KR890002988A - 반도체 단결정봉의 절단장치 - Google Patents
반도체 단결정봉의 절단장치 Download PDFInfo
- Publication number
- KR890002988A KR890002988A KR1019880009648A KR880009648A KR890002988A KR 890002988 A KR890002988 A KR 890002988A KR 1019880009648 A KR1019880009648 A KR 1019880009648A KR 880009648 A KR880009648 A KR 880009648A KR 890002988 A KR890002988 A KR 890002988A
- Authority
- KR
- South Korea
- Prior art keywords
- sensor
- inner circumferential
- circumferential edge
- distance
- edge
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D47/00—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
- B23D47/005—Vibration-damping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/849—With signal, scale, or indicator
- Y10T83/853—Indicates tool position
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/849—With signal, scale, or indicator
- Y10T83/853—Indicates tool position
- Y10T83/855—Relative to another element
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 본 발명의 한 실시예를 설명하기 위한 도이고, 제 1 도는 블록의 구성도. 제 2 도는 블레이드의 정면도.
Claims (3)
- 회전하는 안쪽둘레날에 의하여 반도체 단결절봉을 절단하여 웨이퍼를 만드는 반도체 단결절봉의 절단장치에 있어서, 전기한 안쪽둘레날(1)과 마주보는 일정위치에 장비되어서, 안쪽둘레날(1)과의 사이의 거리를 검출하는 거리센서(2)와, 전기한 거리센서(2)의 검출신호를 입력하고, 전기한 안쪽둘레날(1)을 기준위치로 하여 전기한 거리신호(2)의 위치가 소정의 허용범위안에 있는지의 여부를 검출하는 센서의 위치검출부(4)와, 전기한 센서의 위치검출부(4)의 검출결과를 표시하는 표시기(6)를 구비하여 이루어진 것을 특징으로 하는 반도체 단결정봉의 절단장치.
- 전기한 안쪽둘레날(1)과 마주보는 일정위치에 비치되어서, 안쪽둘레날(1)과의 사이의 거리를 검출하는 제 1 의 센서(2)와, 전기한 안쪽둘레날(1)의 일정위치에 부착된 마아크와, 전기한 안쪽둘레날(1)과 마주보는 일정위치에 비치되어서, 전기한 마아크를 검출하는 제 2 의 센서(11)와, 전기한 제 2 의의 센서(11)의 검출신호에 같은 시기로서 전기한 제 1 센서(2)의 검출신호를 거두어 들이므로서, 전기한 안쪽둘레날(1)위의 일정위치에 관한 휘어지는 양을 연산하는 연산처리부(7)의 연산결과를 기록하는 기록장치(10)를 구비해서 이루어진 것을 특징으로 하는 반도체 단결정봉의 절단장치.
- 전기한 안쪽둘레날(1)과 마주보는 일정위치에 비치되어서, 안쪽둘레날(1)과의 사이의 거리를 검출하는 제 1 의 센서(2)와, 전기한 안쪽둘레날(1)의 일정위치에 부착된마아크와, 전기한 안쪽둘레날(1)과 마주보는 일정위치에 비치되어서, 전기한 마아크를 검출하는 제 2 의 센서(11)와, 절단개시시에 절단개시의 제어신호를 출력하는 제어신호 출력장치와, 전기한 제어신호 출력장치가 제어신호를 출력해서, 전기한 제 2 센서(11)의 검출신호에 같은 시기로서 전기한 제 1 센서(2)의 검출신호를 거두에 들여, 또한 상기의 제어신호 출력장치가 제어신호를 출력해서 최초에 거두어 들인 전기한 제 1 센서(2)의 검출신호를 초기 데이터로서 기억하여, 그 이후는 그 초기 데이터와 차례로 거두어 들이는 검출신호를 비교하여 전기한 안쪽둘레날(1)위에 있어서의 일정위치의 휘어지는 양을 연산하는 연산처리부(7)와, 전기한 연산처리부(7)의 연산결과를 기록하는 기록장치(10)을 구비해서 이루어진 것을 특징으로 하는 반도체 단결정봉의 절단장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP???62-?192474? | 1987-07-31 | ||
JP???62-192472 | 1987-07-31 | ||
JP???62-?192472? | 1987-07-31 | ||
JP???62-192473 | 1987-07-31 | ||
JP???62-?192473? | 1987-07-31 | ||
JP???62-192474 | 1987-07-31 | ||
JP62192472A JPS6436406A (en) | 1987-07-31 | 1987-07-31 | Cutter for semiconductor single-crystalline bar |
JP62192474A JPS6436408A (en) | 1987-07-31 | 1987-07-31 | Cutter for semiconductor single-crystalline bar |
JP62192473A JPS6436407A (en) | 1987-07-31 | 1987-07-31 | Cutter for semiconductor single-crystalline bar |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890002988A true KR890002988A (ko) | 1989-04-12 |
KR940011179B1 KR940011179B1 (ko) | 1994-11-26 |
Family
ID=27326618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880009648A KR940011179B1 (ko) | 1987-07-31 | 1988-07-29 | 반도체 단결정봉의 절단장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4971021A (ko) |
KR (1) | KR940011179B1 (ko) |
IT (1) | IT1226469B (ko) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3941038A1 (de) * | 1989-12-12 | 1991-06-13 | Wacker Chemitronic | Vorrichtung zum nachschaerfen der schneidkante von trennwerkzeugen beim abtrennen von scheiben von stab- oder blockfoermigen werkstuecken, insbesondere aus halbleitermaterial, ihre verwendung und saegeverfahren |
JPH05116138A (ja) * | 1991-09-30 | 1993-05-14 | Mitsubishi Materials Corp | スライシングマシン |
DE59303694D1 (de) * | 1992-02-08 | 1996-10-17 | Hoechst Ag | Verfahren und Vorrichtung zum kontinuierlichen Zerschneiden von band- oder strangförmigem Gut |
US5351444A (en) * | 1992-09-25 | 1994-10-04 | Silicon Technology Corporation | Blade track control system |
US5613350A (en) * | 1992-12-24 | 1997-03-25 | Boucher; John N. | Method for packaging and handling fragile dicing blade |
US5632666A (en) * | 1994-10-28 | 1997-05-27 | Memc Electronic Materials, Inc. | Method and apparatus for automated quality control in wafer slicing |
JP3195504B2 (ja) * | 1994-11-24 | 2001-08-06 | トーヨーエイテック株式会社 | スライシング装置のブレード変位検出装置 |
US5718615A (en) * | 1995-10-20 | 1998-02-17 | Boucher; John N. | Semiconductor wafer dicing method |
US6152803A (en) * | 1995-10-20 | 2000-11-28 | Boucher; John N. | Substrate dicing method |
JP2943673B2 (ja) * | 1995-10-31 | 1999-08-30 | 日本電気株式会社 | 半導体基板の製造装置及び製造方法 |
US6142046A (en) * | 1996-08-06 | 2000-11-07 | Cae Machinery Ltd. | Knife projection sensing system |
US6493934B2 (en) | 1996-11-12 | 2002-12-17 | Salman Akram | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
US6250192B1 (en) | 1996-11-12 | 2001-06-26 | Micron Technology, Inc. | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
US20040112360A1 (en) * | 1998-02-12 | 2004-06-17 | Boucher John N. | Substrate dicing method |
US6033288A (en) * | 1998-10-29 | 2000-03-07 | Kulicke & Soffa Investments, Inc. | Monitoring system for dicing saws |
US6165051A (en) * | 1998-10-29 | 2000-12-26 | Kulicke & Soffa Investments, Inc. | Monitoring system for dicing saws |
US6612901B1 (en) | 2000-06-07 | 2003-09-02 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
US6609947B1 (en) | 2000-08-30 | 2003-08-26 | Micron Technology, Inc. | Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates |
KR100414890B1 (ko) * | 2001-05-10 | 2004-01-13 | 삼성전자주식회사 | 웨이퍼 절삭 장치 |
US20020185121A1 (en) * | 2001-06-06 | 2002-12-12 | Farnworth Warren M. | Group encapsulated dicing chuck |
SG118084A1 (en) * | 2001-08-24 | 2006-01-27 | Micron Technology Inc | Method and apparatus for cutting semiconductor wafers |
US7131889B1 (en) | 2002-03-04 | 2006-11-07 | Micron Technology, Inc. | Method for planarizing microelectronic workpieces |
US7341502B2 (en) | 2002-07-18 | 2008-03-11 | Micron Technology, Inc. | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
US6872132B2 (en) | 2003-03-03 | 2005-03-29 | Micron Technology, Inc. | Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces |
US7131891B2 (en) | 2003-04-28 | 2006-11-07 | Micron Technology, Inc. | Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
US6939211B2 (en) * | 2003-10-09 | 2005-09-06 | Micron Technology, Inc. | Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions |
US7086927B2 (en) | 2004-03-09 | 2006-08-08 | Micron Technology, Inc. | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
US20060127179A1 (en) * | 2004-06-10 | 2006-06-15 | Nadler Donald S | System and method for concrete slab connection |
ITMI20041269A1 (it) * | 2004-06-24 | 2004-09-24 | Paper Converting Machine Co | Sistema di controllo della lama di taglio particolarmente per macchine troncatrici per il taglio di log di materiale in foglio |
CN107443600A (zh) * | 2017-08-25 | 2017-12-08 | 芜湖长润特种铜线有限公司 | 一种铜材切割加工设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3681978A (en) * | 1971-02-23 | 1972-08-08 | Cincinnati Milacron Inc | Method and apparatus for automatically balancing deflection sensors on rotating equipment |
US3986010A (en) * | 1973-08-23 | 1976-10-12 | International Business Machines Corporation | Automatic tool deflection calibration system |
US3895358A (en) * | 1973-10-17 | 1975-07-15 | Gerber Garment Technology Inc | Method of reproducing a marker |
US4498345A (en) * | 1982-10-04 | 1985-02-12 | Texas Instruments Incorporated | Method for measuring saw blade flexure |
GB8314768D0 (en) * | 1983-05-27 | 1983-07-06 | Thurne Eng Co Ltd | Slicing machine |
EP0166064B1 (de) * | 1984-06-27 | 1988-03-02 | Maschinenfabrik Meyer & Burger AG | Trennschleifmaschine mit einer Messanordnung und Verwendung dieser Messanordnung |
-
1988
- 1988-07-25 US US07/223,802 patent/US4971021A/en not_active Expired - Fee Related
- 1988-07-27 IT IT2152288A patent/IT1226469B/it active
- 1988-07-29 KR KR1019880009648A patent/KR940011179B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR940011179B1 (ko) | 1994-11-26 |
US4971021A (en) | 1990-11-20 |
IT1226469B (it) | 1991-01-16 |
IT8821522A0 (it) | 1988-07-27 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |