HK1056948A1 - Microelectronic substrate with integrated devices - Google Patents

Microelectronic substrate with integrated devices

Info

Publication number
HK1056948A1
HK1056948A1 HK03109117.6A HK03109117A HK1056948A1 HK 1056948 A1 HK1056948 A1 HK 1056948A1 HK 03109117 A HK03109117 A HK 03109117A HK 1056948 A1 HK1056948 A1 HK 1056948A1
Authority
HK
Hong Kong
Prior art keywords
microelectronic
microelectronic substrate
integrated devices
opening
encapsulation material
Prior art date
Application number
HK03109117.6A
Other languages
English (en)
Inventor
Jian Li
Quat Vu
Steven Towle
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of HK1056948A1 publication Critical patent/HK1056948A1/xx

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Classifications

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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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HK03109117.6A 2000-10-19 2003-12-15 Microelectronic substrate with integrated devices HK1056948A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/692,908 US6734534B1 (en) 2000-08-16 2000-10-19 Microelectronic substrate with integrated devices
PCT/US2001/031438 WO2002033751A2 (en) 2000-10-19 2001-10-09 Microelectronic substrate with integrated devices

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DE60139504D1 (de) 2009-09-17
JP2008300877A (ja) 2008-12-11
MY148046A (en) 2013-02-28
EP1356520B1 (en) 2009-08-05
WO2002033751A3 (en) 2003-08-14
ATE438925T1 (de) 2009-08-15
JP2004530285A (ja) 2004-09-30
KR20030060914A (ko) 2003-07-16
KR100591216B1 (ko) 2006-06-22
AU2001296719A1 (en) 2002-04-29
CN100403534C (zh) 2008-07-16
CN1524293A (zh) 2004-08-25
WO2002033751A2 (en) 2002-04-25
US6734534B1 (en) 2004-05-11

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