HK1043138B - Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates - Google Patents

Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates Download PDF

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Publication number
HK1043138B
HK1043138B HK02102373.1A HK02102373A HK1043138B HK 1043138 B HK1043138 B HK 1043138B HK 02102373 A HK02102373 A HK 02102373A HK 1043138 B HK1043138 B HK 1043138B
Authority
HK
Hong Kong
Prior art keywords
metallic foil
compound
polyepoxide
acid
weight percent
Prior art date
Application number
HK02102373.1A
Other languages
German (de)
English (en)
French (fr)
Chinese (zh)
Other versions
HK1043138A1 (en
Inventor
Joseph Gan
Original Assignee
The Dow Chemical Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Dow Chemical Company filed Critical The Dow Chemical Company
Publication of HK1043138A1 publication Critical patent/HK1043138A1/en
Publication of HK1043138B publication Critical patent/HK1043138B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
HK02102373.1A 1998-12-11 1999-12-10 Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates HK1043138B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9827367.5 1998-12-11
GBGB9827367.5A GB9827367D0 (en) 1998-12-11 1998-12-11 Adhesive resin composition
PCT/US1999/029431 WO2000034351A1 (en) 1998-12-11 1999-12-10 Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates

Publications (2)

Publication Number Publication Date
HK1043138A1 HK1043138A1 (en) 2002-09-06
HK1043138B true HK1043138B (en) 2006-04-07

Family

ID=10844100

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102373.1A HK1043138B (en) 1998-12-11 1999-12-10 Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates

Country Status (11)

Country Link
US (1) US6432541B1 (enExample)
EP (1) EP1137683B1 (enExample)
JP (2) JP5209155B2 (enExample)
CN (1) CN100379781C (enExample)
AT (1) ATE302221T1 (enExample)
AU (1) AU2051200A (enExample)
DE (1) DE69926790T2 (enExample)
GB (1) GB9827367D0 (enExample)
HK (1) HK1043138B (enExample)
TW (1) TWI240745B (enExample)
WO (1) WO2000034351A1 (enExample)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294922A (ja) * 1999-04-01 2000-10-20 Victor Co Of Japan Ltd 多層プリント配線板用の絶縁樹脂組成物
JP3711842B2 (ja) * 2000-06-01 2005-11-02 ソニーケミカル株式会社 異方性導電接続材料及び接続構造体
TW593404B (en) * 2001-03-14 2004-06-21 Akzo Nobel Nv Powder coated rotor, stator or field coil and powder coating composition
US7431981B2 (en) * 2002-11-04 2008-10-07 The Boeing Company Polymer composite structure reinforced with shape memory alloy and method of manufacturing same
US6989197B2 (en) * 2002-11-04 2006-01-24 The Boeing Company Polymer composite structure reinforced with shape memory alloy and method of manufacturing same
US20090032286A1 (en) * 2005-04-07 2009-02-05 Masaaki Urakawa Epoxy Resin Composition
EP1818044A1 (en) 2005-11-25 2007-08-15 DSMIP Assets B.V. Cosmetic or personal care composition comprising a polymer comprising oxazolidon groups
CN101511900B (zh) * 2006-09-14 2011-11-23 松下电工株式会社 印刷电路板用环氧树脂组合物、树脂组合物清漆、预成型料、覆金属层压体、印刷电路板以及多层印刷电路板
ATE547446T1 (de) * 2007-05-16 2012-03-15 Dow Global Technologies Llc Flammenhemmende zusammensetzungen
WO2009045835A1 (en) * 2007-10-05 2009-04-09 Dow Global Technologies Inc. Isocyanate modified epoxy resin and epoxy powder coating composition thereof
JP2011500950A (ja) * 2007-10-26 2011-01-06 ダウ グローバル テクノロジーズ インコーポレイティド 電気用積層体において使用されるイソシアヌラート含有エポキシ樹脂組成物
KR101150311B1 (ko) * 2007-11-29 2012-06-11 다우 글로벌 테크놀로지스 엘엘씨 열경화성 에폭시 수지의 경화제로서 디시안디아미드를 사용한 디메틸포름아미드가 없는 제형
JP2011509339A (ja) * 2008-01-08 2011-03-24 ダウ グローバル テクノロジーズ エルエルシー 複合材料用の高Ｔｇエポキシ系
CN101998970B (zh) 2008-04-14 2013-12-18 陶氏环球技术公司 用于粉末涂料应用的环氧-咪唑催化剂
US20110218273A1 (en) * 2009-01-06 2011-09-08 Dow Global Technologies Llc Metal stabilizers for epoxy resins and advancement process
KR20120097511A (ko) * 2009-11-12 2012-09-04 다우 글로벌 테크놀로지스 엘엘씨 폴리옥사졸리돈 수지
US20120129414A1 (en) * 2010-11-24 2012-05-24 Chung-Hao Chang Thermosetting resin composition and prepreg or laminate using the same
KR101520202B1 (ko) 2010-12-28 2015-05-13 미쓰이 가가쿠 토세로 가부시키가이샤 수지 조성물, 이것을 포함하는 보호막, 드라이 필름, 회로 기판 및 다층 회로 기판
US20140121299A1 (en) * 2011-07-04 2014-05-01 Dow Global Technologies Llc Adducts as tougheners in thermosettable epoxy systems
TWI444132B (zh) * 2011-12-08 2014-07-01 Ind Tech Res Inst 電磁波屏蔽複合膜及具有該複合膜之軟性印刷電路板
EP2917278A4 (en) 2012-11-07 2016-06-08 Dow Global Technologies Llc CURABLE EPOXY COMPOSITION AND COMPOSITE MANUFACTURED THEREFROM
EP2803684A1 (de) * 2013-05-13 2014-11-19 Basf Se Isocyanat-Epoxid-Hybridharze
CN103436155B (zh) * 2013-09-09 2015-12-23 段宝荣 一种耐光性水性聚氨酯涂料的制备方法
DE102014226838A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Oxazolidinon- und Isocyanurat-vernetzte Matrix für faserverstärktes Material
DE102014226842A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Katalysator-Zusammensetzung zur Härtung von Epoxidgruppen-haltigen Harzen
JP2016094610A (ja) * 2015-11-24 2016-05-26 ブルー キューブ アイピー エルエルシー 熱硬化性エポキシ系の強化剤用付加体
CN105295041B (zh) * 2015-12-03 2017-07-25 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在浸渍漆中的应用
CN106916282B (zh) 2015-12-28 2019-07-26 广东生益科技股份有限公司 一种环氧树脂组合物以及使用其的预浸料和层压板
CN107227001B (zh) * 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
ES2909123T3 (es) * 2016-06-20 2022-05-05 Henkel Ag & Co Kgaa Composición curada con alta resistencia al impacto y estabilidad frente a la temperatura, que se basa en una resina epoxídica y un poliisocianato
JP6294927B1 (ja) 2016-09-15 2018-03-14 日清紡ホールディングス株式会社 樹脂組成物及びこれを用いた熱伝導性軟質シート、並びに放熱構造
CN106497024A (zh) * 2016-10-27 2017-03-15 国家康复辅具研究中心 一种抗菌聚氨酯复合材料及其制备方法和应用
US11180603B2 (en) * 2017-02-16 2021-11-23 Basf Se Polyoxazolidones and production thereof
JP7323265B2 (ja) * 2017-03-31 2023-08-08 富士紡ホールディングス株式会社 研磨パッド
EP3428045A1 (de) * 2017-07-13 2019-01-16 Sika Technology Ag Einkomponentiger hitzehärtender epoxidklebstoff hoher auswaschbeständigkeit
EP3456754A1 (en) * 2017-09-15 2019-03-20 Covestro Deutschland AG Method for the production of thermoplastic polyoxazolidinone polymers
WO2019063391A1 (de) * 2017-09-29 2019-04-04 Basf Se Thermoplastische polyoxazolidone aus diisocyanten und diglycidylether von 2-phenyl-1,3-propandiol-derivaten
CN107652937B (zh) * 2017-11-06 2021-03-30 烟台德邦科技股份有限公司 一种可与低表面能材料粘接的聚氨酯热熔胶的制备方法
CN108371948A (zh) * 2018-02-09 2018-08-07 安徽师范大学 新型亲和嗜硫硅球色谱材料及其制备方法和应用
US12152161B2 (en) * 2018-04-30 2024-11-26 Evonik Operations Gmbh Polyurea compositions from polyaspartic esters and secondary heterocyclic amines derived aspartic esters
JP7512249B2 (ja) * 2018-07-18 2024-07-08 ビーエーエスエフ ソシエタス・ヨーロピア ポリオキサゾリドンのバルク重合
EP3647335A1 (en) * 2018-10-30 2020-05-06 Covestro Deutschland AG Method for the production of thermoplastic polyoxazolidinone polymers
US20220154055A1 (en) * 2019-05-15 2022-05-19 Dow Global Technologies Llc Two-component adhesive compositions, articles prepared with same and preparation methods thereof
CN112175168B (zh) * 2020-10-14 2021-12-14 上海交通大学 一种三元共聚物、嵌段聚合物以及三元共聚物的合成方法
CN119019639A (zh) * 2024-09-14 2024-11-26 万华化学集团股份有限公司 一种低内生热的热塑性聚氨酯弹性体及其制备方法和应用

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3354114A (en) 1964-03-03 1967-11-21 Grace W R & Co Polystyrene fiber-finely divided silica thickening agent, and organic liquid materials thickened therewith
GB1037895A (en) 1964-06-29 1966-08-03 Sels Et Prod Chim Sa Epoxy resin compositions
US3334110A (en) 1965-08-16 1967-08-01 Baker Chem Co J T Method for preparing epoxyoxazolidinones
GB1370782A (en) 1970-11-11 1974-10-16 Ciba Geigy Ag Adhesive compositions
US4070416A (en) 1972-11-29 1978-01-24 Hitachi, Ltd. Novel thermosetting resin and a process for producing same
US4066628A (en) 1976-08-02 1978-01-03 Mitsubishi Chemical Industries Ltd. Oxazolidone catalyst
JPS5515870A (en) 1978-07-23 1980-02-04 Toho Beslon Co Strand preepreg composition
US4401499A (en) * 1980-06-09 1983-08-30 Sumitomo Bakelite Company Limited Crosslinked resin of epoxy compound and isocyanate and process for producing same
ZA839459B (en) * 1982-12-30 1985-08-28 Mobil Oil Corp Polyoxazolidone powder coating compositions
DE3323122A1 (de) 1983-06-27 1985-05-23 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von reaktionsharzformstoffen
DE3323084A1 (de) 1983-06-27 1985-01-10 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von formstoffen
US4622983A (en) 1983-08-08 1986-11-18 Kimberly-Clark Corporation Reduced ignition proclivity smoking article wrapper and smoking article
JPS61118247A (ja) 1984-11-14 1986-06-05 松下電工株式会社 金属張積層板
JPS61118246A (ja) 1984-11-14 1986-06-05 松下電工株式会社 金属張積層板
DE3720759A1 (de) * 1987-06-24 1989-01-05 Bayer Ag Oxazolidongruppen enthaltende epoxidharze
US5066735A (en) 1987-11-16 1991-11-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
DE3888467T2 (de) 1987-11-26 1994-10-13 Nippon Catalytic Chem Ind Harzzusammensetzung für Kunstmarmor.
JPH01236226A (ja) 1988-03-17 1989-09-21 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
GB8912952D0 (en) * 1989-06-06 1989-07-26 Dow Rheinmuenster Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones
US5387495A (en) 1989-06-28 1995-02-07 Digital Equipment Corporation Sequential multilayer process for using fluorinated hydrocarbons as a dielectric
US5071520A (en) 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
ZA913801B (en) 1990-05-21 1993-01-27 Dow Chemical Co Latent catalysts,cure-inhibited epoxy resin compositions and laminates prepared therefrom
JP3322909B2 (ja) 1991-08-15 2002-09-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
JP3290449B2 (ja) * 1991-08-19 2002-06-10 旭化成エポキシ株式会社 エポキシ樹脂組成物
JP3355658B2 (ja) 1992-08-13 2002-12-09 旭化成エポキシ株式会社 エポキシ樹脂組成物
WO1994011415A1 (en) 1992-11-12 1994-05-26 The Dow Chemical Company Curable composition containing anhydride resins
JPH07197000A (ja) 1993-12-28 1995-08-01 Shin Etsu Chem Co Ltd 耐熱性接着剤
CA2115533C (en) 1994-02-11 2002-06-18 Hiroshi Uchida Urethane modified epoxy resin compositions
US5545697A (en) 1994-02-14 1996-08-13 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
GB9421405D0 (en) 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
JP3415349B2 (ja) 1995-11-20 2003-06-09 三菱レイヨン株式会社 複合材料用エポキシ樹脂組成物
NL1003499C2 (nl) 1996-07-04 1998-01-07 Holland Sweetener Co Aspartaampoeders voor poedermengsels.
DE69829465T2 (de) 1997-03-27 2006-02-09 Mitsubishi Rayon Co., Ltd. Epoxidharzzusammensetzung für faserverstärkte kunststoffe, prepeg, und daraus hergestellter schlauchförmiger formkörper

Also Published As

Publication number Publication date
JP5209155B2 (ja) 2013-06-12
JP2003522217A (ja) 2003-07-22
GB9827367D0 (en) 1999-02-03
DE69926790T2 (de) 2006-06-08
CN100379781C (zh) 2008-04-09
EP1137683B1 (en) 2005-08-17
ATE302221T1 (de) 2005-09-15
DE69926790D1 (de) 2005-09-22
AU2051200A (en) 2000-06-26
HK1043138A1 (en) 2002-09-06
JP2012251161A (ja) 2012-12-20
US6432541B1 (en) 2002-08-13
JP5735467B2 (ja) 2015-06-17
EP1137683A1 (en) 2001-10-04
TWI240745B (en) 2005-10-01
CN1333791A (zh) 2002-01-30
WO2000034351A1 (en) 2000-06-15

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PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20131210