HK1074883A1 - Acceleration sensor and manufacturingmethod for the same - Google Patents

Acceleration sensor and manufacturingmethod for the same

Info

Publication number
HK1074883A1
HK1074883A1 HK05107227A HK05107227A HK1074883A1 HK 1074883 A1 HK1074883 A1 HK 1074883A1 HK 05107227 A HK05107227 A HK 05107227A HK 05107227 A HK05107227 A HK 05107227A HK 1074883 A1 HK1074883 A1 HK 1074883A1
Authority
HK
Hong Kong
Prior art keywords
manufacturingmethod
same
acceleration sensor
acceleration
sensor
Prior art date
Application number
HK05107227A
Other languages
English (en)
Inventor
Kazuhiro Okada
Original Assignee
Wako Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wako Kk filed Critical Wako Kk
Publication of HK1074883A1 publication Critical patent/HK1074883A1/xx

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0062Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0228Inertial sensors
    • B81B2201/0235Accelerometers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0228Inertial sensors
    • B81B2201/0242Gyroscopes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/05Type of movement
    • B81B2203/053Translation according to an axis perpendicular to the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/05Type of movement
    • B81B2203/055Translation in a plane parallel to the substrate, i.e. enabling movement along any direction in the plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/05Type of movement
    • B81B2203/056Rotation in a plane parallel to the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/05Type of movement
    • B81B2203/058Rotation out of a plane parallel to the substrate
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G01P2015/0842Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0862Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
    • G01P2015/0871Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system using stopper structures for limiting the travel of the seismic mass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
HK05107227A 2002-05-13 2005-08-19 Acceleration sensor and manufacturingmethod for the same HK1074883A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002136596A JP4216525B2 (ja) 2002-05-13 2002-05-13 加速度センサおよびその製造方法

Publications (1)

Publication Number Publication Date
HK1074883A1 true HK1074883A1 (en) 2005-11-25

Family

ID=29397532

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05107227A HK1074883A1 (en) 2002-05-13 2005-08-19 Acceleration sensor and manufacturingmethod for the same

Country Status (5)

Country Link
US (2) US6772632B2 (zh)
EP (1) EP1371993B1 (zh)
JP (1) JP4216525B2 (zh)
CN (1) CN100374865C (zh)
HK (1) HK1074883A1 (zh)

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6864677B1 (en) * 1993-12-15 2005-03-08 Kazuhiro Okada Method of testing a sensor
US5421213A (en) * 1990-10-12 1995-06-06 Okada; Kazuhiro Multi-dimensional force detector
US6314823B1 (en) * 1991-09-20 2001-11-13 Kazuhiro Okada Force detector and acceleration detector and method of manufacturing the same
US6282956B1 (en) * 1994-12-29 2001-09-04 Kazuhiro Okada Multi-axial angular velocity sensor
US6809529B2 (en) * 2001-08-10 2004-10-26 Wacoh Corporation Force detector
JP4125931B2 (ja) * 2002-08-26 2008-07-30 株式会社ワコー 回転操作量の入力装置およびこれを利用した操作装置
JP4907050B2 (ja) * 2003-03-31 2012-03-28 株式会社ワコー 力検出装置
JP4387691B2 (ja) * 2003-04-28 2009-12-16 株式会社ワコー 力検出装置
EP1491901A1 (en) 2003-06-25 2004-12-29 Matsushita Electric Works, Ltd. Semiconductor acceleration sensor and method of manufacturing the same
JP2005049130A (ja) * 2003-07-30 2005-02-24 Oki Electric Ind Co Ltd 加速度センサ及び加速度センサの製造方法
JP4416460B2 (ja) * 2003-09-16 2010-02-17 トレックス・セミコンダクター株式会社 加速度センサー
JP4552002B2 (ja) * 2003-10-23 2010-09-29 東亜ディーケーケー株式会社 気液分離膜およびその製造方法
JP4578087B2 (ja) * 2003-11-10 2010-11-10 Okiセミコンダクタ株式会社 加速度センサ
US7397097B2 (en) * 2003-11-25 2008-07-08 Stmicroelectronics, Inc. Integrated released beam layer structure fabricated in trenches and manufacturing method thereof
US7501835B2 (en) * 2004-03-10 2009-03-10 Kabushiki Kaisha Toyota Chuo Kenkyusho Displacement sensor
JP2005283393A (ja) * 2004-03-30 2005-10-13 Fujitsu Media Device Kk 慣性センサ
JP2005283402A (ja) * 2004-03-30 2005-10-13 Fujitsu Media Device Kk 慣性センサ
JP4272115B2 (ja) * 2004-06-03 2009-06-03 Okiセミコンダクタ株式会社 加速度センサ及びその製造方法
JP2006062002A (ja) * 2004-08-25 2006-03-09 Oki Electric Ind Co Ltd 半導体装置の個片化方法
US7179674B2 (en) * 2004-12-28 2007-02-20 Stmicroelectronics, Inc. Bi-directional released-beam sensor
US7353706B2 (en) 2004-12-28 2008-04-08 Stmicroelectronics, Inc. Weighted released-beam sensor
JP2006242692A (ja) * 2005-03-02 2006-09-14 Oki Electric Ind Co Ltd 加速度センサチップ
JP2006250581A (ja) * 2005-03-08 2006-09-21 Mitsumi Electric Co Ltd 3軸加速度センサモジュールおよびその製造方法
JP2006275896A (ja) * 2005-03-30 2006-10-12 Yokohama Rubber Co Ltd:The 半導体加速度センサ
JP4815857B2 (ja) * 2005-04-26 2011-11-16 大日本印刷株式会社 力学量検出センサの製造方法
US7337671B2 (en) * 2005-06-03 2008-03-04 Georgia Tech Research Corp. Capacitive microaccelerometers and fabrication methods
US7318349B2 (en) * 2005-06-04 2008-01-15 Vladimir Vaganov Three-axis integrated MEMS accelerometer
US7578189B1 (en) 2006-05-10 2009-08-25 Qualtre, Inc. Three-axis accelerometers
JP2007309654A (ja) * 2006-05-16 2007-11-29 Sony Corp 加速度センサおよびその製造方法
US20080041156A1 (en) * 2006-07-05 2008-02-21 Oki Electric Industry Co., Ltd. Semiconductor acceleration sensor
JP5007083B2 (ja) * 2006-08-08 2012-08-22 本田技研工業株式会社 力覚センサ用チップ
JP4858064B2 (ja) * 2006-10-04 2012-01-18 大日本印刷株式会社 力学量検出センサおよびその製造方法
EP2090866A4 (en) * 2006-11-20 2011-08-31 Dainippon Printing Co Ltd DYNAMIC QUANTITY DETECTOR AND METHOD FOR MANUFACTURING THE SAME
JP2008190931A (ja) 2007-02-02 2008-08-21 Wacoh Corp 加速度と角速度との双方を検出するセンサ
JP4858215B2 (ja) * 2007-02-20 2012-01-18 パナソニック株式会社 複合センサ
JP2008224254A (ja) * 2007-03-08 2008-09-25 Oki Electric Ind Co Ltd センサ装置、センサ装置の製造方法
JP2008249390A (ja) * 2007-03-29 2008-10-16 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JPWO2008143191A1 (ja) * 2007-05-17 2010-08-05 ローム株式会社 Memsセンサおよびその製造方法
JP2007279055A (ja) * 2007-05-29 2007-10-25 Oki Electric Ind Co Ltd 加速度センサの製造方法
JP2009020001A (ja) * 2007-07-12 2009-01-29 Oki Electric Ind Co Ltd 加速度センサ
DE102007046017B4 (de) * 2007-09-26 2021-07-01 Robert Bosch Gmbh Sensorelement
JP5186885B2 (ja) 2007-11-07 2013-04-24 大日本印刷株式会社 マスクパターンの補正方法およびそれを用いた加速度センサと角速度センサの製造方法
US8136400B2 (en) * 2007-11-15 2012-03-20 Physical Logic Ag Accelerometer
JP4687736B2 (ja) 2008-03-25 2011-05-25 株式会社村田製作所 外力検知装置の製造方法および外力検知装置
JP5253859B2 (ja) * 2008-03-28 2013-07-31 ラピスセミコンダクタ株式会社 加速度センサの構造及びその製造方法
JP5147491B2 (ja) * 2008-03-28 2013-02-20 ラピスセミコンダクタ株式会社 加速度センサ装置
US8980008B2 (en) * 2008-04-15 2015-03-17 Hanergy Hi-Tech Power (Hk) Limited Apparatus and methods for manufacturing thin-film solar cells
JP5108617B2 (ja) 2008-05-13 2012-12-26 大日本印刷株式会社 加速度センサ
JP2010085143A (ja) * 2008-09-30 2010-04-15 Torex Semiconductor Ltd 加速度センサー
JP2010107242A (ja) * 2008-10-28 2010-05-13 Rohm Co Ltd Memsセンサ
JP5293145B2 (ja) * 2008-12-17 2013-09-18 大日本印刷株式会社 半導体装置
US20100162823A1 (en) * 2008-12-26 2010-07-01 Yamaha Corporation Mems sensor and mems sensor manufacture method
TWI391663B (zh) * 2009-02-25 2013-04-01 Nat Univ Tsing Hua 加速度計
TW201034932A (en) * 2009-03-31 2010-10-01 Domintech Co Ltd Capacitor type three-axis accelerometer for microelectromechanical systems (MEMS)
JP5439068B2 (ja) * 2009-07-08 2014-03-12 株式会社ワコー 力検出装置
JP5724342B2 (ja) 2009-12-10 2015-05-27 大日本印刷株式会社 パターン配置方法並びにシリコンウェハ及び半導体デバイスの製造方法
KR101119283B1 (ko) * 2009-12-22 2012-06-05 삼성전기주식회사 관성 센서 및 그 제조 방법
KR20120131788A (ko) * 2011-05-26 2012-12-05 삼성전기주식회사 관성센서 및 그 제조방법
CN102959403B (zh) 2010-06-21 2015-11-25 大日本印刷株式会社 力学量传感器
CN102408089A (zh) * 2010-09-20 2012-04-11 利顺精密科技股份有限公司 可同时量测加速度及压力的微机电传感器
KR101264549B1 (ko) 2011-11-11 2013-05-14 삼성전기주식회사 관성센서의 제조방법
KR101354757B1 (ko) * 2011-11-18 2014-01-22 삼성전기주식회사 관성센서
US8984942B2 (en) * 2012-02-10 2015-03-24 Hewlett-Packard Development Company, L.P. Suspended masses in micro-mechanical devices
TWI586946B (zh) * 2013-02-04 2017-06-11 Fujikura Ltd Sensing detectors
JP6339669B2 (ja) 2013-07-08 2018-06-06 モーション・エンジン・インコーポレーテッド Memsデバイスおよび製造する方法
US10273147B2 (en) 2013-07-08 2019-04-30 Motion Engine Inc. MEMS components and method of wafer-level manufacturing thereof
WO2015013828A1 (en) 2013-08-02 2015-02-05 Motion Engine Inc. Mems motion sensor and method of manufacturing
JP5529328B1 (ja) 2013-09-04 2014-06-25 株式会社トライフォース・マネジメント 発電素子
KR20150049056A (ko) * 2013-10-29 2015-05-08 삼성전기주식회사 가속도 센서
JP6590812B2 (ja) 2014-01-09 2019-10-16 モーション・エンジン・インコーポレーテッド 集積memsシステム
US20170030788A1 (en) 2014-04-10 2017-02-02 Motion Engine Inc. Mems pressure sensor
WO2015184531A1 (en) 2014-06-02 2015-12-10 Motion Engine Inc. Multi-mass mems motion sensor
CA3004760A1 (en) 2014-12-09 2016-06-16 Motion Engine Inc. 3d mems magnetometer and associated methods
US10407299B2 (en) 2015-01-15 2019-09-10 Motion Engine Inc. 3D MEMS device with hermetic cavity
WO2016121129A1 (ja) 2015-01-26 2016-08-04 株式会社ワコーテック 力覚センサ
WO2016163033A1 (ja) 2015-04-07 2016-10-13 株式会社トライフォース・マネジメント 力覚センサおよびこれに用いる構造体
KR20160126211A (ko) 2015-04-23 2016-11-02 삼성전기주식회사 관성 센서
JP6527801B2 (ja) * 2015-09-30 2019-06-05 日立オートモティブシステムズ株式会社 物理量センサ
JP5996078B1 (ja) 2015-10-19 2016-09-21 株式会社トライフォース・マネジメント 発電素子
JP2017187447A (ja) * 2016-04-08 2017-10-12 アルプス電気株式会社 センサ装置
WO2018135211A1 (ja) 2017-01-17 2018-07-26 パナソニックIpマネジメント株式会社 センサ
CN107271724A (zh) * 2017-05-18 2017-10-20 中北大学 单片集成的压阻式三轴加速度计及制备方法
IT201700071798A1 (it) * 2017-06-27 2018-12-27 St Microelectronics Srl Sensore di forza multiassiale, metodo di fabbricazione del sensore di forza multiassiale, e metodo di funzionamento del sensore di forza multiassiale

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE376421A (zh) * 1930-02-10
US4891985A (en) * 1985-07-22 1990-01-09 Honeywell Inc. Force sensor with attached mass
US5182515A (en) * 1987-04-24 1993-01-26 Wacoh Corporation Detector for magnetism using a resistance element
EP0312605A4 (en) * 1987-04-24 1992-06-17 Kabushiki Kaisha Nexy Kenkyusho Detector for force, acceleration and magnetism using resistor element
EP0311695B1 (en) * 1987-04-24 1994-11-30 Enplas Laboratories, Inc. Force and moment detector using resistor
US5092645A (en) * 1987-09-18 1992-03-03 Wacoh Corporation Robotic gripper having strain sensors formed on a semiconductor substrate
US5263375A (en) * 1987-09-18 1993-11-23 Wacoh Corporation Contact detector using resistance elements and its application
US5121633A (en) * 1987-12-18 1992-06-16 Nissan Motor Co., Ltd. Semiconductor accelerometer
US4882933A (en) * 1988-06-03 1989-11-28 Novasensor Accelerometer with integral bidirectional shock protection and controllable viscous damping
JPH0623782B2 (ja) * 1988-11-15 1994-03-30 株式会社日立製作所 静電容量式加速度センサ及び半導体圧力センサ
US5035148A (en) * 1989-02-01 1991-07-30 Wacoh Corporation Force detector using resistance elements
JP2681215B2 (ja) * 1989-05-29 1997-11-26 株式会社ワコー 積層基板を用いたセンサの製造方法
JP2822486B2 (ja) * 1989-09-27 1998-11-11 株式会社デンソー 感歪センサおよびその製造方法
US5531092A (en) * 1989-12-28 1996-07-02 Okada; Kazuhiro Device for moving a suspended weight body
EP0461265B1 (en) * 1989-12-28 1995-05-10 Wacoh Corporation Acceleration sensors
DE4016472A1 (de) 1990-05-22 1991-11-28 Bosch Gmbh Robert Verfahren zur herstellung von mikromechanischen sensoren mit ueberlastsicherung
US6314823B1 (en) 1991-09-20 2001-11-13 Kazuhiro Okada Force detector and acceleration detector and method of manufacturing the same
US5421213A (en) * 1990-10-12 1995-06-06 Okada; Kazuhiro Multi-dimensional force detector
WO1992017759A1 (en) * 1991-03-30 1992-10-15 Kazuhiro Okada Method of testing performance of device for measuring physical quantity by using change of distance between electrodes and physical quantity measuring device provided with function of executing this method
JP3141954B2 (ja) * 1991-07-17 2001-03-07 株式会社ワコー 圧電素子を用いた力・加速度・磁気のセンサ
JP3027457B2 (ja) * 1991-10-25 2000-04-04 和廣 岡田 多次元方向に関する力・加速度・磁気の検出装置
JPH05215627A (ja) * 1992-02-04 1993-08-24 Kazuhiro Okada 多次元方向に関する力・加速度・磁気の検出装置
JP2776142B2 (ja) * 1992-05-15 1998-07-16 株式会社日立製作所 加速度センサ
US6282956B1 (en) * 1994-12-29 2001-09-04 Kazuhiro Okada Multi-axial angular velocity sensor
US5646346A (en) * 1994-11-10 1997-07-08 Okada; Kazuhiro Multi-axial angular velocity sensor
JP3256346B2 (ja) * 1993-07-29 2002-02-12 和廣 岡田 圧電素子を用いた力・加速度・磁気のセンサ
JP3549590B2 (ja) * 1994-09-28 2004-08-04 和廣 岡田 加速度・角速度センサ
JP3585980B2 (ja) * 1995-02-21 2004-11-10 株式会社ワコー 角速度センサ
US6003371A (en) * 1995-02-21 1999-12-21 Wacoh Corporation Angular velocity sensor
JPH0949856A (ja) * 1995-05-31 1997-02-18 Wako:Kk 加速度センサ
JPH0945937A (ja) 1995-07-26 1997-02-14 Matsushita Electric Works Ltd 3軸加速度センサの製造方法
JPH09119943A (ja) * 1995-10-24 1997-05-06 Wako:Kk 加速度センサ
US6367326B1 (en) * 1996-07-10 2002-04-09 Wacoh Corporation Angular velocity sensor
WO1998001722A1 (fr) * 1996-07-10 1998-01-15 Wacoh Corporation Detecteur de vitesse angulaire
US6293149B1 (en) * 1997-02-21 2001-09-25 Matsushita Electric Works, Ltd. Acceleration sensor element and method of its manufacture
JP4176849B2 (ja) 1997-05-08 2008-11-05 株式会社ワコー センサの製造方法
US5832163A (en) * 1997-07-18 1998-11-03 Mcdonnell Douglas Corporation Single mode optical waveguide with expanded rare-earth doped region
JPH11103076A (ja) * 1997-07-30 1999-04-13 Matsushita Electric Works Ltd 半導体加速度センサの製造方法
JP3191770B2 (ja) * 1997-08-29 2001-07-23 松下電工株式会社 半導体加速度センサ及びその製造方法
JP2000249609A (ja) * 1999-03-01 2000-09-14 Wakoo:Kk 静電容量式センサ
JP4295883B2 (ja) 1999-12-13 2009-07-15 株式会社ワコー 力検出装置
CN1111741C (zh) * 2000-08-25 2003-06-18 华北工学院微米纳米技术研究中心 集成硅微电阻式加速度传感器及其制造加工方法

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CN100374865C (zh) 2008-03-12
JP4216525B2 (ja) 2009-01-28
EP1371993A3 (en) 2004-12-01
US20040231422A1 (en) 2004-11-25
US6920788B2 (en) 2005-07-26
EP1371993B1 (en) 2016-04-06
US6772632B2 (en) 2004-08-10
CN1605870A (zh) 2005-04-13
JP2003329702A (ja) 2003-11-19
EP1371993A2 (en) 2003-12-17

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