JP4185941B2 - Nanoimprint method and nanoimprint apparatus - Google Patents

Description

  The present invention relates to a nanoimprint method and a nanoimprint apparatus for transferring a pattern to a resin by curing the resin in a state in which a mold material on which a pattern has been formed is pressed against the resin.

  At present, in the field of semiconductor manufacturing, nanoimprint technology (see Non-Patent Document 1), which is a low-cost pattern transfer method capable of transferring a fine pattern, has attracted attention.

  The nanoimprint technology is a method in which a mold material in which a fine pattern has been formed in advance by electron beam exposure or the like is pressed against a substrate such as a silicon wafer or a glass wafer coated with the resin, and the resin is cured, whereby a fine pattern is formed on the resin. The pattern is transferred. Regarding the nanoimprint technology, it has already been shown that transfer of a fine shape of about 10 nm is possible, and it has sufficient performance for future miniaturization of semiconductor process rules. In addition, the nanoimprint technology does not require complicated equipment for processes such as exposure and development as in the case of conventional exposure apparatuses, so that a fine structure can be produced with less capital investment than conventional exposure apparatuses. Is possible.

As the nanoimprint technology, a thermal cycle method, a photocuring method, and the like have been proposed. The thermal cycle method is a method of transferring a pattern by heating a thermoplastic resin to a temperature higher than the glass transition temperature, pressing the mold material against the resin in a state where the flowability of the resin is enhanced, cooling the mold material, and separating the mold material from the resin. . The photocuring method is a method in which an ultraviolet curable resin is used, a pattern is transferred by releasing the mold material from the resin after the resin is cured by irradiating the mold with ultraviolet rays while the mold material is pressed against the resin. .
FIG. 7 illustrates a pattern transfer process in the nanoimprint technique using a photocuring method.

  FIG. 7A shows a process of pressing the mold material 11 against the resin 13 as the first process. The mold member 11 is made of a material that transmits ultraviolet rays, such as quartz, and a pattern transfer region 16 in which a pattern is formed is provided on the pattern surface 15 on the lower surface. By pressing the mold material 11 against an ultraviolet curable resin 13 applied on a substrate 12 such as a silicon wafer or a glass wafer, the resin 13 flows along the pattern formed in the pattern transfer region 16.

  In the second step shown in FIG. 7B, ultraviolet rays 14 are irradiated from an ultraviolet light source (not shown) in a state where the mold material 11 is pressed against the resin 13. As a result, the ultraviolet curable resin 13 is cured into a shape corresponding to the pattern of the mold material 11.

  In the third step shown in FIG. 7C, the mold material 11 is pulled away from the resin 13 on the substrate 12. Since the resin 13 on the substrate 12 remains on the substrate 12 while being cured into a shape corresponding to the pattern of the mold material 11, the pattern formed on the mold material 11 is transferred to the resin 13 on the substrate 12.

  The transferred pattern of the resin 13 is equivalent to the pattern created by the photolithography process of the conventional exposure apparatus when the mold member 11 is pulled away. Subsequent steps in the manufacture of the semiconductor can be handled in the same manner as when a conventional exposure apparatus is used.

  By the way, in the manufacture of semiconductors, many superposition processes are required, and miniaturization of semiconductor process rules is progressing. For this reason, alignment of the mold material and the substrate, so-called alignment, is also important in pattern transfer by nanoimprint technology.

  In the nanoimprint technique, in order to perform high-precision alignment, it is desirable to detect the alignment mark provided on the mold material and the alignment mark provided on the substrate using the same optical detection device. However, in the nanoimprint technology, since the refractive index of the mold material and the resin is almost the same, the signal contrast of the alignment mark provided on the mold material becomes low when the mold material is in contact with the resin. For this reason, it is difficult to detect the alignment mark provided on the mold material and the alignment mark provided on the substrate using the same optical detection device while the mold material is in contact with the resin.

  In addition, when alignment is performed while the mold material is separated from the substrate, an error occurs in the relative positional relationship between the mold material and the substrate in the process of bringing the mold material into contact with the substrate. Resulting in. Even if a mechanism capable of preventing the occurrence of lock deviation can be configured, the scale is large and the mechanism becomes complicated.

  As means for solving the above problem, in the alignment method disclosed in Patent Document 1, first, the mold material and the substrate are brought close to each other so that there is no resin between the alignment material provided on the mold material and the substrate. In this state, using the same optical detection device, the alignment mark provided on the mold and the substrate is detected and aligned, and then the final pressing for curing the resin is performed. .

  FIG. 8 illustrates an alignment method in the nanoimprint technique disclosed in Patent Document 1.

  FIG. 8A shows a process of applying the resin 23 onto the substrate 22 in an uncured state. An alignment mark (not shown) is provided on the substrate 22.

  FIG. 8B shows a step of bringing the mold material 21 into contact with the resin 23 applied on the substrate 22. The mold material 21 is provided with an alignment mark 24 that is detected by an optical detection device (not shown) in order to align the mold material 21 and the substrate 22. In this step, the distance between the mold material 21 and the substrate 22 is set to be slightly wider than the distance between the mold material 21 and the substrate 22 when the resin 23 is cured. Further, when the mold material 21 comes into contact with the resin 23 and approaches the substrate 22, there is no resin 23 between the mold material 21 of the alignment mark 24 provided on the mold material 21 and the substrate 22. Does not completely fill the space between the mold material 21 and the substrate 22. In this state, the alignment mark provided on the mold material 21 and the substrate 22 can be detected using the optical detection device, and the mold material 21 and the substrate 22 can be aligned.

FIG. 8C shows a step of curing the resin 23 applied on the substrate 22. After alignment is performed in a state where the resin 23 is not completely filled between the mold material 21 and the substrate 22, the mold material 21 is pressed against the resin 23 until the resin 23 is cured. In this state, the resin 23 on the substrate 22 is cured, and the pattern formed on the mold material 21 is transferred to the resin 23.
S. Y. Chou, et. al. , Science, vol. 272, p. 85-87, 5 April 1996 US Patent No. USP6921615 Japanese Patent Laid-Open No. 10-335242

  In the alignment method disclosed in Patent Document 1, after performing alignment in a state in which the mold material and the substrate are close to each other so that there is no resin between the alignment marks provided on the mold material and the substrate, the mold material is further resinated. Is pressed against. For this reason, there is a risk that a slight amount of locking will occur, and the alignment method of the nanoimprint technology that is performed in a state where the resin is not completely filled between the mold material and the substrate cannot accurately align the mold material and the substrate. there were.

The nanoimprint method of the present invention is made in view of the above-mentioned problems,
Using a mold material having a pattern transfer region in which a pattern is formed on one surface, the resin in a state where the surface having the pattern transfer region of the mold material is pressed against an uncured curable resin applied on the substrate. In the nanoimprint method in which the pattern is transferred to the resin by curing
A first alignment mark and a second alignment mark provided on a surface of the mold material having a pattern transfer region, other than the pattern transfer region;
A third alignment mark provided on the substrate;
First detection means capable of simultaneously detecting the first alignment mark and the third alignment mark;
Second detection means capable of detecting the second alignment mark;
Storage means capable of storing relative positional information between the third alignment mark detected by the first detection means and the second alignment mark detected by the second detection means;
Use
In a state where the mold material and the substrate are aligned by the detection of the first alignment mark and the third alignment mark by the first detection means without contacting the mold material and the resin, Detecting the second alignment mark by a second detection means, obtaining relative positional information between the third alignment mark and the second alignment mark, and storing it in the storage means;
In a state where the mold material and the resin are in contact with each other so as not to fill the resin on the second alignment mark, a relative relationship between the third alignment mark and the second alignment mark stored in the storage unit And detecting the third alignment mark by the first detection means and detecting the second alignment mark by the second detection means on the basis of the specific position information. The process of aligning,
It is characterized by having.

  According to the present invention, it is possible to perform alignment by pressing the substrate to the resin until the resin is cured. Therefore, it is possible to provide a nanoimprint method and a nanoimprint apparatus that can be aligned with high accuracy.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS.
First, the whole nanoimprint apparatus will be described with reference to FIG.

  FIG. 4 is an external view of the nanoimprint apparatus. Here, each part will be described using a step-and-repeat nanoimprint apparatus using a photocuring method. The lower surface of the mold material 101 is a pattern surface 151 that comes into contact with the resin, and a pattern transfer region 152 in which a concavo-convex shape of a pattern to be transferred is formed. In order to cure the ultraviolet curable resin, the material of the mold material 101 is quartz or the like that transmits ultraviolet light. An uncured resin is applied to the surface of a substrate 102 such as a silicon wafer or a glass wafer, and then irradiated with ultraviolet light while the mold material 101 is pressed to form a three-dimensional resin pattern on the surface of the substrate 102. . The head 103 has a function of holding the mold material 101 and a function of irradiating ultraviolet light by an ultraviolet optical system (not shown) installed therein. In addition, a parallel projection mechanism is provided so that the pattern surface 151 of the mold 101 follows the surface of the substrate 102. The load sensor 104 includes a load cell and the like, and measures a load applied to the mold material 101. The elevating unit 106 moves up and down while holding the mold material 101 via the load sensor 104 and the head 103 on the lower side, and after the stamping operation for pressing the mold material 101 against the resin, the resin is cured, A mold release operation for separating the mold material 101 from the resin is performed. In addition, the elevating unit 106 can keep the distance between the mold material 101 and the substrate 102 in the state where the mold material 101 is not in contact with the resin and the state where the mold material 101 is pressed against the resin, along with the vertical movement. By the linear motion guide 105, the moving direction of the elevating unit 106 is adjusted to be perpendicular (z direction) to an XY plane on which an XY stage 110 described later moves. The upper end of the ball screw 107 is connected to the motor 108. Further, the ball screw 107 is combined with a ball nut installed inside the elevating unit 106, and by rotating the motor 108, the elevating unit 106 moves in the z direction. The frame 109 is formed of a highly rigid member and serves to support the entire mechanism that drives the mold 101 up and down. The XY stage 110 has a role of holding the substrate 102 and a role of moving in the XY direction in order to perform sequential patterning. The XY stage 110 is driven by a linear motor (not shown) and moves in the XY direction along the upper surface of the surface plate 111. The surface plate 111 holds the frame 109, mounts an XY table 110, and supports the entire apparatus, and is installed on the floor via a vibration isolation table 112. The anti-vibration table 112 blocks vibrations from the floor and prevents the influence of disturbance on the apparatus. The dispenser 114 drops the resin in order to apply the resin for each shot, which is a region where the pattern is transferred at a time. The alignment scope 115 for measuring the position of the substrate 102 is used when measuring the alignment mark arranged on the substrate 102 and aligning the position of the pattern of the mold material 101 with the substrate 102. The motor driver 113 drives the motor 108.

  The XY stage 110 is roughly composed of two members, an XY stage vibration part A203 and an XY stage main body A204. The XY stage vibration unit A203 is placed on the XY stage main body A204, but is connected by an elastic hinge or a link mechanism, and can move only a small amount in the x direction with respect to the XY stage main body A204. It has become. The vibrator A201 is an actuator made of a piezo element and can be driven by a minute amount. By driving the vibrator A201, the XY stage vibrating portion A203 can move a minute amount in the x direction. The elastic body A202 is disposed at a position opposite to the vibrator A201, and serves as a reaction force receiver when the XY stage vibration unit A203 moves in the x direction. The vibrator drive unit A205 drives the vibrator A201. The central controller A206 controls the entire apparatus. Furthermore, the central controller A206 takes in the output of the load sensor 104, and sends a command to the motor driver 113 based on the value to perform load control. The vibrator A201 is also controlled by sending a drive signal to the vibrator drive unit A205.

  The operation of the apparatus will be described. The substrate 102 is carried into the apparatus by a substrate transport system (not shown) and is held on the XY stage 110. Thereafter, the alignment mark 115 (not shown) on the mold 101 and the substrate 102 is observed by the alignment scope 115 which is an optical detection device, and the positions of the mold 101 and the substrate 102 at the coordinates of the XY stage 110 are detected. According to this detection result, the XY stage 110 moves and the mold material 101 and the substrate 102 are aligned. At this time, the alignment mark (not shown) provided on the substrate 102 and the alignment mark (not shown) provided on the mold 101 detected by the alignment scope 116 in a state where the mold material 101 and the substrate 102 are aligned. Relative position information is stored in the storage unit 207 in the central controller A206. The alignment scopes 115 and 116 are configured by an imaging device such as a CCD, an illumination optical system, an imaging optical system, and the like. Next, the XY stage 110 moves so that the stamping position of the substrate 102 matches the dropping position of the dispenser 114 in order to drop the resin at the stamping position that is the position on the substrate 102 where the pattern of the mold 101 is transferred. Thereafter, resin is dropped onto the surface of the substrate 102 by the dispenser 114. After dripping, the position based on the alignment result is corrected and moved to the position of the mold 101. Thereafter, the motor 108 is driven and the mold material 101 is pressed against the substrate 102. At this time, the XY stage vibration part A203 on the XY stage 110 is driven, and the substrate 102 reciprocates in the x direction. As the mold material 101 approaches, the dropped resin spreads along the pattern surface 151 of the mold material 101. When the operation is completed, an alignment mark (not shown) on the substrate 102 observed by the alignment scope 115 and an alignment mark (not shown) on the mold 101 detected by 116 are observed, and the coordinates of the XY stage 110 are observed. The positions of the mold 101 and the substrate 102 are detected. In the previous alignment, the relative position information of the alignment mark (not shown) provided on the substrate 102 and the alignment mark (not shown) provided on the mold 101 detected by the alignment scope 116 has already been acquired. . Therefore, based on this information, the XY stage 110 can be moved and the mold 101 and the substrate 102 can be aligned. When the alignment is completed, the resin is irradiated with ultraviolet light from the ultraviolet light source through the mold material 101. After performing irradiation for curing the resin, the mold material 101 is pulled up. Thereafter, resin is dropped at the next shot position, and the transfer is repeated successively.

  Next, details of the alignment method between the mold member 101 and the substrate 102 in the present embodiment will be described.

  FIG. 1 shows a configuration of a mold material 101 that can be used in this embodiment. A pattern transfer region 152 in which a pattern for transfer is formed is provided on the pattern surface 151 of the mold material 101. In the outer peripheral region of the pattern transfer region 152 of the mold 101, two first alignment marks 301 are provided at the center, and second alignment marks 302 are provided at the four corners. For the first alignment mark 301 and the second alignment mark 302, an example is used in which the marks extend in the x direction and the y direction along the pattern surface 151 of the mold 101. However, the shape of the alignment mark and the arrangement of the alignment mark with respect to the mold 101 are not limited to those exemplified in this embodiment.

  Next, an alignment method between the mold material 101 and the substrate 102 in the present embodiment will be described with reference to FIG. Here, an alignment method in one shot 121, which is a region where a pattern is transferred at a time, on a substrate 102 such as a silicon wafer or a glass wafer will be described.

  FIG. 2A shows an outline when alignment of the mold material 101 and the substrate 102 is performed in a state where the mold material 101 and the substrate 102 are arranged at an interval. In this embodiment, the mold 101 and the substrate 102 are aligned with the uncured resin 300 applied on the substrate 102. However, after the alignment is performed as described above, the resin 300 is applied. May be.

  In the drawing, a first alignment mark 301 is disposed on the pattern surface 151 of the mold 101, and a third alignment mark 303 is disposed on the substrate 102. The third alignment mark 303 is provided on a scribe line that is a margin for cutting the substrate 102. In addition, the first alignment scope 115 detects the first alignment mark 301 and the third alignment mark 303.

  The second alignment scope 116 detects the second alignment mark 302 provided on the pattern surface 151 of the mold material 101. The resin 300 is not applied between the mold material 101 and the substrate 102 at the location where the second alignment mark 302 is provided. Even if the mold material 101 is pressed against the resin 300, the mold material 101 and the substrate 102 are not applied. The resin 300 is not filled between the two. The second alignment scope 116 will be described here with two scopes shown for convenience.

  Reference numeral 304 denotes a monitor, which shows a state in which the first, second, and third alignment marks 301, 302, and 303 are detected using the first and second alignment scopes 115 and 116. ing. Reference numerals 311, 312, and 313 denote first, second, and third alignment marks observed on the monitor. Here, for convenience, the alignment marks 311, 312, and 313 on the monitor detected by the alignment scopes 115 and 116 are only marks in one direction.

  The contrast of the first, second, and third alignment marks 311, 312, and 313 on the monitor detected by the first and second alignment scopes 115 and 116 is sufficiently high for detection. Therefore, the detection method of each of these alignment marks using the alignment scopes 115 and 116 can use, for example, a detection method using bright field illumination and an image processing method. The image processing method is a method in which an alignment mark is imaged on an image sensor such as a CCD, and an electrical signal obtained from the image sensor is processed to perform alignment.

  First, in a state in which the mold material 101 and the substrate 102 are arranged with a space therebetween, the first alignment mark 301 and the third alignment mark 303 are detected by using the first alignment scope 115, whereby the mold material is detected. 101 and substrate 102 are aligned. Further, at the time of this alignment, the position of the second alignment mark 302 is also detected using the second alignment scope 116.

  As described above, since the second and third alignment marks 302 and 303 are detected in a state where the mold 101 and the substrate 102 are aligned, the relative alignment between the second alignment mark 302 and the third alignment mark 303 is relatively small. It is possible to detect a specific positional relationship. This relative position information is stored in a storage unit in the central controller A (not shown).

  Here, an alignment method in a state in which the mold member 101 and the substrate 102 are arranged at an interval will be described. An alignment method in a state where the mold material 101 and the substrate 102 are separated from each other has been proposed in Patent Document 2 by the present applicant, and high-accuracy alignment confirmation has been obtained in an actual semiconductor manufacturing process. By applying this alignment method to the first alignment scope 115 of the present invention, it is possible to perform alignment in a state in which the mold material 101 and the substrate 102 are arranged at an interval.

  FIG. 3 shows an alignment method in a state where the mold material 101 and the substrate 102 are separated from each other. For the sake of convenience, only the first alignment mark 301 disposed on the mold 101 and the third alignment mark 303 disposed on the substrate 102 will be described for the sake of convenience. Illumination light from the light source 404 is irradiated to the first alignment mark 301 and the third alignment mark 303 via the illumination optical system 405 and the beam splitter 406. The image of the first alignment mark 301 is imaged on the imaging element 409 via the beam splitter 406, the beam splitter 407, and the imaging optical system 408. The image of the third alignment mark 303 is imaged on the imaging element 411 via the beam splitter 406, the beam splitter 407, and the imaging optical system 410.

  On the other hand, on the reference alignment mark base 402, a mold reference alignment mark 401 and a substrate reference alignment mark 403 are arranged. Illumination light from the light source 412 is irradiated to the mold reference alignment mark 401 and the substrate reference alignment mark 403 via the illumination optical system 413. The image of the mold material reference alignment mark 401 is formed on the imaging element 409 via the beam splitter 406, the beam splitter 407, and the imaging optical system 408. The image of the substrate reference alignment mark 403 is imaged on the imaging element 411 via the beam splitter 406, the beam splitter 407, and the imaging optical system 410.

  The image sensor 409 detects images of the first alignment mark 301 and the mold reference alignment mark 401 provided on the mold 101. Image information obtained from the image sensor 409 can be processed to detect the relative position between the first alignment mark 301 and the mold reference alignment mark 401. Similarly, since the image sensor 411 detects images of the third alignment mark 303 and the substrate reference alignment mark 403 provided on the substrate 102, the third alignment mark 303 and the substrate reference alignment are detected. The relative position of the mark 403 can be detected. Further, the relative positional relationship between the mold reference alignment mark 401 and the substrate reference alignment mark 403 provided on the reference alignment mark base 402 is known.

  Therefore, based on these pieces of information, the relative positional relationship between the first alignment mark 301 and the third alignment mark 303 is acquired, and the mold material 101 and the substrate 102 are separated in a state where the mold material 101 and the substrate 102 are separated from each other. Can be aligned.

  Next, FIG. 2B illustrates the alignment of the mold material 101 and the substrate 102 in a state where the mold material 101 is brought into contact with the resin 300 and the substrate 101 is pressed against the resin 300 until the resin 300 is cured. The outline is shown.

  Reference numeral 304 denotes a monitor, which shows the state of each observed alignment mark.

  In a state where the mold material 101 is pressed against the resin 300 until the resin 300 is cured, the refractive index of the mold material 101 and the resin 300 is almost the same, so the first alignment mark 301 provided on the mold material 101 is , The image will have almost no contrast. Therefore, only the third alignment mark 303 is detected by the first alignment scope 115, and the detected third alignment mark is shown as 313.

  On the other hand, since the resin 300 is not filled between the mold 101 provided with the second alignment mark 302 and the substrate 102, the second alignment mark 302 can be detected by the second alignment scope 116. Is possible. Therefore, the second alignment mark 312 is observed on the monitor.

  The relative positional relationship between the second alignment mark 302 and the third alignment mark 303 has already been detected in a state where the mold material 101 and the substrate 102 are arranged at an interval. Therefore, the second and third alignment marks 302 and 303 are detected by detecting the second and third alignment marks 302 and 303 in a state where the mold material 101 is pressed against the resin 300 until the resin 300 is cured. Based on the relative position information, the mold 101 and the substrate 102 can be aligned.

  Thus, in the present invention, even when the first alignment scope 115 and the second alignment scope 116 which are separate detection devices are used, the second and third alignments are performed before the mold material 101 contacts the resin 102. The relative positions of the marks 302 and 303 are detected. Therefore, as in the case of using the same detection device, it is possible to align the mold material 101 and the substrate 102 with high accuracy.

  Further, in a state where the mold material 101 is pressed against the resin 300 until the resin 300 is cured, based on the relative positions of the second and third alignment marks 302 and 303, the second and third alignment marks 302, Since 303 can be detected and alignment can be performed, accurate alignment between the mold 101 and the substrate 102 can be performed.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 5 shows a configuration of a mold 101 that can be used in this embodiment. A pattern transfer region 152 in which a pattern for transfer is formed is provided on the pattern surface 151 of the mold material 101. A first alignment mark 301 is provided at the center of the outer peripheral area of the pattern transfer area 152 of the mold 101. Further, the second alignment marks 302 are installed at the four corners on the surface 153 facing the pattern surface 151 of the mold 101.

  FIG. 6A shows an outline when alignment of the mold material 101 and the substrate 102 is performed in one shot in a state where the mold material 101 and the substrate 102 are arranged with a space therebetween. Also in this embodiment, the mold 101 and the substrate 102 are aligned with the uncured resin 300 applied on the substrate 102. However, the resin 300 may be applied after the alignment. .

  In the drawing, a first alignment mark 301 is disposed on the pattern surface 151 of the mold 101, and a third alignment mark 303 is disposed on the substrate 102. The third alignment mark 303 is provided on a scribe line that is a margin for cutting the substrate 102. The first alignment scope 115 detects the first alignment mark 301 and the third alignment mark 303. The second alignment scope 116 detects the second alignment mark 302 provided on the surface of the mold 101 that faces the pattern surface 151.

  Reference numeral 304 denotes a monitor, which shows how the first, second, and third alignment marks 301, 302, and 303 are detected by the first and second alignment scopes 115 and 116. Reference numerals 311, 312, and 313 denote first, second, and third alignment marks observed on the monitor. Here, for convenience, the alignment marks 311, 312, and 313 detected by the alignment scopes 115 and 116 are only marks in one direction.

  The contrast of the first, second, and third alignment marks 311, 312, and 313 detected by these alignment scopes is sufficiently high for detection. For this reason, as a method for detecting these alignment marks using each alignment scope, for example, a detection method using bright field illumination and an image processing method can be used.

  Also in the present embodiment, as in the first embodiment, the first alignment mark 301 and the first alignment mark 115 are used in a state where the mold member 101 and the substrate 102 are spaced apart from each other. By detecting the third alignment mark 303, the mold material 101 and the substrate 102 are aligned. Further, at the time of this alignment, the position of the second alignment mark 302 is also detected using the second alignment scope 116.

  As described above, in order to detect the second and third alignment marks 302 and 303 in a state where the mold material 101 and the substrate 102 are aligned, the relative alignment between the second alignment mark 302 and the third alignment mark 303 is relatively small. It is possible to detect a correct positional relationship. Further, relative positional information of the first alignment mark 301 and the third alignment mark 303 is stored in a storage unit in the central control device A (not shown).

  FIG. 6B shows an outline of alignment between the mold material 101 and the substrate 102 in a state where the mold material 101 is brought into contact with the resin 300 and the mold material 101 is pressed against the resin 102 until the resin 300 is cured. ing.

  Reference numeral 304 denotes a monitor, which shows how the alignment marks to be observed are detected when the mold 101 and the resin 300 are in contact with each other.

  In a state where the mold material 101 is pressed against the resin 300 until the resin 300 is cured, the refractive index of the mold material 101 and the resin 300 is almost the same, so the first alignment mark 301 provided on the mold material 101 is , The image will have almost no contrast. Therefore, only the third alignment mark 303 is detected by the first alignment scope 115, and the detected third alignment mark 313 is observed on the monitor.

  In the present embodiment, the second alignment mark 302 is provided on the surface facing the pattern surface 151 of the mold 101. Therefore, even if the resin 300 fills the space between the mold material 101 and the substrate 102 where the second alignment mark 302 is provided, the second alignment mark 302 can be detected by the second alignment scope 116. Reference numeral 304 denotes a second alignment mark 302 detected by the second alignment scope 116.

  The relative positional relationship between the second alignment mark 302 and the third alignment mark 303 has already been detected in a state where the mold material 101 and the substrate 102 are arranged at an interval. Therefore, the second and third alignment marks 302 and 303 are detected by detecting the second and third alignment marks 302 and 303 in a state where the mold material 101 is pressed against the resin 300 until the resin 300 is cured. Based on the relative position information, the mold 101 and the substrate 102 can be aligned.

  Accordingly, in the present embodiment, even when the resin 300 is on the second alignment mark 302, the mold 101 and the substrate 102 can be aligned.

  In the first embodiment and the second embodiment, the alignment of the mold 101 and the substrate 102 in the photo-implantation nanoimprint technology has been described. However, the present invention is not limited to the photo-curing method, and the thermal cycle. It is also applicable to nanoimprint technology.

The figure which shows the mold material which can be used for the 1st Embodiment of this invention. FIG. 3 is a schematic view of alignment of a mold material and a substrate in the first embodiment of the present invention. The figure which shows the alignment in the state which the mold material and the board | substrate of patent document 2 left | separated. The external view of the whole nanoimprint apparatus of this invention. The figure which shows the mold material which can be used for the 2nd Embodiment of this invention. Schematic of alignment of the mold material and the substrate in the second embodiment of the present invention. The figure which shows description of the nanoimprint method by a photocuring method. The figure which shows the alignment of the nanoimprint method in a prior art example.

Explanation of symbols

101 Mold Material 102 Substrate 115 First Alignment Scope 116 Second Alignment Scope 207 Storage Unit 300 Resin 301 First Alignment Mark 302 Second Alignment Mark 303 Third Alignment Mark

Claims (4)

Using a mold material having a pattern transfer region in which a pattern is formed on one surface, the resin in a state where the surface having the pattern transfer region of the mold material is pressed against an uncured curable resin applied on the substrate. In the nanoimprint method in which the pattern is transferred to the resin by curing
A first alignment mark and a second alignment mark provided on a surface of the mold material having a pattern transfer region, other than the pattern transfer region;
A third alignment mark provided on the substrate;
First detection means capable of detecting both the first alignment mark and the third alignment mark;
Second detection means capable of detecting the second alignment mark;
Storage means capable of storing relative positional information between the third alignment mark detected by the first detection means and the second alignment mark detected by the second detection means;
Use
In a state where the mold material and the substrate are aligned by the detection of the first alignment mark and the third alignment mark by the first detection means without contacting the mold material and the resin, Detecting the second alignment mark by a second detection means, obtaining relative positional information between the third alignment mark and the second alignment mark, and storing it in the storage means;
In a state where the mold material and the resin are in contact with each other so as not to fill the resin on the second alignment mark, a relative relationship between the third alignment mark and the second alignment mark stored in the storage unit And detecting the third alignment mark by the first detection means and detecting the second alignment mark by the second detection means on the basis of the specific position information. The process of aligning,
A nanoimprinting method comprising: Using a mold material having a pattern transfer region in which a pattern is formed on one surface, the resin in a state where the surface having the pattern transfer region of the mold material is pressed against an uncured curable resin applied on the substrate. In the nanoimprint method in which the pattern is transferred to the resin by curing
A first alignment mark provided on an area other than the pattern transfer area on the surface of the mold material having the pattern transfer area;
A second alignment mark provided on a surface facing the surface having the pattern transfer region of the mold material;
A third alignment mark provided on the substrate;
First detection means capable of detecting both the first alignment mark and the third alignment mark;
Second detection means capable of detecting the second alignment mark;
Storage means capable of storing relative positional information between the third alignment mark detected by the first detection means and the second alignment mark detected by the second detection means;
Use
In a state where the mold material and the substrate are aligned by the detection of the first alignment mark and the third alignment mark by the first detection means without contacting the mold material and the resin, Detecting the second alignment mark by a second detection means, obtaining relative positional information between the third alignment mark and the second alignment mark, and storing it in the storage means;
Based on the relative position information of the third alignment mark and the second alignment mark stored in the storage means in a state where the mold material and the resin are in contact with each other, the first detection means A step of positioning the mold material and the substrate by detecting the third alignment mark and detecting the second alignment mark by the second detection means;
A nanoimprinting method comprising: Using a mold material having a pattern transfer region in which a pattern is formed on one surface, the resin in a state where the surface having the pattern transfer region of the mold material is pressed against an uncured curable resin applied on the substrate. In a nanoimprint apparatus that cures and transfers the pattern to the resin,
On the surface having the pattern transfer region, a mold material provided with a first alignment mark and a second alignment mark in a region other than the pattern transfer region;
A substrate provided with a third alignment mark;
Use
A first state in which the mold material and the substrate are relatively moved so that the mold material and the resin are not in contact with each other, and a pattern transfer region of the mold material without being in contact with the second alignment mark of the mold material And a holding means capable of holding in a second state in which a resin is in contact with the first alignment mark;
Moving means for relatively moving the mold material and the substrate parallel to the surface having the pattern transfer region in order to align the mold material and the substrate;
First detection means capable of detecting both the first alignment mark and the third alignment mark;
Second detection means capable of detecting the second alignment mark;
Control means for controlling the holding means, the moving means, and the first and second detecting means;
With
In the first state, the control means detects the first alignment mark and the third alignment mark by the first detection means, and aligns the mold material and the substrate by the moving means. The second alignment mark is detected by the second detection unit in a state where the alignment is performed, and relative positional information of the third alignment mark and the second alignment mark is stored in the storage unit. Remember,
In the second state, the third detection mark is detected by the first detection means and the second alignment mark is detected by the second detection means, and the third alignment mark is stored in the storage means. Based on the relative position information of the alignment mark and the second alignment mark, the moving means performs alignment between the mold material and the substrate.
Nanoimprint apparatus characterized by the above. Using a mold material having a pattern transfer region in which a pattern is formed on one surface, the resin in a state where the surface having the pattern transfer region of the mold material is pressed against an uncured curable resin applied on the substrate. In a nanoimprint apparatus that cures and transfers the pattern to the resin,
A first alignment mark is provided on a surface having the pattern transfer region, and a region other than the pattern transfer region is provided, and a second alignment mark is provided on a surface facing the surface having the pattern transfer region. Mold material,
A substrate provided with a third alignment mark;
Use
A first state in which the mold material and the substrate are relatively moved so that the mold material and the resin are not in contact with each other, and a second pattern in which the resin is brought into contact with the pattern transfer region of the mold material and the first alignment mark. Holding means that can be held in a state of
Moving means for relatively moving the mold material and the substrate parallel to the surface having the pattern transfer region in order to align the mold material and the substrate;
First detection means capable of detecting both the first alignment mark and the third alignment mark;
Second detection means capable of detecting the second alignment mark;
Control means for controlling the holding means, the moving means, and the first and second detecting means;
With
In the first state, the control means detects the first alignment mark and the third alignment mark by the first detection means, and aligns the mold material and the substrate by the moving means. The second alignment mark is detected by the second detection unit in a state where the alignment is performed, and relative positional information of the third alignment mark and the second alignment mark is stored in the storage unit. Remember,
In the second state, the third detection mark is detected by the first detection means and the second alignment mark is detected by the second detection means, and the third alignment mark is stored in the storage means. Based on the relative position information of the alignment mark and the second alignment mark, the moving means performs alignment between the mold material and the substrate.
Nanoimprint apparatus characterized by the above.

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