20030230817A1 (en) * 2002-06-13 2003-12-18 Agere Systems, Inc. Mold for UV curable adhesive and method of use therefor
US20040032063A1 (en) * 2002-08-16 2004-02-19 Peter Walther Process for shaping plate-shaped materials and an arrangement for carrying out the process
JP2005537656A (ja) * 2002-08-27 2005-12-08 オブデュキャット、アクチボラグ 対象物にパターンを転写するための装置
JP2004109417A (ja) * 2002-09-18 2004-04-08 Dainippon Printing Co Ltd 光回折構造の製造方法、複製版材、及び媒体
JP4061220B2 (ja) * 2003-03-20 2008-03-12 株式会社日立製作所 ナノプリント装置、及び微細構造転写方法
US20040241049A1 (en) * 2003-04-04 2004-12-02 Carvalho Bruce L. Elastomeric tools for the fabrication of elastomeric devices and uses thereof
TW200507175A (en) * 2003-06-20 2005-02-16 Matsushita Electric Ind Co Ltd Pattern forming method, and manufacturing method for semiconductor device
US20050084804A1 (en) * 2003-10-16 2005-04-21 Molecular Imprints, Inc. Low surface energy templates
US7150844B2 (en) * 2003-10-16 2006-12-19 Seagate Technology Llc Dry passivation process for stamper/imprinter family making for patterned recording media
US6939664B2 (en) * 2003-10-24 2005-09-06 International Business Machines Corporation Low-activation energy silicon-containing resist system
EP1533657B1 (en) * 2003-11-21 2011-03-09 Obducat AB Multilayer nano imprint lithography
DE102004005247A1 (de) * 2004-01-28 2005-09-01 Infineon Technologies Ag Imprint-Lithographieverfahren
EP1594001B1 (en) * 2004-05-07 2015-12-30 Obducat AB Device and method for imprint lithography
US7717693B2 (en) 2004-05-28 2010-05-18 Obducat Ab Modified metal mold for use in imprinting processes
US7163888B2 (en) * 2004-11-22 2007-01-16 Motorola, Inc. Direct imprinting of etch barriers using step and flash imprint lithography

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