IT8821522A0 - Apparecchio per tagliare cristallo semiconduttore - Google Patents
Apparecchio per tagliare cristallo semiconduttoreInfo
- Publication number
- IT8821522A0 IT8821522A0 IT8821522A IT2152288A IT8821522A0 IT 8821522 A0 IT8821522 A0 IT 8821522A0 IT 8821522 A IT8821522 A IT 8821522A IT 2152288 A IT2152288 A IT 2152288A IT 8821522 A0 IT8821522 A0 IT 8821522A0
- Authority
- IT
- Italy
- Prior art keywords
- semiconductor crystal
- cutting semiconductor
- cutting
- crystal
- semiconductor
- Prior art date
Links
- 239000013078 crystal Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D47/00—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
- B23D47/005—Vibration-damping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/849—With signal, scale, or indicator
- Y10T83/853—Indicates tool position
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/849—With signal, scale, or indicator
- Y10T83/853—Indicates tool position
- Y10T83/855—Relative to another element
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62192474A JPS6436408A (en) | 1987-07-31 | 1987-07-31 | Cutter for semiconductor single-crystalline bar |
JP62192472A JPS6436406A (en) | 1987-07-31 | 1987-07-31 | Cutter for semiconductor single-crystalline bar |
JP62192473A JPS6436407A (en) | 1987-07-31 | 1987-07-31 | Cutter for semiconductor single-crystalline bar |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8821522A0 true IT8821522A0 (it) | 1988-07-27 |
IT1226469B IT1226469B (it) | 1991-01-16 |
Family
ID=27326618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT2152288A IT1226469B (it) | 1987-07-31 | 1988-07-27 | Apparecchio per tagliare cristallo semiconduttore |
Country Status (3)
Country | Link |
---|---|
US (1) | US4971021A (it) |
KR (1) | KR940011179B1 (it) |
IT (1) | IT1226469B (it) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3941038A1 (de) * | 1989-12-12 | 1991-06-13 | Wacker Chemitronic | Vorrichtung zum nachschaerfen der schneidkante von trennwerkzeugen beim abtrennen von scheiben von stab- oder blockfoermigen werkstuecken, insbesondere aus halbleitermaterial, ihre verwendung und saegeverfahren |
JPH05116138A (ja) * | 1991-09-30 | 1993-05-14 | Mitsubishi Materials Corp | スライシングマシン |
ES2092706T3 (es) * | 1992-02-08 | 1996-12-01 | Hoechst Ag | Procedimiento y dispositivo para cortar continuamente material en forma de banda o de cuerda. |
US5351444A (en) * | 1992-09-25 | 1994-10-04 | Silicon Technology Corporation | Blade track control system |
US5613350A (en) * | 1992-12-24 | 1997-03-25 | Boucher; John N. | Method for packaging and handling fragile dicing blade |
US5632666A (en) * | 1994-10-28 | 1997-05-27 | Memc Electronic Materials, Inc. | Method and apparatus for automated quality control in wafer slicing |
JP3195504B2 (ja) * | 1994-11-24 | 2001-08-06 | トーヨーエイテック株式会社 | スライシング装置のブレード変位検出装置 |
US5718615A (en) * | 1995-10-20 | 1998-02-17 | Boucher; John N. | Semiconductor wafer dicing method |
US6152803A (en) * | 1995-10-20 | 2000-11-28 | Boucher; John N. | Substrate dicing method |
JP2943673B2 (ja) * | 1995-10-31 | 1999-08-30 | 日本電気株式会社 | 半導体基板の製造装置及び製造方法 |
US6142046A (en) * | 1996-08-06 | 2000-11-07 | Cae Machinery Ltd. | Knife projection sensing system |
US6493934B2 (en) | 1996-11-12 | 2002-12-17 | Salman Akram | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
US6250192B1 (en) | 1996-11-12 | 2001-06-26 | Micron Technology, Inc. | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
US20040112360A1 (en) * | 1998-02-12 | 2004-06-17 | Boucher John N. | Substrate dicing method |
US6033288A (en) * | 1998-10-29 | 2000-03-07 | Kulicke & Soffa Investments, Inc. | Monitoring system for dicing saws |
US6165051A (en) * | 1998-10-29 | 2000-12-26 | Kulicke & Soffa Investments, Inc. | Monitoring system for dicing saws |
US6612901B1 (en) | 2000-06-07 | 2003-09-02 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
US6609947B1 (en) | 2000-08-30 | 2003-08-26 | Micron Technology, Inc. | Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates |
KR100414890B1 (ko) * | 2001-05-10 | 2004-01-13 | 삼성전자주식회사 | 웨이퍼 절삭 장치 |
US20020185121A1 (en) * | 2001-06-06 | 2002-12-12 | Farnworth Warren M. | Group encapsulated dicing chuck |
SG118084A1 (en) * | 2001-08-24 | 2006-01-27 | Micron Technology Inc | Method and apparatus for cutting semiconductor wafers |
US7131889B1 (en) | 2002-03-04 | 2006-11-07 | Micron Technology, Inc. | Method for planarizing microelectronic workpieces |
US7341502B2 (en) | 2002-07-18 | 2008-03-11 | Micron Technology, Inc. | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
US6872132B2 (en) | 2003-03-03 | 2005-03-29 | Micron Technology, Inc. | Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
US7131891B2 (en) | 2003-04-28 | 2006-11-07 | Micron Technology, Inc. | Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
US6939211B2 (en) * | 2003-10-09 | 2005-09-06 | Micron Technology, Inc. | Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions |
US7086927B2 (en) | 2004-03-09 | 2006-08-08 | Micron Technology, Inc. | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
US20060127179A1 (en) * | 2004-06-10 | 2006-06-15 | Nadler Donald S | System and method for concrete slab connection |
ITMI20041269A1 (it) * | 2004-06-24 | 2004-09-24 | Paper Converting Machine Co | Sistema di controllo della lama di taglio particolarmente per macchine troncatrici per il taglio di log di materiale in foglio |
CN107443600A (zh) * | 2017-08-25 | 2017-12-08 | 芜湖长润特种铜线有限公司 | 一种铜材切割加工设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3681978A (en) * | 1971-02-23 | 1972-08-08 | Cincinnati Milacron Inc | Method and apparatus for automatically balancing deflection sensors on rotating equipment |
US3986010A (en) * | 1973-08-23 | 1976-10-12 | International Business Machines Corporation | Automatic tool deflection calibration system |
US3895358A (en) * | 1973-10-17 | 1975-07-15 | Gerber Garment Technology Inc | Method of reproducing a marker |
US4498345A (en) * | 1982-10-04 | 1985-02-12 | Texas Instruments Incorporated | Method for measuring saw blade flexure |
GB8314768D0 (en) * | 1983-05-27 | 1983-07-06 | Thurne Eng Co Ltd | Slicing machine |
DE3469498D1 (en) * | 1984-06-27 | 1988-04-07 | Meyer & Burger Ag Maschf | Cutting machine with measuring device and utilization of this measuring device |
-
1988
- 1988-07-25 US US07/223,802 patent/US4971021A/en not_active Expired - Fee Related
- 1988-07-27 IT IT2152288A patent/IT1226469B/it active
- 1988-07-29 KR KR1019880009648A patent/KR940011179B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US4971021A (en) | 1990-11-20 |
KR890002988A (ko) | 1989-04-12 |
KR940011179B1 (ko) | 1994-11-26 |
IT1226469B (it) | 1991-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970731 |