FR2582149B1 - Appareil pour la croissance d'un cristal semiconducteur - Google Patents

Appareil pour la croissance d'un cristal semiconducteur

Info

Publication number
FR2582149B1
FR2582149B1 FR858511516A FR8511516A FR2582149B1 FR 2582149 B1 FR2582149 B1 FR 2582149B1 FR 858511516 A FR858511516 A FR 858511516A FR 8511516 A FR8511516 A FR 8511516A FR 2582149 B1 FR2582149 B1 FR 2582149B1
Authority
FR
France
Prior art keywords
growing
semiconductor crystal
crystal
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR858511516A
Other languages
English (en)
French (fr)
Other versions
FR2582149A1 (fr
Inventor
Junichi Nishizawa
Hitoshi Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Science and Technology Agency
Original Assignee
Research Development Corp of Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59153975A external-priority patent/JPH0766907B2/ja
Priority claimed from JP59153974A external-priority patent/JP2577542B2/ja
Priority claimed from JP59153976A external-priority patent/JPH0766908B2/ja
Application filed by Research Development Corp of Japan filed Critical Research Development Corp of Japan
Publication of FR2582149A1 publication Critical patent/FR2582149A1/fr
Application granted granted Critical
Publication of FR2582149B1 publication Critical patent/FR2582149B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/60Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
    • C30B29/68Crystals with laminate structure, e.g. "superlattices"

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
FR858511516A 1984-07-26 1985-07-26 Appareil pour la croissance d'un cristal semiconducteur Expired - Lifetime FR2582149B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59153975A JPH0766907B2 (ja) 1984-07-26 1984-07-26 半導体結晶成長方法
JP59153974A JP2577542B2 (ja) 1984-07-26 1984-07-26 半導体結晶成長装置
JP59153976A JPH0766908B2 (ja) 1984-07-26 1984-07-26 半導体単結晶成長方法

Publications (2)

Publication Number Publication Date
FR2582149A1 FR2582149A1 (fr) 1986-11-21
FR2582149B1 true FR2582149B1 (fr) 1991-06-14

Family

ID=27320569

Family Applications (1)

Application Number Title Priority Date Filing Date
FR858511516A Expired - Lifetime FR2582149B1 (fr) 1984-07-26 1985-07-26 Appareil pour la croissance d'un cristal semiconducteur

Country Status (4)

Country Link
US (4) US4975252A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3526888A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2582149B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (3) GB2162207B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (126)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5294286A (en) * 1984-07-26 1994-03-15 Research Development Corporation Of Japan Process for forming a thin film of silicon
JPH0766906B2 (ja) * 1984-07-26 1995-07-19 新技術事業団 GaAsエピタキシャル成長方法
GB2162207B (en) 1984-07-26 1989-05-10 Japan Res Dev Corp Semiconductor crystal growth apparatus
JPS61260622A (ja) * 1985-05-15 1986-11-18 Res Dev Corp Of Japan GaAs単結晶薄膜の成長法
JPS6291494A (ja) * 1985-10-16 1987-04-25 Res Dev Corp Of Japan 化合物半導体単結晶成長方法及び装置
GB2185758B (en) * 1985-12-28 1990-09-05 Canon Kk Method for forming deposited film
JP2914992B2 (ja) * 1989-03-31 1999-07-05 キヤノン株式会社 堆積膜形成方法
GB2234529B (en) * 1989-07-26 1993-06-02 Stc Plc Epitaxial growth process
US5213654A (en) * 1990-05-18 1993-05-25 Kabushiki Kaisha Toshiba Vapor-phase epitaxial growth method for semiconductor crystal layers
US5225366A (en) * 1990-06-22 1993-07-06 The United States Of America As Represented By The Secretary Of The Navy Apparatus for and a method of growing thin films of elemental semiconductors
GB2248456A (en) * 1990-09-12 1992-04-08 Philips Electronic Associated A method of growing III-V compound semiconductor material on a substrate
FR2667197B1 (fr) * 1990-09-20 1993-12-24 Rosette Azoulay Procede d'epitaxie selective et de gravure de materiau iii-v ou ii-vi dans un meme bati de croissance omcvd.
US5705224A (en) * 1991-03-20 1998-01-06 Kokusai Electric Co., Ltd. Vapor depositing method
JP3137767B2 (ja) * 1992-10-20 2001-02-26 富士通株式会社 半導体装置の製造方法
US5379719A (en) * 1993-07-26 1995-01-10 Sandia National Laboratories Method of deposition by molecular beam epitaxy
US5421957A (en) * 1993-07-30 1995-06-06 Applied Materials, Inc. Low temperature etching in cold-wall CVD systems
US6047713A (en) * 1994-02-03 2000-04-11 Applied Materials, Inc. Method for cleaning a throttle valve
US5407531A (en) * 1994-02-15 1995-04-18 At&T Corp. Method of fabricating a compound semiconductor device
FI100409B (fi) * 1994-11-28 1997-11-28 Asm Int Menetelmä ja laitteisto ohutkalvojen valmistamiseksi
JP3206375B2 (ja) * 1995-06-20 2001-09-10 信越半導体株式会社 単結晶薄膜の製造方法
TW283250B (en) * 1995-07-10 1996-08-11 Watkins Johnson Co Plasma enhanced chemical processing reactor and method
JPH09190979A (ja) * 1996-01-10 1997-07-22 Nec Corp 選択シリコンエピタキシャル成長方法及び成長装置
JP2785803B2 (ja) * 1996-05-01 1998-08-13 日本電気株式会社 フォトマスクの白点欠陥修正方法および装置
US6342277B1 (en) * 1996-08-16 2002-01-29 Licensee For Microelectronics: Asm America, Inc. Sequential chemical vapor deposition
US6286451B1 (en) * 1997-05-29 2001-09-11 Applied Materials, Inc. Dome: shape and temperature controlled surfaces
FI104383B (fi) 1997-12-09 2000-01-14 Fortum Oil & Gas Oy Menetelmä laitteistojen sisäpintojen päällystämiseksi
WO2000026029A1 (en) * 1998-11-04 2000-05-11 Xenon Corporation A spiral-shaped lamp for uv curing of coatings and bonding for a digital versatile disk (dvd) or compact disk (cd)
US6503330B1 (en) 1999-12-22 2003-01-07 Genus, Inc. Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition
US6551399B1 (en) 2000-01-10 2003-04-22 Genus Inc. Fully integrated process for MIM capacitors using atomic layer deposition
JP3985416B2 (ja) * 2000-03-02 2007-10-03 松下電器産業株式会社 ガスレーザ発振装置
EP1139402A1 (en) * 2000-03-27 2001-10-04 Infineon Technologies AG Method and arrangement for depositing a dielectric layer
US6808758B1 (en) * 2000-06-09 2004-10-26 Mattson Technology, Inc. Pulse precursor deposition process for forming layers in semiconductor devices
US6620723B1 (en) 2000-06-27 2003-09-16 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7732327B2 (en) 2000-06-28 2010-06-08 Applied Materials, Inc. Vapor deposition of tungsten materials
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US6551929B1 (en) 2000-06-28 2003-04-22 Applied Materials, Inc. Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US7964505B2 (en) 2005-01-19 2011-06-21 Applied Materials, Inc. Atomic layer deposition of tungsten materials
US6881259B1 (en) 2000-08-07 2005-04-19 International Business Machines Corporation In-situ monitoring and control of germanium profile in silicon-germanium alloy films and temperature monitoring during deposition of silicon films
US6617173B1 (en) 2000-10-11 2003-09-09 Genus, Inc. Integration of ferromagnetic films with ultrathin insulating film using atomic layer deposition
US20030190424A1 (en) * 2000-10-20 2003-10-09 Ofer Sneh Process for tungsten silicide atomic layer deposition
US9255329B2 (en) 2000-12-06 2016-02-09 Novellus Systems, Inc. Modulated ion-induced atomic layer deposition (MII-ALD)
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6765178B2 (en) 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US6825447B2 (en) 2000-12-29 2004-11-30 Applied Materials, Inc. Apparatus and method for uniform substrate heating and contaminate collection
US6811814B2 (en) 2001-01-16 2004-11-02 Applied Materials, Inc. Method for growing thin films by catalytic enhancement
US20020127336A1 (en) * 2001-01-16 2002-09-12 Applied Materials, Inc. Method for growing thin films by catalytic enhancement
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6660126B2 (en) 2001-03-02 2003-12-09 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6734020B2 (en) 2001-03-07 2004-05-11 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US6627268B1 (en) * 2001-05-03 2003-09-30 Novellus Systems, Inc. Sequential ion, UV, and electron induced chemical vapor deposition
US6849545B2 (en) 2001-06-20 2005-02-01 Applied Materials, Inc. System and method to form a composite film stack utilizing sequential deposition techniques
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US20090004850A1 (en) 2001-07-25 2009-01-01 Seshadri Ganguli Process for forming cobalt and cobalt silicide materials in tungsten contact applications
US20030029715A1 (en) 2001-07-25 2003-02-13 Applied Materials, Inc. An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
US8110489B2 (en) 2001-07-25 2012-02-07 Applied Materials, Inc. Process for forming cobalt-containing materials
JP2005504885A (ja) 2001-07-25 2005-02-17 アプライド マテリアルズ インコーポレイテッド 新規なスパッタ堆積方法を使用したバリア形成
US9051641B2 (en) 2001-07-25 2015-06-09 Applied Materials, Inc. Cobalt deposition on barrier surfaces
US7085616B2 (en) * 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US7780785B2 (en) 2001-10-26 2010-08-24 Applied Materials, Inc. Gas delivery apparatus for atomic layer deposition
US7204886B2 (en) 2002-11-14 2007-04-17 Applied Materials, Inc. Apparatus and method for hybrid chemical processing
US6729824B2 (en) 2001-12-14 2004-05-04 Applied Materials, Inc. Dual robot processing system
US6620670B2 (en) 2002-01-18 2003-09-16 Applied Materials, Inc. Process conditions and precursors for atomic layer deposition (ALD) of AL2O3
US7175713B2 (en) 2002-01-25 2007-02-13 Applied Materials, Inc. Apparatus for cyclical deposition of thin films
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6998014B2 (en) 2002-01-26 2006-02-14 Applied Materials, Inc. Apparatus and method for plasma assisted deposition
TWI295483B (en) * 2002-01-31 2008-04-01 Sumitomo Chemical Co 3-5 group compound semiconductor, process for producing the same, and compound semiconductor element using the same
US6827978B2 (en) 2002-02-11 2004-12-07 Applied Materials, Inc. Deposition of tungsten films
US20030155328A1 (en) * 2002-02-15 2003-08-21 Huth Mark C. Laser micromachining and methods and systems of same
US6833161B2 (en) 2002-02-26 2004-12-21 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
US6972267B2 (en) 2002-03-04 2005-12-06 Applied Materials, Inc. Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
US6730367B2 (en) * 2002-03-05 2004-05-04 Micron Technology, Inc. Atomic layer deposition method with point of use generated reactive gas species
PT1347077E (pt) * 2002-03-15 2006-09-29 Vhf Technologies Sa Aparelho e metodo para a producao de dispositivos semicondutores flexiveis
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US6846516B2 (en) 2002-04-08 2005-01-25 Applied Materials, Inc. Multiple precursor cyclical deposition system
US6720027B2 (en) 2002-04-08 2004-04-13 Applied Materials, Inc. Cyclical deposition of a variable content titanium silicon nitride layer
US6869838B2 (en) 2002-04-09 2005-03-22 Applied Materials, Inc. Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications
US6875271B2 (en) 2002-04-09 2005-04-05 Applied Materials, Inc. Simultaneous cyclical deposition in different processing regions
US7279432B2 (en) 2002-04-16 2007-10-09 Applied Materials, Inc. System and method for forming an integrated barrier layer
US6838114B2 (en) 2002-05-24 2005-01-04 Micron Technology, Inc. Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpieces
US6821347B2 (en) 2002-07-08 2004-11-23 Micron Technology, Inc. Apparatus and method for depositing materials onto microelectronic workpieces
US7186385B2 (en) * 2002-07-17 2007-03-06 Applied Materials, Inc. Apparatus for providing gas to a processing chamber
US6915592B2 (en) 2002-07-29 2005-07-12 Applied Materials, Inc. Method and apparatus for generating gas to a processing chamber
US6955725B2 (en) 2002-08-15 2005-10-18 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US6821563B2 (en) 2002-10-02 2004-11-23 Applied Materials, Inc. Gas distribution system for cyclical layer deposition
US20040069227A1 (en) 2002-10-09 2004-04-15 Applied Materials, Inc. Processing chamber configured for uniform gas flow
JP2004207687A (ja) * 2002-12-10 2004-07-22 Sharp Corp 半導体製造装置とそれを用いた半導体製造方法
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
US6926775B2 (en) * 2003-02-11 2005-08-09 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US20040177813A1 (en) 2003-03-12 2004-09-16 Applied Materials, Inc. Substrate support lift mechanism
WO2004085309A1 (ja) * 2003-03-24 2004-10-07 Japan Science And Technology Agency カーボンナノ構造物の高効率合成方法、装置及びカーボンナノ構造物
US7342984B1 (en) 2003-04-03 2008-03-11 Zilog, Inc. Counting clock cycles over the duration of a first character and using a remainder value to determine when to sample a bit of a second character
US20040198069A1 (en) 2003-04-04 2004-10-07 Applied Materials, Inc. Method for hafnium nitride deposition
US7335396B2 (en) 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
US7754999B2 (en) 2003-05-13 2010-07-13 Hewlett-Packard Development Company, L.P. Laser micromachining and methods of same
US6969822B2 (en) * 2003-05-13 2005-11-29 Hewlett-Packard Development Company, L.P. Laser micromachining systems
KR20060079144A (ko) 2003-06-18 2006-07-05 어플라이드 머티어리얼스, 인코포레이티드 배리어 물질의 원자층 증착
US7344755B2 (en) 2003-08-21 2008-03-18 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
US7422635B2 (en) * 2003-08-28 2008-09-09 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
US7056806B2 (en) 2003-09-17 2006-06-06 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
US7323231B2 (en) 2003-10-09 2008-01-29 Micron Technology, Inc. Apparatus and methods for plasma vapor deposition processes
US7581511B2 (en) 2003-10-10 2009-09-01 Micron Technology, Inc. Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes
US7258892B2 (en) 2003-12-10 2007-08-21 Micron Technology, Inc. Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
US7584942B2 (en) 2004-03-31 2009-09-08 Micron Technology, Inc. Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers
US8133554B2 (en) 2004-05-06 2012-03-13 Micron Technology, Inc. Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
US20050252449A1 (en) 2004-05-12 2005-11-17 Nguyen Son T Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
US8323754B2 (en) 2004-05-21 2012-12-04 Applied Materials, Inc. Stabilization of high-k dielectric materials
US8119210B2 (en) 2004-05-21 2012-02-21 Applied Materials, Inc. Formation of a silicon oxynitride layer on a high-k dielectric material
US7699932B2 (en) 2004-06-02 2010-04-20 Micron Technology, Inc. Reactors, systems and methods for depositing thin films onto microfeature workpieces
US7402534B2 (en) 2005-08-26 2008-07-22 Applied Materials, Inc. Pretreatment processes within a batch ALD reactor
US7464917B2 (en) 2005-10-07 2008-12-16 Appiled Materials, Inc. Ampoule splash guard apparatus
TWI329135B (en) 2005-11-04 2010-08-21 Applied Materials Inc Apparatus and process for plasma-enhanced atomic layer deposition
US7798096B2 (en) 2006-05-05 2010-09-21 Applied Materials, Inc. Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool
US7601648B2 (en) 2006-07-31 2009-10-13 Applied Materials, Inc. Method for fabricating an integrated gate dielectric layer for field effect transistors
US8053372B1 (en) 2006-09-12 2011-11-08 Novellus Systems, Inc. Method of reducing plasma stabilization time in a cyclic deposition process
US7871678B1 (en) 2006-09-12 2011-01-18 Novellus Systems, Inc. Method of increasing the reactivity of a precursor in a cyclic deposition process
US7775508B2 (en) 2006-10-31 2010-08-17 Applied Materials, Inc. Ampoule for liquid draw and vapor draw with a continuous level sensor
US20080206987A1 (en) 2007-01-29 2008-08-28 Gelatos Avgerinos V Process for tungsten nitride deposition by a temperature controlled lid assembly
US8383525B2 (en) 2008-04-25 2013-02-26 Asm America, Inc. Plasma-enhanced deposition process for forming a metal oxide thin film and related structures
KR101436564B1 (ko) * 2008-05-07 2014-09-02 한국에이에스엠지니텍 주식회사 비정질 실리콘 박막 형성 방법
US8146896B2 (en) 2008-10-31 2012-04-03 Applied Materials, Inc. Chemical precursor ampoule for vapor deposition processes
WO2012060940A1 (en) 2010-11-04 2012-05-10 Novellus Systems, Inc. Ion-induced atomic layer deposition of tantalum

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1017119A (en) * 1964-05-06 1966-01-19 Standard Telephones Cables Ltd Improvements in or relating to the manufacture of semiconductor materials
US2841477A (en) * 1957-03-04 1958-07-01 Pacific Semiconductors Inc Photochemically activated gaseous etching method
GB1164352A (en) * 1967-06-16 1969-09-17 Standard Telephones Cables Ltd Optical Filters.
DE1900116C3 (de) * 1969-01-02 1978-10-19 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen hxxochreiner, aus Silicium bestehender einkristalliner Schichten
US4368098A (en) * 1969-10-01 1983-01-11 Rockwell International Corporation Epitaxial composite and method of making
FR2116194B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1970-02-27 1974-09-06 Labo Electronique Physique
US3916034A (en) * 1971-05-21 1975-10-28 Hitachi Ltd Method of transporting substances in a plasma stream to and depositing it on a target
SE393967B (sv) * 1974-11-29 1977-05-31 Sateko Oy Forfarande och for utforande av stroleggning mellan lagren i ett virkespaket
DE2548891C3 (de) * 1975-10-31 1983-04-28 Finnigan MAT GmbH, 2800 Bremen Probenwechsler für Massenspektrometer
US4214926A (en) * 1976-07-02 1980-07-29 Tdk Electronics Co., Ltd. Method of doping IIb or VIb group elements into a boron phosphide semiconductor
GB1582231A (en) * 1976-08-13 1981-01-07 Nat Res Dev Application of a layer of carbonaceous material to a surface
FR2370320A1 (fr) * 1976-11-05 1978-06-02 Thomson Csf Systeme de regulation de flux moleculaires, et son application aux techniques de co-evaporation
GB1592063A (en) * 1978-05-08 1981-07-01 Chloride Silent Power Ltd Sodium sulphur cells
JPS53121469A (en) * 1977-03-31 1978-10-23 Toshiba Corp Gas etching unit
JPS53148277A (en) * 1977-05-31 1978-12-23 Fujitsu Ltd Controlling method of goping gas in vapor phase growth of semiconductor
FR2397720A1 (fr) * 1977-07-13 1979-02-09 Anvar Soudure et procede de soudage de haute qualite cristallographique applicables aux circuits supraconducteurs
GB2002169B (en) * 1977-08-03 1982-01-06 Leybold Heraeus Gmbh & Co Kg Apparatus for sample analysis
US4159919A (en) * 1978-01-16 1979-07-03 Bell Telephone Laboratories, Incorporated Molecular beam epitaxy using premixing
US4223048A (en) * 1978-08-07 1980-09-16 Pacific Western Systems Plasma enhanced chemical vapor processing of semiconductive wafers
JPS5562734A (en) * 1978-11-01 1980-05-12 Toshiba Corp Ion source and ion etching method
US4190470A (en) * 1978-11-06 1980-02-26 M/A Com, Inc. Production of epitaxial layers by vapor deposition utilizing dynamically adjusted flow rates and gas phase concentrations
FI57975C (fi) * 1979-02-28 1980-11-10 Lohja Ab Oy Foerfarande och anordning vid uppbyggande av tunna foereningshinnor
GB2045809B (en) * 1979-04-02 1983-03-30 Standard Telephones Cables Ltd Chemical vapour deposition of aluminium
JPS55158623A (en) * 1979-05-29 1980-12-10 Hitachi Ltd Method of controlling semiconductor vapor phase growth
US4282267A (en) * 1979-09-20 1981-08-04 Western Electric Co., Inc. Methods and apparatus for generating plasmas
DE3066027D1 (en) * 1979-12-17 1984-02-02 Hughes Aircraft Co Low temperature process for depositing oxide layers by photochemical vapor deposition
DD153899A5 (de) * 1980-02-26 1982-02-10 Lohja Ab Oy Verfahren und vorrichtung zur durchfuehrung des wachstums von zusammengesetzten duennen schichten
JPS574172A (en) * 1980-06-09 1982-01-09 Canon Inc Light conductive member
DE3175345D1 (en) * 1980-08-21 1986-10-23 Nat Res Dev Coating insulating materials by glow discharge
IL64258A0 (en) * 1980-12-15 1982-02-28 Hughes Aircraft Co Method and apparatus for photochemical vapor deposition
US4394237A (en) * 1981-07-17 1983-07-19 Bell Telephone Laboratories, Incorporated Spectroscopic monitoring of gas-solid processes
DE3376432D1 (en) * 1982-01-28 1988-06-01 Toshiba Machine Co Ltd Semiconductor vapor phase growing apparatus
JPS58158914A (ja) * 1982-03-16 1983-09-21 Semiconductor Res Found 半導体製造装置
US4435445A (en) * 1982-05-13 1984-03-06 Energy Conversion Devices, Inc. Photo-assisted CVD
US4464342A (en) * 1982-05-14 1984-08-07 At&T Bell Laboratories Molecular beam epitaxy apparatus for handling phosphorus
US4447469A (en) * 1982-06-10 1984-05-08 Hughes Aircraft Company Process for forming sulfide layers by photochemical vapor deposition
US4451503A (en) * 1982-06-30 1984-05-29 International Business Machines Corporation Photo deposition of metals with far UV radiation
EP0106637B1 (en) * 1982-10-12 1988-02-17 National Research Development Corporation Infra red transparent optical components
JPS5982732A (ja) * 1982-11-02 1984-05-12 Nec Corp 半導体装置の製造方法
JPS59135730A (ja) * 1983-01-24 1984-08-04 Hitachi Ltd 表面改質装置
FR2544752B1 (fr) * 1983-04-25 1985-07-05 Commissariat Energie Atomique Procede de croissance amorphe d'un corps avec cristallisation sous rayonnement
US4632710A (en) * 1983-05-10 1986-12-30 Raytheon Company Vapor phase epitaxial growth of carbon doped layers of Group III-V materials
JPS59207631A (ja) * 1983-05-11 1984-11-24 Semiconductor Res Found 光化学を用いたドライプロセス装置
JPS6050169A (ja) * 1983-08-26 1985-03-19 Res Dev Corp Of Japan 薄膜形成方法
US4645687A (en) * 1983-11-10 1987-02-24 At&T Laboratories Deposition of III-V semiconductor materials
FR2555206B1 (fr) * 1983-11-22 1986-05-09 Thomson Csf Procede de depot de silicium amorphe par decomposition thermique a basse temperature et dispositif de mise en oeuvre du procede
GB2156857B (en) * 1983-11-30 1987-01-14 Philips Electronic Associated Method of manufacturing a semiconductor device
US4504331A (en) * 1983-12-08 1985-03-12 International Business Machines Corporation Silicon dopant source in intermetallic semiconductor growth operations
US4624736A (en) * 1984-07-24 1986-11-25 The United States Of America As Represented By The United States Department Of Energy Laser/plasma chemical processing of substrates
JPH0766910B2 (ja) * 1984-07-26 1995-07-19 新技術事業団 半導体単結晶成長装置
JP2577550B2 (ja) * 1986-11-20 1997-02-05 新技術事業団 ▲iii▼−▲v▼族化合物半導体単結晶薄膜の不純物添加法
GB2162862B (en) * 1984-07-26 1988-10-19 Japan Res Dev Corp A method of growing a thin film single crystalline semiconductor
GB2162207B (en) * 1984-07-26 1989-05-10 Japan Res Dev Corp Semiconductor crystal growth apparatus
US4597989A (en) * 1984-07-30 1986-07-01 Burroughs Corporation Method of depositing silicon films with reduced structural defects
US4636268A (en) * 1984-11-30 1987-01-13 At&T Bell Laboratories Chemical beam deposition method utilizing alkyl compounds in a carrier gas
US4662312A (en) * 1984-12-28 1987-05-05 Nissin Electric Co., Ltd. Apparatus for ion and vapor deposition
JPS61260622A (ja) * 1985-05-15 1986-11-18 Res Dev Corp Of Japan GaAs単結晶薄膜の成長法
CH664768A5 (de) * 1985-06-20 1988-03-31 Balzers Hochvakuum Verfahren zur beschichtung von substraten in einer vakuumkammer.
GB8525290D0 (en) * 1985-10-14 1985-11-20 Boc Group Plc Mass spectrometers
DE3542111A1 (de) * 1985-11-28 1987-06-04 Nukem Gmbh Verfahren zur durchfuehrung eines glimmprozesses
US4699688A (en) * 1986-07-14 1987-10-13 Gte Laboratories Incorporated Method of epitaxially growing gallium arsenide on silicon
JPH0639357B2 (ja) * 1986-09-08 1994-05-25 新技術開発事業団 元素半導体単結晶薄膜の成長方法

Also Published As

Publication number Publication date
GB8718943D0 (en) 1987-09-16
US5443033A (en) 1995-08-22
GB2200138B (en) 1989-05-10
GB2200138A (en) 1988-07-27
US20010001952A1 (en) 2001-05-31
GB2200137A (en) 1988-07-27
DE3526888A1 (de) 1986-02-06
US6464793B1 (en) 2002-10-15
GB2162207B (en) 1989-05-10
DE3526888C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-02-08
US4975252A (en) 1990-12-04
GB2200137B (en) 1989-05-10
GB2162207A (en) 1986-01-29
GB8718942D0 (en) 1987-09-16
GB8518842D0 (en) 1985-08-29
FR2582149A1 (fr) 1986-11-21

Similar Documents

Publication Publication Date Title
FR2582149B1 (fr) Appareil pour la croissance d'un cristal semiconducteur
FR2557246B1 (fr) Dispositif d'obturation pour robinet-vanne
FR2593592B1 (fr) Appareil perfectionne pour la fabrication de glace
IT8821522A0 (it) Apparecchio per tagliare cristallo semiconduttore
FI895158A7 (fi) Laite piiyksinäiskiteiden valmistamiseksi
FR2568396B1 (fr) Appareil d'affichage
FR2562278B1 (fr) Appareil d'enregistrement
FR2532214B1 (fr) Support rigide pour un appareil d'usinage a laser
FR2469977B1 (fr) Appareil pour le maintien d'un ensemble d'elements
FR2568272B1 (fr) Appareil pour former un cristal de semi-conducteur
FI901415A7 (fi) Laite piiyksittäiskiteiden valmistamiseksi
BE872397A (fr) Procede et dispositif pour la fabrication d'une plaque de construction par emploi de gypse
FR2627296B1 (fr) Appareil pour indiquer l'heure, du type analogique
FI901414A7 (fi) Laite piiyksittäiskiteiden valmistamiseksi
IT8423695A0 (it) Procedimento per compensare l'errore di troncamento di un segnale campionato e dispositivoper attuare detto procedimento.
FR2569880B1 (fr) Appareil d'etranglement pour fluides
FR2546313B1 (fr) Dispositif pour l'orientation d'un rayon laser
FI901413A7 (fi) Laite piiyksittäiskiteiden valmistamiseksi
FR2594228B1 (fr) Procede et dispositif pour determiner l'orientation d'un cristal
FR2550470B1 (fr) Dispositif pour l'irrigation goutte a goutte
FR2614557B2 (fr) Dispositif pour l'irrigation goutte a goutte
FR2602978B1 (fr) Procede pour la fabrication d'un ski
FR2560763B1 (fr) Dispositif hygienique individuel pour lieux d'aisances
FR2586186B1 (fr) Appareil d'aide a la parole pour operes du larynx
FR2563426B1 (fr) Appareil d'orthodontie

Legal Events

Date Code Title Description
TP Transmission of property