TWI266970B - Scatterometry alignment for imprint lithography - Google Patents

Scatterometry alignment for imprint lithography

Info

Publication number
TWI266970B
TWI266970B TW092120993A TW92120993A TWI266970B TW I266970 B TWI266970 B TW I266970B TW 092120993 A TW092120993 A TW 092120993A TW 92120993 A TW92120993 A TW 92120993A TW I266970 B TWI266970 B TW I266970B
Authority
TW
Taiwan
Prior art keywords
imprint lithography
scatterometry
alignment
liquid
template
Prior art date
Application number
TW092120993A
Other languages
Chinese (zh)
Other versions
TW200406651A (en
Inventor
Michael P C Watts
Ian Mcmackin
Sidlgata V Sreenivasan
Byung-Jin Choi
Ronald D Voisin
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/210,780 external-priority patent/US6916584B2/en
Priority claimed from US10/210,785 external-priority patent/US7027156B2/en
Priority claimed from US10/210,894 external-priority patent/US7070405B2/en
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of TW200406651A publication Critical patent/TW200406651A/en
Application granted granted Critical
Publication of TWI266970B publication Critical patent/TWI266970B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7065—Production of alignment light, e.g. light source, control of coherence, polarization, pulse length, wavelength

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Micromachines (AREA)

Abstract

Described are methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. Alignment of the template with a previously formed layer on a substrate, in one embodiment, is accomplished by suing scatterometry.
TW092120993A 2002-08-01 2003-07-31 Scatterometry alignment for imprint lithography TWI266970B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/210,780 US6916584B2 (en) 2002-08-01 2002-08-01 Alignment methods for imprint lithography
US10/210,785 US7027156B2 (en) 2002-08-01 2002-08-01 Scatterometry alignment for imprint lithography
US10/210,894 US7070405B2 (en) 2002-08-01 2002-08-01 Alignment systems for imprint lithography

Publications (2)

Publication Number Publication Date
TW200406651A TW200406651A (en) 2004-05-01
TWI266970B true TWI266970B (en) 2006-11-21

Family

ID=31499238

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092120993A TWI266970B (en) 2002-08-01 2003-07-31 Scatterometry alignment for imprint lithography

Country Status (6)

Country Link
EP (1) EP1573395A4 (en)
JP (2) JP2006516065A (en)
KR (1) KR20050026088A (en)
AU (1) AU2003261317A1 (en)
TW (1) TWI266970B (en)
WO (1) WO2004013693A2 (en)

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Publication number Priority date Publication date Assignee Title
TWI483225B (en) * 2011-11-30 2015-05-01 Screen Holdings Co Ltd Alignment method, transfer method, and transfer apparatus

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Also Published As

Publication number Publication date
AU2003261317A1 (en) 2004-02-23
JP2011101016A (en) 2011-05-19
WO2004013693A2 (en) 2004-02-12
KR20050026088A (en) 2005-03-14
TW200406651A (en) 2004-05-01
EP1573395A4 (en) 2010-09-29
WO2004013693A3 (en) 2006-01-19
AU2003261317A8 (en) 2004-02-23
JP2006516065A (en) 2006-06-15
EP1573395A2 (en) 2005-09-14
JP5421221B2 (en) 2014-02-19

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