KR101212244B1 - Stage leveling device for mask aligner with simplified structure - Google Patents

Stage leveling device for mask aligner with simplified structure Download PDF

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Publication number
KR101212244B1
KR101212244B1 KR1020120114249A KR20120114249A KR101212244B1 KR 101212244 B1 KR101212244 B1 KR 101212244B1 KR 1020120114249 A KR1020120114249 A KR 1020120114249A KR 20120114249 A KR20120114249 A KR 20120114249A KR 101212244 B1 KR101212244 B1 KR 101212244B1
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KR
South Korea
Prior art keywords
stage
wafer
mask
base plate
support
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KR1020120114249A
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Korean (ko)
Inventor
이곤철
Original Assignee
마이다스시스템주식회사
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Priority to KR1020120114249A priority Critical patent/KR101212244B1/en
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Publication of KR101212244B1 publication Critical patent/KR101212244B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage leveling device for a mask aligner having a simplified structure. In particular, the mask and the wafer are maintained in parallel while the wafer stage of the mask aligner, which is a key equipment of the semiconductor process, is precisely performed. It is about calibrating.
The present invention uses the stage support to support the wafer stage three points while performing ultra-precision leveling, as well as temporarily fixing the stage support to maintain the parallelism between the mask and the leveled wafers without variation In addition, by arranging the stage fixing cylinder on the outside of the base plate and at the same time simplifying the structure of arranging the leveling air bellows on the lower side of the base plate, sufficient space for installing peripheral components in the center of the base plate is ensured. It is the technical feature of this invention to make it possible.

Description

Stage leveling device for mask aligner with simplified structure}

The present invention relates to a technique for correcting the mask and the wafer to maintain parallelism while performing a very precise leveling of the wafer stage of the mask aligner, which is a key equipment of the semiconductor process.

In the case of recent semiconductor devices, high integration is essential for achieving low cost and high quality required for securing competitiveness. High integration involves scaling down the gate oxide film thickness and channel lengths of transistor elements, and the like, and accordingly, technologies and manufacturing systems of semiconductor manufacturing processes are being developed in various forms.

One of the semiconductor manufacturing processes, photo-lithography, is a wafer cleaning process that removes foreign matter from the wafer surface, a surface treatment process for treating the surface of the wafer so that the photoresist film adheres well to the wafer, and a desired thickness of the photoresist film on the wafer. in

A photoresist coating process, a mask or a reticle (hereinafter referred to as a "mask"), which is uniformly applied, is placed on the photosensitive film-coated wafer to expose light on the mask so that a circuit pattern drawn on the mask is formed on the wafer; and An exposure process and a developing process of removing a photosensitive film deformed by exposure through a cleaning liquid, and in particular, a semiconductor device performing an alignment / exposure process is called a mask aligner.

In the above-mentioned conventional mask aligner, mask stages on which a mask having a predetermined pattern is engraved are seated, a wafer stage on which a wafer on which a pattern of the mask is etched is seated, and a projection provided therebetween. It includes an optical system.

A mask on which a circuit pattern is formed is mounted on the mask stage, and the wafer stage selects a position to be exposed by moving horizontally and vertically after mounting a wafer adsorbed by vacuum.

As a prior art related to such a mask aligner, "Patent Application No. 2009-0014342, Name / Mask aligner apparatus for performing a plurality of photolithography operations with one mask and a method using the same" has been proposed.

The prior art discloses a technique in which a wafer mounting means for mounting a wafer is movable in two-dimensional x and y directions, and a mask mounting means for supporting a mask is movable in two-dimensional x and y directions.

All other mask aligners including this prior art can only move the wafer mounting means or the mask mounting means in the two-dimensional x and y directions, but the maximum of the core technology for eliminating the focus defect that appears on the surface of the wafer during exposure. No technique has been disclosed for the calibration of the key to maintain parallelism between the mask and the wafer.

However, in the production process of the mask aligner, a very small design and processing error occurs, which causes the light that passes through the lens portion at a predetermined point on the wafer when the wafer seated on the wafer stage is inclined very finely. You get out. In other words, localized poor focus (defocus) appears on the wafer surface during exposure.

As a result, there is a problem that the quality and yield of the semiconductor device are deteriorated eventually, as well as a problem that the pattern of the mask is not accurately formed on the wafer due to defocus.

SUMMARY OF THE INVENTION The present invention is to actively solve all the problems of the above-described conventional mask aligner, and supports the wafer stage by three points using a stage supporter installed in a vertical flow state above and above a plurality of leveling air bellows. The problem of the present invention is to enable ultra-precision leveling, and to temporarily fix the stage support at the same time as leveling is completed to maintain the parallelism between the mask and the wafer without variation.

In addition, the present invention is directly connected to the outer surface of the support guide holder of the stage fixed cylinder, and the structure is sufficient to install the peripheral accessory module in the central portion of the base plate by simplifying the structure to arrange the leveling air bellows on the lower side of the base plate It is another object of the present invention to ensure space.

In addition, another object of the present invention is that the wear prevention plate provided on the bottom surface of the wafer stage is supported on the upper end of the stage support to suppress the wear of the wafer stage.

The present invention connects the bellows bottom plate and the base plate spaced apart at a plurality of points along the circumferential direction on the lower side of the base plate as a means for solving the above problems through a plurality of connecting rods, the upper end of the bellows bottom plate A bellows upper plate having a connecting protrusion formed therein so as to be movable up and down while penetrating the connecting rod, and a leveling air bellows is integrally installed between the bellows upper plate and the bellows lower plate, while the connecting protrusion penetrates the base plate. It is connected to the inside of the support guide holder is installed on the upper surface of the base plate, and inside the support guide holder is installed on the top of the connecting protrusions the stage support that the three-point support pin is exposed to the upper outward, While the wafer stage is seated and installed on the upper end of the stage support, the way A plurality of guide bolts penetrating the stage up and down integrally screwed to the support guide holder, and a stage fixing cylinder is directly installed on the outer surface of the support guide holder, but the pressure head of the stage fixing cylinder is the support guide. A technique for selectively pressing and securing the stage support through the holder is devised.

According to the present invention, even if a slight error in design and processing occurs during the production of the mask aligner, there is a fear that the mask and the wafer will be generated on the wafer surface during exposure by automatically correcting the mask and the wafer to maintain parallelism with each other through the leveling of the wafer stage. By eliminating the large defocus phenomenon, the quality and yield of the wafer can be dramatically improved, and the mask pattern is more precisely formed on the wafer, thereby producing a low-cost, high-quality wafer.

In addition, the present invention is the stage fixing cylinder is directly connected to the outer surface of the plurality of support guide holders installed on the base plate, as well as the leveling air bellows sufficient space in the center of the base plate through a structural change disposed on the lower side of the base plate By providing a vision system (backside scoop module) installed in the interior of the conventional wafer chuck in the space to simplify the overall structure as well as to provide an effect that can be compactly miniaturized the wafer chuck.

In addition, the present invention is provided with a wear prevention plate on the bottom surface of the wafer stage supported on the upper end of the stage support to suppress the occurrence of wear of the wafer stage to provide an effect of significantly improving the durability.

1 is a front sectional view of a stage leveling device to which the present invention is applied.
Figure 2 is a plan view of the support guide holder is installed on the base plate of the present invention
Figure 3 is an exploded perspective view of the base plate and the wafer stage of the present invention
Figure 4 is a longitudinal cross-sectional view of the main portion of the base plate on the bottom, the stage support and the leveling air bellows respectively installed on the bottom
5 is a longitudinal sectional view of a state in which the wafer stage of the present invention performs leveling;
Figure 6 is an enlarged cross-sectional view of the stage support is fixed in accordance with the operation of the stage fixing cylinder of the present invention
Figure 7 is an enlarged view of the installation state of the wear prevention plate and the anti-injury spring of the present invention
8 is a plan view of the coupling state of the bellows top plate and the connecting rod of the present invention

Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings.

Looking at the overall configuration of the stage leveling device (L) according to the preferred embodiment of the present invention based on the accompanying drawings schematically, the base plate 10, the bellows lower plate 20, the bellows upper plate 30, the leveling air bellows 40 It can be seen that the support guide holder 50, the stage support 60, the wafer stage 70, the guide bolt 80 and the stage fixed cylinder 90 of the organic coupling configuration.

In addition, the present invention is characterized by automatically correcting the mask (3) and the wafer (2) to maintain the parallelism while performing the high leveling of the wafer stage 70 through the organic coupling configuration between these components Shall be.

Hereinafter, the present invention made of the above-described schematic configuration will be described in more detail.

Base plate 10 of the present invention is installed so as to be movable in the Z-axis direction by a known Z-axis moving device, the lower side of the base plate 10 bellows lower plate 20 at a plurality of points along the circumferential direction Spaced apart but the base plate 10 and the bellows lower plate 20 is integrally connected via a plurality of connecting rods 21 arranged at equal intervals along the circumferential direction.

Here, the bellows lower plate 20 of the present invention is installed at three points at 120 ° intervals below the base plate 10 while forming a pair together with the bellows upper plate 30.

The bellows upper plate 30 is installed on the upper side of the bellows lower plate 20, and the bellows upper plate 30 is formed with a plurality of guide holes 31 penetrating up and down at equal intervals along the circumferential direction as shown in FIG. 8. The guide hole 31 may move up and down along the connecting rod 21 by penetrating through the connecting rod 21, and the connecting protrusion 32 formed at the center of the upper end is exposed through the base plate 10. .

A leveling air bellows 40 is integrally installed between the bellows upper plate 30 and the bellows lower plate 20, and the bellows lower plate 20 can supply air to the leveling air bellows 40. An air inlet 41 is formed.

The leveling air bellows 40 serves as a shock absorber that exhibits a buffering force to absorb even when an impact is transmitted to the bellows upper plate 30 by supplying air therein, and finely buffers the buffering force according to the supply amount of air. In particular, the present invention provides a special effect of smoothly performing leveling while supporting the three points of the wafer stage 70 most stably by being installed at three locations.

The base plate 10 has a plurality of holder fitting grooves 11 recessed at equal intervals on the upper surface of the point where the connecting protrusion 32 is exposed to the upper portion, and the holder fitting groove 11 has a cylindrical shape. A plurality of support guide holder 50 is integrally fixed and installed in a fitted state, the connecting protrusion 32 is connected to the inside of the support guide holder 50 fixedly installed as shown in FIGS.

Inside the support guide holder 50, the stage support 60 is installed to be movable up and down in a state seated directly on the connecting protrusion 32, the stage support 60 is three points protruding on the upper end The support pins 61 are exposed outwardly from the support guide holder 50.

Here, the departure prevention plate 63 is fitted to the outside of the three-point support pin 61, as shown in Figure 7, the departure prevention plate 63 is the upper end of the support guide holder 50 using a fastener By being integrally fixed to the stage supporter 60 is effectively prevented from being separated to the outside.

In addition, the stage support 60 may be directly seated on the upper end of the connecting protrusion 32, but is not limited thereto, and a separate lifting rod 65 is additionally added to the upper end of the connecting protrusion 32. Connected and installed, the upper portion of the elevating rod 65 may be fitted to the rod insertion portion 62 is formed recessed in the lower end of the stage support 60, in this case the three-point support pin 61 The impact applied to the leveling air bellows 40 via the elevating rod 65 can be resolved.

The wafer stage 70 is seated and installed on an upper end of the three-point support pin 61 of the stage support 60, and a known wafer chuck 1 is installed on the wafer stage 70. It can be fixed by vacuum adsorption.

At this time, the wafer stage 70 seated on the upper end of the three-point support pin 61 is attached to the bottom surface of the wafer stage 70 by attaching a wear preventing plate 72 made of a material having high rigidity and detachability. The restrained wear caused by the friction with the three-point support pin 61 can be significantly extended life.

In addition, a flow preventing groove 72a is further formed on the bottom surface of the wear preventing plate 72, and the wafer stage 70 is formed by inserting a three-point support pin 61 into the flow preventing groove 72a. By preventing flow occurring in the dimensional direction, the wafer stage 70 maintains an accurate center position, thereby eliminating the occurrence of errors in which the pattern of the mask 3 is formed off the surface of the wafer 2, thereby further reducing the defective rate of the product. Provide effect.

The wafer stage 70 has a plurality of bolt fastening holes 81 formed along the circumferential direction, and a plurality of guide bolts 80 are coupled to each other through the bolt fastening holes 81 as shown in FIG. The lower side of the bolt 80 is screwed to the upper end of the support guide holder 50 to maintain the integrity of the wafer stage 70 is not separated from the support guide holder 50 as well as to perform leveling. In this case, the lower stage of the wafer stage 70 may be smoothly guided, and the initial setting for maintaining the distance between the wafer stage 70 and the support guide holder 50 may be freely adjusted.

In addition, a spring connector 101 is coupled to the bottom surface of the wafer stage 70 and the inner surface of the support guide holder 50, respectively, as shown in FIG. 7, and the anti-floating spring 100 is provided on the spring connector 101. By being connected, the wafer stage 70 can be pulled downward to prevent the unnecessary upward injury and the wafer stage 70 can be stably placed on the top of the three-point support pin 61 at all times.

On the other hand, a stage fixing cylinder 90 is directly installed on the outer surface of the support guide holder 50 as shown in FIG. 4, and a pressure head 93 is formed at the tip of the piston rod 91 of the stage fixing cylinder 90. The pressing head 93 is fixed while pressing linearly the side surface of the stage support 60 while linearly moving through the head through hole 53 formed in the support guide holder 50 as shown in FIG. 6. Keep it.

That is, the stage supporter 60 stably supports the wafer stage 70 in up and down free flow state when performing the leveling while being provided with the elastic force of the leveling air bellows 40, and the wafer stage 70. When the leveling is completed, the mask 3 and the wafer 2 are super-precise in parallel by serving to fix the wafer stage 70 while temporarily maintaining the fixed state according to the operation of the stage fixing cylinder 90. Will be able to maintain.

In the present invention, the stage fixing cylinder 90 is directly installed on the outer surface of the support guide holder 50, and the leveling air bellows 40 is disposed below the base plate 10 as described in the former. By implementing the new core technology to secure the accessory module installation space 15 in the center of the base plate 10 as shown in FIG.

Accordingly, by installing an accessory module such as a vision system (backside scoop module) that is installed inside the conventional wafer chuck 1 in the accessory module installation space 15, the height of the wafer chuck 1 is relatively reduced. Not only can it be configured, but also provides a special effect that can simplify the overall structure of the stage leveling device (L).

According to the present invention having such a configuration, when the entire stage leveling device L including the base plate 10 is lifted in the Z-axis direction according to the operation of the Z-axis moving device, the wafer 2 seated on the wafer chuck 1 is The upper and lower surfaces of the mask 3 fixedly mounted to the mask mount 4 while being elevated together are closely contacted with the upper surface, and then the entire area of the upper surface is closely contacted with each other to perform automatic leveling. ) And automatic correction to maintain parallelism between the ultra precision.

In addition, in the leveling process, the three-point support pin 61 transmits an impact generated when the wafer 2 is in close contact with the mask 3 to the leveling air bellows 40 to completely absorb the mask 3. ) And the damage of the wafer 2 at the source, and when the leveling of the wafer 2 is completed, the mask is temporarily fixed by temporarily fixing the stage support 60 that supported the wafer stage 70 in a vertical flow state. The parallelism between 3) and the wafer 2 can be maintained without change.

1: wafer chuck 2: wafer
3: mask 4: mask mount
10: base plate 15: accessory module installation space
20: lower bellows 21: connecting rod
30: bellows top 31: guide ball
32: connecting protrusion 40: leveling air bellows
50: support guide holder 60: stage support
61: 3-point support pin 63: Breakaway prevention plate
65: elevating rod 70: wafer stage
72: wear prevention plate 72a: flow prevention groove
80: guide bolt 81: bolt fastener
90: stage fixing cylinder 93: pressurizing head
100: anti-floating spring 101: spring connector

Claims (8)

A base plate 10 installed to be movable in the Z-axis direction;
A bellows lower plate 20 installed spaced apart at a plurality of points along the circumferential direction under the base plate 10 and connected to the base plate 10 by a plurality of connecting rods 21;
A bellows upper plate 30 installed at an upper portion of the bellows lower plate 20 while penetrating through the connecting rod 21, and having a connection protrusion 32 protruding at an upper end thereof through the base plate 10 and exposed upward;
A leveling air bellows (40) integrally connected between the bellows upper plate (30) and the bellows lower plate (20);
A plurality of support guide holders 50 fixedly installed on an upper surface of the base plate 10 and connected to the connection protrusions 32;
A stage supporter 60 installed in the supporter guide holder 50 in a state seated on the connecting protrusion 32, and having a three-point support pin 61 formed at an upper end thereof;
A wafer stage 70 mounted on an upper end of the stage support 60;
A plurality of guide bolts 80 screwed to the support guide holder 50 through the wafer stage 70;
Directly installed on the outer surface of the support guide holder 50, the pressing head 93 formed at the tip of the piston rod 91 penetrates the support guide holder 50 to selectively press the stage support 60 Stage leveling device for a mask aligner of the simplified structure, characterized in that consisting of a stage fixing cylinder (90) for fixing.
The method of claim 1,
An elevating rod 65 is additionally installed at an upper end of the connecting protrusion 32, and an upper portion of the elevating rod 65 is formed in the rod inserting portion 62 recessed at the lower end of the stage support 60. Stage leveling device for a mask aligner of the simplified structure characterized in that the fitting is supported.
The method of claim 1,
On the outside of the three-point support pin 61 is installed a separation prevention plate 63 to prevent the separation of the stage support 60, the release prevention plate 63 is the upper end of the support guide holder 50 Stage leveling device for a mask aligner of the simplified structure, characterized in that fixed to the installation.
The method of claim 1,
When the stage leveling device L including the base plate 10 moves up and down, the wafer 2 seated on the wafer chuck 1 installed on the top of the wafer stage 70 is mounted on the mask mount 4. The leveling air bellows 40 is applied to the bottom surface of the mask 3 while automatically leveling, and the three-point support pin 61 receives an impact generated when the wafer 2 is brought into close contact with the mask 3. A stage leveling device for a mask aligner, characterized by absorbing while transmitting to the.
The method of claim 1,
The wafer stage 70 seated in the ground state at the upper end of the three-point support pin 61 is detachably attached to the bottom surface of the wafer stage 70 to prevent abrasion caused by friction. A stage leveling device for a mask aligner having a simplified structure.
6. The method of claim 5,
A flow preventing groove 72a is further formed on the bottom of the wear preventing plate 72, and the three-point support pin 61 is fitted into the flow preventing groove 72a to prevent the flow of the wafer stage 70. A stage leveling device for a mask aligner having a simplified structure.
The method of claim 1,
An accessory module installation space 15 is provided in the center of the base plate 10, and the accessory module installation space 15 includes an accessory module such as a vision system (backside scoop module) installed inside the wafer chuck 1. Stage leveling device for a mask aligner of the simplified structure, characterized in that the installation is simplified.
The method of claim 1,
Spring connectors 101 are coupled to the bottom surface of the wafer stage 70 and the inner surface of the support guide holder 50, respectively. Stage leveling device for a mask aligner of the simplified structure, characterized in that the injury prevention spring 100 is installed to prevent injury to the.
KR1020120114249A 2012-10-15 2012-10-15 Stage leveling device for mask aligner with simplified structure KR101212244B1 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101347397B1 (en) * 2013-08-19 2014-01-06 마이다스시스템주식회사 Air floating fype the vacuum chuck leveling device for mask aligner
KR101360954B1 (en) * 2013-09-23 2014-02-12 마이다스시스템주식회사 Stage leveling device for mask aligner with improved leveling performance
KR101671390B1 (en) * 2016-08-16 2016-11-02 마이다스시스템주식회사 Stage leveling device for high performance mask aligner
KR20180071166A (en) * 2016-12-19 2018-06-27 캐논 가부시끼가이샤 Imprint apparatus and method of manufacturing article
CN115206414A (en) * 2022-07-29 2022-10-18 无锡地心科技有限公司 Multi-degree-of-freedom alignment platform guided by flexible reed
CN117572732A (en) * 2024-01-16 2024-02-20 上海图双精密装备有限公司 Leveling auxiliary device and leveling method

Citations (1)

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Publication number Priority date Publication date Assignee Title
KR100422721B1 (en) 1995-09-04 2005-02-23 우시오덴키 가부시키가이샤 Mask and workpiece gap setting device

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
KR100422721B1 (en) 1995-09-04 2005-02-23 우시오덴키 가부시키가이샤 Mask and workpiece gap setting device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101347397B1 (en) * 2013-08-19 2014-01-06 마이다스시스템주식회사 Air floating fype the vacuum chuck leveling device for mask aligner
KR101360954B1 (en) * 2013-09-23 2014-02-12 마이다스시스템주식회사 Stage leveling device for mask aligner with improved leveling performance
KR101671390B1 (en) * 2016-08-16 2016-11-02 마이다스시스템주식회사 Stage leveling device for high performance mask aligner
EP3285120A1 (en) * 2016-08-16 2018-02-21 Midas System Co., Ltd. Stage leveling device for high performance mask aligner
WO2018034380A1 (en) * 2016-08-16 2018-02-22 마이다스시스템주식회사 High-performance mask aligner stage levelling apparatus having improved levelling maintenance force
CN107768293A (en) * 2016-08-16 2018-03-06 美达思系统株式会社 Smooth the high-performance mask aligner workbench leveling apparatus of maintenance energy lifting
KR20180071166A (en) * 2016-12-19 2018-06-27 캐논 가부시끼가이샤 Imprint apparatus and method of manufacturing article
KR102257509B1 (en) 2016-12-19 2021-05-31 캐논 가부시끼가이샤 Imprint apparatus and method of manufacturing article
CN115206414A (en) * 2022-07-29 2022-10-18 无锡地心科技有限公司 Multi-degree-of-freedom alignment platform guided by flexible reed
CN115206414B (en) * 2022-07-29 2024-05-17 无锡地心科技有限公司 Multi-degree-of-freedom alignment platform guided by flexible reed
CN117572732A (en) * 2024-01-16 2024-02-20 上海图双精密装备有限公司 Leveling auxiliary device and leveling method

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