JPS6436408A - Cutter for semiconductor single-crystalline bar - Google Patents
Cutter for semiconductor single-crystalline barInfo
- Publication number
- JPS6436408A JPS6436408A JP62192474A JP19247487A JPS6436408A JP S6436408 A JPS6436408 A JP S6436408A JP 62192474 A JP62192474 A JP 62192474A JP 19247487 A JP19247487 A JP 19247487A JP S6436408 A JPS6436408 A JP S6436408A
- Authority
- JP
- Japan
- Prior art keywords
- blade
- distance
- detected
- sensor
- inner circumferential
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D47/00—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
- B23D47/005—Vibration-damping
Abstract
PURPOSE:To detect an accurate warp without being affected by facial deviation of an inner circumferential blade, by a method wherein a distance between the inner circumferential blade and a fixed position facing upon the same is detected synchronously with detecting timing of a mark put down on a fixed position of the inner circumferential blade. CONSTITUTION:A distance sensor 2 provided on a fixed position facing upon a blade 1 puts out an analog signal by detecting a distance between the distance sensor 2 and a blade 1 continuously. A detected signal including a facial deviation of the blade 1, a warp and a ripple ingredient of a power source noise is treated by a sensor amplifier 3 and sensor position detecting part. The detected signal decides that in which state out of the five stages the detected distance exists by comparing in order the detected distance between the blade 1 corresponding to contents of the detected signal and the distance sensor 2 with a predetermined reference value in five stage. Luminous indication of a decision result is performed by an indicator 6 according to a display signal through the sensor position detecting part 4.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62192474A JPS6436408A (en) | 1987-07-31 | 1987-07-31 | Cutter for semiconductor single-crystalline bar |
US07/223,802 US4971021A (en) | 1987-07-31 | 1988-07-25 | Apparatus for cutting semiconductor crystal |
IT2152288A IT1226469B (en) | 1987-07-31 | 1988-07-27 | APPARATUS TO CUT SEMICONDUCTOR CRYSTAL |
KR1019880009648A KR940011179B1 (en) | 1987-07-31 | 1988-07-29 | Apparatus for cutting semiconductor crystal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62192474A JPS6436408A (en) | 1987-07-31 | 1987-07-31 | Cutter for semiconductor single-crystalline bar |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6436408A true JPS6436408A (en) | 1989-02-07 |
Family
ID=16291895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62192474A Pending JPS6436408A (en) | 1987-07-31 | 1987-07-31 | Cutter for semiconductor single-crystalline bar |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6436408A (en) |
-
1987
- 1987-07-31 JP JP62192474A patent/JPS6436408A/en active Pending
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