JP5754535B2 - Imprint method and imprint apparatus - Google Patents

Description

  The present invention relates to an imprint method and an imprint apparatus for transferring a fine uneven transfer pattern formed on an imprint mold to a curable resin formed on a substrate to be transferred. It relates to alignment technology.

  In recent years, especially for semiconductor devices, high speed operation and low power consumption operation are required due to further progress in miniaturization, and high technology such as integration of functions called system LSIs is required. Under such circumstances, the lithography technology that is necessary for producing the pattern of the semiconductor device has become very expensive as the exposure apparatus and the like as the pattern becomes finer, and the price of the mask used therefor also becomes expensive. Yes.

  On the other hand, the nanoimprint method (also called imprint method) proposed by Chou et al. In Princeton University in 1995 is a fine pattern formation technology having a high resolution of about 10 nm while the apparatus price and the materials used are low. (Patent Document 1).

  In the imprint method, a mold (also referred to as a template, a stamper, or a mold) in which a nanometer-sized uneven pattern is formed on a surface in advance is pressed against a resin formed on the surface of a substrate to be transferred such as a semiconductor wafer. Is a technique for transferring the concavo-convex pattern by mechanically deforming the substrate, and processing the substrate to be transferred using the resin having the pattern transferred as a resist mask. Once the mold is made, the nanostructure can be easily and repeatedly molded, resulting in high throughput and economics, and because it is a nano-processing technology with little harmful waste, not only semiconductor devices in recent years, Application to various fields is expected.

  As such an imprint method, there are known a thermal imprint method in which a concavo-convex pattern is transferred by heat using a thermoplastic resin, and a photo imprint method in which a concavo-convex pattern is transferred by ultraviolet rays using a photocurable resin. (Patent Document 2).

  The optical imprint method can transfer a pattern at a low applied pressure at room temperature, and does not require a heating / cooling cycle like the thermal imprint method and does not cause dimensional changes due to mold or resin heat. It is said that it is excellent in terms of productivity.

Here, when the concavo-convex pattern is transferred to the transfer substrate using the imprint method as described above, it is necessary to precisely align the mold and the transfer substrate.

Generally, alignment is performed by optically detecting an alignment mark provided on the mold side and an alignment mark provided on the transfer substrate from the mold side.
FIG. 5 is a schematic cross-sectional view showing an example of a conventional imprint mold.

  As shown in FIG. 5, the imprint mold 101 generally has a mesa structure made of a transparent material, and has a transfer region 102 and a mold-side alignment mark region 103 on the top surface of the mesa structure. In general, the mold-side alignment mark is a mark having a step structure obtained by processing the imprint mold 101 into a concavo-convex shape.

  Next, an example of a conventional imprint method is shown in FIG. Here, FIG. 6A is a schematic cross-sectional view showing the relationship between the imprint mold and the resin provided on the transfer substrate, and FIG. 6B is the optical path length of the detection light at the alignment mark. FIG.

  As shown in FIG. 6A, when the uneven transfer pattern of the imprint mold is aligned and transferred, first, the imprint mold is applied to the curable resin 121 before curing formed on the transfer substrate 111. 101 is brought into contact, the detector 131 optically detects the alignment mark in the mold side alignment mark region 103 and the alignment mark in the substrate side alignment mark region 113, and the mold 101 and the substrate to be transferred so as to correct the deviation. 111 is moved relatively to align both positions.

  Then, the curable resin 121 is cured in the aligned state, thereby transferring the uneven pattern of the mold.

  As described above, the alignment is performed in a state where the mold 101 is in contact with the curable resin 121 on the transferred substrate 111 because the mold 101 is aligned after the mold 101 is separated from the transferred substrate 111. This is because a positional shift (so-called lock shift) occurs in the process of bringing the mold 101 into contact with the curable resin 121 on the transfer substrate 111 in the method of bringing the mold 101 into contact with the curable resin 121 on the transfer substrate 111.

JP-T-2004-504718 JP 2002-93748 A JP 2007-103915 A

  However, when the mold is brought into contact with the curable resin for alignment, the unevenness of the mold side alignment mark is filled with the curable resin, and in such a state, the refraction of the mold material constituting the mold side alignment mark is caused. Since the refractive index and the refractive index of the curable resin are almost the same, there is a problem that it is difficult to optically identify the mold-side alignment mark.

  Here, in general, a structure can be recognized by refraction, scattering, or reflection of light at the interface between substances having greatly different refractive indexes. However, when the difference in refractive index is small as described above, it is difficult to recognize the structure, and the difference in the optical path length is important in order to obtain contrast in a fine structure.

  For example, as shown in FIG. 6 (b), it enters the convex part and concave part of the mold side alignment mark from the back side of the mold 101 (upper side in FIG. 6 (b)), passes through the resin 121 and is transferred to the substrate. The difference between the optical path lengths of the detection light beams 132a and 132b reflected on the surface of the mold 111 is as follows. 2t | n2-n1 |.

  Here, the detection light 132a, 132b uses light in a wavelength region where the photo-curing resin is not cured, and generally uses a wavelength in the visible light region.

In addition, the refractive index of light having a wavelength of 633 nm of SiO ₂ that is a general mold material is 1.45, and the refractive index of the curable resin used in the imprint method is generally 1.5. Degree.

  Therefore, for example, assuming that a light source having a single wavelength of 633 nm is used as the light source for detection light, the step t between the convex portion and the concave portion of the mold side alignment mark is 150 nm, the refractive index n1 of the mold material is 1.45, and the curing is performed. Assuming that the refractive index n2 of the mold resin is 1.50 and calculating the above equation, the optical path length difference obtained is 15 nm, and this value is only about 1/40 of the wavelength of 633 nm. It becomes difficult to identify well.

To solve this problem, for example, a surface layer made of a second material having a refractive index larger than 1.7 is formed on a mold substrate made of a material such as SiO ₂ , and the surface layer is etched to form a mold. A method of forming a side alignment mark has been proposed (Patent Document 3), but this method complicates the mold creation process.

  In addition, it is necessary to develop a technique for forming a film with a high refractive index material as described above on the mold surface and a technique for processing the high refractive index material as described above into an alignment mark structure. Therefore, it is necessary to evaluate reliability such as imprint resistance and cleaning resistance of the mold using the rate material, which is not preferable.

  The present invention has been made in view of the above circumstances, and enables alignment marks made of the same material as the mold material to be optically identified without requiring a complicated process for manufacturing the mold, and has high alignment accuracy. It is an object of the present invention to provide an imprint method and an imprint apparatus that can be aligned with each other.

  As a result of various studies, the present inventors have made at least the refractive index of the curable resin formed on the substrate side alignment mark region different from the refractive index value of the conventional curable resin, and The present invention has been completed by finding that the above-mentioned problems can be solved by widening the difference from the refractive index.

  That is, the invention according to claim 1 of the present invention includes an imprint mold having a transfer region in which an uneven transfer pattern is formed and a mold side alignment mark region in which a mold side alignment mark is formed, and the transfer of the unevenness. Using a transferred substrate having a transferred region to which a pattern is transferred and a substrate-side alignment mark region on which a substrate-side alignment mark is formed, the mold-side alignment mark and the substrate-side alignment mark are optically aligned. An imprint method for transferring a transfer pattern of the mold to a curable resin formed on the transfer substrate, wherein the curable resin formed on the transfer substrate is the transfer region A different resin is formed on the substrate-side alignment mark region and on the substrate to be transferred. The curable resin to be formed is formed by dropping at a desired position using an ink jet method, so that a curable resin having a different refractive index is formed on the transferred region and the substrate-side alignment mark region. Each of the imprint methods is characterized by being formed.

  Further, the invention according to claim 2 of the present invention is an imprint mold having a transfer region in which an uneven transfer pattern is formed and a mold-side alignment mark region in which a mold-side alignment mark is formed; The mold-side alignment mark and the substrate-side alignment mark are aligned using a substrate to be transferred having a substrate-side alignment mark region on which the substrate-side alignment mark is formed, and the transfer pattern of the mold is transferred to the transfer target An imprint apparatus for transferring to a curable resin formed on a substrate, the mold holding means for holding the mold, the transferred substrate holding means for holding the transferred substrate, and the transferred substrate of the transferred substrate A curable resin having a different refractive index is applied to the region and the substrate side alignment mark region. Detection for optically detecting resin forming means to be formed, moving means for relatively moving the mold and the transferred substrate, and a mold side alignment mark of the mold and a substrate side alignment mark of the transferred substrate And a control means for controlling the mold holding means, the transferred substrate holding means, the resin forming means, the moving means, and the detecting means, and on the transferred region of the transferred substrate and the substrate side alignment. The resin forming means for forming curable resins having different refractive indexes on the mark region is means for forming a desired resin by dropping at a desired position using an ink jet method, and the mold is formed by the detecting means. Relative position information between the side alignment mark and the substrate side alignment mark is detected, and based on the detected relative position information. Te, by the moving means via the control unit, an in-printing apparatus and performs the alignment by moving the said transfer substrate and the mold.

  According to the present invention, it is possible to optically identify an alignment mark made of the same material as the molding material without requiring a complicated process for manufacturing the mold, and position the mold and the transfer substrate with high alignment accuracy. In combination, the transfer pattern can be imprinted.

It is explanatory drawing which shows an example of the imprint method which concerns on this invention, (a) is typical sectional drawing which shows the relationship between the mold for imprint, and resin provided on the to-be-transferred substrate, (b) is It is a schematic diagram explaining the optical path length of the detection light in an alignment mark. It is explanatory drawing which shows the other example of the imprint method which concerns on this invention, (a) is typical sectional drawing which shows the relationship between the mold for imprint, and resin provided on the to-be-transferred substrate, (b) ) Is a schematic diagram illustrating the optical path length of the detection light in the alignment mark. It is process drawing which shows an example of the pattern transfer process using the imprint method which concerns on this invention. It is the schematic which shows the structure of the imprint apparatus which concerns on this invention. It is typical sectional drawing which shows the example of the conventional mold for imprint. It is explanatory drawing which shows an example of the conventional imprint method, (a) is typical sectional drawing which shows the relationship between the mold for imprint, and resin provided on the to-be-transferred substrate, (b) is an alignment mark. It is a schematic diagram explaining the optical path length of the detection light in.

[Imprint method]
First, the imprint method according to the present invention will be described.

(First embodiment)
FIG. 1 is an explanatory view showing an example of an imprint method according to the present invention, and (a) is a schematic cross-sectional view showing a relationship between an imprint mold and a resin provided on a transfer substrate, (B) is a schematic diagram explaining the optical path length of the detection light in an alignment mark.

  As shown in FIG. 1A, in this embodiment, first, the imprint mold 1 is brought into contact with the curable resin 21 before curing according to the present invention formed on the substrate 11 to be transferred. The mold 31 optically detects the alignment mark in the mold-side alignment mark region 3 and the alignment mark in the substrate-side alignment mark region 13 and relatively moves the mold 1 and the transferred substrate 11 so as to correct the deviation. And align the position of both.

  Then, by curing the curable resin 21 in the aligned state, the concavo-convex transfer pattern of the mold is transferred.

  Here, when the mold 1 is brought into contact with the curable resin 21 for alignment, the concave portion of the mold side alignment mark is filled with the curable resin 21.

  Since the refractive index of the conventional curable resin is about 1.5, it is difficult to optically identify the mold side alignment mark when the concave part of the mold side alignment mark is filled with the curable resin. .

  However, since the curable resin 21 according to the present invention has a refractive index of 1.7 or more at an average wavelength of a light source used for optical alignment, for example, a light source having a single wavelength of 633 nm is used as a light source of detection light. In this case, as shown in FIG. 1 (b), it enters the convex and concave portions of the mold side alignment mark from the back side of the mold 1 (upper side in FIG. 1 (b)), passes through the resin 21, and is transferred to the substrate. 11. The difference in the optical path lengths of the detection lights 32a and 32b reflected from the surface is as follows. The refractive index n1 of the mold material is 1.45, and the step t between the convex part and the concave part of the mold side alignment mark is 150 nm. Since the rate n2 is 1.7 or more, 2t | n2-n1 | ≧ 75 nm.

  Since this value corresponds to 1/8 or more of the wavelength of 633 nm, it is possible to optically identify the mold side alignment mark.

  The curable resin 21 having a refractive index of 1.7 or more at the average wavelength of the light source used for optical alignment as described above is obtained by using a conventional method in which a substance having a high refractive index is mixed into the curable resin. be able to. For example, a conventional method may be used in which titanium oxide having a refractive index of 2.4 is finely granulated and dispersed in a conventional curable resin.

(Second Embodiment)
Next, another embodiment of the imprint method according to the present invention will be described.
FIG. 2 is an explanatory view showing another example of the imprint method according to the present invention, and (a) is a schematic cross-sectional view showing the relationship between the imprint mold and the resin provided on the transfer substrate. FIG. 6B is a schematic diagram illustrating the optical path length of the detection light in the alignment mark.

  As shown in FIG. 2A, in the present embodiment, the curable resin formed on the transferred substrate 11 is different between the resin 21a on the transferred region 12 and the substrate-side alignment mark region 13. 21b is formed, and the refractive index at the average wavelength of the light source used for optical alignment of the curable resin 21b before curing formed on the substrate side alignment mark region 13 is 1.7 or more.

  On the other hand, the refractive index at the average wavelength of the light source used for optical alignment of the curable resin 21a before curing formed on the transferred region 12 does not need to be 1.7 or more. You may use the thing of a grade.

  By adopting such a form, in addition to the effect of improving the detection accuracy of the mold side alignment mark as described in the first embodiment, it is possible to achieve the effect of preventing the deterioration of the pattern transfer resolution. .

  For example, as in the first embodiment, the resin 21b on the substrate-side alignment mark region 13 is made of a curable resin mixed with a material having a high refractive index such as titanium oxide, thereby improving alignment accuracy. On the other hand, as the resin 21a on the transferred region 12 which is required to transfer and transfer the mold transfer pattern with high resolution, a conventional curable resin with a proven track record or a resin pursuing higher resolution can be used. Can be used, and a fine pattern can be formed without being affected by degradation of resolution due to contamination of foreign matters such as titanium oxide.

  A method of forming different resins 21a and 21b on the transfer region 12 and the substrate-side alignment mark region 13 of the transfer substrate 11 includes, for example, a desired amount of a desired resin at a desired position using an inkjet method. Only the dropping method can be used.

  For example, a curable resin having a refractive index of 1.7 or more as described above is dropped on the substrate-side alignment mark region 13 of the transfer substrate 11 and the other transfer substrate 11 including the transfer region 12 is formed. For this, a curable resin that has been used in conventional imprinting may be formed by dropping.

  FIG. 3 is a process diagram showing an example of a pattern transfer process using the imprint method according to the second embodiment of the present invention.

  The imprint method according to the present invention is characterized in that a curable resin having a refractive index different from the conventional one is used as described above, and that the curable resin is formed on at least the substrate side alignment mark region. Conventional methods can be used for other processes such as a mold contact process, a resin curing process, and a mold release process.

  First, as shown in FIG. 3A, an imprint mold 1 according to the present invention is prepared, an uncured curable resin 21a is formed on a transfer area 12 on a transfer substrate 11, and the substrate side An uncured curable resin 21 b is formed on the alignment mark region 13.

  Here, the refractive index at the average wavelength of the light source used for optical alignment of the curable resin 21b before curing formed on the substrate side alignment mark region 13 is 1.7 or more. On the other hand, the refractive index at the average wavelength of the light source used for optical alignment of the curable resin 21a before curing formed on the transferred region 12 does not need to be 1.7 or more. Something about can be used.

  Next, as shown in FIG. 3B, the mold 1 and the resins 21a and 21b on the substrate 11 to be transferred are brought into contact with each other, and the position information of the mold side alignment mark and the opposing substrate side alignment mark is detected light 32. Is detected by the detector 31 to align the mold 1 and the substrate 11 to be transferred.

At this time, although the concave portion of the mold side alignment mark is filled with the curable resin 21b, the refractive index at the average wavelength of the light source used for optical alignment of the curable resin 21b is 1.7 or more. It is possible to sufficiently identify the mold side alignment mark made of SiO ₂ which is a simple mold material.

  Next, as shown in FIG. 3 (c), for example, the resin 21a and 21b are cured by irradiating a predetermined amount of ultraviolet rays 42, and then the mold 1 is released as shown in FIG. 3 (d). Thus, cured resin patterns 22a and 22b are obtained.

  Although FIG. 3 shows an example of the second embodiment described above, pattern transfer can also be performed by the same process in the case of the first embodiment. In this case, the curable resin formed on the transferred substrate 11 is not different between the transferred region 12 and the substrate side alignment mark region 13, and the same curable resin is formed.

[Imprint device]
Next, the imprint apparatus according to the present invention will be described.
The imprint apparatus according to the present invention is characterized in that a curable resin having a refractive index different from that of the conventional one as described above is formed on at least the substrate side alignment mark region. Conventional mechanisms can be used for the mechanism, the resin curing mechanism, and the mold release mechanism.

FIG. 4 is a schematic diagram showing the configuration of the imprint apparatus according to the present invention.
As shown in FIG. 4, an imprint apparatus 50 according to the present invention includes a mold holding unit 52 a that holds an imprint mold 1, a transfer substrate holding unit 52 b that holds a transfer substrate 11, and a transfer substrate 11. Resin forming means 51 including a dispenser for dropping uncured resin at a desired position, the mold 1 is brought into contact with or released from the resin formed on the transfer substrate 11, and the mold 1 and the transfer target are further transferred. In order to perform alignment with the substrate 11, the mold 1, the mold moving means 53a and the transferred substrate moving means 53b for moving the transferred substrate 11, the mold-side alignment mark of the mold 1, and the opposing substrate-side alignment mark Detection means 54 for optically detecting the resin, the resin forming means 51, the mold holding means 52a, the substrate to be transferred. And a control means 55 for controlling the means 52b, the mold moving means 53a, the transferred substrate moving means 53b, the detecting means 54, and the like. The detecting means 54 allows the mold side alignment mark and the opposing substrate side alignment mark to be Relative position information is detected, and based on the detected relative position information, the mold 1 and the transferred substrate 11 are moved by the mold moving means 53a and the transferred substrate moving means 53b via the control means 55 to perform alignment. Is what you do.

  In the case where a photocurable resin is used for imprinting, the imprint apparatus according to the present invention is configured to include the exposure means 56.

  The resin forming means 51 described above forms curable resins having different refractive indexes on the transferred region of the transferred substrate 11 and the substrate-side alignment mark region, respectively. For example, a curable resin having a refractive index of 1.7 or more at an average wavelength of a light source used for optical alignment is dropped on the substrate-side alignment mark region by using an inkjet method, and includes the transferred region 12. On the other substrate 11 to be transferred, a curable resin that has been used for conventional imprinting is dropped.

  Thereby, for example, the curable resin formed on the substrate side alignment mark region is improved in alignment accuracy by using a curable resin mixed with a material having a high refractive index such as titanium oxide as described above. On the other hand, the curable resin on the transfer area can be a conventional curable resin with a proven track record or a resin pursuing higher resolution. A fine pattern can be formed without being affected by the above.

  According to the imprint apparatus according to the present invention, it is possible to eliminate defects caused by resin filling in the alignment mark recesses, optically identify the mold-side alignment mark made of the same material as the molding material, and achieve high alignment accuracy. Thus, the transfer pattern can be imprinted by aligning the mold and the transfer substrate.

  As mentioned above, although each embodiment was described about the imprint method and the imprint apparatus which concern on this invention, this invention is not limited to the said embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

Hereinafter, the present invention will be described more specifically with reference to examples.
Example 1
A synthetic quartz substrate having a length of 152 mm, a width of 152 mm, and a thickness of 0.25 inch is used as a mold substrate. An electron beam resist is applied to a thickness of 200 nm on one main surface of the synthetic quartz substrate, and an electron beam is drawn. After development, dry etching is performed to form a transfer region 2 in which a transfer pattern of a line / space pattern having a depth of 150 nm, a width of 100 nm, and a pitch of 200 nm is formed, and an alignment mark having a periodic structure with a depth of 150 nm. The imprint mold 1 having the mold-side alignment mark region 3 thus formed was formed.

  Next, a substrate having a transferred region 12 and a substrate-side alignment mark region 13 on a silicon wafer having a diameter of 200 mm was prepared as the transferred substrate 11.

  Next, a titanium oxide having a refractive index of 2.4 is dispersed and mixed in the photocurable resin PAK-01 (manufactured by Toyo Gosei Kogyo Co., Ltd.) as the curable resin 21 on the transferred substrate 11 so as to have a wavelength of 633 nm. A resin with a refractive index adjusted to 1.7 was formed, the mold 1 was brought into contact with the resin 21, and the mold-side alignment mark was optically detected using detection light having a wavelength of 633 nm.

The refractive index of SiO ₂ constituting the mold-side alignment mark of the mold 1 with respect to light having a wavelength of 633 nm is 1.45, and the step difference between the convex portion and the concave portion of the mold-side alignment mark is 150 nm. Since the refractive index of the filled resin with respect to light having a wavelength of 633 nm is 1.7, the detection lights 32 a and 32 b that are incident from the back side of the mold 1, pass through the resin 21, and are reflected from the surface of the transfer substrate 11. The difference in optical path length was 75 nm, and the mold side alignment mark could be identified well.

  Next, after aligning the mold 1 and the transferred substrate 11, the resin 21 is cured by irradiating with ultraviolet rays having a wavelength of 320 nm, and the mold 1 is released from the transferred substrate 11 and cured on the transferred substrate 11. The obtained resin pattern 22 was obtained.

(Example 2)
In the same manner as in Example 1 described above, an imprint mold 1 was formed, and a transfer substrate 11 was prepared.

  Next, on the substrate-side alignment mark region 13 of the transfer substrate 11, a titanium oxide having a refractive index of 2.4 is applied to a photocurable resin PAK-01 (manufactured by Toyo Gosei Co., Ltd.) as a curable resin 21b. A resin in which the refractive index for light having a wavelength of 633 nm is adjusted to 1.7 is dispersed and mixed, and the photocurable resin PAK is used as the curable resin 21a on the other substrate to be transferred 11 including the transferred region 12. After forming -01 (manufactured by Toyo Gosei Co., Ltd.), the mold 1 was brought into contact with the resins 21a and 21b, and the mold-side alignment mark was optically detected using detection light having a wavelength of 633 nm.

The refractive index of SiO ₂ constituting the mold-side alignment mark of the mold 1 with respect to light having a wavelength of 633 nm is 1.45, and the step difference between the convex portion and the concave portion of the mold-side alignment mark is 150 nm. Since the refractive index of the filled resin with respect to light having a wavelength of 633 nm is 1.7, the detection lights 32a and 32b that enter from the back side of the mold 1 and pass through the resin 21b and are reflected by the surface of the substrate 11 to be transferred. The difference in optical path length was 75 nm, and the mold side alignment mark could be identified well.

  Next, after aligning the mold 1 and the transferred substrate 11, ultraviolet rays having a wavelength of 320 nm are irradiated to cure the resins 21 a and 21 b, and the mold 1 is released from the transferred substrate 11. Resin patterns 22a and 22b were obtained.

(Comparative Example 1)
In the same manner as in Example 1 described above, an imprint mold 1 was formed, and a transfer substrate 11 was prepared.

  Next, a photocurable resin PAK-01 (manufactured by Toyo Gosei Kogyo Co., Ltd.) is formed on the transfer substrate 11 as the curable resin 21, and the mold 1 is brought into contact with the resin 21 to detect a wavelength of 633 nm. An attempt was made to optically detect the mold side alignment mark using light.

The refractive index of SiO ₂ constituting the mold-side alignment mark of the mold 1 with respect to light having a wavelength of 633 nm is 1.45, and the step difference between the convex portion and the concave portion of the mold-side alignment mark is 150 nm. Since the refractive index of the filled resin with respect to light having a wavelength of 633 nm is about 1.5, the detection lights 32 a and 32 b that enter from the back side of the mold 1, pass through the resin 21, and are reflected from the surface of the transfer substrate 11. The difference in the optical path length is only about 15 nm, and it is difficult to identify the mold side alignment mark well.

DESCRIPTION OF SYMBOLS 1 ... Mold 2 ... Transfer area 3 ... Mold side alignment mark area 11 ... Substrate to be transferred 12 ... Transfer area 13 ... Substrate side alignment mark area 14 ... Substrate side alignment Marks 21, 21a, 21b ... curable resin 22, 22a, 22b ... cured resin pattern 31 ... detector 32, 32a, 32b ... detection light 42 ... ultraviolet ray 50 ... in Printing device 51 ... resin forming means 52 ... holding means 52a ... mold holding means 52b ... transfer substrate holding means 53 ... moving means 53a ... mold moving means 53b ... transferred Substrate moving means 54 ... detecting means 55 ... control means 56 ... exposure means 101 ... mold 102 ... transfer area 103 ... mold side error Ment mark area 111 ... substrate to be transferred 112 ... area to be transferred 113 ... substrate-side alignment mark area 114 ... substrate-side alignment mark 121 ... curable resin 131 ... detectors 132 and 132a 132b... Detection light

Claims (2)

An imprint mold having a transfer region in which a concavo-convex transfer pattern is formed and a mold-side alignment mark region in which a mold-side alignment mark is formed, a transferred region to which the concavo-convex transfer pattern is transferred, and a substrate-side alignment mark The substrate-side alignment mark region having the substrate-side alignment mark region is used, the mold-side alignment mark and the substrate-side alignment mark are optically aligned, and the transfer pattern of the mold is transferred to the substrate-to-be-transferred An imprint method for transferring to a curable resin formed on the substrate,
The curable resin formed on the transferred substrate is formed of a different resin on the transferred region and on the substrate side alignment mark region,
The curable resin formed on the substrate to be transferred is dropped at a desired position using an ink jet method, so that the refractive index differs between the region to be transferred and the alignment mark region on the substrate side. An imprinting method, wherein a curable resin having each of the above is formed. An imprint mold having a transfer region in which an uneven transfer pattern is formed and a mold-side alignment mark region in which a mold-side alignment mark is formed, and a substrate-side alignment mark region in which a transferred region and a substrate-side alignment mark are formed The mold-side alignment mark and the substrate-side alignment mark are aligned with each other using a transfer substrate having a transfer substrate, and the transfer pattern of the mold is transferred to a curable resin formed on the transfer substrate. A printing device,
Mold holding means for holding the mold;
A transfer substrate holding means for holding the transfer substrate;
Resin forming means for forming curable resins having different refractive indexes on the transferred region and the substrate-side alignment mark region of the transferred substrate,
Moving means for relatively moving the mold and the transfer substrate;
Detecting means for optically detecting a mold side alignment mark of the mold and a substrate side alignment mark of the transferred substrate;
A control means for controlling the mold holding means, the transferred substrate holding means, the resin forming means, the moving means, and the detecting means,
Resin forming means for forming a curable resin having different refractive indexes on the transfer region and the substrate-side alignment mark region of the transfer substrate respectively drops the desired resin at a desired position by using an ink jet method. Means to form,
By the detection means,
Detecting relative position information of the mold side alignment mark and the substrate side alignment mark;
Based on the detected relative position information,
By the moving means via the control means,
An imprint apparatus that performs alignment by moving the mold and the substrate to be transferred.

Images