HK1074883A1 - Acceleration sensor and manufacturingmethod for the same - Google Patents
Acceleration sensor and manufacturingmethod for the sameInfo
- Publication number
- HK1074883A1 HK1074883A1 HK05107227A HK05107227A HK1074883A1 HK 1074883 A1 HK1074883 A1 HK 1074883A1 HK 05107227 A HK05107227 A HK 05107227A HK 05107227 A HK05107227 A HK 05107227A HK 1074883 A1 HK1074883 A1 HK 1074883A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- manufacturingmethod
- same
- acceleration sensor
- acceleration
- sensor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0062—Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0242—Gyroscopes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/053—Translation according to an axis perpendicular to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/055—Translation in a plane parallel to the substrate, i.e. enabling movement along any direction in the plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/056—Rotation in a plane parallel to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/058—Rotation out of a plane parallel to the substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
- G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
- G01P2015/0871—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system using stopper structures for limiting the travel of the seismic mass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002136596A JP4216525B2 (ja) | 2002-05-13 | 2002-05-13 | 加速度センサおよびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1074883A1 true HK1074883A1 (en) | 2005-11-25 |
Family
ID=29397532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05107227A HK1074883A1 (en) | 2002-05-13 | 2005-08-19 | Acceleration sensor and manufacturingmethod for the same |
Country Status (5)
Country | Link |
---|---|
US (2) | US6772632B2 (zh) |
EP (1) | EP1371993B1 (zh) |
JP (1) | JP4216525B2 (zh) |
CN (1) | CN100374865C (zh) |
HK (1) | HK1074883A1 (zh) |
Families Citing this family (83)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6864677B1 (en) * | 1993-12-15 | 2005-03-08 | Kazuhiro Okada | Method of testing a sensor |
US5421213A (en) * | 1990-10-12 | 1995-06-06 | Okada; Kazuhiro | Multi-dimensional force detector |
US6314823B1 (en) * | 1991-09-20 | 2001-11-13 | Kazuhiro Okada | Force detector and acceleration detector and method of manufacturing the same |
US6282956B1 (en) * | 1994-12-29 | 2001-09-04 | Kazuhiro Okada | Multi-axial angular velocity sensor |
US6809529B2 (en) * | 2001-08-10 | 2004-10-26 | Wacoh Corporation | Force detector |
JP4125931B2 (ja) * | 2002-08-26 | 2008-07-30 | 株式会社ワコー | 回転操作量の入力装置およびこれを利用した操作装置 |
JP4907050B2 (ja) * | 2003-03-31 | 2012-03-28 | 株式会社ワコー | 力検出装置 |
JP4387691B2 (ja) * | 2003-04-28 | 2009-12-16 | 株式会社ワコー | 力検出装置 |
EP1491901A1 (en) | 2003-06-25 | 2004-12-29 | Matsushita Electric Works, Ltd. | Semiconductor acceleration sensor and method of manufacturing the same |
JP2005049130A (ja) * | 2003-07-30 | 2005-02-24 | Oki Electric Ind Co Ltd | 加速度センサ及び加速度センサの製造方法 |
JP4416460B2 (ja) * | 2003-09-16 | 2010-02-17 | トレックス・セミコンダクター株式会社 | 加速度センサー |
JP4552002B2 (ja) * | 2003-10-23 | 2010-09-29 | 東亜ディーケーケー株式会社 | 気液分離膜およびその製造方法 |
JP4578087B2 (ja) * | 2003-11-10 | 2010-11-10 | Okiセミコンダクタ株式会社 | 加速度センサ |
US7397097B2 (en) * | 2003-11-25 | 2008-07-08 | Stmicroelectronics, Inc. | Integrated released beam layer structure fabricated in trenches and manufacturing method thereof |
US7501835B2 (en) * | 2004-03-10 | 2009-03-10 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Displacement sensor |
JP2005283393A (ja) * | 2004-03-30 | 2005-10-13 | Fujitsu Media Device Kk | 慣性センサ |
JP2005283402A (ja) * | 2004-03-30 | 2005-10-13 | Fujitsu Media Device Kk | 慣性センサ |
JP4272115B2 (ja) * | 2004-06-03 | 2009-06-03 | Okiセミコンダクタ株式会社 | 加速度センサ及びその製造方法 |
JP2006062002A (ja) * | 2004-08-25 | 2006-03-09 | Oki Electric Ind Co Ltd | 半導体装置の個片化方法 |
US7179674B2 (en) * | 2004-12-28 | 2007-02-20 | Stmicroelectronics, Inc. | Bi-directional released-beam sensor |
US7353706B2 (en) | 2004-12-28 | 2008-04-08 | Stmicroelectronics, Inc. | Weighted released-beam sensor |
JP2006242692A (ja) * | 2005-03-02 | 2006-09-14 | Oki Electric Ind Co Ltd | 加速度センサチップ |
JP2006250581A (ja) * | 2005-03-08 | 2006-09-21 | Mitsumi Electric Co Ltd | 3軸加速度センサモジュールおよびその製造方法 |
JP2006275896A (ja) * | 2005-03-30 | 2006-10-12 | Yokohama Rubber Co Ltd:The | 半導体加速度センサ |
JP4815857B2 (ja) * | 2005-04-26 | 2011-11-16 | 大日本印刷株式会社 | 力学量検出センサの製造方法 |
US7337671B2 (en) * | 2005-06-03 | 2008-03-04 | Georgia Tech Research Corp. | Capacitive microaccelerometers and fabrication methods |
US7318349B2 (en) * | 2005-06-04 | 2008-01-15 | Vladimir Vaganov | Three-axis integrated MEMS accelerometer |
US7578189B1 (en) | 2006-05-10 | 2009-08-25 | Qualtre, Inc. | Three-axis accelerometers |
JP2007309654A (ja) * | 2006-05-16 | 2007-11-29 | Sony Corp | 加速度センサおよびその製造方法 |
US20080041156A1 (en) * | 2006-07-05 | 2008-02-21 | Oki Electric Industry Co., Ltd. | Semiconductor acceleration sensor |
JP5007083B2 (ja) * | 2006-08-08 | 2012-08-22 | 本田技研工業株式会社 | 力覚センサ用チップ |
JP4858064B2 (ja) * | 2006-10-04 | 2012-01-18 | 大日本印刷株式会社 | 力学量検出センサおよびその製造方法 |
EP2090866A4 (en) * | 2006-11-20 | 2011-08-31 | Dainippon Printing Co Ltd | DYNAMIC QUANTITY DETECTOR AND METHOD FOR MANUFACTURING THE SAME |
JP2008190931A (ja) | 2007-02-02 | 2008-08-21 | Wacoh Corp | 加速度と角速度との双方を検出するセンサ |
JP4858215B2 (ja) * | 2007-02-20 | 2012-01-18 | パナソニック株式会社 | 複合センサ |
JP2008224254A (ja) * | 2007-03-08 | 2008-09-25 | Oki Electric Ind Co Ltd | センサ装置、センサ装置の製造方法 |
JP2008249390A (ja) * | 2007-03-29 | 2008-10-16 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JPWO2008143191A1 (ja) * | 2007-05-17 | 2010-08-05 | ローム株式会社 | Memsセンサおよびその製造方法 |
JP2007279055A (ja) * | 2007-05-29 | 2007-10-25 | Oki Electric Ind Co Ltd | 加速度センサの製造方法 |
JP2009020001A (ja) * | 2007-07-12 | 2009-01-29 | Oki Electric Ind Co Ltd | 加速度センサ |
DE102007046017B4 (de) * | 2007-09-26 | 2021-07-01 | Robert Bosch Gmbh | Sensorelement |
JP5186885B2 (ja) | 2007-11-07 | 2013-04-24 | 大日本印刷株式会社 | マスクパターンの補正方法およびそれを用いた加速度センサと角速度センサの製造方法 |
US8136400B2 (en) * | 2007-11-15 | 2012-03-20 | Physical Logic Ag | Accelerometer |
JP4687736B2 (ja) | 2008-03-25 | 2011-05-25 | 株式会社村田製作所 | 外力検知装置の製造方法および外力検知装置 |
JP5253859B2 (ja) * | 2008-03-28 | 2013-07-31 | ラピスセミコンダクタ株式会社 | 加速度センサの構造及びその製造方法 |
JP5147491B2 (ja) * | 2008-03-28 | 2013-02-20 | ラピスセミコンダクタ株式会社 | 加速度センサ装置 |
US8980008B2 (en) * | 2008-04-15 | 2015-03-17 | Hanergy Hi-Tech Power (Hk) Limited | Apparatus and methods for manufacturing thin-film solar cells |
JP5108617B2 (ja) | 2008-05-13 | 2012-12-26 | 大日本印刷株式会社 | 加速度センサ |
JP2010085143A (ja) * | 2008-09-30 | 2010-04-15 | Torex Semiconductor Ltd | 加速度センサー |
JP2010107242A (ja) * | 2008-10-28 | 2010-05-13 | Rohm Co Ltd | Memsセンサ |
JP5293145B2 (ja) * | 2008-12-17 | 2013-09-18 | 大日本印刷株式会社 | 半導体装置 |
US20100162823A1 (en) * | 2008-12-26 | 2010-07-01 | Yamaha Corporation | Mems sensor and mems sensor manufacture method |
TWI391663B (zh) * | 2009-02-25 | 2013-04-01 | Nat Univ Tsing Hua | 加速度計 |
TW201034932A (en) * | 2009-03-31 | 2010-10-01 | Domintech Co Ltd | Capacitor type three-axis accelerometer for microelectromechanical systems (MEMS) |
JP5439068B2 (ja) * | 2009-07-08 | 2014-03-12 | 株式会社ワコー | 力検出装置 |
JP5724342B2 (ja) | 2009-12-10 | 2015-05-27 | 大日本印刷株式会社 | パターン配置方法並びにシリコンウェハ及び半導体デバイスの製造方法 |
KR101119283B1 (ko) * | 2009-12-22 | 2012-06-05 | 삼성전기주식회사 | 관성 센서 및 그 제조 방법 |
KR20120131788A (ko) * | 2011-05-26 | 2012-12-05 | 삼성전기주식회사 | 관성센서 및 그 제조방법 |
CN102959403B (zh) | 2010-06-21 | 2015-11-25 | 大日本印刷株式会社 | 力学量传感器 |
CN102408089A (zh) * | 2010-09-20 | 2012-04-11 | 利顺精密科技股份有限公司 | 可同时量测加速度及压力的微机电传感器 |
KR101264549B1 (ko) | 2011-11-11 | 2013-05-14 | 삼성전기주식회사 | 관성센서의 제조방법 |
KR101354757B1 (ko) * | 2011-11-18 | 2014-01-22 | 삼성전기주식회사 | 관성센서 |
US8984942B2 (en) * | 2012-02-10 | 2015-03-24 | Hewlett-Packard Development Company, L.P. | Suspended masses in micro-mechanical devices |
TWI586946B (zh) * | 2013-02-04 | 2017-06-11 | Fujikura Ltd | Sensing detectors |
JP6339669B2 (ja) | 2013-07-08 | 2018-06-06 | モーション・エンジン・インコーポレーテッド | Memsデバイスおよび製造する方法 |
US10273147B2 (en) | 2013-07-08 | 2019-04-30 | Motion Engine Inc. | MEMS components and method of wafer-level manufacturing thereof |
WO2015013828A1 (en) | 2013-08-02 | 2015-02-05 | Motion Engine Inc. | Mems motion sensor and method of manufacturing |
JP5529328B1 (ja) | 2013-09-04 | 2014-06-25 | 株式会社トライフォース・マネジメント | 発電素子 |
KR20150049056A (ko) * | 2013-10-29 | 2015-05-08 | 삼성전기주식회사 | 가속도 센서 |
JP6590812B2 (ja) | 2014-01-09 | 2019-10-16 | モーション・エンジン・インコーポレーテッド | 集積memsシステム |
US20170030788A1 (en) | 2014-04-10 | 2017-02-02 | Motion Engine Inc. | Mems pressure sensor |
WO2015184531A1 (en) | 2014-06-02 | 2015-12-10 | Motion Engine Inc. | Multi-mass mems motion sensor |
CA3004760A1 (en) | 2014-12-09 | 2016-06-16 | Motion Engine Inc. | 3d mems magnetometer and associated methods |
US10407299B2 (en) | 2015-01-15 | 2019-09-10 | Motion Engine Inc. | 3D MEMS device with hermetic cavity |
WO2016121129A1 (ja) | 2015-01-26 | 2016-08-04 | 株式会社ワコーテック | 力覚センサ |
WO2016163033A1 (ja) | 2015-04-07 | 2016-10-13 | 株式会社トライフォース・マネジメント | 力覚センサおよびこれに用いる構造体 |
KR20160126211A (ko) | 2015-04-23 | 2016-11-02 | 삼성전기주식회사 | 관성 센서 |
JP6527801B2 (ja) * | 2015-09-30 | 2019-06-05 | 日立オートモティブシステムズ株式会社 | 物理量センサ |
JP5996078B1 (ja) | 2015-10-19 | 2016-09-21 | 株式会社トライフォース・マネジメント | 発電素子 |
JP2017187447A (ja) * | 2016-04-08 | 2017-10-12 | アルプス電気株式会社 | センサ装置 |
WO2018135211A1 (ja) | 2017-01-17 | 2018-07-26 | パナソニックIpマネジメント株式会社 | センサ |
CN107271724A (zh) * | 2017-05-18 | 2017-10-20 | 中北大学 | 单片集成的压阻式三轴加速度计及制备方法 |
IT201700071798A1 (it) * | 2017-06-27 | 2018-12-27 | St Microelectronics Srl | Sensore di forza multiassiale, metodo di fabbricazione del sensore di forza multiassiale, e metodo di funzionamento del sensore di forza multiassiale |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE376421A (zh) * | 1930-02-10 | |||
US4891985A (en) * | 1985-07-22 | 1990-01-09 | Honeywell Inc. | Force sensor with attached mass |
US5182515A (en) * | 1987-04-24 | 1993-01-26 | Wacoh Corporation | Detector for magnetism using a resistance element |
EP0312605A4 (en) * | 1987-04-24 | 1992-06-17 | Kabushiki Kaisha Nexy Kenkyusho | Detector for force, acceleration and magnetism using resistor element |
EP0311695B1 (en) * | 1987-04-24 | 1994-11-30 | Enplas Laboratories, Inc. | Force and moment detector using resistor |
US5092645A (en) * | 1987-09-18 | 1992-03-03 | Wacoh Corporation | Robotic gripper having strain sensors formed on a semiconductor substrate |
US5263375A (en) * | 1987-09-18 | 1993-11-23 | Wacoh Corporation | Contact detector using resistance elements and its application |
US5121633A (en) * | 1987-12-18 | 1992-06-16 | Nissan Motor Co., Ltd. | Semiconductor accelerometer |
US4882933A (en) * | 1988-06-03 | 1989-11-28 | Novasensor | Accelerometer with integral bidirectional shock protection and controllable viscous damping |
JPH0623782B2 (ja) * | 1988-11-15 | 1994-03-30 | 株式会社日立製作所 | 静電容量式加速度センサ及び半導体圧力センサ |
US5035148A (en) * | 1989-02-01 | 1991-07-30 | Wacoh Corporation | Force detector using resistance elements |
JP2681215B2 (ja) * | 1989-05-29 | 1997-11-26 | 株式会社ワコー | 積層基板を用いたセンサの製造方法 |
JP2822486B2 (ja) * | 1989-09-27 | 1998-11-11 | 株式会社デンソー | 感歪センサおよびその製造方法 |
US5531092A (en) * | 1989-12-28 | 1996-07-02 | Okada; Kazuhiro | Device for moving a suspended weight body |
EP0461265B1 (en) * | 1989-12-28 | 1995-05-10 | Wacoh Corporation | Acceleration sensors |
DE4016472A1 (de) | 1990-05-22 | 1991-11-28 | Bosch Gmbh Robert | Verfahren zur herstellung von mikromechanischen sensoren mit ueberlastsicherung |
US6314823B1 (en) | 1991-09-20 | 2001-11-13 | Kazuhiro Okada | Force detector and acceleration detector and method of manufacturing the same |
US5421213A (en) * | 1990-10-12 | 1995-06-06 | Okada; Kazuhiro | Multi-dimensional force detector |
WO1992017759A1 (en) * | 1991-03-30 | 1992-10-15 | Kazuhiro Okada | Method of testing performance of device for measuring physical quantity by using change of distance between electrodes and physical quantity measuring device provided with function of executing this method |
JP3141954B2 (ja) * | 1991-07-17 | 2001-03-07 | 株式会社ワコー | 圧電素子を用いた力・加速度・磁気のセンサ |
JP3027457B2 (ja) * | 1991-10-25 | 2000-04-04 | 和廣 岡田 | 多次元方向に関する力・加速度・磁気の検出装置 |
JPH05215627A (ja) * | 1992-02-04 | 1993-08-24 | Kazuhiro Okada | 多次元方向に関する力・加速度・磁気の検出装置 |
JP2776142B2 (ja) * | 1992-05-15 | 1998-07-16 | 株式会社日立製作所 | 加速度センサ |
US6282956B1 (en) * | 1994-12-29 | 2001-09-04 | Kazuhiro Okada | Multi-axial angular velocity sensor |
US5646346A (en) * | 1994-11-10 | 1997-07-08 | Okada; Kazuhiro | Multi-axial angular velocity sensor |
JP3256346B2 (ja) * | 1993-07-29 | 2002-02-12 | 和廣 岡田 | 圧電素子を用いた力・加速度・磁気のセンサ |
JP3549590B2 (ja) * | 1994-09-28 | 2004-08-04 | 和廣 岡田 | 加速度・角速度センサ |
JP3585980B2 (ja) * | 1995-02-21 | 2004-11-10 | 株式会社ワコー | 角速度センサ |
US6003371A (en) * | 1995-02-21 | 1999-12-21 | Wacoh Corporation | Angular velocity sensor |
JPH0949856A (ja) * | 1995-05-31 | 1997-02-18 | Wako:Kk | 加速度センサ |
JPH0945937A (ja) | 1995-07-26 | 1997-02-14 | Matsushita Electric Works Ltd | 3軸加速度センサの製造方法 |
JPH09119943A (ja) * | 1995-10-24 | 1997-05-06 | Wako:Kk | 加速度センサ |
US6367326B1 (en) * | 1996-07-10 | 2002-04-09 | Wacoh Corporation | Angular velocity sensor |
WO1998001722A1 (fr) * | 1996-07-10 | 1998-01-15 | Wacoh Corporation | Detecteur de vitesse angulaire |
US6293149B1 (en) * | 1997-02-21 | 2001-09-25 | Matsushita Electric Works, Ltd. | Acceleration sensor element and method of its manufacture |
JP4176849B2 (ja) | 1997-05-08 | 2008-11-05 | 株式会社ワコー | センサの製造方法 |
US5832163A (en) * | 1997-07-18 | 1998-11-03 | Mcdonnell Douglas Corporation | Single mode optical waveguide with expanded rare-earth doped region |
JPH11103076A (ja) * | 1997-07-30 | 1999-04-13 | Matsushita Electric Works Ltd | 半導体加速度センサの製造方法 |
JP3191770B2 (ja) * | 1997-08-29 | 2001-07-23 | 松下電工株式会社 | 半導体加速度センサ及びその製造方法 |
JP2000249609A (ja) * | 1999-03-01 | 2000-09-14 | Wakoo:Kk | 静電容量式センサ |
JP4295883B2 (ja) | 1999-12-13 | 2009-07-15 | 株式会社ワコー | 力検出装置 |
CN1111741C (zh) * | 2000-08-25 | 2003-06-18 | 华北工学院微米纳米技术研究中心 | 集成硅微电阻式加速度传感器及其制造加工方法 |
-
2002
- 2002-05-13 JP JP2002136596A patent/JP4216525B2/ja not_active Expired - Lifetime
-
2003
- 2003-04-21 US US10/419,610 patent/US6772632B2/en not_active Expired - Lifetime
- 2003-04-21 CN CNB031218458A patent/CN100374865C/zh not_active Expired - Fee Related
- 2003-05-12 EP EP03010605.8A patent/EP1371993B1/en not_active Expired - Lifetime
-
2004
- 2004-06-29 US US10/879,317 patent/US6920788B2/en not_active Expired - Lifetime
-
2005
- 2005-08-19 HK HK05107227A patent/HK1074883A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20030209075A1 (en) | 2003-11-13 |
CN100374865C (zh) | 2008-03-12 |
JP4216525B2 (ja) | 2009-01-28 |
EP1371993A3 (en) | 2004-12-01 |
US20040231422A1 (en) | 2004-11-25 |
US6920788B2 (en) | 2005-07-26 |
EP1371993B1 (en) | 2016-04-06 |
US6772632B2 (en) | 2004-08-10 |
CN1605870A (zh) | 2005-04-13 |
JP2003329702A (ja) | 2003-11-19 |
EP1371993A2 (en) | 2003-12-17 |
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