AU2001296719A1 - Microelectronic substrate with integrated devices - Google Patents

Microelectronic substrate with integrated devices

Info

Publication number
AU2001296719A1
AU2001296719A1 AU2001296719A AU9671901A AU2001296719A1 AU 2001296719 A1 AU2001296719 A1 AU 2001296719A1 AU 2001296719 A AU2001296719 A AU 2001296719A AU 9671901 A AU9671901 A AU 9671901A AU 2001296719 A1 AU2001296719 A1 AU 2001296719A1
Authority
AU
Australia
Prior art keywords
microelectronic
microelectronic substrate
integrated devices
opening
encapsulation material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001296719A
Inventor
Jian Li
Steven Towle
Quat Vu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2001296719A1 publication Critical patent/AU2001296719A1/en
Abandoned legal-status Critical Current

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    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Abstract

A microelectronic substrate including at least one microelectronic die disposed within an opening in a microelectronic substrate core, wherein an encapsulation material is disposed within portions of the opening not occupied by the microelectronic dice, or a plurality microelectronic dice encapsulated without the microelectronic substrate core. Interconnection layers of dielectric materials and conductive traces are then fabricated on the microelectronic die, the encapsulation material, and the microelectronic substrate core (if present) to form the microelectronic substrate.
AU2001296719A 2000-10-19 2001-10-09 Microelectronic substrate with integrated devices Abandoned AU2001296719A1 (en)

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US09/692,908 US6734534B1 (en) 2000-08-16 2000-10-19 Microelectronic substrate with integrated devices
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HK1056948A1 (en) 2004-03-05
JP2004530285A (en) 2004-09-30
WO2002033751A3 (en) 2003-08-14
EP1356520A2 (en) 2003-10-29
MY148046A (en) 2013-02-28
KR20030060914A (en) 2003-07-16
EP1356520B1 (en) 2009-08-05
CN100403534C (en) 2008-07-16
CN1524293A (en) 2004-08-25
ATE438925T1 (en) 2009-08-15
JP2008300877A (en) 2008-12-11
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KR100591216B1 (en) 2006-06-22
WO2002033751A2 (en) 2002-04-25

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