JP2009020001A - 加速度センサ - Google Patents
加速度センサ Download PDFInfo
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- JP2009020001A JP2009020001A JP2007182966A JP2007182966A JP2009020001A JP 2009020001 A JP2009020001 A JP 2009020001A JP 2007182966 A JP2007182966 A JP 2007182966A JP 2007182966 A JP2007182966 A JP 2007182966A JP 2009020001 A JP2009020001 A JP 2009020001A
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- 230000001133 acceleration Effects 0.000 title claims abstract description 57
- 230000002093 peripheral effect Effects 0.000 claims description 43
- 230000003014 reinforcing effect Effects 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 33
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 238000006073 displacement reaction Methods 0.000 abstract description 18
- 230000002787 reinforcement Effects 0.000 abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 31
- 229910052710 silicon Inorganic materials 0.000 description 31
- 239000010703 silicon Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 14
- 238000004458 analytical method Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 101100121460 Mus musculus Gcsam gene Proteins 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012916 structural analysis Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
- G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Pressure Sensors (AREA)
Abstract
【解決手段】錘部材36に下向きの振動が加えられ、錘部材36が下側に変位すると、錘部材36の底面が底板90に当って、錘部材36は停止して下側の変位は阻止される。また、錘部材36が上側に変位すると、周辺錘部36Bがストッパ部20に当って、錘部材36は停止して上側の変位は阻止される。ストッパ部20に当って錘部材36の変位が阻止されるため、ストッパ部20の強度が低いとストッパ部20の破損が考えられる。しかし、ストッパ部20の両側にストッパ部20を補強する補強部24が設けられていため、ストッパ部20の破損を防止し、これにより、加速度センサ100の耐久性を向上させることができる。
【選択図】図1
Description
12 開口部
14A 開口縁
16 錘固定部
18 梁部
20 ストッパ部
20A 開口縁
22 抵抗素子
23 ストッパ
24 補強部
24A 開口縁
26 補強部
26A 開口縁
32 台座部
36 錘部材
36A 中央錘部
36B 周辺錘部
100 加速度センサ
Claims (3)
- 錘固定部と、該錘固定部の周囲に離間して形成される周辺固定部と、該錘固定部と該周辺固定部とを接続する梁部と、該錘固定部及び該梁部と離間し、該周辺固定部に隣接するストッパと、該錘固定部、該周辺固定部、該梁部、及び該ストッパを画成する開口部を備える第1の基板と、
前記周辺固定部を支持する台座部と、
前記錘固定部に固定される中央錘部と、該中央錘部から四方へ伸びる周辺錘部と、を備える錘部材と、
を有する加速度センサにおいて、
前記ストッパは、前記周辺錘部の角部が上方へ過度に変位すると接触するストッパ部と、該ストッパ部から前記梁部へ向って延在する補強部と、を備えることを特徴とする加速度センサ。 - 前記補強部の前記開口部に臨む開口縁は、直線形状であることを特徴とする請求項1記載の加速度センサ。
- 前記補強部の前記開口部に臨む開口縁は、湾曲形状であることを特徴とする請求項1記載の加速度センサ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007182966A JP2009020001A (ja) | 2007-07-12 | 2007-07-12 | 加速度センサ |
US12/153,500 US20090025478A1 (en) | 2007-07-12 | 2008-05-20 | Acceleration sensor |
CNA2008101256842A CN101344534A (zh) | 2007-07-12 | 2008-06-20 | 加速度传感器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007182966A JP2009020001A (ja) | 2007-07-12 | 2007-07-12 | 加速度センサ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009020001A true JP2009020001A (ja) | 2009-01-29 |
Family
ID=40246570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007182966A Pending JP2009020001A (ja) | 2007-07-12 | 2007-07-12 | 加速度センサ |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090025478A1 (ja) |
JP (1) | JP2009020001A (ja) |
CN (1) | CN101344534A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012209169A (ja) * | 2011-03-30 | 2012-10-25 | Sumitomo Bakelite Co Ltd | リチウムイオン二次電池用炭素材、リチウムイオン二次電池用負極材およびリチウムイオン二次電池 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100162823A1 (en) * | 2008-12-26 | 2010-07-01 | Yamaha Corporation | Mems sensor and mems sensor manufacture method |
US20130019678A1 (en) * | 2011-07-22 | 2013-01-24 | Lazaroff Dennis M | Limiting travel of proof mass within frame of MEMS device |
KR20150085705A (ko) * | 2014-01-16 | 2015-07-24 | 삼성전기주식회사 | 가속도 센서 |
US10196259B2 (en) * | 2015-12-30 | 2019-02-05 | Mems Drive, Inc. | MEMS actuator structures resistant to shock |
US10322925B2 (en) * | 2015-12-30 | 2019-06-18 | Mems Drive, Inc. | Shock caging features for MEMS actuator structures |
EP3464168A1 (en) | 2016-05-26 | 2019-04-10 | Mems Drive Inc. | Shock caging features for mems actuator structures |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003329702A (ja) * | 2002-05-13 | 2003-11-19 | Wacoh Corp | 加速度センサおよびその製造方法 |
JP2004177233A (ja) * | 2002-11-26 | 2004-06-24 | Matsushita Electric Works Ltd | 半導体加速度センサ |
JP2005134367A (ja) * | 2003-10-06 | 2005-05-26 | Matsushita Electric Works Ltd | 半導体加速度センサ |
JP2005345294A (ja) * | 2004-06-03 | 2005-12-15 | Oki Electric Ind Co Ltd | 加速度センサ及びその製造方法 |
JP2006177768A (ja) * | 2004-12-22 | 2006-07-06 | Oki Electric Ind Co Ltd | 加速度センサ及びその製造方法 |
JP2006242692A (ja) * | 2005-03-02 | 2006-09-14 | Oki Electric Ind Co Ltd | 加速度センサチップ |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5866818A (en) * | 1995-11-30 | 1999-02-02 | Matsushita Electric Works, Ltd. | Acceleration sensor device |
ATE333651T1 (de) * | 2001-09-04 | 2006-08-15 | Tokyo Electron Ltd | Mikrostruktur mit beweglicher masse |
EP1491901A1 (en) * | 2003-06-25 | 2004-12-29 | Matsushita Electric Works, Ltd. | Semiconductor acceleration sensor and method of manufacturing the same |
JP2005283393A (ja) * | 2004-03-30 | 2005-10-13 | Fujitsu Media Device Kk | 慣性センサ |
JP4540467B2 (ja) * | 2004-12-22 | 2010-09-08 | Okiセミコンダクタ株式会社 | 加速度センサの構造及びその製造方法 |
-
2007
- 2007-07-12 JP JP2007182966A patent/JP2009020001A/ja active Pending
-
2008
- 2008-05-20 US US12/153,500 patent/US20090025478A1/en not_active Abandoned
- 2008-06-20 CN CNA2008101256842A patent/CN101344534A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003329702A (ja) * | 2002-05-13 | 2003-11-19 | Wacoh Corp | 加速度センサおよびその製造方法 |
JP2004177233A (ja) * | 2002-11-26 | 2004-06-24 | Matsushita Electric Works Ltd | 半導体加速度センサ |
JP2005134367A (ja) * | 2003-10-06 | 2005-05-26 | Matsushita Electric Works Ltd | 半導体加速度センサ |
JP2005345294A (ja) * | 2004-06-03 | 2005-12-15 | Oki Electric Ind Co Ltd | 加速度センサ及びその製造方法 |
JP2006177768A (ja) * | 2004-12-22 | 2006-07-06 | Oki Electric Ind Co Ltd | 加速度センサ及びその製造方法 |
JP2006242692A (ja) * | 2005-03-02 | 2006-09-14 | Oki Electric Ind Co Ltd | 加速度センサチップ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012209169A (ja) * | 2011-03-30 | 2012-10-25 | Sumitomo Bakelite Co Ltd | リチウムイオン二次電池用炭素材、リチウムイオン二次電池用負極材およびリチウムイオン二次電池 |
Also Published As
Publication number | Publication date |
---|---|
US20090025478A1 (en) | 2009-01-29 |
CN101344534A (zh) | 2009-01-14 |
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