JP4448191B2 - Mold, imprint method, and chip manufacturing method - Google Patents

Description

  The present invention relates to a mold, an imprint method using the mold, and a chip manufacturing method using the mold.

2. Description of the Related Art In recent years, a microfabrication technique for pressure-transferring a fine structure on a mold to a workpiece such as resin or metal has been developed and attracts attention.
This technology is called nanoimprinting or nano-embossing, and has a resolution of the order of several nanometers. Therefore, there is an increasing expectation as a next-generation semiconductor manufacturing technology that can replace optical exposure devices such as steppers and scanners.
Furthermore, since this technique can collectively process a three-dimensional structure on a wafer, it is expected to be applied to manufacturing techniques in the following fields in addition to semiconductors.
For example, it is expected to be applied to a wide range of fields as an optical element such as a photonic crystal, or a biochip manufacturing technology such as μ-TAS (Micro Total Analysis System).

  Such an imprint method, for example, as introduced in Non-Patent Document 1, is applied as follows when applied to semiconductor manufacturing technology. In other words, a work is prepared by providing a photocurable resin layer on a substrate (for example, a semiconductor wafer). And the mold in which the desired uneven | corrugated pattern was formed on the process surface is pressed with respect to the workpiece | work, it further pressurizes, and resin is hardened by irradiating with ultraviolet light. Thus, the pattern is transferred to the resin layer, and etching or the like is performed using the resin layer as a mask layer to form a pattern on the semiconductor wafer.

In such an imprint technique, alignment of the mold and the workpiece becomes an important issue when transferring the uneven pattern of the mold.
In patent document 1, both are aligned as follows.
Specifically, a position reference mark is provided on a light transmissive mold substrate, and a mark corresponding to the position reference mark provided on the mold substrate is also formed on the workpiece side. Then, using these position reference marks, alignment of the mold and the workpiece is performed.
By transmitting light from the upper side of the mold substrate and observing simultaneously the mark for position reference provided on the mold substrate and the mark formed on the workpiece, the mold and the workpiece can be aligned. .

JP 2000-323461 A

Stephan Y. Chou et. al. , Appl. Phys. Lett, Vol. 67, Issue 21, pp. 3114-3116 (1995)

As described above, in the imprint technique, it is important to align the mold and the workpiece when transferring the pattern. For this reason, in Patent Document 1, alignment is performed using a position reference mark provided on the mold substrate and the workpiece side.
However, as a result of intensive studies by the inventor, the inventors have come to the opinion that the following problems occur in the alignment by the above-described method.
That is, when the mold using the light-transmitting alignment structure and the photocurable resin come into contact with each other, the alignment structure becomes unclear because the refractive index difference between the two is small.

The refractive index of the photocurable resin used for the imprint technique is generally about 1.5.
And as a mold main body, quartz is generally used and this refractive index is about 1.45. Thus, since the difference in refractive index between the two is small, even if the mold surface is processed and the unevenness for the alignment structure is provided, it becomes difficult to see due to contact with the resin.
Of course, depending on the required alignment accuracy, the alignment can actually be performed even if the unevenness for the alignment structure is somewhat difficult to see.
However, in the future, alignment with extremely high accuracy will be required. The inventors of the present invention have intensively studied for the purpose of providing a mold suitable for such high-accuracy alignment, and have achieved the present invention.
Another object of the present invention is to provide an imprint method using the mold and a chip manufacturing method.

The mold according to the first invention is
A substrate comprising a first material;
An alignment mark provided on a surface of the substrate and configured to include a second material different from the first material;
With
Refractive index of the second material of a wavelength of 633nm for visible light state, and are 1.7 or more,
The alignment mark is observed when the mold contacts the photocurable resin due to the refractive index difference between the refractive index of the second material and the photocurable resin interposed between the mold and the workpiece. It is characterized by being able to suppress that it becomes difficult to do.
The imprint method according to the second aspect of the present invention includes:
A substrate configured to include a first material, an alignment mark provided on a surface of the substrate and configured to include a second material different from the first material;
Preparing a mold in which the refractive index of the second material with respect to visible light having a wavelength of 633 nm is 1.7 or more;
Between the mold and the work piece, the photocurable resin is interposed so as to directly contact an alignment mark provided on the mold ,
A step of performing position control between the alignment mark and the workpiece while detecting the alignment mark provided on the mold and the alignment mark provided on the workpiece. And
A method for manufacturing a chip according to a third aspect of the present invention includes:
Preparing the mold according to the first aspect of the present invention and a workpiece;
A pattern is formed on the photocurable resin on the workpiece using the mold,
The workpiece is etched using the pattern as a mask.
The mold according to the fourth invention is:
A substrate comprising a first material;
A plurality of convex portions that are alignment marks including a first layer made of a second material different from the first material provided on the surface of the substrate ;
A second layer made of the second material provided between the convex portions on the substrate;
With
The refractive index of the second material with respect to visible light having a wavelength of 633 nm is 1.7 or more, and the refractive index of the second material and the photocurable resin interposed between the mold and the workpiece It is possible to prevent the alignment mark from being difficult to observe when the mold comes into contact with the photocurable resin due to a difference in refractive index, and the layers of the first layer and the second layer The thicknesses are different from each other.
The mold according to the fifth invention is
A substrate comprising a first material;
A plurality of convex portions that are alignment marks including a first layer made of a second material different from the first material provided on the surface of the substrate ;
With
The refractive index of the second material with respect to visible light having a wavelength of 633 nm is 1.7 or more, and the refractive index of the second material and the photocurable resin interposed between the mold and the workpiece It is possible to prevent the alignment mark from being difficult to observe when the mold comes into contact with the photo-curable resin due to a difference in refractive index, and the second substrate is formed on the substrate between the convex portions. No. 2 material is not provided.
The mold according to the sixth aspect of the present invention is
A substrate comprising a first material;
A layer composed of an alignment mark region and an imprint pattern region formed on the surface of the substrate ,
The alignment mark region includes a material having a refractive index of 1.7 or more with respect to visible light having a wavelength of 633 nm, and is photocured interposed between the refractive index of the second material and the mold and the workpiece. It is possible to suppress the difficulty in observing the alignment mark region when the mold comes into contact with the photo-curable resin due to a difference in refractive index with the curable resin .

Furthermore, in order to solve the above-described problems, the present invention includes a mold, a mold manufacturing method, a pressure processing method, and a pressure processing apparatus configured as follows.
The mold according to the present invention includes, for example, a concave portion and a convex portion, and is characterized in that the mold used for pattern formation of the photocurable resin layer is configured as follows.
Specifically, a mold substrate including the first material and a surface layer including the second material and constituting at least a part of the convex portion are provided.
In this case, the first and second materials can transmit light in at least a part of the wavelength range of ultraviolet light, and the second material has a refractive index of 1.7 or more. It is said.
The mold according to the present invention is characterized in that the optical path length of the surface layer is different between the concave portion and the convex portion of the mold.
The mold according to the present invention has an alignment structure, and at least a part of the alignment structure is made of the second material.
The mold according to the present invention is characterized in that the first material and the second material are the same material.
In addition, the mold according to the present invention is characterized in that it is used for manufacturing techniques of any one of a semiconductor, an optical element including a photonic crystal, and a biochip. The mold manufacturing method according to the present invention includes the following steps (1) to (2) in order to manufacture the above-described mold.
(1) A step of forming a surface layer of a second material having a refractive index greater than 1.7 on a mold substrate formed of the first material.
(2) A step of etching the surface layer to form a desired step shape by the uneven portion.
In addition, a method for pressurizing a mold according to the present invention is characterized in that the mold is used for pressurizing.
The mold pressurizes either the mold or the workpiece, passes through the mold from a light source, and cures the photocurable resin of the workpiece by light irradiated from the light source. And it is used when transferring the pattern formed on the processed surface of the mold onto the workpiece.
Moreover, the pressurization processing method of the mold which concerns on this invention is characterized by aligning using the light of the wavelength range which does not harden the said photocurable resin.
Moreover, the pressurization processing apparatus of the mold which concerns on this invention is equipped with the above-mentioned mold, pressurizes either a mold or a to-be-processed member, and irradiation of the light from the light source which permeate | transmits the said mold WHEREIN: The photo-curing resin is cured. And it is comprised by the means etc. which transfer the pattern formed in the process surface of the said mold to a to-be-processed member.
In the present invention, the concave portion and the convex portion are patterns for alignment.

  ADVANTAGE OF THE INVENTION According to this invention, the novel mold which can position with high precision with a mold and a workpiece | work can be provided.

It is sectional drawing for demonstrating the mold which concerns on this invention. It is sectional drawing for demonstrating the mold which concerns on this invention. It is a figure for demonstrating position alignment with the mold and workpiece | work in embodiment of this invention. It is a figure for demonstrating the manufacturing method of the mold which concerns on this invention. It is a figure for demonstrating the manufacturing method of the mold which concerns on this invention. It is a figure for demonstrating the manufacturing method of the mold which concerns on this invention. It is a figure for demonstrating the manufacturing method of the mold which concerns on this invention. It is a figure for demonstrating the manufacturing method of the mold which concerns on this invention. It is a figure for demonstrating the manufacturing method of the mold which concerns on this invention. It is a figure for demonstrating the imprint method which concerns on this invention. It is sectional drawing for demonstrating the mold which concerns on this invention.

(First embodiment)
The mold in the first embodiment of the present invention will be described.
FIG. 1 is a schematic cross-sectional view for explaining alignment marks provided in a mold (sometimes referred to as a template) in the present embodiment. Reference numeral 1000 denotes a mold, 1010 denotes a substrate (sometimes referred to as a mold substrate), and 1050 denotes a pattern area for imprinting and transferring. In the pattern region 1050, an imprint pattern (for example, a structure including a concave portion and a convex portion) is actually formed, but is omitted in the drawing. Reference numeral 1020 denotes an alignment mark area where an alignment mark is provided.
In the figure, the imprint pattern area 1050 is provided at the center and the alignment mark areas 1020 are provided at both ends thereof. However, the positional relationship between the two is not particularly limited. For example, an alignment mark area may be provided inside the pattern area 1050. Of course, the alignment mark region 1020 does not necessarily have to be two places in the mold 1000, and may be one place or three places or more.
The alignment mark in this embodiment is used for alignment in the in-plane direction of the pattern area formed in the mold, so-called XY in-plane direction, and for adjusting the gap between the mold and the workpiece. is there.

The mold (template) according to this embodiment will be described below with reference to FIG.
FIG. 2 is a schematic view partially enlarged for easy explanation of the alignment mark region 1020 in FIG. 1 constituting the mold.
In FIG. 2 ((a) to (g)), reference numeral 2010 denotes a substrate including the first material (sometimes called a mold substrate).
Reference numeral 2102 denotes an alignment mark that is provided on the substrate 2010 and includes a second material different from the first material. Hereinafter, the alignment mark 2102 may be simply referred to as a member or a surface layer.
The first material and the second material are transparent to light in at least part of the wavelength range of ultraviolet light, and the refractive index of the second material is 1.7 or more.
Thus, by using a material having a refractive index of 1.7 or more as the second material constituting the alignment mark region of the mold, even when the mold and the photo-curing resin are in contact, the alignment mark of the mold Can be detected (or observed) satisfactorily. Therefore, it is possible to align the mold and the workpiece with high accuracy.
That is, the invention according to the present embodiment forms a surface layer (made of the second material) having a refractive index equal to or higher than a predetermined value on the processed surface of the mold. This solves a problem in alignment caused by a small difference in refractive index.
Specifically, the surface layer material has a refractive index greater than 1.7, so that the alignment provided on the mold and the workpiece due to the difference in refractive index from the photo-curing resin. It has been found that the structure can be detected and the alignment can be performed with high accuracy.
The refractive index of the surface layer is 1.7 or more, preferably 1.8 or more, and more preferably 1.9 or more. The upper limit is, for example, 3.5 or less. Of course, the upper limit value is not limited to this as long as it can be used.
Further, as long as a part of the surface layer has the above refractive index, the surface layer may be further covered with another layer.

As described above, in the invention according to this embodiment, the member 2102 made of the second material, which is the alignment mark, is disposed on the substrate 2010 constituting the mold.
And this member can be arrange | positioned by changing the thickness of this member in the direction (2610 of FIG. 2) perpendicular | vertical to the thickness direction (2600 of FIG. 2) of the said mold. By arranging the second material in this way, the optical path length (refractive index of the medium × length) when light is incident from the substrate 2010 side in the direction parallel to the thickness direction 2600 of the mold can be expressed in the plane of the mold. The direction (2610 in FIG. 2) can be changed. This means that one of the irregularities provided in the alignment mark region can be optically observed. For example, it is observed as a plurality of lines, a plurality of dots, or a plurality of rings.
The member has a first thickness and a second thickness in a direction perpendicular to the thickness direction of the mold, and does the second thickness have a certain thickness (FIG. 2A)? ) (E) (g)), the thickness can be zero (FIGS. 2B, 2C, 2D, and 2F). In other words, the member 2102 made of the second material constituting the alignment mark is arranged on the mold substrate 2010, and the thickness of the member 2102 at the concave portion and the convex portion of the mold is different. The alignment mark can be observed optically.
Here, the thickness of the member 2102 in the concave portion and the convex portion is different. For example, as shown in FIG. 2 (h), the thickness of the layer made of the member 2102 is constituted by two layers or a plurality of layers. (It can also be called optical length) is also included.
Of course, since the alignment can be performed simply by clearly observing the position of the alignment mark, the member does not necessarily have to be arranged on the substrate with a different thickness.
FIG. 2 is a schematic cross-sectional view, but a top view (not shown) shows that a plurality of members 2102 made of the second material are arranged in a line shape or a dot shape, or in a ring shape. It is arranged.

FIG. 2A shows a case where a member 2102 having a convex portion including the second material is provided on the flat substrate 2010 as the alignment mark. In other words, it can be said that the mold 2103 has a structure in which a step is provided by the surface layer 2102.
FIG. 2 (b)
In this example, a member 2102 including the second material as the alignment mark is provided on the flat substrate. In other words, it can be said that the mold 2104 has a structure in which a step is provided up to the boundary between the surface layer 2102 and the mold substrate 2010. The film thickness of the surface layer 2102 is a level difference as it is.

  In FIG. 2C, the member 2102 including the second material as the alignment mark has the convex portion 2011 (it can also be regarded as a substrate having a concave portion or a groove). The case where it is provided in the convex part 2011 is shown. In other words, it can be said that the mold 2105 shown in FIG. 2C has a structure in which a step is provided partway along the mold substrate 2010 in addition to the film thickness of the surface layer 2102.

FIG. 2D shows an example in which a covering material 2106 is further provided on the member 2102 and the substrate 2010 in FIG.
That is, the mold 2107 shown in FIG. 2D is the same as the mold 2 shown in FIG.
The entire surface of 105 has a structure in which a protective layer 2106 made of a third material is further provided. Needless to say, the protective layer 2106 may be provided on the entire surface of the molds 2103 and 2104.
The third material may be the same material as that of the surface layer 2102, but can be selected from any material that has the same transmittance as that of the mold substrate 2010 and the surface layer 2102 in the ultraviolet light region. Moreover, the release agent which may be apply | coated in order to perform the mold release after an imprint smoothly may be sufficient.

FIG. 2E illustrates the case where the mold is configured only by the member 2102 made of the second material.
FIG. 2F shows a case where a member 2102 including the second material as the alignment mark is provided on the concave portion of the substrate 2010 having a concave portion. Note that the thickness of the member 2102 is not particularly limited, but a thickness that does not protrude from the surface of the substrate 2010 is preferable.
2 (g) and 2 (h) show that the member 2102 including the second material as the alignment mark is both on the concave portion 2999 and the convex portion 2011 of the substrate 2010 having a concave portion or a convex portion. The case where it is provided is shown.
The substance 2021 provided in the recess can be made of the same substance as the member 2102 or can be made of a different material. However, the refractive index of the substance 2021 is preferably close to the refractive index of the member 2102.
In addition, as for the relationship between the thickness d1 of the member 2102 on the convex part 2011 and the thickness d2 of the member 2021 on the concave part 2999, it is preferable that d1 and d2 differ.

Moreover, it is preferable that d1> d2 in that the mark on the outermost surface of the mold can be grasped more clearly. However, the invention according to the present embodiment is not limited to this condition.
Note that the thicknesses of the substrate 2010 and the member 2102 are not particularly limited, but it is desirable that the thicknesses avoid unnecessary interference conditions. For example,
If λ / 4n <the thickness of the member 2102 <the coherence length of the observation light, unnecessary interference may occur, which may hinder obtaining contrast (λ is the wavelength of the observation light, and n is the refractive index of 2102).
When the wavelength of the observation light is 633 nm and the refractive index n of the member 2102 is 1.7, λ / 4n to 100 nm. Therefore, it is desirable that the thickness of 2102 be 100 nm or less, or more than the coherence length of the observation light. Although the thickness of the substrate 2010 can be considered in the same manner, it is preferably several tens of μm or more in consideration of the strength of the mold.
In FIG. 2, reference numerals 2103, 2104, 2105, 2107, and 2108 denote molds.

Next, the first material and the second material used for the mold in this embodiment will be described. The first material of the mold substrate 2010 and the second material of the surface layer 2102 can cure the photocurable resin layer provided on the workpiece with respect to light in at least a part of the wavelength range of ultraviolet light. It has transmittance.
Accordingly, the light curable resin provided on the work is solidified by the light from the light source that passes through the mold, and the uneven pattern formed on the processed surface of the mold can be transferred to the work.
The transmittance of ultraviolet light (having a wavelength of, for example, 365 nm) of the entire mold including the first and second materials is 50% or more, preferably 70% or more, and more preferably 85% or more.
Here, the substrate 2010, the member (surface layer) 2102 and the protective layer 2106 are transparent to at least a part of the wavelength range of ultraviolet light for curing the photo-curing resin.
On the other hand, when aligning the mold and the workpiece, the alignment is performed using light in a wavelength region that does not cure the photocurable resin.

  Therefore, each material of the substrate 2010, the member (surface layer) 2102 and the protective layer 2106 is preferably a material having transparency even in a part of the wavelength range where the photo-curing resin is not cured. Of course, the light having a wavelength used for actually curing the resin can be applied as a light source for alignment by reducing the amount of light. Further, as described above, the alignment structure provided in the mold is detected based on the difference in refractive index between the photo-curing resin and the second material, so that the mold and the workpiece are aligned with high accuracy. The surface layer 2102 needs to be selected from a material having a refractive index different from that of the photocurable resin.

From the above, in selecting the materials for the substrate 2010, the surface layer 2102, and the protective layer 2106, what is the transmittance for ultraviolet light and what is the refractive index of 2102? Explain what to do.
First, the transmittance will be explained. The transmittance here is such that the photocurable resin can be cured by irradiation with ultraviolet light from the light source with a mold interposed between the light source and the resin. Necessary.
If the mold transmittance is not zero with respect to the ultraviolet light to be used, the resin will basically harden if the exposure amount is increased. However, considering realistic throughput, a certain degree of transmittance is required. Become.

The light source used for photocuring process, for example, using the wavelength of 365 nm, for this wavelength, for example, the transmittance of quartz (SiO ₂₎ is about 90%.
In order not to significantly reduce the throughput as compared with SiO ₂ , it is desirable that the member (surface layer) made of the second material has a transmittance of at least 30% or more.
Furthermore, if there is a large difference in the transmittance of the substrate 2010, the surface layer 2102, and the protective layer 2106, the resin may be unevenly cured. Therefore, the transmittances of these materials are preferably close to each other. Is better. Therefore, more desirably, the member (surface layer) made of the second material has a transmittance of 60% or more, more preferably 80% or more.

Next, the refractive index will be described.
In general, structures having different refractive indexes can recognize structures by refraction, reflection, and scattering at the interface. Therefore, the higher the refractive index of the member (surface layer) 2102, the easier it is to obtain contrast.
The upper limit of the refractive index is not particularly limited, but the refractive index of a typical dielectric that transmits ultraviolet light is 1.43 for calcium fluoride, 1.45 for quartz, 1.78 for alumina, and silicon nitride. 2.0, titanium oxide is about 2.4.
Note that calcium fluoride is typically represented by CaF ₂ . Quartz (typically represented by SiO ₂ (Note) The English translation of quartz is described as silica, quartz, fused silica).
Moreover, alumina is typically in _Al 2 _{O 3,} the silicon nitride is typically in SiN, the titanium oxide is typically in TiO _2, represented Re Zorezo.

Ultraviolet light of these substances, the transmittance example for wavelengths near 365 nm, CaF ₂ is about 97%, SiO ₂ is about 90%, Al ₂ O ₃ about 80%, TiO ₂ is about 60%, SiN 90 %.
If the alignment mark is optically observable, SiNC or SiC may be used as the second material. Since the refractive index of SiC is 3.1, the upper limit of the refractive index is 3.5 or less, preferably 3.0 or less.
Although the refractive index value itself depends on the measurement wavelength, the above data is the refractive index in visible light (wavelength 633 nm).
That is, as the refractive index of the second material in the invention according to the present embodiment, the refractive index with respect to visible light (wavelength 633 nm) is preferably 1.7 or more. The upper limit of the refractive index is not particularly limited, but is, for example, 3.5 or less as described above.

On the other hand, when the difference in refractive index is small, the difference in optical path length is important for obtaining further contrast in a fine structure.
Let n1 be the refractive index of the photocurable resin, n2 be the refractive index of the material 2102 which is the surface layer, and t be the level difference of the surface layer 2102 of the mold.
In this case, the optical path length difference between the concave portion and the convex portion of the mold of the light incident on the mold and reflected on the workpiece surface is obtained by the following equation.
Optical path length difference = 2 | n2 * t-n1 * t | = 2t | n2-n1 |
When the wavelength of incident light is λ, the best contrast is obtained when the optical path length difference is (1/2 + m) λ (m is an integer).
Therefore,
2t | n2-n1 | = (1/2 + m) λ (m is an integer)
When satisfying, maximum contrast can be obtained.
However, when the difference between n1 and n2 is small and t is equal to or less than λ, it exists only when m = 0, and the left side is mostly smaller. Therefore, the following formula is a guideline in practice.
2t | n2-n1 | ≦ (1/2) λ
As the detection light, light in a wavelength region where the photo-curing resin is not cured is used, but generally a wavelength in the visible light region is used.
For example, assuming that a light source with a single wavelength of 633 nm is used,
(1/2) λ = 316.5 nm.
Here, when the mold is composed entirely of SiO ₂ having a refractive index of 1.45, for example, assuming that the refractive index of the photocurable resin is 1.5 and the depth of the mold is 150 nm, the obtained optical path length difference is 2 × 150 nm × | 1.45-1.5 | = 15 nm
It becomes. This is an example that we have experimented with and found that it is difficult to obtain contrast in practice.
Therefore, at least an optical path difference exceeding this is required.

On the other hand, in an example in which water (refractive index: 1.4) is immersed in a mold using TiO ₂ (t = 60 nm) as the surface layer, contrast detection is successful.
When the refractive index of TiO ₂ is 2.4, the optical path length difference at this time is as follows.
2 × 60 nm × (2.4-1.4) = 120 nm
Thus, it is considered that there is a threshold at which contrast can be observed in the range of 15 nm ≦ optical path length difference ≦ 120 nm.
Here, for example, the optical path length difference serving as the threshold is assumed to be 60 nm.
When the thickness of the surface layer is 150 nm, n2> 1.7. Therefore, under this assumption, a refractive index of at least 1.7 or more is necessary to establish a mold that can observe contrast only with the unevenness of the surface layer.
That is, the refractive index of the second material is preferably 1.7 or more. This means that the refractive index difference between the surface layer and the photocurable resin is greater than 0.2.
Since the optical path length is proportional to the product of the step and the refractive index, the step is actually small if a material with a high refractive index is prepared, and conversely, if the step is large, the refractive index may be small.
Further, if the sensitivity of the detector can be increased, the contrast can be detected even with a smaller optical path length difference.
Therefore, the refractive index of 1.7 is only one practical solution, but it can be a measure that it becomes difficult to detect below that.

Based on the above, when materials of the mold substrate 2010, the member (surface layer) 2102 made of the second material, and the protective layer 2106 are selected, the following is obtained.
For example, the mold substrate 2010 constituted by the first _material, SiO 2, CaF _2, or ordinary glass and quartz, and the like.
Examples of the material of the member 2102 made of the second material include SiN, TiO ₂ , Al ₂ O ₃ , indium tin oxide (ITO), and zinc oxide.
Examples of the material of the protective layer 2106 include transparent dielectrics such as SiO ₂ , SiN, TiO ₂ , ITO, Al ₂ O ₃ , and CaF ₂ , or release agents.
In addition, as a material of the protective layer 2106 in FIG.2 (d), it is also preferable to select as follows.
That is, it is preferable to coat a silicon oxide layer as the protective layer 2106. In the imprint process, a hydrophobic silane coupling agent may be used as a mold release agent. In such a case, if silicon oxide is present as a protective layer for the mold surface layer, the mold release agent should be easily attached to the mold. Because you can.

Note that the thicknesses of the substrate 2010 and the member 2102 are not particularly limited, but it is desirable that the thicknesses avoid unnecessary interference conditions. For example,
If λ / 4n <the thickness of the member 2102 <the coherence length of the observation light, unnecessary interference may occur, which may hinder obtaining contrast (λ is the wavelength of the observation light, and n is the refractive index of 2102). For example, when the wavelength of the observation light is 633 nm, and the refractive index n of 2102 is 1.7, λ / 4n to 100 nm. Therefore, it is desirable that the thickness of 2102 be 100 nm or less, or more than the coherence length of the observation light. Although the thickness of the substrate 2010 can be considered in the same manner, it is preferably several tens of μm or more in consideration of the strength of the mold.

As a layer configuration of the alignment mark region and the pattern region of the present embodiment,
It is preferable that the alignment mark region 1020 and the pattern region 1050 in FIG. 1 have the same layer configuration because the process for manufacturing the mold is simplified.
In addition, it is preferable to use the same layer structure because unevenness in the in-plane direction is reduced with respect to the rigidity of the mold.
Of course, the alignment mark region 1020 and the pattern region 1050 may have different layer configurations.
For example, the alignment mark region is composed of quartz and silicon nitride provided on the surface thereof, and the pattern region is composed of quartz.
In such a case, the process for producing the mold is somewhat complicated, but it is effective for controlling the molding film thickness. This configuration is particularly suitable for controlling a relatively thick film thickness.

The workpiece is sometimes called a workpiece.
Examples of workpieces include semiconductor substrates such as Si substrates and GaAs substrates, resin substrates, quartz substrates, and glass substrates.
A multilayer substrate formed by growing or bonding a thin film on a substrate made of these materials can also be used. Of course, a light-transmitting substrate such as a quartz substrate can also be used.
In order to cure the resin applied to the substrate, for example, the resin is irradiated with ultraviolet rays from the mold side. Examples of the photocurable resin include urethane, epoxy, and acrylic.
It is also possible to use thermosetting resins such as phenol resins, epoxy resins, silicones and polyimides, and thermoplastic resins such as polymethyl methacrylate (PMMA), polycarbonate (PC), PET, and acrylic. it can. The pattern is transferred by performing a heat treatment as necessary.
Of course, when the workpiece is configured without containing resin, the workpiece is physically deformed only by the applied pressure.

As described above, the technical matters described in the present embodiment are also applied to the inventions according to the following embodiments and the first to sixth inventions described above.
The invention according to this embodiment, the invention according to the following embodiments, and the first to sixth inventions described above (hereinafter collectively referred to as the present invention group) include the following technologies: It is incorporated except for elements that contradict the present invention group.
That is, the techniques described in US Pat. No. 6,696,220, US Pat. No. 6,719,915, US Pat. No. 6,334,960, and the like can be incorporated.
Alternatively, the techniques described in US Pat. No. 5,772,905, US patent application Ser. No. 10 / 221,331, etc. can be incorporated. .
For example, in US patent application Ser. No. 10 / 221,331, the work piece is supported not over the entire surface on the back side of the work piece, but with a movable mechanism, work piece or mold ( A holding mechanism or the like in the (stamp) holding unit can be applied to the present invention group.
Note that the imprint apparatus in the present invention group can be applied particularly to uneven pattern transfer from nano-order to micro-order. For example, it can be suitably used for pattern formation at intervals of several nanometers to several hundred nanometers.

(Second Embodiment)
Next, a mold according to the second embodiment of the present invention will be described with reference to FIG.
In the first embodiment, the figure is described as a cross-sectional view of the layer structure of the mold in the alignment mark region. In the present embodiment, however, the figure is distinguished from the pattern region or the alignment region. There is no.
This is because which part of the concavo-convex pattern (imprint pattern) provided on the processed surface of the mold can be appropriately determined as to whether or not to use as an alignment mark.
That is, as long as the mold has the following characteristic items, the mold is included in the scope of the invention according to the present embodiment, regardless of what region of the mold the characteristic item is provided.

In FIG. 2G, the mold according to this embodiment includes a substrate 2010 that includes the first material,
A plurality of convex portions 2011 including a first layer 2102 made of a second material different from the first material;
And a second layer 2021 made of the second material provided between the convex portions 2011 on the substrate 2010.
The first and second materials are transparent to light in at least part of the wavelength range of ultraviolet light.
Furthermore, the refractive index of the second material is set to 1.7 or more.
The layer thicknesses of the first layer and the second layer (d1 and d2 in FIG. 2G) are different from each other.
Thus, by making d1 and d2 different, the optical path length difference can be ensured as described in the above-described embodiment.
Therefore, even in a state where the resin is interposed between the workpiece and the mold, the portion (2102 or 2021) can be optically observed and detected.
Note that the thickness of d2 may be zero.
Alternatively, d1 may be zero and d2 may have a predetermined thickness (that is, the case of FIG. 2 (f)).

An example of a specific method for producing the mold shown in FIG. 2G is shown in FIGS.
Specifically, this will be described in Examples 4 and 5.
FIG. 9 shows an example of a specific method for producing the mold shown in FIG.
Specifically, this will be described in Example 6.
The technical matters described in the first embodiment are also applied to the invention according to the present embodiment as long as there is no contradiction.

(Third embodiment)
Next, a mold according to a third embodiment of the present invention will be described with reference to FIG. As shown in FIG. 1, the mold according to the present embodiment includes an imprint pattern region 1050 (not shown), and an alignment mark region 1020 (note that details of marks are not shown).
As described in the first embodiment, the positional relationship between the regions, the number of alignment mark regions, and the like are not particularly limited.
The material constituting the alignment mark region is made of a material having a refractive index of 1.7 or more (selected from the above-mentioned silicon nitride, titanium oxide, and aluminum oxide). Of course, it is not necessary that the alignment mark region is made of only the material.
The imprint pattern region 1050 may be made of the same material as described above, or may be made of quartz or the like.
By adopting such a configuration, for example, even when the processing surface of the mold 1000 is in contact with the photo-curing resin, a material having a high refractive index is used for the alignment mark region, so that the mark is recognized with high contrast. be able to. As a result, an alignment mark with high accuracy is possible.

In addition, as shown in FIG. 11, the alignment mark region can be arranged so as to protrude from the level of the outermost surface in the imprint region 1050. 2010 is a mold substrate. In the figure, a portion 1020 constituting the alignment mark protrudes by a thickness p.
The value of p can be appropriately set in the range of 1 nm to 1 μm. The portion 2202 is made of a material having a refractive index of 1.7 or more.
Such a configuration is effective as follows.
In the imprint method, it is important to make the thickness of the remaining film indicated by 9002 in FIG. This is because the remaining film portion is generally removed by reactive ion etching or the like, but if the thickness of the remaining film is not uniform, the shape of the resin portion used as a mask eventually becomes uneven.

The configuration as shown in FIG. 11 is adopted, and the thickness of the remaining film can be made uniform by substantially contacting the workpiece 10 disposed to face the portion 1020. In practice, a very thin resin layer may remain between the portion and the workpiece.
Note that the outermost surface of the portion 2202 constituting the alignment mark region can be made of a conductive material (for example, titanium oxide) having a refractive index of 1.7 or more.
In such a case, a mark (a conductive material is selected) corresponding to the alignment mark on the mold side is provided on the wafer side which is a workpiece.
Then, by detecting an electrical change caused when both marks are in physical contact or close to contact, alignment between them (in-plane alignment and gap adjustment in the direction perpendicular to it) )It can be performed. The detection of the electrical change here is realized by a configuration in which a current flows between the mold and the wafer, for example.

(Fourth embodiment)
Next, an imprint method will be described as a fourth embodiment of the present invention. The imprint method according to this embodiment uses the mold described in any of the first to third embodiments described above.
Specifically, a photocurable resin is interposed between the mold and the workpiece, the alignment mark provided on the mold, and the alignment mark provided on the workpiece. The position control of both is performed while detecting each other.

(Fifth embodiment)
Next, a chip manufacturing method will be described as a fifth embodiment of the present invention. The chip manufacturing method according to this embodiment uses the mold described in any of the first to third embodiments described above.
Specifically, the mold and the workpiece are prepared, a pattern is formed on the photocurable resin on the workpiece using the mold, and the pattern is used as a mask to form the workpiece. Etching is performed. More specifically, the region of the workpiece that is not in contact with the pattern is removed.
Actually, a recess is formed at a location where a pattern is not formed on the workpiece.

Hereinafter, specifically, an example of the imprint method (imprint lithography) according to the present embodiment will be described with reference to FIGS. 10A to 10D.
An optical imprinting method in which the resin is cured by light irradiation is shown. Of course, the present invention can also be applied to an imprinting method in which the resin is cured by heating, or is cured by using both light and heat.
First, as shown in FIG. 10A, a work piece 9033 such as a silicon substrate having a photo-curing resin 9034 on its surface and a mold 9020 (not shown in FIG. 10A) are arranged to face each other.

Next, as shown in FIG. 10B, the mold 9020 and the resin 9034 are brought into contact with each other. At that time, the mold side may be moved, the workpiece side may be moved, or both may be moved to contact. Both will be under pressure. As a result, the resin shape changes to a shape reflecting the uneven pattern of the mold. In the figure, the mold is drawn such that there is some imprint pattern, and the alignment mark is omitted.
If the mold described in the above-described embodiment is used, the alignment mark can be clearly observed even when the mold 9020 and the resin 9034 are in contact (contact state) as shown in FIG.
That is, even in the contact state, highly accurate alignment control between the mold and the workpiece can be performed.

Next, as shown in FIG. 10C, the resin is cured by irradiating UV light 5001 from the back side of the mold 9020.
Then, the mold 9020 and the resin 9034 are separated (FIG. 10D).
If necessary, the mold or workpiece is moved relatively, and so-called step-and-repeat is performed in which transfer is performed again next to the area where the pattern is transferred.

As shown in FIG. 10D, when the residual film 9002 exists, the residual film is removed by ashing (oxygen reactive etching) as necessary. Thus, the workpiece (
The pattern is transferred to the workpiece.
Although not shown, the underlying substrate is etched using the transferred pattern (in the case of FIG. 10, it is made of resin) as a mask. The substrate is a silicon substrate itself, and is a multilayer film on which a plurality of layers are laminated.
Although depending on the viscosity of the resin, if the resin has a very low viscosity, the pattern can be transferred by sufficiently reducing the pressure applied to the resin by the mold.

Next, the alignment between the mold and the workpiece (workpiece) will be described.
FIG. 3 is a view for explaining the alignment between any of the molds shown in FIG. 2 and the workpiece.
For example, as shown in FIG. 3, a mold 3104 is prepared, and a photocurable resin 3203 is applied on the work 3202. That is, it is assumed that the space between the mold 3104 and the work 3202 is filled with the photocurable resin 3203.
In FIG. 3, reference numeral 3205 denotes an alignment structure (alignment mark) formed on the mold side. The surface layer 2102 may be formed on the mold substrate 2010 as shown in FIG. 3, or may be formed inside the mold substrate. Reference numeral 3206 denotes an alignment structure provided on the workpiece 3202 side. Here, the material of the surface layer 2102 has a refractive index higher than 1.7.
Under the above configuration, alignment is performed using light in a wavelength region where the photocurable resin 3203 is not cured as the detection light 3204.

Since the refractive index of the surface layer 2102 and the photo-curing resin 3203 is different, the alignment structure 3205 can be observed.
In other words, the refractive index difference between the surface layer 2102 and the photo-curing resin 3203 can be ensured by adopting a configuration in which the surface layer 2102 has a refractive index greater than 1.7. That is, the alignment structure 3205 can be clearly observed.
On the other hand, since the detection light 3204 passes through the mold substrate 2010 and the surface layer 2102, the alignment structure 3206 on the substrate 3202 can be observed at the same time.
Therefore, according to the above-described configuration in the present embodiment, even when the mold and the workpiece are brought close to each other and the photocurable resin is filled between the mold and the workpiece (the mold and the workpiece are in contact with the resin, respectively). Therefore, it is possible to perform alignment with high accuracy.

  In order to perform accurate alignment in the optical imprint technique using ultraviolet light irradiation, it is preferable that the mold and the workpiece can be brought close to each other. In that case, since it became the state with which the photocurable resin was filled between the mold and the workpiece | work, there existed a problem that a position structure became difficult to see. However, as described above, if a mold having an alignment structure made of the high refractive index material according to the present embodiment is used, the same structure (alignment mark) can have high contrast even in a photo-curing resin with visible light. It can be secured and detected. As a result, highly accurate alignment is possible.

Examples of the present invention will be described below.
[Example 1]
In Example 1, a method of manufacturing a mold by etching to which the present invention is applied will be described.
FIG. 4 is a diagram for explaining an example of the mold manufacturing process shown in FIG. 2A in this embodiment.
The mold in this example is manufactured according to the following procedure.
(1) First, a mask layer 4301 is formed on the surface layer 2102 (FIG. 4A).
The mask layer 4301 is a resist mask or a metal material (for example, Cr, Al, WS
The hard mask of i) can be considered.
(2) Next, the surface layer 2102 is etched using the mask layer 4301 as a mask (FIG. 4B).
(3) After the etching, the mask layer 4301 is removed.
Here, the mold 2103 shown in FIG. 2A can be formed by stopping the etching in the middle of the surface layer 2102.
Further, by stopping etching at the boundary between the mold substrate 2010 and the surface layer 2102, the mold 2104 shown in FIG. 2B can be formed.
Furthermore, by proceeding to the mold substrate 2010, the mold 2105 shown in FIG. 2C can be formed.
Further, the mold 2108 can be formed by forming the substrate itself from the material of the surface layer 2102.

[Example 2]
In Example 2, a method for manufacturing a mold by the lift-off method to which the present invention is applied will be described.
FIG. 5 is a view for explaining an example of a mold creation process shown in FIG. 2B in this embodiment.
The mold in this example is manufactured according to the following procedure.
(1) First, a resist mask layer 5401 is formed on the surface of the mold substrate 2010 (FIG. 5A).
(2) Next, the surface layer 2102 is formed on the entire surface (FIG. 5B).
(3) Next, lift-off is performed by removing the mask layer 5401 to form a pattern 2102 (FIG. 5C).
The mold shown in FIG. 5C corresponds to the mold 2104 shown in FIG. 2B. However, if the material of the surface layer 2102 is formed on the entire surface before forming the mask layer 5401, the mold 2103 is formed. can do. Further, the mold 2108 can be formed using the material of the surface layer 2102 as a material of the substrate.
Further, if 2010 is etched using the surface layer 2102 formed by lift-off as a mask, a mold 2105 is obtained. However, in the case where the mold substrate 2010 is etched using the surface layer 2102 as a mask, it is necessary to select a combination of materials capable of obtaining a sufficient etching selectivity and an etching condition.

[Example 3]
In the third embodiment, a method of manufacturing a mold for adjusting the depth of the step in the actual pattern region and the alignment structure region to which the present invention is applied will be described.
The contrast for observing the alignment structure basically depends on the level difference formed on the surface layer 2102 (made of the second material).
Therefore, for the molds 2104 and 2105, the surface layer 2102 having a thickness designed to obtain contrast may be formed.
On the other hand, when taking the structure of the mold 2103 or the mold 2108, the step formed in the surface layer 2102 is not necessarily the optimum depth for the imprint process. In that case, it is necessary to change the depth between the actual pattern region and the alignment structure region.

A process for realizing this is shown in FIG.
A region 1020 and an actual pattern region 1050 having an alignment structure are defined in the mold substrate.
The process in the present embodiment is as follows.
(1) First, a hard mask layer 6503 is formed on the surface layer 2102 (FIG. 6A). Reference numeral 2010 denotes a mold substrate. The material of the hard mask layer 6503 is, for example, Al, Cr, or WSi.
(2) Next, the resist 6504 is patterned (FIG. 6B).
(3) Next, the hard mask layer 6503 is etched, and then the surface layer 2102 is etched. When etching 2102, the resist 6504 may be left, or may be removed and etched using 6503 as a mask. In either case, the resist 6504 is finally removed (FIG. 6C).
(4) Next, a resist 6505 is patterned so as to cover the actual pattern region 1050 (FIG. 6D).
(5) An additional etching of the alignment region 1020 is performed using 6503 as a mask (FIG. 6E).
(6) The resist 6505 is removed (FIG. 6F).

By this process, a mold having an alignment structure (alignment mark) having a deeper recess than the actual pattern can be manufactured.
On the contrary, in order to make the alignment structure shallower than the actual pattern, the resist 6505 in FIG. 6D may be patterned so as to cover the alignment structure. As a result, the actual pattern and the alignment structure can be separately created at optimum depths.

Note that, after the step (6), the hard mask 6503 can be appropriately removed to form an imprint mold.
By doing so, the mold according to the sixth aspect of the present invention is realized.
More specifically, both the alignment mark area 1020 and the imprint pattern area 1050 are configured to include a recess. Under this configuration, a mold is realized in which the depth of the recess in the alignment mark region is deeper than the depth of the recess in the imprint pattern region.
Further, if the substrate 2010 itself can sufficiently secure the strength as a mold, the substrate 2010 can be removed after the step (6) or the step (1) (FIG. 6A). From the time point, it is possible to omit the mold.

[Example 4]
Below, the manufacturing method of the mold in Example 4 is demonstrated.
FIG. 7 shows a method for manufacturing the mold shown in FIG.
The mold in this example is manufactured according to the following procedure.
(1) A layer 2021 made of a high refractive index material is formed on the surface of the mold substrate 2010 (FIG. 7A).
(2) A layer 2710 made of the same material as that of the mold substrate 2010 or a material having a similar refractive index is formed on 2021 (FIG. 7B).
(3) A layer 2102 made of the same material as 2021 or a material having a similar refractive index is formed on 2710 (FIG. 7C).
(4) A mask layer 7301 is formed on the surface of 2102 (FIG. 7D).
(5) 2102 is etched using 7301 as a mask layer (FIG. 7E), and then 2710 is etched. In the etching of 2710, the mask layer 7301 may be left, or may be removed and etched using 2102 as a mask layer. In either case, the mask layer 7301 is finally removed (FIG. 7F).

[Example 5]
Below, the manufacturing method of the mold in Example 5 is demonstrated.
FIG. 8 shows a method for producing the mold shown in FIG. 2G in this example.
The mold in this example is manufactured according to the following procedure.
(1) A layer 2021 made of a high refractive index material is formed on the surface of the mold substrate 2010 (FIG. 8).
(A)).
(2) A mask layer 8301 is formed on the surface of 2021 (FIG. 8B).
(3) 2021 is etched using 8301 as a mask layer (FIG. 8C).

(4) After removing the mask 8301, a layer 2710 made of the same material as that of the mold substrate 2010 or a material having a refractive index close to that of the mold substrate 2010 is formed (FIG. 8D).
(5) On the 2710, a layer 2102 made of the same material as 2021 or a material having a refractive index close to that is formed (FIG. 8E).
(6) A mask layer 8302 is formed on the surface of 2102 (FIG. 8F).
(7) 2102 is etched using 8302 as a mask layer (FIG. 8G), and then 2710 is etched. In the etching of 2710, the mask layer 8302 may be left, or may be removed and etched using the 2102 as a mask layer. In either case, the mask layer 8302 is finally removed (FIG. 8H).

[Example 6]
Below, the manufacturing method of the mold in Example 6 is demonstrated.
FIG. 9 shows a method for producing the mold shown in FIG.
The mold in this example is manufactured according to the following procedure.
(1) A mask layer 9301 is formed on the surface of the mold substrate 2010 (FIG. 9A).
(2) 2010 is etched using 9301 as a mask layer (FIG. 9B).
A hard mask layer may be provided between 9301 and 2010.
(3) A layer 2102 made of a high refractive index material is formed on the surface of the mold substrate 2010 (FIG. 9C).
(4) 2102 is removed to the same height as the surface of the mold substrate 2010 by a processing method such as etching or CMP (FIG. 9D).
(5) Further, 2102 is removed to an arbitrary height between the surface of the mold substrate 2010 and the bottom surface of the recess processed into the mold substrate 2010 by a processing method such as etching.

1000: Mold 1010: Substrate 1020: Alignment mark area 1050: Pattern area 2010: Substrate 2011: Convex part 2102: Alignment marks 2103, 2104, 2105, 2107, 2108: Mold 2106: Protective layer (covering material)
2600: Mold thickness direction 2610: Mold in-plane direction 2999: Recess

Claims (23)

A mold,
A substrate comprising a first material;
An alignment mark provided on a surface of the substrate and configured to include a second material different from the first material;
With
Refractive index of the second material of a wavelength of 633nm for visible light state, and are 1.7 or more,
The alignment mark is observed when the mold comes into contact with the photocurable resin due to the refractive index difference between the refractive index of the second material and the photocurable resin interposed between the mold and the workpiece. A mold characterized in that it can be prevented from becoming difficult .   The mold according to claim 1, wherein the first material and the second material are transmissive to light in at least a part of a wavelength region of ultraviolet light.   A member made of the second material constituting the alignment mark is arranged on the substrate, and the member is arranged by changing the thickness of the member in a direction perpendicular to the thickness direction of the mold. The mold according to claim 1, wherein the mold is formed.   The member has a first thickness and a second thickness in a direction perpendicular to the thickness direction of the mold, and the second thickness has a certain thickness or is zero in thickness. The mold according to claim 3, wherein the mold is provided.   The member made of the second material constituting the alignment mark is disposed on the substrate, and the thickness of the member in the concave portion and the convex portion of the mold is different. The mold described.   The mold according to claim 1, wherein a member having a projecting portion including the second material is provided on the substrate as the alignment mark.   The mold according to claim 1, wherein a member including the second material as the alignment mark is provided on the substrate.   The mold according to claim 1, wherein a member including the second material as the alignment mark is provided on the convex portion of the substrate having a convex portion.   2. The mold according to claim 1, wherein a member including the second material is provided in the recess of the substrate having a recess as the alignment mark.   The mold according to claim 1, wherein the first material is selected from silicon oxide, calcium fluoride, and glass.   The mold according to claim 1, wherein the second material is selected from silicon nitride, titanium oxide, aluminum oxide, indium tin oxide, and zinc oxide.   The mold according to claim 1, wherein the layer configuration of the region having the alignment mark and the imprint pattern region is the same.   The mold according to claim 1, wherein the recesses formed in the region having the alignment mark and the imprint pattern region have different depths.   The mold according to claim 1, wherein the second material constituting the alignment mark is covered with a third material. An imprint method,
A substrate configured to include a first material, an alignment mark provided on a surface of the substrate and configured to include a second material different from the first material;
Preparing a mold in which the refractive index of the second material with respect to visible light having a wavelength of 633 nm is 1.7 or more;
Between the mold and the work piece, the photocurable resin is interposed so as to directly contact an alignment mark provided on the mold ,
A step of performing position control between the alignment mark and the workpiece while detecting the alignment mark provided on the mold and the alignment mark provided on the workpiece. And imprint method. A chip manufacturing method comprising:
A mold according to claim 1 and a workpiece are prepared,
A pattern is formed on the photocurable resin on the workpiece using the mold,
A chip manufacturing method, wherein the workpiece is etched using the pattern as a mask. A mold,
A substrate comprising a first material;
A plurality of convex portions that are alignment marks including a first layer made of a second material different from the first material provided on the surface of the substrate ;
A second layer made of the second material provided between the convex portions on the substrate;
With
The refractive index of the second material with respect to visible light having a wavelength of 633 nm is 1.7 or more, and the refractive index of the second material and the photocurable resin interposed between the mold and the workpiece It is possible to suppress the difficulty of observing the alignment mark when the mold comes into contact with the photocurable resin due to a difference in refractive index, and the layers of the first layer and the second layer Mold with different thicknesses.   The mold according to claim 17, wherein the first and second materials are transmissive to light in at least a part of a wavelength region of ultraviolet light. A mold,
A substrate comprising a first material;
A plurality of convex portions that are alignment marks including a first layer made of a second material different from the first material provided on the surface of the substrate ;
With
The refractive index of the second material with respect to visible light having a wavelength of 633 nm is 1.7 or more, and the refractive index of the second material and the photocurable resin interposed between the mold and the workpiece It is possible to prevent the alignment mark from being difficult to observe when the mold comes into contact with the photo-curable resin due to the difference in refractive index, and the second substrate is formed on the substrate between the convex portions. 2. A mold characterized in that the material 2 is not provided.   The mold according to claim 19, wherein the first and second materials are transparent to light in at least a part of the wavelength range of ultraviolet light. A mold,
A substrate comprising a first material;
A layer composed of an alignment mark region and an imprint pattern region formed on the surface of the substrate ,
The alignment mark region includes a material having a refractive index of 1.7 or more with respect to visible light having a wavelength of 633 nm, and is photocured interposed between the refractive index of the second material and the mold and the workpiece. It is possible to suppress the difficulty in observing the alignment mark region when the mold comes into contact with the photocurable resin due to a difference in refractive index with the curable resin .   The mold according to claim 21, wherein the material is selected from silicon nitride, titanium oxide, aluminum oxide, indium tin oxide, and zinc oxide. The alignment mark area and the imprint pattern area are both configured to include a recess,
The mold according to claim 21, wherein the depth of the concave portion in the alignment mark region is deeper than the depth of the concave portion in the imprint pattern region.

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