JP2018101671A - Imprint device and manufacturing method of article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint device which is advantageous in aligning a mold with a substrate.SOLUTION: Provided is an imprint device which uses a mold to form a pattern of an imprint material on a substrate. The imprint device comprises: a head for holding the mold; a stage for holding and moving the substrate; and a support member for supporting the head. In the support member, a spring constant in the horizontal direction is set to be smaller than a spring constant in the vertical direction so that the mold held by the head may follow the movement of the stage via the imprint material while the mold and the imprint material is in contact with each other.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an imprint apparatus and an article manufacturing method.

  The demand for miniaturization of semiconductor devices, MEMS, and the like has advanced, and in addition to the conventional photolithography technology, an imprint technology capable of forming a fine pattern (structure) on the order of several nanometers on a substrate has attracted attention. Yes. The imprint technology supplies (applies) an uncured imprint material onto a substrate, contacts the imprint material with a mold (mold), and corresponds to a fine uneven pattern formed on the mold. This is a fine processing technique for forming a material pattern on a substrate.

  In the imprint technique, there is a photocuring method as one of the methods for curing an imprint material. In the photo-curing method, the imprint material supplied to the shot area on the substrate is in contact with the mold to irradiate light to cure the imprint material, and the mold is removed from the cured imprint material. This is a method for forming a pattern of a printing material on a substrate.

  In an imprint apparatus that employs imprint technology, when the imprint material on the substrate is brought into contact with the mold, it is necessary to match the position of the pattern formed on the substrate with the position of the pattern formed on the mold. There is. Therefore, techniques for performing alignment between the mold and the substrate with high accuracy have been conventionally proposed (see Patent Documents 1 and 2).

  In the technique disclosed in Patent Document 1, the mold is supported by the flexible member so that the movement of the mold occurs around the center (pivot point) of the mold. As a result, vibrations and other movements that may shear the pattern shape of the imprint material formed by the mold can be substantially reduced. Moreover, since the bending member is designed to have high rigidity, the movement in the side surface direction of the mold can be ignored.

  In Patent Document 2, the alignment between the mold and the substrate (positioning of the mold with respect to the substrate) should be performed in a state where there is substantially no influence of disturbance such as floor vibration. Therefore, Patent Document 2 discloses an imprint apparatus including a vibration isolation system configured to insulate vibrations of a support structure that supports a mold holder and / or a substrate holder. Such a vibration isolation system may comprise one or more so-called air mounts, characterized for example by a low stiffness support having a cut-off frequency or natural frequency of 1 Hz or less.

JP 2011-101016 A JP 2011-135077 A

  In imprint equipment, the imprint material with improved fillability has been developed, so that the shear force generated when the imprint material on the substrate and the mold are brought into contact with each other is reduced, and the alignment between the mold and the substrate is achieved. There is a problem that the accuracy of the system is lowered.

  For example, in Patent Document 1, since the mold is supported by a flexible member having high rigidity, the horizontal natural frequency of the mold is higher than the horizontal natural frequency of the substrate. In such a state, when a disturbance such as floor vibration is applied, a relative displacement occurs between the mold and the substrate due to a difference in natural frequency between the mold and the substrate.

  Further, in Patent Document 2, disturbances such as floor vibration can be reduced by the vibration isolation system, but such disturbances cannot be completely removed. Since Patent Document 2 does not disclose a countermeasure against such a disturbance that cannot be completely removed, when such a disturbance is applied to the support structure, a relative displacement occurs between the mold and the substrate.

  The present invention has been made in view of the above-described problems of the prior art, and an exemplary object thereof is to provide an imprint apparatus that is advantageous for alignment between a mold and a substrate.

  In order to achieve the above object, an imprint apparatus according to one aspect of the present invention is an imprint apparatus that forms a pattern of an imprint material on a substrate using a mold, and a head that holds the mold; A stage that holds and moves the substrate; and a support member that supports the head. The support member is held by the head in a state where the mold and the imprint material are in contact with each other. The horizontal spring constant is set smaller than the vertical spring constant so that the mold follows the movement of the stage through the imprint material.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide an imprint apparatus that is advantageous for alignment between a mold and a substrate.

It is the schematic which shows the structure of the imprint apparatus as 1 side surface of this invention. It is the schematic which shows an example of a structure of the supporting member of the imprint apparatus shown in FIG. It is a gain diagram which shows the vibration transmissibility from a main body structure to the relative displacement of a mold and a board | substrate. It is a gain diagram which shows the vibration transmissibility from a main body structure to the relative displacement of a mold and a board | substrate. It is the schematic which shows an example of a structure of the supporting member of the imprint apparatus shown in FIG. It is the schematic which shows an example of a structure of the supporting member of the imprint apparatus shown in FIG. It is a figure for demonstrating the manufacturing method of articles | goods.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

<First Embodiment>
FIG. 1 is a schematic diagram showing a configuration of an imprint apparatus 1 as one aspect of the present invention. The imprint apparatus 1 is a lithographic apparatus that is used for manufacturing a semiconductor device as an article and forms a pattern of an imprint material on a substrate using a mold. In the present embodiment, the imprint apparatus 1 makes the imprint material supplied on the substrate come into contact with the mold, and gives a curing energy to the imprint material, whereby a cured product to which the uneven pattern of the mold is transferred. The pattern is formed.

  As the imprint material, a curable composition (also referred to as an uncured resin) that cures when given energy for curing is used. As the energy for curing, electromagnetic waves, heat, or the like is used. As the electromagnetic wave, for example, light such as infrared rays, visible rays, and ultraviolet rays, whose wavelength is selected from a range of 10 nm to 1 mm is used.

  A curable composition is a composition which hardens | cures by irradiation of light or by heating. The photocurable composition that is cured by light irradiation contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

  The imprint material may be applied in a film form on the substrate by a spin coater or a slit coater. Further, the imprint material may be applied onto the substrate in the form of droplets by the liquid ejecting head, or in the form of islands or films formed by connecting a plurality of droplets. The imprint material has a viscosity (viscosity at 25 ° C.) of, for example, 1 mPa · s or more and 100 mPa · s or less.

  As the substrate, glass, ceramics, metal, semiconductor, resin, or the like is used, and a member made of a material different from the substrate may be formed on the surface as necessary. Specific examples of the substrate include a silicon wafer, a compound semiconductor wafer, and quartz glass.

  The imprint apparatus 1 employs a photocuring method as a method for curing the imprint material. The imprint apparatus 1 includes an irradiation unit 2, a head 3, a substrate stage 4, a supply unit 5, an alignment scope 6, a stage drive unit 17, a measurement unit 18, and a main body structure 27. Here, the direction parallel to the optical axis of the ultraviolet rays 9 irradiated to the imprint material on the substrate is defined as the Z axis, and the directions perpendicular to each other in a plane perpendicular to the Z axis are defined as the X axis and the Y axis.

  The irradiation unit 2 irradiates the imprint material 14 on the substrate with ultraviolet rays 9 through the mold 8 when the imprint material 14 on the substrate is cured. The irradiation unit 2 includes, for example, a light source (not shown) and an optical system that adjusts the ultraviolet rays 9 emitted from the light source to light suitable for curing the imprint material 14.

  The mold 8 has a rectangular outer peripheral shape, and has a pattern 8 a in which a concave / convex pattern (for example, a circuit pattern) to be transferred to the substrate 10 is three-dimensionally formed on a surface facing the substrate 10. The mold 8 is made of a material that can transmit ultraviolet rays 9, for example, quartz. The mold 8 has a cavity (concave portion) having a circular planar shape and a certain depth on the surface irradiated with the ultraviolet rays 9.

  The head 3 includes a mold chuck 11 that holds the mold 8 and a mold driving unit 12 that holds the mold chuck 11 movably. The mold chuck 11 holds the mold 8 by attracting the outer peripheral region of the irradiation region of the ultraviolet ray 9 in the mold 8 by a vacuum adsorption force or an electrostatic force. For example, when the mold 8 is held by a vacuum adsorption force, the mold chuck 11 is connected to a vacuum pump (not shown) installed outside, and the attachment / detachment of the mold 8 is switched by turning on / off the vacuum pump. It is done.

  The mold driving unit 12 moves the mold chuck 11 (mold 8) so as to selectively perform contact (imprint) between the imprint material 14 and the mold 8 and separation (release) of the mold 8 from the imprint material 14. Move (drive) in the direction of each axis. Examples of the actuator that can be used in the mold driving unit 12 include a linear motor and an air cylinder. Further, the mold driving unit 12 may be composed of a plurality of driving systems such as a coarse driving system and a fine driving system in order to realize highly accurate positioning of the mold 8. The mold driving unit 12 may have a function for correcting the tilt of the mold 8. The imprint apparatus 1 may perform the stamping and releasing operations of the mold 8 by moving the mold 8 in the Z-axis direction, but may also be realized by moving the substrate 10 in the Z-axis direction. Alternatively, both the mold 8 and the substrate 10 may be moved relatively.

  The mold chuck 11 has an opening region in the central portion (inner side) that allows the imprint material 14 on the substrate to be irradiated with the ultraviolet rays 9 from the irradiation unit 2. In the opening region, a light transmitting member (for example, a glass plate) is installed in which a space surrounded by a part of the opening region and the mold 8 is a sealed space. The pressure inside the sealed space is adjusted by a pressure adjusting device (not shown) including a vacuum pump or the like. For example, when the imprint material 14 on the substrate and the mold 8 are brought into contact with each other, the pressure adjusting device makes the pressure inside the sealed space higher than the pressure outside the pattern 8a (pattern 8a (pattern). Surface) is deformed into a convex shape toward the substrate 10. Thereby, it becomes possible to make it contact with the imprint material 14 on a board | substrate from the center part of the pattern 8a, it suppresses that gas (air) remains between the pattern 8a and the imprint material 14, and the pattern 8a The imprint material 14 can be filled to every corner.

  The substrate stage 4 holds the substrate 10 via a substrate chuck 16 that attracts the substrate 10 by suction force. An imprint material 14 for transferring the pattern 8 a of the mold 8 is supplied to the substrate 10. The substrate stage 4 is used to align the mold 8 and the substrate 10 when the imprint material 14 on the substrate and the mold 8 are brought into contact with each other. The stage drive unit 17 moves the substrate stage 4 (substrate 10) in the direction of each axis. Examples of actuators that can be used in the stage drive unit 17 include a linear motor and a planar motor. The stage drive unit 17 may include a plurality of drive systems such as a coarse drive system and a fine drive system in each direction of the X axis and the Y axis. The stage drive unit 17 includes a drive system for adjusting the position in the Z-axis direction, a drive system for adjusting the position of the substrate 10 in the θ direction, and a drive system for correcting the tilt of the substrate 10. You may do it. In the main body structure 27, a measuring unit 18 for measuring the position and angle of each axis of the substrate stage 4 with respect to the main body structure 27 is arranged.

  The supply unit 5 is disposed in the vicinity of the head 3. The supply unit 5 includes a dispenser 5a that discharges the imprint material 14, and supplies the imprint material 14 onto the substrate. In the present embodiment, the imprint material 14 has a property of being cured by irradiation with ultraviolet rays 9, but the type thereof is appropriately selected according to various conditions such as a semiconductor device manufacturing process. Further, the amount of the imprint material 14 discharged from the dispenser 5a is appropriately determined according to the thickness (remaining film thickness) of the imprint material 14 to be formed on the substrate, the density of the pattern to be formed on the substrate, and the like. Is done.

  The alignment scope 6 detects an alignment mark formed on each of the mold 8 and the substrate 10 and measures a positional deviation between the mold 8 and the substrate 10 in the X-axis and Y-axis directions.

  Here, a control system for controlling the movement of the substrate stage 4 will be described. The imprint apparatus 1 includes a first feedback control system 40 including a measurement unit 18, a first compensator 42, a stage drive unit 17, and a first input unit 41. The first compensator 42 outputs the output of the measurement unit 18 (the position (measurement value) of the substrate stage 4 measured by the measurement unit 18) and the target position (target value) of the substrate stage 4 input from the first input unit 41. ) To calculate (determine) the amount of operation given to the stage drive unit 17. The movement of the substrate stage 4 is controlled by giving the operation amount to the substrate stage 4. In the present embodiment, a PID compensator is used as the first compensator 42.

  Furthermore, the imprint apparatus 1 includes a second feedback control system 50 for correcting the position of the substrate stage 4 based on the output of the alignment scope 6 (the positional deviation between the mold 8 and the substrate 10). The second feedback control system 50 includes an alignment scope 6, a second compensator 52, and a second input unit 51. The second compensator 52 calculates a correction amount for correcting the position of the substrate stage 4 based on the output of the alignment scope 6 and the alignment target value input from the second input unit 51. In the present embodiment, a PI compensator is used as the second compensator 52. By adding the correction amount calculated by the second compensator 52 to the target position of the substrate stage 4, alignment between the mold 8 and the substrate 10 can be realized.

  When a disturbance such as floor vibration is applied to the main body structure 27 after the alignment between the mold 8 and the substrate 10 is finished, a relative displacement occurs between the mold 8 and the substrate 10. Therefore, in the present embodiment, the imprint apparatus 1 includes a support member 30 for flexibly supporting the head 3 from the main body structure 27 in the horizontal direction. The support member 30 is arranged in the horizontal direction so that the mold 8 held by the head 3 follows the movement of the substrate stage 4 via the imprint material 14 while the mold 8 and the imprint material 14 are in contact with each other. The spring constant is set smaller than the vertical spring constant. As shown in FIG. 1, the support member 30 may be disposed above the mold driving unit 12 that drives the mold chuck 11 (the mold 8 held by the head 3) in the vertical direction in the vertical direction. It may be placed below. Here, “upper” and “lower” represent “upper” and “lower”, respectively, in the page of FIG.

  The support member 30 includes a spring member such as a hinge mechanism, a leaf spring, a coil spring, and a pendulum. FIG. 2 is a schematic diagram illustrating an example of the support member 30 configured by a hinge mechanism. However, the shape of the hinge mechanism constituting the support member 30 is not limited to the shape shown in FIG.

  The support member 30 is configured as described below in the present embodiment in order to make the spring constant in the horizontal direction smaller than the spring constant in the vertical direction. For example, assuming that the horizontal rigidity of the support member 30 is Km and the horizontal rigidity (shear direction) of the imprint material 14 is Kr, the horizontal rigidity Km of the support member 30 satisfies the following Expression 1. Yes. Thereby, when a disturbance such as floor vibration is applied to the main body structure 27 and the substrate stage 4 vibrates, the head 3 easily follows the vibration of the substrate stage 4 and vibrates. Therefore, relative displacement between the mold 8 and the substrate 10 is less likely to occur.

  The horizontal rigidity Kr of the imprint material 14 is such that the longitudinal elastic modulus of the imprint material 14 is E, the Poisson's ratio is ν, the area of the contact area between the mold 8 and the imprint material 14 is A, and the thickness of the imprint material 14 If d is d, it can be obtained from Equation 2 below.

  Further, the horizontal rigidity Kr of the imprint material 14 can also be obtained experimentally using the imprint apparatus 1. For example, in the process of aligning the mold 8 and the substrate 10, the substrate stage 4 is moved until the output of the alignment scope 6 becomes X 1, and the force output by the stage drive unit 17 for the movement of the substrate stage 4 is used. F. In this case, the horizontal rigidity Kr of the imprint material 14 can be obtained from Equation 3 below. The horizontal rigidity Kr of the imprint material 14 may be obtained using a dedicated experimental device.

  FIG. 3 is a gain diagram showing the vibration transmissibility from the main body structure 27 to the relative displacement XX3 between the mold 8 and the substrate 10. As shown in FIG. FIG. 3 shows the vibration transmissibility when the horizontal rigidity Kr of the imprint material 14 is 1e7 [N / m] and the horizontal rigidity Km of the support member 30 is 5e7 [N / m]. The vibration transmissibility is shown when the horizontal rigidity Km of the member 30 is 1e5 [N / m]. In FIG. 3, the vertical axis represents gain [dB], and the horizontal axis represents frequency [Hz]. Referring to FIG. 3, it can be seen that the vibration transmissibility is smaller when the horizontal stiffness Km of the support member 30 is smaller than the horizontal stiffness Kr of the imprint material 14.

  As described above, the substrate stage 4 moves in the horizontal direction in the process of aligning the mold 8 and the substrate 10. As the substrate stage 4 moves, the head 3 also moves in the horizontal direction. Therefore, the support member 30 needs to have a movable range that can accommodate the movement of the head 3. Accordingly, the movable range L of the support member 30 satisfies the following expression 4 when the initial positional deviation amount between the mold 8 and the substrate 10 is X2. Thereby, even when the head 3 is flexibly supported from the main body structure 27 in the horizontal direction via the support member 30, the alignment between the mold 8 and the substrate 10 can be realized.

  Thus, in the first embodiment, the horizontal rigidity Km of the support member 30 is made smaller than the horizontal rigidity Kr of the imprint material 14. Thus, when a disturbance such as floor vibration is applied to the main body structure 27 and the substrate stage 4 vibrates, the head 3 easily follows the vibration of the substrate stage 4 and vibrates. Accordingly, it is possible to reduce the occurrence of relative displacement between the mold 8 and the substrate 10 after the alignment between the mold 8 and the substrate 10 is completed.

Second Embodiment
In the second embodiment, when a disturbance such as floor vibration is applied to the main body structure 27, the substrate stage 4 and the head 3 vibrate in the same manner. This is particularly effective when the horizontal rigidity Kr of the imprint material 14 is small.

  When the horizontal displacement of the main body structure 27 when a disturbance such as floor vibration is applied is XX0 and the mass of the head 3 is Mm, the displacement XX1 of the head 3 is expressed by the following Expression 5. However, the natural frequency of the head 3 supported from the main body structure 27 via the support member 30 is Fm, and the damping ratio is ζm. In Expression 5, s represents a complex number used for Laplace transform.

  Next, the displacement XX2 of the substrate stage 4 when a disturbance such as floor vibration is applied is obtained. A transfer function from the horizontal displacement of the main body structure 27 of the substrate stage 4 controlled by the first feedback control system 40 to the horizontal displacement of the substrate stage 4 can be approximated by the following Expression 6. However, the crossover frequency of the first feedback control system 40 is Fw, and the attenuation of the first feedback control system 40 is the attenuation ratio ζw.

  When the relative displacement between the mold 8 and the substrate 10 is XX3, the relative displacement XX3 between the mold 8 and the substrate 10 is expressed by the following Expression 7.

  Referring to Equation 7, if the natural frequency Fm and the crossing frequency Fm are the same, the relative displacement XX3 between the mold 8 and the substrate 10 can be reduced in the frequency band lower than the natural frequency Fm or the crossing frequency Fw. Can do. Furthermore, if the damping ratio ζm and the damping ratio ζw are the same, the relative displacement XX3 between the mold 8 and the substrate 10 can be reduced even in the frequency band equal to or higher than the natural frequency Fm or the crossing frequency Fw.

  FIG. 4 shows the main body structure 27 when the crossing frequency Fw of the substrate stage 4 is 60 Hz and the natural frequency Fm is 1/4 times, 1/2 times, 1 time, 2 times or 4 times the crossing frequency Fw. It is a gain diagram which shows the vibration transmissibility to relative displacement XX3 of the mold 8 and the board | substrate 10 from FIG. Here, the horizontal rigidity Kr of the imprint material 14 is set to 1e5 [N / m]. In FIG. 4, the vertical axis represents gain [dB], and the horizontal axis represents frequency [Hz]. Referring to FIG. 4, when the natural frequency Fm is 1/2 to 2 times the crossing frequency Fw, compared to the case where the natural frequency Fm is 1/4 or 4 times the crossing frequency Fw, It can be seen that the maximum value of the vibration transmissibility is small. Therefore, if the natural frequency Fw is 1/2 to 2 times the crossing frequency Fw, the occurrence of relative displacement between the mold 8 and the substrate 10 due to disturbance such as floor vibration can be sufficiently reduced.

  The natural frequency Fm is expressed by the following formula 8 from the horizontal rigidity Km of the support member 30 and the mass Mm of the head 3. Therefore, the horizontal stiffness Km of the support member 30 needs to be designed so that the natural frequency Fm is a value within a range of 1/2 times or more and 2 times or less of the crossing frequency Fw. .

  Further, the natural frequency Fm may change under the influence of the natural frequency of other units mounted on the main body structure 27. In such a case, the cross frequency Fw of the substrate stage 4 may be finely adjusted so as to coincide with the natural frequency Fm.

<Third Embodiment>
There are various types of imprint material 14 as described above. The horizontal rigidity Kr of the imprint material 14 varies depending on the type of the imprint material 14. In addition, the crossing frequency Fw of the substrate stage 4 may be changed depending on the environment where the imprint apparatus 1 is installed. In order to cope with such a case, the support member 30 may be configured to be able to change the rigidity Km in the horizontal direction. In order to make it possible to change the horizontal rigidity Km of the support member 30, for example, the support member 30 shown in FIG. 2 is configured to be replaceable, that is, the support member 30 is replaced with another support member having a different spring constant. What is necessary is just to comprise. Further, the support member 30 may be provided with an adjustment mechanism (not shown) that can change the horizontal rigidity Km.

<Fourth embodiment>
As described in the second embodiment, if the damping ratio ζm and the damping ratio ζw representing the damping property of the substrate stage 4 are set to be the same, floor vibration or the like can be obtained in a frequency band equal to or higher than the natural frequency Fm or the crossing frequency Fw. The relative displacement XX3 between the mold 8 and the substrate 10 due to disturbance can be reduced. Therefore, the imprint apparatus 1 may be configured so that the damping ratio ζm corresponding to the damping ratio in the horizontal direction of the support member 30 can be changed. Specifically, as shown in FIG. 5, the support member 30 may be provided with an attenuation member 31 for adjusting the horizontal attenuation ratio of the support member 30. The damping ratio ζm can be adjusted by changing at least one of the material and the amount of the damping member 31.

<Fifth Embodiment>
In the imprint apparatus 1, in addition to the alignment process between the mold 8 and the substrate 10, a supply process for supplying the imprint material 14 from the supply unit 5 to the substrate 10 must be performed. In order to perform the supply process, it is necessary to move the substrate stage 4 below the supply unit 5, that is, toward the supply position where the supply unit 5 supplies the imprint material 14. In such a case, when the head 3 is flexibly supported with respect to the main body structure 27 in the horizontal direction via the support member 30, the head 3 vibrates due to the reaction force accompanying the movement of the substrate stage 4, and residual vibration. As a result, the performance of the imprint apparatus 1 may be degraded.

  Therefore, as shown in FIG. 6, the imprint apparatus 1 further includes a fixing portion 32 for fixing the head 3 to the main body structure 27 in addition to the support member 30. In the supply process, the fixing unit 32 specifically moves the head 3 to the main body structure 27 while moving the substrate stage 4 toward the supply position where the supply unit 5 supplies the imprint material 14. Secure to. In addition, the fixing portion 32 releases the fixing of the head 3 to the main body structure 27 in the process of aligning the mold 8 and the substrate 10.

<Sixth Embodiment>
In the embodiments so far, the case where the imprint apparatus 1 has the support member 30 for flexibly supporting the head 3 from the main body structure 27 in the horizontal direction has been described. However, the imprint apparatus 1 may have a support member that flexibly supports the substrate chuck 16 holding the substrate 10 from the substrate stage 4 in the horizontal direction instead of the support member 30. The same effects as described above can be obtained by applying the configuration described in the first to fifth embodiments (that is, the same configuration as that of the support member 30) to such a support member. it can.

  The pattern of the cured product formed using the imprint apparatus 1 is used permanently on at least a part of various articles, or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit element include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the above-described article or temporarily used as a resist mask. After a process such as etching or ion implantation is performed in the substrate processing step, the resist mask is removed.

  Next, a specific method for manufacturing an article will be described. As shown in FIG. 7A, a substrate 10 such as a silicon wafer on which a workpiece such as an insulator is formed is prepared, and then an imprint material is applied to the surface of the workpiece by an inkjet method or the like. 14 is given. Here, a state in which the imprint material 14 in the form of a plurality of droplets is applied on the substrate is shown.

  As shown in FIG. 7B, the imprint mold 8 is opposed to the imprint material 14 on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG.7 (c), the board | substrate 10 with which the imprint material 14 was provided, and the mold 8 are made to contact, and a pressure is applied. The imprint material 14 is filled in the gap between the mold 8 and the workpiece. In this state, when light is irradiated as energy for curing through the mold 8, the imprint material 14 is cured.

  As shown in FIG. 7D, when the imprint material 14 is cured and then the mold 8 and the substrate 10 are separated, a pattern of a cured product of the imprint material 14 is formed on the substrate. The pattern of the cured product is such that the concave portion of the mold 8 corresponds to the convex portion of the cured product, and the convex portion of the mold 8 corresponds to the concave portion of the cured product. Has been transcribed.

  As shown in FIG. 7E, when etching is performed using the pattern of the cured product as an anti-etching mask, the portion of the surface of the workpiece that has no cured product or remains thin is removed to form a groove. . As shown in FIG. 7 (f), when the pattern of the cured product is removed, an article having grooves formed on the surface of the workpiece can be obtained. Here, although the pattern of the cured product is removed, it may be used as, for example, an interlayer insulating film included in a semiconductor element, that is, a constituent member of an article without being removed after processing.

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

1: Imprint device 3: Head 4: Substrate stage 8: Mold 10: Substrate 30: Support member

Claims (9)

An imprint apparatus for forming a pattern of an imprint material on a substrate using a mold,
A head for holding the mold;
A stage for holding and moving the substrate;
A support member for supporting the head,
The support member is a horizontal spring so that the mold held by the head follows the movement of the stage via the imprint material while the mold and the imprint material are in contact with each other. An imprint apparatus characterized in that the constant is set smaller than the spring constant in the vertical direction. An actuator for driving the mold held by the head in the vertical direction;
The imprint apparatus according to claim 1, wherein the support member is disposed above the actuator in the vertical direction. An actuator for driving the mold held by the head in the vertical direction;
The imprint apparatus according to claim 1, wherein the support member is disposed below the actuator in the vertical direction. A measuring unit for measuring the position of the stage;
A control system for determining an operation amount for moving the stage based on a measurement value of the measurement unit, and controlling the movement of the stage by giving the operation amount to the stage;
Further comprising
The natural frequency in the horizontal direction of the head supported by the support member is a value within a range of 1/2 times or more and 2 times or less of a cross frequency of the control system. Item 4. The imprint apparatus according to any one of Items 1 to 3.   The imprint apparatus according to claim 1, wherein the support member can be replaced with another support member having a different spring constant.   The imprint apparatus according to claim 1, further comprising an attenuation member that adjusts an attenuation ratio of the support member in the horizontal direction. A structure that supports the support member;
A fixing portion for fixing the head to the structure;
The imprint apparatus according to claim 1, further comprising: A supply unit for supplying an imprint material to the substrate;
The said fixing | fixed part fixes the said head to the said structure while moving the said stage toward the supply position where the imprint material by the said supply part is supplied, The said structure is characterized by the above-mentioned. The imprint apparatus described. Forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 8,
Processing the substrate on which the pattern has been formed in the step;
A method for producing an article comprising:

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