GB9827367D0 - Adhesive resin composition - Google Patents

Adhesive resin composition

Info

Publication number
GB9827367D0
GB9827367D0 GBGB9827367.5A GB9827367A GB9827367D0 GB 9827367 D0 GB9827367 D0 GB 9827367D0 GB 9827367 A GB9827367 A GB 9827367A GB 9827367 D0 GB9827367 D0 GB 9827367D0
Authority
GB
United Kingdom
Prior art keywords
resin composition
polyepoxide
weight percent
polyisocyanate
adhesive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB9827367.5A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Deutschland Inc
Original Assignee
Dow Deutschland Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Deutschland Inc filed Critical Dow Deutschland Inc
Priority to GBGB9827367.5A priority Critical patent/GB9827367D0/en
Publication of GB9827367D0 publication Critical patent/GB9827367D0/en
Priority to US09/458,379 priority patent/US6432541B1/en
Priority to HK02102373.1A priority patent/HK1043138B/en
Priority to TW088121687A priority patent/TWI240745B/zh
Priority to DE69926790T priority patent/DE69926790T2/de
Priority to AU20512/00A priority patent/AU2051200A/en
Priority to PCT/US1999/029431 priority patent/WO2000034351A1/en
Priority to EP99964227A priority patent/EP1137683B1/en
Priority to JP2000586792A priority patent/JP5209155B2/ja
Priority to AT99964227T priority patent/ATE302221T1/de
Priority to CNB998157384A priority patent/CN100379781C/zh
Priority to JP2012185696A priority patent/JP5735467B2/ja
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
GBGB9827367.5A 1998-12-11 1998-12-11 Adhesive resin composition Ceased GB9827367D0 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
GBGB9827367.5A GB9827367D0 (en) 1998-12-11 1998-12-11 Adhesive resin composition
CNB998157384A CN100379781C (zh) 1998-12-11 1999-12-10 由多环氧化物和多异氰酸酯制得的聚唑烷酮粘合剂树脂组合物
DE69926790T DE69926790T2 (de) 1998-12-11 1999-12-10 Polyoxazolidon-klebstoffzusammensetzung hergestellt aus polyepoxiden und polyisocyanaten
HK02102373.1A HK1043138B (en) 1998-12-11 1999-12-10 Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates
TW088121687A TWI240745B (en) 1998-12-11 1999-12-10 Adhesive resin composition
US09/458,379 US6432541B1 (en) 1998-12-11 1999-12-10 Resin composition of polyepoxide and polyisocyanate, prepreg, and metallic foil laminate
AU20512/00A AU2051200A (en) 1998-12-11 1999-12-10 Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates
PCT/US1999/029431 WO2000034351A1 (en) 1998-12-11 1999-12-10 Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates
EP99964227A EP1137683B1 (en) 1998-12-11 1999-12-10 Polyoxazolidone adhesive resin composition prepared from polyepoxides and polyisocyanates
JP2000586792A JP5209155B2 (ja) 1998-12-11 1999-12-10 ポリエポキシド及びポリイソシアネートから合成されたポリオキサゾリドン接着樹脂組成物
AT99964227T ATE302221T1 (de) 1998-12-11 1999-12-10 Polyoxazolidon-klebstoffzusammensetzung hergestellt aus polyepoxiden und polyisocyanaten
JP2012185696A JP5735467B2 (ja) 1998-12-11 2012-08-24 ポリエポキシド及びポリイソシアネートから合成されたポリオキサゾリドン接着樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9827367.5A GB9827367D0 (en) 1998-12-11 1998-12-11 Adhesive resin composition

Publications (1)

Publication Number Publication Date
GB9827367D0 true GB9827367D0 (en) 1999-02-03

Family

ID=10844100

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB9827367.5A Ceased GB9827367D0 (en) 1998-12-11 1998-12-11 Adhesive resin composition

Country Status (11)

Country Link
US (1) US6432541B1 (enExample)
EP (1) EP1137683B1 (enExample)
JP (2) JP5209155B2 (enExample)
CN (1) CN100379781C (enExample)
AT (1) ATE302221T1 (enExample)
AU (1) AU2051200A (enExample)
DE (1) DE69926790T2 (enExample)
GB (1) GB9827367D0 (enExample)
HK (1) HK1043138B (enExample)
TW (1) TWI240745B (enExample)
WO (1) WO2000034351A1 (enExample)

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JP2000294922A (ja) * 1999-04-01 2000-10-20 Victor Co Of Japan Ltd 多層プリント配線板用の絶縁樹脂組成物
JP3711842B2 (ja) * 2000-06-01 2005-11-02 ソニーケミカル株式会社 異方性導電接続材料及び接続構造体
TW593404B (en) * 2001-03-14 2004-06-21 Akzo Nobel Nv Powder coated rotor, stator or field coil and powder coating composition
US7431981B2 (en) * 2002-11-04 2008-10-07 The Boeing Company Polymer composite structure reinforced with shape memory alloy and method of manufacturing same
US6989197B2 (en) * 2002-11-04 2006-01-24 The Boeing Company Polymer composite structure reinforced with shape memory alloy and method of manufacturing same
EP1867672B1 (en) * 2005-04-07 2011-01-26 Asahi Kasei Chemicals Corporation Epoxy resin composition
EP1818044A1 (en) 2005-11-25 2007-08-15 DSMIP Assets B.V. Cosmetic or personal care composition comprising a polymer comprising oxazolidon groups
KR101051865B1 (ko) * 2006-09-14 2011-07-25 파나소닉 전공 주식회사 프린트 배선판용 에폭시 수지 조성물, 수지 조성물 바니시,프리프레그, 금속 피복 적층체, 프린트 배선판 및 다층 프린트 배선판
WO2008144252A1 (en) * 2007-05-16 2008-11-27 Dow Global Technologies Inc. Flame retardant composition
CN101815734A (zh) * 2007-10-05 2010-08-25 陶氏环球技术公司 异氰酸酯改性环氧树脂及其环氧粉末涂料组合物
TW200922959A (en) * 2007-10-26 2009-06-01 Dow Global Technologies Inc Epoxy resin composition containing isocyanurates for use in electrical laminates
ATE509053T1 (de) * 2007-11-29 2011-05-15 Dow Global Technologies Llc Dimethylformamidfreie formulierungen mit dicyanadiamid als härtemittel für wärmehärtende epoxidharze
KR101571184B1 (ko) * 2008-01-08 2015-11-23 다우 글로벌 테크놀로지스 엘엘씨 복합재 제품을 위한 높은 Ｔｇ의 에폭시 시스템
KR20160007668A (ko) 2008-04-14 2016-01-20 블루 큐브 아이피 엘엘씨 분말 피복 분야에 유용한 에폭시-이미다졸 촉매
EP2385962B1 (en) * 2009-01-06 2015-09-02 Dow Global Technologies LLC Metal stabilizers for epoxy resins and advancement process
KR20120097511A (ko) * 2009-11-12 2012-09-04 다우 글로벌 테크놀로지스 엘엘씨 폴리옥사졸리돈 수지
US20120129414A1 (en) * 2010-11-24 2012-05-24 Chung-Hao Chang Thermosetting resin composition and prepreg or laminate using the same
JP5833024B2 (ja) 2010-12-28 2015-12-16 三井化学東セロ株式会社 樹脂組成物、これを含む保護膜、ドライフィルム、回路基板、及び多層回路基板
US20140121299A1 (en) * 2011-07-04 2014-05-01 Dow Global Technologies Llc Adducts as tougheners in thermosettable epoxy systems
TWI444132B (zh) * 2011-12-08 2014-07-01 Ind Tech Res Inst 電磁波屏蔽複合膜及具有該複合膜之軟性印刷電路板
BR112015010248A2 (pt) 2012-11-07 2017-07-11 Dow Global Technologies Llc composição de resina epóxi curável, processo para preparar a composição de resina epóxi curável e compósito
EP2803684A1 (de) * 2013-05-13 2014-11-19 Basf Se Isocyanat-Epoxid-Hybridharze
CN103436155B (zh) * 2013-09-09 2015-12-23 段宝荣 一种耐光性水性聚氨酯涂料的制备方法
DE102014226842A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Katalysator-Zusammensetzung zur Härtung von Epoxidgruppen-haltigen Harzen
DE102014226838A1 (de) 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Oxazolidinon- und Isocyanurat-vernetzte Matrix für faserverstärktes Material
JP2016094610A (ja) * 2015-11-24 2016-05-26 ブルー キューブ アイピー エルエルシー 熱硬化性エポキシ系の強化剤用付加体
CN105295041B (zh) * 2015-12-03 2017-07-25 苏州太湖电工新材料股份有限公司 一种聚噁唑烷酮树脂、其制备方法及在浸渍漆中的应用
CN106916282B (zh) 2015-12-28 2019-07-26 广东生益科技股份有限公司 一种环氧树脂组合物以及使用其的预浸料和层压板
CN107227001B (zh) * 2016-03-25 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板
EP3260481B1 (de) * 2016-06-20 2022-02-23 Henkel AG & Co. KGaA Gehärtete zusammensetzung mit hoher schlagfestigkeit und temperaturbeständigkeit, basierend auf einem epoxidharz und einem polyisocyanat
JP6294927B1 (ja) * 2016-09-15 2018-03-14 日清紡ホールディングス株式会社 樹脂組成物及びこれを用いた熱伝導性軟質シート、並びに放熱構造
CN106497024A (zh) * 2016-10-27 2017-03-15 国家康复辅具研究中心 一种抗菌聚氨酯复合材料及其制备方法和应用
JP7317707B2 (ja) * 2017-02-16 2023-07-31 ビーエーエスエフ ソシエタス・ヨーロピア ポリオキサゾリドン及びその製造方法
JP7323265B2 (ja) * 2017-03-31 2023-08-08 富士紡ホールディングス株式会社 研磨パッド
EP3428045A1 (de) * 2017-07-13 2019-01-16 Sika Technology Ag Einkomponentiger hitzehärtender epoxidklebstoff hoher auswaschbeständigkeit
EP3456754A1 (en) * 2017-09-15 2019-03-20 Covestro Deutschland AG Method for the production of thermoplastic polyoxazolidinone polymers
JP7365096B2 (ja) * 2017-09-29 2023-10-19 ビーエーエスエフ ソシエタス・ヨーロピア ジイソシアネートおよび２－フェニル－１，３－プロパンジオールのジグリシジルエーテル誘導体からの熱可塑性ポリオキサゾリドン
CN107652937B (zh) * 2017-11-06 2021-03-30 烟台德邦科技股份有限公司 一种可与低表面能材料粘接的聚氨酯热熔胶的制备方法
CN108371948A (zh) * 2018-02-09 2018-08-07 安徽师范大学 新型亲和嗜硫硅球色谱材料及其制备方法和应用
JP7271573B2 (ja) * 2018-04-30 2023-05-11 エボニック オペレーションズ ゲーエムベーハー ポリアスパラギン酸エステルおよび第二級複素環式アミン誘導アスパラギン酸エステルから得られるポリ尿素組成物
JP7512249B2 (ja) * 2018-07-18 2024-07-08 ビーエーエスエフ ソシエタス・ヨーロピア ポリオキサゾリドンのバルク重合
EP3647335A1 (en) * 2018-10-30 2020-05-06 Covestro Deutschland AG Method for the production of thermoplastic polyoxazolidinone polymers
US20220154055A1 (en) * 2019-05-15 2022-05-19 Dow Global Technologies Llc Two-component adhesive compositions, articles prepared with same and preparation methods thereof
CN112175168B (zh) * 2020-10-14 2021-12-14 上海交通大学 一种三元共聚物、嵌段聚合物以及三元共聚物的合成方法
CN119019639A (zh) * 2024-09-14 2024-11-26 万华化学集团股份有限公司 一种低内生热的热塑性聚氨酯弹性体及其制备方法和应用

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Also Published As

Publication number Publication date
ATE302221T1 (de) 2005-09-15
JP5735467B2 (ja) 2015-06-17
CN1333791A (zh) 2002-01-30
HK1043138A1 (en) 2002-09-06
EP1137683A1 (en) 2001-10-04
CN100379781C (zh) 2008-04-09
DE69926790T2 (de) 2006-06-08
DE69926790D1 (de) 2005-09-22
JP2003522217A (ja) 2003-07-22
EP1137683B1 (en) 2005-08-17
HK1043138B (en) 2006-04-07
AU2051200A (en) 2000-06-26
WO2000034351A1 (en) 2000-06-15
JP5209155B2 (ja) 2013-06-12
JP2012251161A (ja) 2012-12-20
TWI240745B (en) 2005-10-01
US6432541B1 (en) 2002-08-13

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